CN210225890U - Vehicle-mounted multimedia host - Google Patents
Vehicle-mounted multimedia host Download PDFInfo
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- CN210225890U CN210225890U CN201920586146.7U CN201920586146U CN210225890U CN 210225890 U CN210225890 U CN 210225890U CN 201920586146 U CN201920586146 U CN 201920586146U CN 210225890 U CN210225890 U CN 210225890U
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 29
- 238000003780 insertion Methods 0.000 claims description 2
- 230000037431 insertion Effects 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 6
- 238000003466 welding Methods 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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Abstract
The utility model provides an on-vehicle multimedia host computer, on-vehicle multimedia host computer includes: a vehicle machine housing; the upper cover and the car machine shell are assembled to form an accommodating cavity; the main board is accommodated in the accommodating cavity, and the chip assembly is fixed on the main board; the heat dissipation assembly is arranged above the chip assembly and used for dissipating heat generated by the chip assembly during working; wherein the chip assembly is fixed on the main board through a BTB connector. Based on the embodiment of the utility model provides an on-vehicle multimedia host passes through the BTB connector with the chip subassembly and fixes the setting on the mainboard for the chip subassembly has the replaceability, has improved the replacement efficiency that host computer function replacement or function promoted.
Description
Technical Field
The utility model relates to the technical field of automobiles, especially, relate to an on-vehicle multimedia host computer.
Background
The vehicle-mounted multimedia host machine, called a vehicle machine for short, is used for being installed in a vehicle cab. The car machine mainly includes the mainboard, nuclear core plate and other structures, to traditional car machine structure, nuclear core plate directly sets up on the mainboard, nuclear core plate is the important part on the car machine, each component or overall arrangement commonality except that nuclear core plate on the mainboard are stronger, to the car machine of different functions or model, the function of required nuclear core plate is probably different, and nuclear core plate lug weld is on the mainboard, consequently, to different car machines, the different mainboard of the development that needs pertinence, not only cause the waste of material like this, development cost is high, development cycle also can be longer.
SUMMERY OF THE UTILITY MODEL
The utility model provides an on-vehicle multimedia host computer is in order to overcome above-mentioned problem or solve above-mentioned problem at least partially.
According to the utility model discloses an aspect provides an on-vehicle multimedia host computer, a serial communication port, on-vehicle multimedia host computer includes:
a vehicle machine housing;
the upper cover and the car machine shell are assembled to form an accommodating cavity;
the main board is accommodated in the accommodating cavity, and the chip assembly is fixed on the main board; and
the heat dissipation assembly is arranged above the chip assembly and used for dissipating heat generated by the chip assembly during working;
wherein the chip assembly is fixed on the main board through a BTB connector.
Optionally, the BTB connector comprises a male board and a female board, and the male board and the female board of the BTB connector can be in plug-in fit;
a male board of the BTB connector is arranged on the chip assembly, and a mother board of the BTB connector is arranged on the main board;
the chip assembly is connected with the main board through the plug-in connection of the male board and the mother board.
Optionally, the BTB connector comprises a male board and a female board, and the male board and the female board of the BTB connector can be in plug-in fit;
a male board of the BTB connector is arranged on the main board, and a mother board of the BTB connector is arranged on the chip assembly;
the chip assembly is connected with the main board through the insertion of the mother board and the male board.
Optionally, the in-vehicle multimedia host further includes: a support;
the support is arranged on the main board and between the chip components and used for bearing the chip components.
Optionally, a plurality of screws are also included;
the heat dissipation assembly is fixed on the car machine shell through the plurality of screws.
Optionally, the heat dissipation assembly includes a thermal pad and a heat sink sequentially disposed above the chip assembly, the thermal pad being bonded to the chip assembly.
Optionally, the support includes a plurality of supporting legs, each supporting leg is provided with a plurality of first screw holes, the heat sink is provided with a plurality of second screw holes, and the first screw holes correspond to the second screw holes in position;
the plurality of screws respectively penetrate the second screw holes, the first screw holes and the mainboard and simultaneously fix the radiating fins and the support on the car machine shell.
Optionally, the car machine housing includes:
a base plate;
two side plates connected to opposite edges of the bottom plate; and
the front cover and the rear cover are oppositely arranged;
the front cover and the rear cover are connected with the two side plates, and the bottom plate, the front cover and the two side plates are integrally formed;
the rear cover is detachably connected with the two side plates and the bottom plate.
