CN210225885U - Circuit board and circuit board via hole structure - Google Patents
Circuit board and circuit board via hole structure Download PDFInfo
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- CN210225885U CN210225885U CN201921134535.2U CN201921134535U CN210225885U CN 210225885 U CN210225885 U CN 210225885U CN 201921134535 U CN201921134535 U CN 201921134535U CN 210225885 U CN210225885 U CN 210225885U
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- circuit board
- via hole
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- 230000002349 favourable effect Effects 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 210000000988 bone and bone Anatomy 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The utility model discloses a circuit board and circuit board via hole structure, circuit board via hole structure include from last to down first signal layer, mistake aperture layer and the second signal layer that distributes in proper order, and first signal layer is equipped with rectangle Anti-Pad structure, and Anti-Pad structure in the mistake aperture layer and the Anti-Pad structure in the second signal layer all are different with rectangle Anti-Pad structure. Through setting up rectangle Anti-Pad structure with first signal layer in this application, can hang down the electric capacity of circuit board via hole structure, need not to increase the distance between the high-speed difference hole to, be favorable to improving under the condition of characteristic, reduce circuit board via hole structure's whole volume, reduction product cost.
Description
Technical Field
The embodiment of the utility model provides a circuit board and circuit board via hole structure is especially related to in the technical field of the circuit board.
Background
With the development of technology, the high performance and high speed of electronic products are more and more emphasized, and as the signal speed is faster and faster, the number of the circuit boards to be used is more and more. When signals are transmitted through the circuit printing plate, the size and the characteristics of the plate material space become parts which need to be considered simultaneously.
The prior art via structure usually reduces the capacitance and improves the 32G characteristic by increasing the distance between the two vias, but this approach results in an increase in the overall volume and cost of the circuit board via structure.
Therefore, how to provide a circuit board and a via structure of the circuit board that solve the above technical problems becomes a problem to be solved by those skilled in the art.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model provides a circuit board and circuit board via hole structure is favorable to under the condition of improving the characteristic in the use, reduces circuit board via hole structure's whole volume, reduction product cost.
In order to solve the technical problem, the embodiment of the utility model provides a circuit board via hole structure, include from last to first signal layer, the via hole layer and the second signal layer that distribute in proper order down, first signal layer is equipped with rectangle Anti-Pad structure, Anti-Pad structure in the via hole layer with Anti-Pad structure in the second signal layer all with rectangle Anti-Pad structure is different.
Optionally, the Anti-Pad structure in the via layer is an annular Anti-Pad.
Optionally, the Anti-Pad structure in the second signal layer is an elliptical Anti-Pad structure.
Optionally, two opposite sides of the rectangular Anti-Pad structure perpendicular to a central connection line of the two via holes are respectively tangent to outer contour lines of the two ground hole pads, and a distance between the two opposite sides is greater than a distance between the other two opposite sides.
Optionally, the rectangular Anti-Pad structure is rectangular.
Optionally, a distance between two opposite sides perpendicular to a central connecting line of the two via holes in the rectangular Anti-Pad structure is greater than a distance between the other two opposite sides.
An embodiment of the utility model provides a circuit board, include as above-mentioned circuit board via hole structure.
The embodiment of the utility model provides a circuit board and circuit board via hole structure, circuit board via hole structure include from last to down first signal layer, mistake aperture layer and the second signal layer that distributes in proper order, and first signal layer is equipped with rectangle Anti-Pad structure, and Anti-Pad structure in the mistake aperture layer and the Anti-Pad structure in the second signal layer all are different with rectangle Anti-Pad structure. Therefore, the first signal layer is provided with the rectangular Anti-Pad structure, so that the capacitance of the circuit board via hole structure can be reduced, the distance between high-speed differential pair holes does not need to be increased, the overall size of the circuit board via hole structure is reduced, and the product cost is reduced under the condition of improving the characteristics.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required in the prior art and the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a circuit board via hole structure according to an embodiment of the present invention;
fig. 2 is a schematic top view of a first signal layer according to an embodiment of the present invention;
fig. 3 is a schematic top view of a via layer according to an embodiment of the present invention;
fig. 4 is a schematic top view of a second signal layer according to an embodiment of the present invention;
FIG. 5 is a graph illustrating insertion loss simulation for a circuit board via structure according to the prior art;
FIG. 6 is a Smith chart corresponding to a prior art circuit board via structure;
fig. 7 is an insertion loss simulation diagram corresponding to the via hole structure of the circuit board provided in the embodiment of the present invention;
fig. 8 is a smith chart corresponding to the circuit board via hole structure provided by the embodiment of the present invention.
