CN210324074U

CN210324074U - Double-semiconductor cooling mobile terminal heat dissipation device

Info

Publication number: CN210324074U
Application number: CN201921688963.XU
Authority: CN
Inventors: 曾健明
Original assignee: Individual
Current assignee: Individual
Priority date: 2019-10-10
Filing date: 2019-10-10
Publication date: 2020-04-14
Anticipated expiration: 2029-10-10

Abstract

The utility model discloses a double-semiconductor refrigeration mobile terminal heat dissipation device, which comprises a heat radiator body formed by a cooling plate and a heat radiator, wherein the cooling plate and the heat radiator form a containing space, and a fan is arranged on the heat radiator; the cooling plate is provided with a first heat conduction area and a second heat conduction area, the first heat conduction area is opposite to the CPU of the mobile terminal and is positioned in the accommodating space, and a first semiconductor refrigeration piece is arranged at the first heat conduction area; the second heat conduction area is opposite to the power supply position of the mobile terminal and is positioned in the containing space, and a second semiconductor refrigerating sheet is arranged at the second heat conduction area; the fan, the first semiconductor refrigeration piece and the second semiconductor refrigeration piece are connected to a power supply socket. This technique is owing to set up first semiconductor refrigeration piece and second semiconductor refrigeration piece, can greatly improve the radiating effect, can reduce whole heat abstractor's height dimension moreover.

Description

Double-semiconductor cooling mobile terminal heat dissipation device

Technical Field

The utility model belongs to the technical field of the mobile terminal radiator technique and specifically relates to a two semiconductor refrigeration mobile terminal heat abstractor.

Background

With the continuous development of network technologies, people can complete various activities such as office work, social contact and entertainment by connecting a mobile terminal to a network, and the mobile terminal becomes an essential element in daily life of people gradually, and the use frequency is higher and higher.

For example, when people use a mobile phone for a long time, the mobile phone generates heat, so that the running speed of the mobile phone is reduced, devices inside the mobile phone are seriously damaged, and the service life of the mobile phone is shortened.

The heat source generated by the mobile phone mainly comprises three parts, namely a CPU, a screen and a battery. The heat generation of the battery is in direct proportion to the brightness of the screen and the load of the CPU. The mobile phone has the advantages that the mobile phone is not cooled in time, the temperature is too high, the mobile phone has an automatic protection function, the CPU performs frequency reduction work, the screen brightness is reduced, the battery load is reduced, the active cooling is achieved, the displayed effect is that the operation of a mobile phone system is not smooth, the picture is blocked, the screen becomes dark, and the like, so that the experience of a user is seriously influenced.

With the popularization of large-scale mobile games and live broadcasts, the hardware resources of the mobile phone are continuously upgraded to meet the requirements of customer groups, which is mainly embodied as follows: A) mobile phone cpu (gpu) upgrading (for example, models a13, 855+, 990, etc.); b) Large screen mobile phones become mainstream (more than 6.5 inches); C) the battery capacity is getting larger (starting to approach 4000 MA); d) The technique of rapid charging is continuously perfected (18W- > 27W- >45W to 100W concept). The situation A and the situation B show that the power consumption is larger and larger in the mobile phone, and the heating of hardware is more and more severe; the situation C shows that the battery occupies space and heats itself, so that the heat dissipation environment inside the mobile phone is increasingly poor; the bottleneck of fast charging is whether the heat dissipation is fast enough during charging the battery.

The traditional mobile phone auxiliary heat dissipation technology comprises air cooling and water cooling. The air cooling effect is not obvious to the effect of the current mobile phone; water cooling is not mainstream due to restrictions of volume and use environment. The heat dissipation cooling source of the mobile phone in the current market only aims at the power consumption of a CPU part, most models suggest that a user is closely attached to the CPU, but the cooling effect on a battery and a screen is greatly reduced after the CPU is cooled. If a user uses high screen brightness and quick charging, a single cooling source cannot meet the cooling requirement, the CPU is slowed down and blocked due to insufficient heat dissipation, the screen brightness becomes dark, the quick charging is automatically adjusted to be in a common charging mode, and the like, and the cooling effect is famous and real.