Optionally, the cover body of the front cover is provided with a plurality of first heat dissipation holes, and the plurality of first heat dissipation holes correspond to the fixing positions of the chip assemblies.
Optionally, the cover body of the upper cover is provided with a plurality of second heat dissipation holes, and the plurality of second heat dissipation holes are located above the chip assembly.
The embodiment of the utility model provides a traditional welding mode has been abandoned to on-vehicle multimedia host computer, passes through the BTB connector with the chip subassembly and fixes the setting on the mainboard for the chip subassembly has the replaceability, has improved the replacement efficiency that host computer function replacement or function promoted, has not only reduced the development cost of different function host computers, has still shortened the development time of different function host computers.
The above description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood, the present invention may be implemented according to the content of the description, and in order to make the above and other objects, features, and advantages of the present invention more obvious and understandable, the following detailed description of the present invention is given.
The above and other objects, advantages and features of the present invention will become more apparent to those skilled in the art from the following detailed description of specific embodiments thereof, taken in conjunction with the accompanying drawings.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to refer to like parts throughout the drawings. In the drawings:
fig. 1 is a schematic diagram of an overall structure of a vehicle-mounted multimedia host according to an embodiment of the present invention;
fig. 2 is an exploded schematic view of the vehicle-mounted multimedia host according to an embodiment of the present invention;
fig. 3 is a schematic diagram of a male plate of a BTB connector according to an embodiment of the present invention;
fig. 4 is a schematic diagram of a motherboard of a BTB connector according to an embodiment of the present invention;
fig. 5 is a schematic diagram of a support structure according to an embodiment of the present invention.
Detailed Description
Exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the invention are shown in the drawings, it should be understood that the invention can be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.
Fig. 1 and fig. 2 respectively show the overall schematic diagram and the explosion schematic diagram of the vehicle-mounted multimedia host 100 structure provided by the embodiment of the present invention, and as can be seen from fig. 1 and fig. 2, the vehicle-mounted multimedia host 100 for the embodiment of the present invention can include: a vehicle machine housing 110; an upper cover 120, the upper cover 120 and the car machine shell 110 being assembled to form an accommodating cavity 130; a main board 140 received in the receiving cavity 130 and a chip assembly 150 fixed on the main board 140; the heat dissipation assembly 160 is arranged above the chip assembly 150 and used for dissipating heat generated by the chip assembly 150 during operation; the chip assembly 150 is fixed on the motherboard 140 by the BTB connector 170. Mainboard 140 in this embodiment is the main control part of on-vehicle multimedia host computer 100, can be including controlling a plurality of subassemblies of on-vehicle multimedia host computer 100 (car machine for short) work on the mainboard 140, and chip subassembly 150 is the chipset then, is main control chip component part in whole mainboard 140, the utility model discloses a chip subassembly 150 can be the subassembly that a plurality of control chip that set up on PCB constitute.
The embodiment of the utility model provides a traditional welding mode has been abandoned to on-vehicle multimedia host computer 100, passes through BTB connector 170 with chip subassembly 150 and fixes the setting on mainboard 140 for chip subassembly 150 has the replaceability, has improved the replacement efficiency that host computer function replacement or function promoted, has not only reduced the development cost of different function host computers, has still shortened the development time of different function host computers. The chip assembly mentioned in this embodiment may constitute a core board in a vehicle-mounted multimedia host.
As can be seen from fig. 1 and 2, the car-mounted machine housing 110 may include: a base plate 111; two side plates 112 connected to opposite edges of the bottom plate 111; and a front cover 113 and a rear cover 114 disposed oppositely; the front cover 113 and the rear cover 114 are connected with the two opposite side plates 112, and the bottom plate 111, the front cover 113 and the two side plates 112 are integrally formed; the rear cover 114 is detachably connected to the opposite side plates 112 and the bottom plate 111. A plurality of first heat dissipation holes 1131 and second heat dissipation holes 121 may be further disposed on the front cover 113 and the cover body of the upper cover 120, respectively, and the plurality of first heat dissipation holes 1131 and the plurality of second heat dissipation holes 121 may be disposed corresponding to the fixing positions of the chip assembly 150 to assist in dissipating heat generated during the operation of the chip assembly 150 in the accommodating cavity 130. Taking the chip module 150 shown in fig. 2 as an example, the chip module 150 is fixed on the main board 140 and is close to the joint of the front cover 113 and one side plate 112, and when a plurality of first heat dissipation holes 1131 are formed in the front cover 113, the chip module 150 can be disposed in the region of the front cover 113 close to the chip module 150. Similarly, a plurality of second heat dissipation holes 121 are disposed in the fixing region of the cover of the upper cover 120 close to the chip assembly 150, and specifically, a plurality of second heat dissipation holes 121 may be disposed above the chip assembly 150 to perform targeted heat dissipation on the main working components in the receiving cavity 130. Optionally, the number, shape and position of the first and second louvers 1131, 121 can also be adjusted according to actual requirements, the utility model discloses do not do the restriction.
