CN107135627B - Automobile sound equipment navigation host and automatic assembly method thereof - Google Patents

Abstract

The invention relates to the field of automobile sound navigation, and discloses an automobile sound navigation host, which comprises a U frame with an integrated surface cover, a core support cover with an integrated core cover and a core support, a core dustproof plastic suction cover, a core assembly, an integrated modularized PCB mainboard assembly, a host bottom cover and radiating fins. By adopting the technical scheme, the purpose of automatic assembly can be realized, and the automatic production capacity and the stability are improved.

Description

Automobile sound equipment navigation host and automatic assembly method thereof

Technical Field

The invention relates to the field of automobile navigation, in particular to an automobile sound navigation host and an automatic assembly method thereof.

Background

With the progress of the technology, the automatic production is the trend of the manufacturing development, and the existing automobile sound navigation product manufacturing process has the defects of multidirectional and multi-angle assembly, complex structure matching, small and compact assembly guide, need of pasting double faced adhesive tape, small and low part positioning, more thread throwing, more wire arrangement and the like, and cannot meet the requirement of automatic production.

Disclosure of Invention

In view of the foregoing problems, an object of the embodiments of the present invention is to provide a car audio navigation host and an automatic assembly method thereof, so as to achieve the purpose of achieving automatic assembly and improve automatic production capacity and stability.

The embodiment of the invention provides a car audio navigation host, which comprises a U frame with an integrated surface cover, a core support cover with an integrated core cover and a core support, a core dustproof plastic suction cover, a core assembly, an integrated modularized PCB main board assembly, a host bottom cover and radiating fins.

Optionally, a fixing boss is arranged on the U frame, and the core dust-proof plastic cover is provided with a rubber sleeve matched with the fixing boss and used for fixing the position of the core dust-proof plastic cover on the U frame.

Optionally, the boss is provided with the core support cover installation guide positioning column.

Optionally, a guide positioning piece for installing a cooling fin is arranged on the U-shaped frame.

Optionally, the movement bracket cover is provided with the movement assembly mounting guide boss.

Optionally, a host bottom cover guiding positioning column is arranged on the U frame.

Optionally, the U frame is provided with a mounting and positioning bolt of an integrated modular PCB motherboard assembly.

Optionally, the integrated modular PCB motherboard assembly is provided with a grounding strip, the grounding strip being grounded through the bottom cover.

Optionally, the integrated modular PCB motherboard assembly integrates each functional module onto the PCB motherboard assembly by SMT automated tape-out reflow soldering.

The embodiment of the invention also provides an automatic assembly method of the car audio navigation host, which comprises the following steps:

(1) taking out the U frame and loading the U frame on a tooling plate;

(2) installing the dustproof plastic suction cover of the machine core into the U frame;

(3) taking out the core assembly and loading the core assembly on a tooling plate;

(4) sleeving a core bracket cover into the core assembly and fixing;

(5) taking out the core assembly with the core bracket cover from the tooling plate, loading the core assembly into the U-shaped frame and fixing the core assembly;

(6) installing an integrated modular PCB mainboard assembly into the U frame;

(7) the host bottom cover is arranged in the U-shaped frame and fixed, and the host is turned for 90 degrees;

(8) and (4) installing the radiating fins into the U-shaped frame and fixing the radiating fins.

Therefore, by applying the technical scheme of the embodiment, the assembly is performed layer by layer from bottom to top, so that the assembly action and direction are simplified, and the automatic production is more convenient to introduce. The complexity of multi-surface assembly and the waste of actions of changing directions back and forth are reduced, the stability of automatic assembly is improved, and the purpose of automatic assembly is achieved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

FIG. 1 is a schematic structural diagram of a car audio navigation host according to the present invention;

FIG. 2 is a schematic diagram of a U-frame structure according to the present invention;

FIG. 3 is a schematic view of a heat sink structure according to the present invention;

fig. 4 is a schematic structural diagram of a core support cover provided by the invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Example (b):

the embodiment provides a car audio navigation host computer, as shown in fig. 1, the host computer includes a U frame 10 of the integrated design of the integrated cover, a core support cover 20 of the integrated design of the integrated cover and the core support, a core dustproof plastic-absorbing cover 30, a core assembly 40, an integrated modularized PCB main board assembly 50, a host bottom cover 60, and a heat sink 70.

As shown in fig. 2, a fixing boss 11 of the core dust-proof plastic cover 30 is designed on the U frame 10, the core dust-proof plastic cover 30 is provided with a rubber sleeve 31 adapted to the fixing boss 11, and the fixing boss 11 is used for fixing a position where the core dust-proof plastic cover 30 is installed on the U frame. The height of the fixing boss 11 also serves as the height for positioning the movement holder cover 20. The fixed boss 11 is provided with a cylindrical conical guiding positioning column 12 with the height of 2mm for guiding and positioning when the movement support cover 20 is automatically assembled, and the movement support cover 20 is further provided with a guiding and positioning boss for guiding and positioning the assembly of the movement assembly component 40.