Therefore, the above technical problem needs to be solved.

SUMMERY OF THE UTILITY MODEL

In order to overcome the not enough of prior art, the utility model provides a two semiconductor refrigeration mobile terminal heat abstractor, aim at solves the not good technical problem of current mobile terminal radiator radiating effect.

In order to solve the technical problem, the utility model provides a basic technical scheme does:

a double-semiconductor refrigeration mobile terminal heat dissipation device comprises a heat dissipation device body formed by a cooling plate and a heat dissipation device, wherein the cooling plate and the heat dissipation device form a containing space;

the cooling plate has thereon:

the first heat conduction area is opposite to the CPU of the mobile terminal and is positioned in the containing space, and a first semiconductor refrigeration piece is arranged at the first heat conduction area;

the second heat conduction area is opposite to the power supply position of the mobile terminal and is positioned in the containing space, and a second semiconductor refrigeration piece is arranged at the second heat conduction area;

the fan, the first semiconductor refrigeration piece and the second semiconductor refrigeration piece are connected to a power supply socket.

Further, the upper surface of at least one of the first semiconductor chilling plate and the second semiconductor chilling plate is in contact with the inner surface of the heat radiator.

Further, the fan is located above the position between the first semiconductor refrigeration piece and the second semiconductor refrigeration piece.

Further, the first heat conduction region and the second heat conduction region are formed by recessing the upper surface of the cooling plate inward.

Furthermore, the first heat conduction area and the second heat conduction area are through holes formed in the upper surface and the lower surface of the cooling plate, the first semiconductor refrigeration piece and the second semiconductor refrigeration piece are respectively arranged in the through holes, and the lower surfaces of the first semiconductor refrigeration piece and the second semiconductor refrigeration piece and the lower surface of the cooling plate are located on the same plane.

Further, the heat dissipation device further comprises a clamping assembly, and the clamping assembly comprises:

the first clamping part is positioned at the first end of the radiator and can stretch and retract relative to the first end;

the second clamping part is positioned at a second end, opposite to the first end, of the radiator and can stretch relative to the second end;

the first clamping part and the second clamping part form a clamping space for clamping the mobile terminal.

Furthermore, the first clamping part and the second clamping part are arranged along the direction of the distribution straight line of the first semiconductor refrigeration piece and the second semiconductor refrigeration piece.

Furthermore, first clamping part has the first joint portion of crooked to centre gripping space direction, the second clamping part has the second joint portion of crooked to centre gripping space direction, and this first joint portion and second joint portion are the elastic component, and first joint portion and second joint portion can produce the directive to mobile terminal when using the power of cooling plate.

Further, an assembly hole penetrating through the accommodating space and the external space is formed in the radiator, and the fan is arranged in the assembly hole.

Furthermore, the power supply interface is a MicroUSB interface or a USBTypeC interface.

The utility model has the advantages that:

the technical scheme of the utility model is that the heat dissipation device of the double-semiconductor refrigeration mobile terminal comprises a radiator body formed by a cooling plate and a radiator, wherein the cooling plate and the radiator form a containing space, and a fan is arranged on the radiator; the cooling plate is provided with a first heat conduction area and a second heat conduction area, the first heat conduction area is opposite to the CPU of the mobile terminal and is positioned in the accommodating space, and a first semiconductor refrigeration piece is arranged at the first heat conduction area; the second heat conduction area is opposite to the power supply position of the mobile terminal and is positioned in the containing space, and a second semiconductor refrigerating sheet is arranged at the second heat conduction area; the fan, the first semiconductor refrigeration piece and the second semiconductor refrigeration piece are connected to a power supply socket. This technique is owing to set up first semiconductor refrigeration piece and second semiconductor refrigeration piece, can greatly improve the radiating effect, can reduce whole heat abstractor's height dimension moreover.