The BTB connector 170 is used as a connecting device between the chip assembly 150 and the motherboard 140, so that the connected chip assembly 150 and the motherboard 140 can be mechanically and electrically connected, and is characterized in that a male connector and a female connector are used in a matching manner. The BTB connector 170 may include a male board 171 and a female board 172, as shown in fig. 3 and 4, respectively, and the male board 171 and the female board 172 of the BTB connector 170 may be plug-fit.
The embodiment of the utility model provides an in can set up the public board and the mother board of BTB connector 170 respectively on chip subassembly 150 and mainboard 140, the cooperation of can pegging graft of public board and mother board two, and then chip subassembly 150 pegs graft on the mainboard board through BTB connector 170, realizes mainboard and chip subassembly 150's connection.
In an optional embodiment of the present invention, as shown in fig. 2, a male board 171 of the BTB connector 170 may be disposed on the chip assembly 150, a motherboard 172 of the BTB connector 170 is disposed on the motherboard 140, and the chip assembly 150 is connected to the motherboard 140 by plugging the male board 171 and the motherboard 172.
In addition to the above, the chip module 150 may further include a male board 171 provided with the BTB connector 170 on the main board 140, and a female board 172 provided with the BTB connector 170 on the chip module 150; the chip assembly 150 is connected to the main board 140 by plugging the mother board 172 and the male board 171. That is to say, in the specific setting, only the male board or the template of the BTB connector 170 needs to be respectively disposed on the main board 140 and the chip assembly 150, and specifically, whether the male board or the female board is disposed on the main board 140 can be selected according to different requirements.
As can be seen from fig. 2, the vehicle-mounted multimedia host 100 according to the embodiment of the present invention may further include a bracket 180; the support frame 180 is disposed on the main board 140 and between the chip components 150 for carrying the chip components 150.
A plurality of screws 190 may also be provided; the heat sink assembly 160 may be secured to the vehicle housing 110 by a plurality of screws 190. The bracket 180 comprises a plurality of supporting legs 181, a plurality of first screw holes 182 are formed on each supporting leg 181, a plurality of second screw holes 161 are formed on the heat dissipation assembly 160, and the first screw holes 182 correspond to the second screw holes 161 in position; the plurality of screws 190 sequentially pass through the second screw holes 161, the first screw holes 182 and the main plate 140 to fix the heat sink assembly 160 and the bracket 180 to the vehicle body housing 110, and specifically, each screw 190 passes through the main plate 140 to fix the heat sink assembly 160 and the bracket 180 to the vehicle body base plate.
The heat sink assembly 160 may include a thermal pad (not shown) and a heat sink 162 sequentially disposed over the chip assembly 150, the thermal pad being disposed between the heat sink 162 and the chip assembly 150. In this embodiment, the heat sink 162 may include a plurality of heat dissipation fins, and is disposed on the heat conduction pad in parallel to dissipate heat transferred by the heat conduction pad with respect to the chip assembly.
Based on the utility model provides a when on-vehicle multimedia host carries out the change of chip subassembly 150, the step is as follows:
1. the upper cover 120 is detached;
2. disassembling the plurality of screws 190, and first removing the heat dissipation assembly 160 from the main board 140;
3. the chip assembly 150 is pulled off from the main board 140, and then a new chip assembly is mounted, and then the original heat dissipation assembly is fixed on the shell of the car machine through screws.