The U-frame 10 is further designed with a guiding and positioning column 13 of the PCB main board assembly 50 and the host bottom cover 60 for guiding and positioning when the integrated modular PCB main board assembly 50 and the host bottom cover 60 are assembled.

The edge of the U-shaped frame 10 is further designed with a left-right direction loading guide matching angle 14 of the main machine bottom cover 60 for guide matching during assembling of the main machine bottom cover 60, and the U-shaped frame 10 is further designed with a main machine bottom cover 60 guide matching positioning column 15 for guiding and positioning in the front-back direction during matching assembling of the main machine bottom cover 60, so that the manipulator is accurately positioned and guided in during assembling. The U-frame 10 is also provided with mounting and positioning pegs for the integral modular PCB motherboard assembly 50.

Generally, in order to achieve certain test indexes, the car audio navigation host needs to connect the main board assembly with the housing so as to achieve the effect of reliable grounding. In the prior art, a mode of soldering and grounding by twisting pins is generally adopted, and the process is complicated. In the present embodiment, the U-frame 10 is further provided with a grounding strip 16, as shown in fig. 3, the grounding strip 16 locks the integrated modular PCB main board assembly 50 and the host bottom cover 60 to be grounded through screws.

As shown in fig. 3, the U frame 10 is further designed with two guiding and positioning pieces 17 with a height of 4mm and a 90 ° intersection, respectively, for guiding and positioning when the heat sink 70 is assembled, the 90 ° intersection of the guiding and positioning pieces 17 is used for guiding the installation of the heat sink 70 and positioning the front, rear, left and right positions of the heat sink 70, and the height of 4mm is used for positioning the longitudinal position of the heat sink 70.

As shown in fig. 4, the movement holder cover 20 is further designed with a positioning hole 21 for positioning when the U frame 10 is assembled, the movement holder cover 20 is further designed with a guide boss 22 of the movement assembly 40 for guiding and positioning when the movement assembly 40 is assembled, the movement holder cover 20 is further designed with a positioning hole 23 for positioning a lock screw when the movement assembly 40 is assembled, and the integrated movement holder cover 20 is designed with an inclination for positioning an inclination angle of the movement assembly 40.

In the prior art, the host portion often has a plurality of functional modules, and these functional modules need a plurality of PCB assemblies to implement, such as a motherboard assembly, a radio module assembly, an SD card module assembly, a navigation module assembly, an input/output socket assembly, and so on, and these assemblies often need to be connected with the motherboard assembly by a plurality of connection methods, including but not limited to a flat cable, a socket, a solder, and a pin header. Therefore, the internal interfaces of the host are easy to be numerous, the wire harnesses are messy, and the implementation of an automatic production method is very unfavorable.

In this embodiment, the integrated modular PCB board assembly 50 adopts a standardized modular design, that is, the integrated modular PCB board assembly 50 integrates each functional module into the PCB board assembly by SMT automatic mounting and reflow soldering. An integral modular jack is also employed that is assembled to the integral modular PCB motherboard assembly 50. The deck assembly 40 is connected to the integrated modular PCB motherboard assembly 50 by a flex cable.

Due to the design of mounting, guiding and positioning of the automatic assembly matching component, the assembly guiding of the automatic assembly and the stability of the component after being mounted are improved. Through the host structure integration modular design, do benefit to automated assembly production, improve production efficiency.

The embodiment also provides an automatic assembling method of the car audio navigation host, which comprises the following steps:

(1) the U-frame 10 is taken out and mounted on the tooling plate.

In specific implementation, the manipulator takes the U frame 10 out of a preset material storage place, for example, a packaging blister box on an automatic feeding machine, moves the U frame to an automatic tooling plate production line, and after aligning the positioning groove of the U frame 10 on the automatic tooling plate, loads the U frame 10 onto the automatic tooling plate.

(2) And installing the dustproof plastic suction cover 30 of the movement into the U-shaped frame 10.

In specific implementation, the manipulator takes out the core dust-proof blister cover 30 from a preset material storage place, for example, a packaging blister box on an automatic feeding machine, moves the core dust-proof blister cover 30 to an automatic tooling plate production line, aligns the fixing boss 11 of the core dust-proof blister cover 30 on the U frame 10, and then loads the core dust-proof blister cover 30 into the U frame 10, so that the core dust-proof blister cover 30 and the rubber sleeve 31 are matched and tightly sleeved on the fixing boss 11 of the U frame 10.

(3) The cartridge holder cover 20 is nested into the cartridge assembly 40.

In specific implementation, the mechanical arm takes the core assembly 40 out of a preset material storage place, for example, a packaging blister box on an automatic feeding machine, moves to an automatic tooling plate production line, and places the core assembly into a tooling plate positioning groove, then the mechanical arm takes the core support cover 20 out of the preset material storage place, for example, the packaging blister box on the automatic feeding machine, moves to the automatic tooling plate production line, sleeves the core assembly 40 along the guide boss 22, overturns the arm, sucks the screw, and locks and fixes the screw by using an electric screwdriver.