Drawings

Fig. 1 is a schematic view of the appearance of a heat dissipation device for a dual semiconductor refrigeration mobile terminal according to the present invention;

FIG. 2 is an exploded view of a dual semiconductor refrigeration mobile terminal heat sink;

FIG. 3 is a cross-sectional view of a dual semiconductor refrigeration mobile terminal heat sink;

FIG. 4 is a schematic diagram of electrical connections of the fan, the first semiconductor chilling plate and the second semiconductor chilling plate;

fig. 5 is a test graph.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to fig. 1 to 5, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that, if directional indications (such as upper, lower, left, right, front and rear … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are changed accordingly.

The double-semiconductor refrigeration mobile terminal heat dissipation device comprises a heat dissipation device body formed by a cooling plate 1 and a heat dissipation device 2, wherein the cooling plate 1 and the heat dissipation device 2 form a containing space 3, and a fan 4 is arranged on the heat dissipation device 2; the cooling plate 1 is provided with a first heat conduction area 11 and a second heat conduction area 12, the first heat conduction area 11 is opposite to the CPU position of the mobile terminal and is positioned in the accommodating space 3, and the first semiconductor refrigerating sheet 5 is arranged at the first heat conduction area 11; the second heat conduction area 12 is opposite to the power supply position of the mobile terminal and is positioned in the containing space 3, and a second semiconductor refrigerating sheet 6 is arranged at the second heat conduction area 12; the fan 4, the first semiconductor refrigeration piece 5 and the second semiconductor refrigeration piece 6 are connected to a power supply socket 8.

During operation, first semiconductor refrigeration piece 5 can carry out quick heat conduction to the just right CPU of first heat conduction region 11, second semiconductor refrigeration piece 6 can carry out quick heat conduction to the just right power of second heat conduction region 12, and the heat of being derived by first semiconductor refrigeration piece 5 and second semiconductor refrigeration piece 6 is dispersed in the atmosphere by radiator 2 and fan 4, realizes dispelling the heat fast, improves the radiating effect.

It should be understood that, in the actual use process, the CPU and the power supply of the mobile terminal both generate a large amount of heat, so that the scheme of this embodiment can greatly conduct and dissipate heat quickly for two main heat sources, and can improve the heat dissipation effect of the whole heat sink. Meanwhile, due to the fact that the two heat sources are subjected to independent semiconductor refrigeration pieces for heat dissipation, the thickness of the whole radiator 2 can be reduced on the premise that the heat dissipation effect is guaranteed, namely the heat dissipation effect is greatly improved on the one hand, the thickness of the radiator 2 is reduced on the other hand, the thickness of the heat dissipation device is smaller, the whole center is closer to the mobile terminal when the heat dissipation device is matched with the mobile terminal for use, and the user experience can be improved.

Wherein, the power supply interface 8 is a MicroUSB interface or a USBTypeC interface. Therefore, the power supply is realized by being connected with an external power supply.

The first heat conduction area 11 is opposite to the CPU of the mobile terminal, so that the CPU can conduct heat quickly, and the second heat conduction area 12 is opposite to the power supply of the mobile terminal, so that the power supply can conduct heat quickly. The dimensions of the first and second

heat conducting areas

11 and 12 may be selected according to the CPU and power supply size of a specific mobile terminal. Generally, the size of a CPU is small, the first semiconductor refrigeration piece 5 can completely cover the CPU under the orthographic projection, the size of a power supply is large, and the human semiconductor refrigeration piece 6 under the orthographic projection is located in the middle of the power supply.

