TW569662B - Manufacturing method of heat sink base - Google Patents

Abstract

The present invention relates to a manufacturing method of heat sink base, which is mainly made by forming a long-stripe like substrate in the way of pressing. The bottom plate is made of metal material with high heat-conduction coefficient. The substrate and the bottom plate can be embedded tightly in the axial direction. Its head segment is cut to form a narrow portion, and the narrow portion can exactly penetrate through the forming mold having a converging opening. A clamping tool clamps the narrow portion, and pulls the substrates mutually embedded tightly and the bottom plate to pass through the converging opening of the forming mold, so that the substrate and the bottom plate are compressed to associate together. A desired length is provided by cutting according to the required specification, thereby forming a base. The heat sink fin is implanted on the base to complete the heat sink. Thus, the method of the present invention can simplify the formation of the bottom plate of heat sink, increase the production efficiency and provide a better heat sink performance.

Description

569662 V. Description of the invention (1) The manufacturing method of the base of the device, especially the lack of the molding technology of the base of the radiator, thereby improving its production (I), the technical field to which the invention belongs ... This creation relates to a type of heat dissipation and an application The improvement of integrated circuits or electronic components is mainly to simplify the current growth rate and better heat dissipation performance. (2) Prior technology: advances the number of coils that are used to perform various electronic component processes in a unit time, which continuously increases the heat generated, and also improves the shape and temperature problems (such as the height of the current Peniuin final product circuit); The operating temperature of the AMDK 7 series is photography, the operating temperature is about 60 degrees Celsius, and the manufacturer does not invest much (about 28 ° degrees). Each heat dissipation is to meet its heat dissipation requirements, and the main heat dissipation problems are: The material with good thermal conductivity is used as the base plate and the bulk? ：: type, its “system” material… another—is limited in the bottom plate ::: Rude changed the heat sink from Ming material to increase the number of heat sinks; installation: possible colonization = product The second part located above the heat sink = the overall heat dissipation: it can not effectively reduce its temperature rise effect; :::: The blown system must consider its material ί: The material is selected by J. Amnesty prefers copper material for heat dissipation. The unit price is too much to blame, and it is not commercially available.::Steel:Molded=The body is basically more expensive than aluminum, and | ° 0 9 is the reason ... so for the unit volume, t, steel ; The specific gravity is about three times as large as that of Ming.

569662 V. Description of the invention (2) The overall cost is more than three times higher, so in order to solve the aforementioned deficiency, as shown in the patent case No. 89 1 1 0847, the heat sink 1 is mainly extruded from aluminum alloy ( (See the first two pictures.) 'The base 60 has a copper plate-shaped plate 6 1 under the base 60, and the plate 6 1 and the heat sink 6 are clamped on the work machine, respectively.' The rotating head base (not shown) drives the plate body 61 to run at a high speed. When the plate body 61 and the base 60 of the heat sink 6 come into contact and rub against each other, the joint surface is melted by the generated heat. At this time, the head body stops. Rotate, and then use another oil pusher to press and position it. After cooling, you must combine the plate 6 1 under the base 60 of the heat sink 6; however, the purpose of the aforementioned patent is to use a copper biscuit. The southern thermal conductivity coefficient is about 0.996 according to copper; the name is only about 82.82, so when the board 61 is attached to the integrated circuit, the heat can be quickly transferred to the board 61. In other words, the plate 6 1 provides the temperature of the integrated circuit to be rapidly diffused and conducted. The plate 6 1 has a large contact area. According to the calculation method of thermal conductivity, it can be known that the thermal conductivity Q = KA △ T / Η where K is the thermal conductivity coefficient; a is the conductive area; △ T is the temperature difference; η is length. Therefore, it can be seen that the thermal conductivity ⑽ is proportional to the conductive area; therefore, the board 61 can diffuse and conduct the heat of the integrated circuit on the one hand, and on the other hand, it has a larger contact area with the bottom plate 61 of the heat sink 6, and Achieve the best heat dissipation performance; although the above cases have been modified to cover the lack of bulky and high unit price of those using copper molding, in addition to the need for various tools in the manufacturing process, the most important thing is that the molding time is slow As for the combination of each heat sink 6 and the bottom plate 61, it needs to be positioned, rotated at high speed, thermally welded, and then squeezed and left to cool until it is cooled. Therefore, the productivity per unit time is very low, which is completely inconsistent with the purpose of economic mass production.

569662 V. Description of the invention (3) (3), new content: This creative method adopts the mutual use of high thermal conductivity to reduce the use of energy and reduce its original creative method, which is based on its overall original creative method. In addition to the basic, it also allows the main components of (4) and solid to be lightweight and borrowed from the machine to be manufactured into a secondary plate and bottom weight. Another purpose of the plate and bottom heating effect is to facilitate the addition of copper. The most important part of the mold is to increase the purpose. The plate system is divided into relative purposes. The board has a better quality and provides a aluminum material as the substrate. The squeezed system can greatly increase the product. Let the materials department provide a good combination. This kind of radiator base manufactures a long-shaped substrate, and the substrate and the bottom plate can be tightly rolled together, so the productivity per unit time can be greatly improved. This kind of radiator base is made of copper and copper, so the purchase cost can be reduced. This kind of heat sink base has the advantages of manufacturing