In the vehicle-mounted multimedia host provided by the utility model, the support and the main board (such as a PCB board) can be connected through the BTB, and the contact between the boards is good; the chip assembly is fixed on the car machine shell through the screw locking, so that the chip assembly can be directly replaced when the function of the core board needs to be changed or the core board needs to be upgraded, the layout and the structure of the mainboard of the car machine do not need to be changed, development cost is reduced, and the development period is shortened.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments can be modified or some or all of the technical features can be equivalently replaced within the spirit and principle of the present invention; such modifications and substitutions do not depart from the scope of the present invention.
Claims (10)
1. An in-vehicle multimedia host, comprising:
a vehicle machine housing;
the upper cover and the car machine shell are assembled to form an accommodating cavity;
the main board is accommodated in the accommodating cavity, and the chip assembly is fixed on the main board; and
the heat dissipation assembly is arranged above the chip assembly and used for dissipating heat generated by the chip assembly during working;
wherein the chip assembly is fixed on the main board through a BTB connector.
2. The multimedia host of claim 1, wherein the BTB connector comprises a male board and a female board, the male board and the female board of the BTB connector being pluggable to mate;
a male board of the BTB connector is arranged on the chip assembly, and a mother board of the BTB connector is arranged on the main board;
the chip assembly is connected with the main board through the plug-in connection of the male board and the mother board.
3. The multimedia host of claim 1, wherein the BTB connector comprises a male board and a female board, the male board and the female board of the BTB connector being pluggable to mate;
a male board of the BTB connector is arranged on the main board, and a mother board of the BTB connector is arranged on the chip assembly;
the chip assembly is connected with the main board through the insertion of the mother board and the male board.
4. The on-vehicle multimedia host of claim 1, further comprising: a support;
the support is arranged on the main board and between the chip components and used for bearing the chip components.
5. The on-board multimedia host of claim 4, further comprising a plurality of screws;
the heat dissipation assembly is fixed on the car machine shell through the plurality of screws.
6. The on-vehicle multimedia host of claim 5,
the heat dissipation assembly comprises a heat conduction pad and a heat dissipation sheet which are sequentially arranged above the chip assembly, and the heat conduction pad is bonded on the chip assembly.
7. The on-vehicle multimedia host of claim 6,
the support comprises a plurality of supporting legs, a plurality of first screw holes are formed in each supporting leg, a plurality of second screw holes are formed in the radiating fins, and the first screw holes correspond to the second screw holes in position;
the plurality of screws respectively penetrate the second screw holes, the first screw holes and the mainboard and simultaneously fix the radiating fins and the support on the car machine shell.
8. The on-vehicle multimedia host of any one of claims 1-7, wherein the on-vehicle housing comprises:
a base plate;
two side plates connected to opposite edges of the bottom plate; and
the front cover and the rear cover are oppositely arranged;
the front cover and the rear cover are connected with the two side plates, and the bottom plate, the front cover and the two side plates are integrally formed;
the rear cover is detachably connected with the two side plates and the bottom plate.
9. The on-vehicle multimedia host of claim 8, wherein the cover of the front cover is provided with a plurality of first heat dissipation holes, and the plurality of first heat dissipation holes are disposed corresponding to the fixing positions of the chip assembly.
10. The on-vehicle multimedia host of any one of claims 1 to 7, wherein the cover of the upper cover is provided with a plurality of second heat dissipation holes, and the plurality of second heat dissipation holes are located above the chip assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920586146.7U CN210225890U (en) | 2019-04-26 | 2019-04-26 | Vehicle-mounted multimedia host |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920586146.7U CN210225890U (en) | 2019-04-26 | 2019-04-26 | Vehicle-mounted multimedia host |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210225890U true CN210225890U (en) | 2020-03-31 |
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ID=69924266
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920586146.7U Active CN210225890U (en) | 2019-04-26 | 2019-04-26 | Vehicle-mounted multimedia host |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210225890U (en) |
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2019
- 2019-04-26 CN CN201920586146.7U patent/CN210225890U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220324 Address after: 430051 No. b1336, chuanggu startup area, taizihu cultural Digital Creative Industry Park, No. 18, Shenlong Avenue, Wuhan Economic and Technological Development Zone, Wuhan, Hubei Province Patentee after: Yikatong (Hubei) Technology Co.,Ltd. Address before: No.c101, chuanggu start up area, taizihu cultural Digital Industrial Park, No.18 Shenlong Avenue, Wuhan Economic Development Zone, Hubei Province Patentee before: HUBEI ECARX TECHNOLOGY Co.,Ltd. |
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| TR01 | Transfer of patent right |