In detail, in order to better achieve the heat conduction, the upper surface of at least one of the first semiconductor chilling plate 5 and the second semiconductor chilling plate 6 is in contact with the inner surface of the heat sink 2. Namely, the heat can be quickly conducted to the radiator 2 by contacting the radiator 2, and then the heat is radiated by the radiator 2 and the fan 4. Preferably, the upper surfaces of the first semiconductor chilling plate 5 and the second semiconductor chilling plate 6 are both in contact with the inner surface of the heat sink 2. It should be understood that the inner surface herein refers to a surface of the heat sink 2 located in the receiving space 3 and facing the cooling plate 1.

Further, the fan 4 is located above the position between the first semiconductor chilling plate 5 and the second semiconductor chilling plate 6, as shown in fig. 2 and 3. Because the fan 4 is located the position between two semiconductor refrigeration pieces, it is close to two semiconductor refrigeration pieces simultaneously, consequently can be fine realize driving the air flow of two semiconductor refrigeration piece near regions, dispel the heat with higher speed, improve the radiating effect. In particular, the fan 4 is arranged directly above the area between two semiconductor chilling plates. In some embodiments, the heat sink 2 is internally formed with a fitting hole 21 penetrating the receiving space 3 and the external space, and the fan is disposed in the fitting hole 21. That is, the fan 4 is housed inside the heat sink 2, which can reduce the thickness of the entire heat sink, and thus make the heat sink more compact.

In detail, the first heat conduction area 11 and the second heat conduction area 12 select specific areas according to different mobile terminals. Specifically, in some embodiments, the first heat conduction region 11 and the second heat conduction region 12 are formed by the upper surface of the cooling plate 1 being recessed inward. Therefore, on one hand, the distance between the semiconductor refrigerating sheet and the mobile terminal to be radiated can be reduced, and a better heat conduction effect can be achieved; on the other hand, the semiconductor refrigerating sheet can be conveniently installed to ensure that the semiconductor refrigerating sheet is right opposite to the CPU and the power supply. In the manufacturing process, two grooves capable of facing corresponding CPUs and power supplies are pre-pressed and formed for different types of mobile terminals to form the first heat conduction area 11 and the second heat conduction area 12 respectively.

In some other embodiments, the first heat conducting area 11 and the second heat conducting area 12 are through holes penetrating through the upper surface and the lower surface of the cooling plate 1, the first semiconductor chilling plate 5 and the second semiconductor chilling plate 6 are respectively disposed in the through holes, and the lower surfaces of the first semiconductor chilling plate 5 and the second semiconductor chilling plate 6 and the lower surface of the cooling plate 1 are located on the same plane. Namely, the first semiconductor refrigerating sheet 5 and the second semiconductor refrigerating sheet 6 are directly used for contacting with the mobile terminal without passing through the cooling plate 1, so that the semiconductor refrigerating sheets are favorable for leading out the heat of the CPU and the power supply more quickly.

In addition, in order to realize the clamping of the mobile terminal, the heat sink further comprises a clamping assembly 7, the clamping assembly 7 is provided with a first clamping part 71 and a second clamping part 72, and the first clamping part 71 is positioned at the first end of the heat sink 2 and can be extended and retracted relative to the first end; the second clamping part 72 is located at a second end of the heat sink 2 opposite to the first end and can be extended and retracted relative to the second end; the first and

second clamping portions

71 and 72 form a clamping space for clamping the mobile terminal. When the mobile terminal clamping device is used, the first clamping portion 71 and the second clamping portion 72 are pulled outwards by force for a certain distance, then the mobile terminal is placed in the clamping space, and finally the first clamping portion 71 and the second clamping portion 72 are released, so that the mobile terminal is clamped and fixed by the first clamping portion 71 and the second clamping portion 72.

Specifically, the first clamping portion 71 and the second clamping portion 72 are arranged along the direction of the distribution line of the first semiconductor chilling plate 5 and the second semiconductor chilling plate 6. I.e. the clamping assembly 7 along both sides of the CPU and power distribution direction, which facilitates better contact between the mobile terminal and the cooling plate 1 for improved heat dissipation.