Please refer to Figures 3 to 5 for illustrations. This method of manufacturing a radiator base is based on the use of lightweight, easy-to-add aluminum material, and forming a long-shaped substrate with an extruded square. The bottom surface has rib grooves η. The bottom plate 2 is made of copper with a thermal conductivity of horses, and convex ribs 21 are provided on the joint surface corresponding to the substrate 丨 so that the bottom plate 2 can be axially fitted to the substrate 丨 bottom surface. After the base plate 1 and the bottom plate 2 are nested and tightly connected to each other, and the head section is cut to form a narrower portion 12, the narrower portion 2 can just be penetrated from a forming mold 3 with a convergent opening 30 and used The clamp 4 exerts a clamp on the narrow part 丨 2 with strong stress, and draws the substrate 1 and the base plate 2 which are tightly attached to each other through the opening 3 of the molding die 3, so that the substrate 1 and the base plate 2 are subject to the surrounding wall surface. Tight compression

Page 7 V. Description of the invention (4), according to the requirements of cutting the required rules (such as the fifth picture), and then length, you can form a maker of the base 10 (see the sixth picture). The government heat transfers the film 5 to complete the heat dissipation. In addition, in the advanced 创作 of the present invention, the joint surface of the substrate 1 is injured 7 > y Shi Qiuzhi method 'where the bottom plate 2 and 2 are mutually m = ΐ not shown), when the substrate 1 and the bottom plate are compressed by the Λ molding die when compressed. 30 and the surrounding wall surface is squeezed through through wearing fun B 主 生 # 丨; the mold 3 can be heated to a certain temperature and the last name as required! Ί Vigorous friction will generate heat, while using the substrate 1 and the bottom plate 2 = 5 pressure So that the solder paste can be densely infiltrated between the bonding surfaces of the substrate 2 and the base plate 2 by hot melting and high pressure, and has a similar effect of the caulking package, thereby making its bonding and heat dissipation effect more excellent. Continued to refer to the seventh and eighth figures, which are the three-dimensional appearance and combined cross-sectional view of another embodiment of the invention. It can be seen that the combined end face of the substrate 1 and the bottom plate 2a is provided with a dovetail groove 11a and a dovetail block 21 correspondingly. a, so that the base plate 1 a and the bottom plate 2 a can be embedded with each other, and squeezed and compressed by the surrounding wall surface of the opening 30 through the forming mold 3 to form a base 10 a ′, which can achieve simple positioning and prevent it from coming out. By.

Page 8 569662 Brief description of the drawings The first figure is an exploded perspective view of the patent case No. 8 9 0 1 1 8 4 7. The second figure is a combined perspective view of Patent No. 890 1 1 847. The third picture is the three-dimensional appearance of the base plate and the bottom plate of this creation. The fourth figure is a schematic diagram of the extrusion molding of this creation. The fifth figure is a molding sectional view of the radiator base of this creation. The sixth picture is the reference diagram of the use status of this creation. The seventh figure is a three-dimensional appearance view of a base plate and a base plate of another embodiment of the present invention. Figure 8 and Figure 7 are sectional views of the extruded base.

Description of drawing number: 1. Base plate 10, 10a, base 11, rib groove 11a, dovetail groove 1, 2, narrower portion 2, bottom plate 2, 1, rib 3, forming mold 4, fixture 2 1a, Hongwei block 30, Constriction mouth 5, cooling fins

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Claims (1)

569662 VI. Scope of patent application 1 quot__ 1 kind of manufacturing method of radiator base, mainly by forming a $ strip-shaped substrate, the bottom plate is made of metal material with high thermal conductivity, so that 2 bottom plates It can be axially fitted on the bottom surface of the substrate, and after the substrate and the bottom plate are sleeved with each other, and the head section is cut to form a narrower portion, the narrower portion can just pass out of a forming mold with a constriction. The clamp is used to clamp the narrower part with a strong stress °, and the substrate and the bottom plate which are nested and tightly attached to each other are pulled through the opening of the molding die, so that the substrate and the bottom plate are squeezed and compressed by the surrounding wall surface. One body, cut to the required length according to the requirements, can form a base, and then plant heat dissipation fins on the base to complete the manufacturer of the diffuser. … 2. The manufacturing method of the radiator base according to item 1 of the scope of patent application, wherein the joint surface of the base plate and the base plate is provided with convex ribs and rib grooves correspondingly, so that the base plate and the base plate can be provided with convex ribs and ribs. When the grooves are nested with each other, and when they are constricted by the forming mold and squeezed and compressed by the surrounding walls, the ribs and the rib grooves can achieve an average force, so that the base plate and the bottom plate are tightly bonded and rolled together. According to the manufacturing method of the radiator base described in item 1 or 2 of the scope of patent application, the substrate is extruded from aluminum, and the bottom plate is preferably copper. The manufacturing method of the radiator base according to item 1 or item 2 of the scope of patent application, wherein the joint surface of the base plate and the base plate is coated with solder paste, and when the base plate and the base plate are nested with each other, and the mouth is constricted by a molding die And when it is compressed by the surrounding wall surface, the molding die can be heated to a certain temperature, and its severe friction will generate heat when it passes through. At the same time, the combination of the substrate and the base plate is used to make the solder paste hot-melt and high-pressure and dense. Penetrate the knot between the substrate and the base plate 569662 6. Scope of applying for patent Those who have similar sealing and sealing performance in the joint surface. 5. The manufacturing method of the radiator base according to item 1 of the scope of patent application, wherein the joint end surface of the substrate and the bottom plate is provided with a dovetail groove and a dovetail block correspondingly, so that the substrate and the bottom plate can be intertwined by them, and When the mouth is constricted by the forming mold and squeezed and compressed by the surrounding wall surface, it can achieve better positioning and prevent it from coming out.