Detailed Description
The embodiment of the utility model provides a circuit board and circuit board via hole structure is favorable to under the condition of improving the characteristic in the use, reduces circuit board via hole structure's whole volume, reduction product cost.
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a circuit board via structure according to an embodiment of the present invention.
The circuit board via hole structure comprises a first signal layer 1, a via hole layer 2 and a second signal layer 3 which are sequentially distributed from top to bottom, wherein the first signal layer 1 is provided with a rectangular Anti-Pad structure 11, and an Anti-Pad structure 21 in the via hole layer 2 and an Anti-Pad structure 31 in the second signal layer 3 are different from the rectangular Anti-Pad structure 11.
It should be noted that, in the present embodiment, the capacitance of the circuit board via structure can be reduced by increasing the inductance, the Anti-Pad in the uppermost first signal layer 1 may be set as a rectangular Anti-Pad, and referring to fig. 2, the ground layer around the Pad 13 of the high-speed differential pair hole 12 in the first signal layer 1 may be cut, the ground plane within the rectangular area is removed as shown, thereby forming a rectangular Anti-Pad structure 11, because the grounding layer in the rectangular range is removed, the capacitance of the circuit board via hole structure can be reduced, in addition, the Anti-Pad structure 21 in the via layer 2 and the Anti-Pad structure 31 in the second signal layer 3 are different from the rectangular Anti-Pad structure 11, therefore, the capacitance can be reduced, and the inductance can not be greatly increased, so that the performance of the via hole structure can be better improved. Compared with the prior art, the characteristic that the via hole structure is improved by the aid of the reduced space is utilized, and the distance between two via holes does not need to be increased.
Specifically, in order to further ensure that the capacitance of the via structure can be reduced, two opposite sides of the rectangular Anti-Pad structure 11 perpendicular to the connecting line of the centers of the two vias are respectively tangent to the outer contour lines of the ground via pads 14 on the corresponding sides, as shown in fig. 2.
The rectangular Anti-Pad structure 11 in this embodiment may be specifically a rectangle, and a long side of the rectangle is along a direction of a connection line between centers of two via holes in the high-speed differential pair hole, that is, a distance between two opposite sides is greater than a distance between the other two opposite sides.
Further, in order to further improve the characteristics of the via structure, the Anti-Pad structure 21 in the via layer 2 in the embodiment may be a ring-shaped Anti-Pad structure, as shown in fig. 3.
Furthermore, the Anti-Pad structure 31 in the second signal layer 3 in the present embodiment may be an elliptical Anti-Pad structure, as shown in fig. 4, that is, the signal is routed out of the line and then the dog bone is made into the Anti-Pad structure 31. Set up first signal layer 1, Anti-Pad structure in via hole layer 2 and the second signal layer 3 into the rectangle respectively in this application, annular and oval-shaped to can be through adjusting the capacitive reduction that makes circuit board via hole structure to every layer Anti-Pad structural parameter, and guarantee that the inductance can not have great increase, thereby improve the characteristic of circuit board via hole structure, be favorable to making circuit board via hole structure keep 26 mil's interval, increase the line space of walking on the PCB board.