Preferably, as shown in fig. 3, the first clamping portion 71 has a first clamping portion 711 bending toward the clamping space, the second clamping portion 72 has a second clamping portion 721 bending toward the clamping space, the first clamping portion 711 and the second clamping portion 721 are elastic members, and the first clamping portion 711 and the second clamping portion 721 can generate a force toward the cooling plate 7 to the mobile terminal when in use. Through this scheme, produce the power of pointing to cooling plate 7 to mobile terminal and can guarantee mobile terminal and cooling plate 7 in close contact with and the clearance does not appear and lead to the heat conduction effect to worsen. Specifically, when the inner sides of the first clamping portion 711 and the second clamping portion 721 are contacted with the mobile terminal, a separation is generated towards the cooling plate 1, so that the mobile terminal and the cooling plate 1 are ensured to be closely contacted when the mobile terminal is clamped, and an excellent heat conduction effect is ensured.

The following is a specific test data of the present solution.

The first semiconductor refrigerating piece 5 and the second semiconductor refrigerating piece 6 in the test both adopt 4902 type semiconductor refrigerating pieces, the size of the semiconductor refrigerating pieces is 20m'm by 20m'm, the standard voltage is below 5.7V, the maximum current is 2A, and the maximum refrigerating power is 7.41 QM.

The comparative example is a conventional radiator.

The test time unit is seconds.

And (3) testing conditions are as follows: the test tool is a probe type thermometer (error 1 degree), a stopwatch and a thermometer probe which are directly contacted with the cooling plate, and a 3M sponge adhesive tape is used for isolating the outside and contacting with the probe; the test prototype is IPHONE MAX; the areas of the radiator 2 and the cooling plate 1 are both 50m'm by 120m', and the area of the cooling plate is large enough to ensure that a sufficient cooling surface is provided.

The testing steps are as follows: the traditional radiator of a single semiconductor refrigerating sheet and the heat radiating device of the scheme are assembled with a prototype for use, and the probe is adhered to the surface of the cooling plate.

And (3) testing results:

through actual measurement, 2 4902 type semiconductor refrigerating chips work simultaneously, the stable current is about 3.1A, and the normal work of a double-semiconductor refrigerating system can be met by using the conventional mobile phone quick-charging charger or a charger with a quick-charging function; and a special arc-shaped aluminum radiator and a turbofan are matched to ensure enough heat dissipation.

The actual measurement shows that the temperature of the whole cooling plate can be reduced to below 10 ℃ within 2 minutes and can be stabilized to about 7 ℃ within 4 minutes at the room temperature of 27 ℃.

Through tests, under the condition that a protective shell is arranged, a certain large-scale 3D hand game is opened, 18W quick charging is carried out at the same time according to the setting of a mainstream picture (the brightness is maximum, the picture is smooth, the highest refresh rate), no screen is darkened within 30 minutes, the mobile phone is stuck, and the like, the whole temperature of the mobile phone is not greatly different from the room temperature, and the whole effect reaches the design target.

In a word, the technical scheme adopts the two semiconductor refrigerating sheets to work simultaneously, so that the refrigerating capacity is doubled compared with the heat dissipation effect of the traditional radiator. Specifically, as shown in fig. 5, the temperature of the conventional heat sink is stabilized at about 16 ℃, and the temperature of the heat dissipation device of the present solution is stabilized at about 7 ℃, so that the heat dissipation effect is more than twice as good as that of the conventional heat sink. Through the simultaneous operation of the double semiconductor refrigerating sheets, the mobile phone can be effectively ensured to have sufficient heat dissipation efficiency. In the figure, the ordinate represents temperature (. degree. C.) and the abscissa represents time (sec).

Variations and modifications to the above-described embodiments may occur to those skilled in the art, in light of the above teachings and teachings. Therefore, the present invention is not limited to the specific embodiments disclosed and described above, and some modifications and changes to the present invention should fall within the protection scope of the claims of the present invention. Furthermore, although specific terms are employed herein, they are used in a generic and descriptive sense only and not for purposes of limitation.