(4) And (3) loading the movement assembly with the movement bracket cover into the U-shaped frame 10 and fixing.

In specific implementation, the mechanical arm takes the movement assembly 40 provided with the movement support cover 30 out of the automatic tooling plate production line, aligns the cylindrical and conical guide positioning column 12 on the positioning boss 11 of the U frame 10, then puts the movement assembly into the U frame 10, turns over the arm of the mechanical arm, sucks screws and locks and fixes the screws by using an electric screwdriver.

(5) An integral modular PCB motherboard assembly 50 is loaded into the U-frame 10.

In specific implementation, the integrated modular PCB main board assembly 50 is taken out from a preset material storage place, such as a turnover box, and moved to an automatic tooling board production line, and is loaded into the U-frame 10 after aligning the integrated modular PCB main board assembly 50 and the guiding positioning columns 13 of the main machine bottom cover 60.

(6) The host bottom cover 60 is fitted into the U-frame 10 and fixed, and the host is turned over by 90 °.

In specific implementation, the manipulator takes the host bottom cover 60 out of a preset material storage place, for example, a packaging blister box on an automatic feeding machine, moves the host bottom cover to an automatic tooling plate production line, aligns the integrated modularized PCB main board assembly 50 and the guiding positioning column 13 of the host bottom cover 60, then loads the host bottom cover 60 into the U-shaped frame 10, turns over an arm of the manipulator, sucks screws, locks and fixes the host bottom cover by using an electric screwdriver, and turns over the arm again to turn over the host by 90 degrees.

(7) The heat sink 70 is fitted into the U frame 10 and fixed.

In specific implementation, the manipulator takes the heat sink 70 out of a preset material storage place, for example, a packaging blister box on an automatic feeding machine, the manipulator turns over 90 degrees to move the heat sink 70 to an automatic hot oil scattering device to be coated with heat sink oil, then the manipulator turns over 90 degrees to move the heat sink 70 to an automatic tooling plate production line, and after aligning two 90-degree crossed heat sink guide positioning pieces 17, the heat sink is loaded into the U-shaped frame 10, the manipulator turns over an arm to absorb screws, and the heat sink is locked and fixed by using an electric screwdriver.

The fixation between the components may be, but is not limited to, a standardized screw-lock fixation.

The automatic assembly mode solves the directionality of automatic assembly, namely the assembly of successive layer superposition from bottom to top conforms to the assembly process of the natural gravity rule vertical superposition type, simplifies the assembly action and the direction, is more convenient for leading in automatic production, reduces the complexity of multi-surface assembly and the action waste of back-and-forth direction conversion, increases the stability of automatic assembly, improves the automatic manufacturing capacity of product production, and achieves the aim of realizing automatic assembly.

The above-described embodiments do not limit the scope of the present invention. Any modification, equivalent replacement, and improvement made within the spirit and principle of the above-described embodiments should be included in the protection scope of the technical solution.

Claims (8)

1. A car stereo navigation host computer, wherein, the host computer includes gathering the U frame that the face cover integrated design, gathering the core cover and core support cover integrated design of core cover, core dustproof plastic uptake cover, core assembly, integrative modularization PCB main board assembly, host computer bottom cover, air-cooling fin;

the U frame is provided with a fixing boss, and the machine core dustproof plastic suction cover is provided with a rubber sleeve matched with the fixing boss and used for fixing the position of the machine core dustproof plastic suction cover on the U frame; and the boss is provided with the core bracket cover installation guide positioning column.

2. The car audio navigation system of claim 1, wherein the U-frame is provided with heat sink mounting guide locator tabs.

3. The car audio navigation host of claim 2, wherein the core bracket is covered with the core assembly mounting guide boss.

4. The car audio navigation system of claim 3, wherein the U-frame has a bottom guide positioning post.

5. The car audio navigation host of claim 4, wherein the U-frame is provided with a mounting detent for an integral modular PCB motherboard assembly.

6. The car audio navigation host of claim 5, wherein the integrated modular PCB board assembly is provided with a grounding tab, the grounding tab being grounded through the bottom cover.

7. The car audio navigation host of claim 6, wherein the integrated modular PCB board assembly integrates the functional modules onto the PCB board assembly by SMT automated tape-and-die reflow soldering.

8. The automatic assembling method of car audio navigation host computer according to claim 1, comprising:

(1) taking out the U frame and loading the U frame on a tooling plate;

(2) installing the dustproof plastic suction cover of the machine core into the U frame;

(3) taking out the core assembly and loading the core assembly on a tooling plate;

(4) sleeving a core bracket cover into the core assembly and fixing;

(5) taking out the core assembly with the core bracket cover from the tooling plate, loading the core assembly into the U-shaped frame and fixing the core assembly;

(6) installing an integrated modular PCB mainboard assembly into the U frame;

(7) the host bottom cover is arranged in the U-shaped frame and fixed, and the host is turned for 90 degrees;

(8) and (4) installing the radiating fins into the U-shaped frame and fixing the radiating fins.

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