Specifically, the capacitance C is 1.41 ∈ T · D1/(D1-D2) and the inductance L is 5.08h [ ln (4h/D) +1], where D1 is the diameter of the isolation hole drilled in the ground layer, D2 is the diameter of the via pad, T is the thickness of the PCB board, ∈ is the dielectric constant of the board substrate, L is the inductance of the via hole, h is the length of the via hole, and D is the diameter of the center drilled hole, as shown in fig. 3. Through simulation software, the LOSS of the via can be obtained, and the comparator SMITH CHART and the LOSS characteristic of LOSS can be obtained, specifically referring to fig. 5 to 8, it can be seen that compared with the prior art, the capacitive LOSS can be reduced, the via LOSS can be effectively reduced, 16G LOSS is improved, LOSS is improved by 50%, and the 32G characteristic can be improved corresponding to the application level.
The embodiment of the utility model provides a circuit board via hole structure, circuit board via hole structure include from last to down first signal layer, the punishment in marriage layer and the second signal layer that distributes in proper order, and first signal layer is equipped with rectangle Anti-Pad structure, and Anti-Pad structure in the punishment in marriage layer and the Anti-Pad structure in the second signal layer all is different with rectangle Anti-Pad structure. Therefore, the first signal layer is provided with the rectangular Anti-Pad structure, so that the capacitance of the circuit board via hole structure can be reduced, the distance between high-speed differential pair holes does not need to be increased, the overall size of the circuit board via hole structure is reduced, and the product cost is reduced under the condition of improving the characteristics.
On the basis of the above embodiment, the embodiment of the utility model provides a circuit board, include as above-mentioned circuit board via hole structure.
It should be noted that the circuit board bath in this embodiment has the same beneficial effects as the circuit board via hole structure provided in the above embodiment, and for the circuit board via hole structure related in this embodiment, please refer to the above embodiment, which is not described herein again.
It should also be noted that in this specification, terms such as "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (7)
1. A circuit board via hole structure is characterized by comprising a first signal layer, a via hole layer and a second signal layer which are sequentially distributed from top to bottom, wherein the first signal layer is provided with a rectangular Anti-Pad structure, and the Anti-Pad structure in the via hole layer and the Anti-Pad structure in the second signal layer are different from the rectangular Anti-Pad structure.
2. The circuit board via structure of claim 1, wherein the Anti-Pad structure in the via layer is a ring-shaped Anti-Pad.
3. The circuit board via structure of claim 2, wherein the Anti-Pad structure in the second signal layer is an elliptical Anti-Pad.
4. The circuit board via structure according to any one of claims 1 to 3, wherein two opposite sides of the rectangular Anti-Pad structure perpendicular to the connecting line of the centers of the two vias are tangent to the outer contour lines of the two ground via pads, respectively.
5. The circuit board via structure of claim 4, wherein the rectangular Anti-Pad structure is rectangular.
6. The circuit board via structure of claim 5, wherein a distance between two opposing sides of the rectangular Anti-Pad structure perpendicular to a line connecting centers of two vias is greater than a distance between the other two opposing sides.
7. A circuit board comprising the circuit board via structure of any one of claims 1 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921134535.2U CN210225885U (en) | 2019-07-18 | 2019-07-18 | Circuit board and circuit board via hole structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921134535.2U CN210225885U (en) | 2019-07-18 | 2019-07-18 | Circuit board and circuit board via hole structure |
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| Publication Number | Publication Date |
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| CN210225885U true CN210225885U (en) | 2020-03-31 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201921134535.2U Active CN210225885U (en) | 2019-07-18 | 2019-07-18 | Circuit board and circuit board via hole structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112580294A (en) * | 2020-12-30 | 2021-03-30 | 芯和半导体科技(上海)有限公司 | Cutting method of PCB layout |
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2019
- 2019-07-18 CN CN201921134535.2U patent/CN210225885U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112580294A (en) * | 2020-12-30 | 2021-03-30 | 芯和半导体科技(上海)有限公司 | Cutting method of PCB layout |
| CN112580294B (en) * | 2020-12-30 | 2023-12-19 | 芯和半导体科技（上海）股份有限公司 | Cutting method of PCB layout |
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