Claims

1. The utility model provides a two semiconductor refrigeration mobile terminal heat abstractor which characterized in that: comprises a radiator body formed by a cooling plate (1) and a radiator (2), wherein the cooling plate (1) and the radiator (2) form a containing space (3), and a fan (4) is arranged on the radiator (2);

the cooling plate (1) has thereon:

the first heat conduction area (11), the first heat conduction area (11) is opposite to the CPU position of the mobile terminal and is positioned in the containing space (3), and a first semiconductor refrigeration sheet (5) is arranged at the first heat conduction area (11);

the second heat conduction area (12), the second heat conduction area (12) is opposite to the power supply position of the mobile terminal and is positioned in the containing space (3), and a second semiconductor refrigerating sheet (6) is arranged at the second heat conduction area (12);

the fan (4), the first semiconductor refrigeration piece (5) and the second semiconductor refrigeration piece (6) are connected to a power supply socket (8).

2. The heat sink for a dual-semiconductor refrigeration mobile terminal as claimed in claim 1, wherein:

the upper surface of at least one of the first semiconductor refrigerating sheet (5) and the second semiconductor refrigerating sheet (6) is in contact with the inner surface of the radiator (2).

3. The heat sink for a dual-semiconductor refrigeration mobile terminal as claimed in claim 1, wherein:

the fan (4) is positioned above the position between the first semiconductor refrigerating sheet (5) and the second semiconductor refrigerating sheet (6).

4. The heat sink for a dual-semiconductor refrigeration mobile terminal as claimed in claim 1, wherein:

the first heat conduction region (11) and the second heat conduction region (12) are formed by the upper surface of the cooling plate (1) being recessed inward.

5. The heat sink for a dual-semiconductor refrigeration mobile terminal as claimed in claim 1, wherein:

first heat conduction region (11) and second heat conduction region (12) are for running through the through-hole of surface about cooling plate (1), first semiconductor refrigeration piece (5) and second semiconductor refrigeration piece (6) set up respectively in the through-hole, and the lower surface of this first semiconductor refrigeration piece (5) and second semiconductor refrigeration piece (6) is located coplanar with the lower surface of cooling plate (1).

6. The heat sink for a dual-semiconductor refrigeration mobile terminal as claimed in claim 1, wherein:

the heat sink further comprises a clamping assembly (7), the clamping assembly (7) having:

a first clamping section (71) which is positioned at a first end of the radiator (2) and can be extended and retracted relative to the first end;

a second clamping portion (72) which is positioned at a second end of the radiator (2) opposite to the first end and can stretch and contract relative to the second end;

the first clamping part (71) and the second clamping part (72) form a clamping space for clamping the mobile terminal.

7. The heat dissipation device for a dual-semiconductor refrigeration mobile terminal as recited in claim 6, wherein:

the first clamping portion (71) and the second clamping portion (72) are arranged along the direction of the distribution straight line of the first semiconductor refrigeration piece (5) and the second semiconductor refrigeration piece (6).

8. The heat dissipation device for a dual-semiconductor refrigeration mobile terminal as recited in claim 6, wherein:

the first clamping portion (71) is provided with a first clamping portion (711) bending towards the clamping space direction, the second clamping portion (72) is provided with a second clamping portion (721) bending towards the clamping space direction, the first clamping portion (711) and the second clamping portion (721) are elastic pieces, and the first clamping portion (711) and the second clamping portion (721) can generate force pointing to the cooling plate (1) for the mobile terminal when in use.

9. The heat sink for a dual-semiconductor refrigeration mobile terminal as claimed in claim 1, wherein: the radiator (2) is internally provided with a mounting hole (21) which penetrates through the accommodating space (3) and the external space, and the fan is arranged in the mounting hole (21).

10. The heat sink for a dual-semiconductor refrigeration mobile terminal as claimed in claim 1, wherein: the power supply socket (8) is a MicroUSB interface or a USBTypeC interface.