CN210221334U - Thermal resistance measuring device - Google Patents
Thermal resistance measuring device Download PDFInfo
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- CN210221334U CN210221334U CN201921181000.0U CN201921181000U CN210221334U CN 210221334 U CN210221334 U CN 210221334U CN 201921181000 U CN201921181000 U CN 201921181000U CN 210221334 U CN210221334 U CN 210221334U
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Abstract
A thermal resistance measurement device comprising: the device comprises a Microcontroller (MCU) module and a signal gating module connected with the MCU module; the signal gating module comprises a multiplexer connected with the MCU module, is connected with each data channel with preset number of lines capable of supporting three-line system and four-line system wiring, and is used for gating the data channels through the multiplexer. The embodiment of the utility model provides a thermal resistance measuring device's measurement accuracy has been promoted.
Description
Technical Field
The present disclosure relates to, but not limited to, power electronics, and more particularly to a thermal resistance measuring device.
Background
The thermal resistance measuring device is a device which determines the temperature of equipment or environment on a measuring site according to collected thermal resistance signals by collecting the thermal resistance signals.
At present, thermal resistance testing equipment is mainly applied to production places such as thermal power, hydropower, chemical power generation and the like; because the production place has no special requirements on the performance of the thermal resistance measuring device, the design of the thermal resistance measuring device mainly takes the cost as a main consideration factor, and the thermal resistance testing equipment has the problems of low precision, non-circuit isolation, weak electromagnetic compatibility (EMC) resistance and the like.
In the nuclear power production process, equipment or environment temperature of nuclear power production also needs to be determined, and the existing thermal resistance measuring device cannot meet the nuclear power production site in performance, so that the thermal resistance measuring device capable of meeting the performance requirements is designed, and the problem to be solved by rapid personnel is solved.
SUMMERY OF THE UTILITY MODEL
The following is a summary of the subject matter described in detail herein. This summary is not intended to limit the scope of the claims.
The embodiment of the utility model provides a thermal resistance measuring device can promote thermal resistance measuring device's measuring working property.
An embodiment of the utility model provides a thermal resistance measuring device, include: the device comprises a Microcontroller (MCU) module and a signal gating module connected with the MCU module; wherein the content of the first and second substances,
the signal gating module comprises a multiplexer connected with the MCU module, is connected with each data channel with preset number of lines capable of supporting three-line system and four-line system wiring, and is used for gating the data channels through the multiplexer.
In an exemplary embodiment, the thermal resistance measuring apparatus further includes a magnetic coupling isolation module, a first end of the magnetic coupling isolation module is connected to the signal gating module, and the magnetic coupling isolation module includes magnetic coupling isolation chips independently disposed on each data channel, and is configured to:
electrically isolating an external data signal from an internal data signal of the thermal resistance measurement device.
In an exemplary embodiment, the thermal resistance measurement device further comprises a front-end processing module for:
and preprocessing the thermal resistance signal received by the thermal resistance measuring device.
In an exemplary embodiment, the thermal resistance measuring apparatus further includes an analog-to-digital conversion module, an input end of the analog-to-digital conversion module is connected to an output end of the front-end processing module, an output end of the analog-to-digital conversion module is connected to the second end of the magnetic coupling isolation module, and the analog-to-digital conversion module includes analog-to-digital conversion chips that are independently disposed on each data channel, and are configured to:
and performing analog-to-digital conversion processing on the data signal on the data channel through an analog-to-digital conversion chip on the data channel.
In an exemplary embodiment, the thermal resistance measuring device further includes: the FPGA module, the input port of FPGA module is connected with outside central controller, output port with the MCU module is connected for:
and receiving a control instruction from the central controller, converting the received control instruction into parallel port data, and sending the parallel port data to the MCU module.
In an exemplary embodiment, the FPGA module and the central controller are connected by a redundant serial bus.
In an exemplary embodiment, the FPGA module is connected to the MCU module through an internally integrated dual-port random access memory RAM.
In an exemplary embodiment, the thermal resistance measuring apparatus further includes an FPGA download debugging module for:
and downloading and debugging the FPGA module.
In an exemplary embodiment, the thermal resistance measuring device further includes: the FPGA resetting module is used for:
and resetting the FPGA module.
Compared with the related art, the technical scheme of the application comprises the following steps: the device comprises a Microcontroller (MCU) module and a signal gating module connected with the MCU module; the signal gating module comprises a multiplexer connected with the MCU module, is connected with each data channel with preset number of lines capable of supporting three-line system and four-line system wiring, and is used for gating the data channels through the multiplexer. The embodiment of the utility model provides a thermal resistance measuring device's measurement accuracy has been promoted.
The embodiment of the utility model provides a thermal resistance measuring device's communication quality has been promoted. Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
Drawings
The accompanying drawings are included to provide a further understanding of the embodiments of the present invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the embodiments of the invention and not to limit the embodiments of the invention.
FIG. 1 is a block diagram of a thermal resistance measuring device according to an embodiment of the present invention;
fig. 2 is a block diagram of a thermal resistance measuring device according to another embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be noted that the embodiments and features of the embodiments in the present application may be arbitrarily combined with each other without conflict.
The steps illustrated in the flow charts of the figures may be performed in a computer system such as a set of computer-executable instructions. Also, while a logical order is shown in the flow diagrams, in some cases, the steps shown or described may be performed in an order different than here.
At present, the thermal resistance measuring device in use in the related technology can not meet the production with higher requirements in terms of performance, the inventor analyzes the composition of the prior thermal resistance measuring device, and the prior thermal resistance measuring device has the advantages of less data path and low precision; the processing process has the following problems that after the thermal resistance measuring device receives a thermal resistance signal, the only optical coupling relay in the device gates a data path and enters the only AD conversion chip for conversion processing, and due to the fact that only one optical coupling relay and one AD conversion chip are arranged, the existing thermal resistance measuring device cannot achieve circuit isolation, and the electromagnetic compatibility (EMC) resistance is weak.
Fig. 1 is a block diagram of a thermal resistance measuring apparatus according to an embodiment of the present invention, as shown in fig. 1, including: the device comprises a Microcontroller (MCU) module and a signal gating module connected with the MCU module; wherein the content of the first and second substances,
the signal gating module comprises a multiplexer connected with the MCU module, is connected with each data channel with preset number of lines capable of supporting three-line system and four-line system wiring, and is used for gating the data channels through the multiplexer.
It should be noted that, referring to the theory related to circuit design, the data channel capable of supporting three-wire system and four-limited wiring includes, but is not limited to, 8-way data channel; theoretically, the more the number of data channels is, the higher the accuracy of the thermal resistance measuring device is. Compared with the prior art, the embodiment of the utility model provides an increase data channel's way number, promoted thermal resistance measuring device's precision, can satisfy the temperature detection including equipment and environment including nuclear power production. Use 8 data channel as an example, the embodiment of the utility model provides a can carry out 8 data channel's gating through a multiplexer and handle, effectively reduced the use of the Serial Peripheral Interface (SPI) interface of MCU module, make the SPI interface resource of MCU module obtain more effectual application, through setting up 8 data channel, can effectively reduce the quantity of on-the-spot fastener, reduce manufacturing cost.
Furthermore, in an exemplary embodiment, the MCU module may be constructed primarily from a single chip microcomputer model STM 32. The STM32 single chip microcomputer adopts an Arm kernel with wide application, has rich integrated interfaces, integrates communication and other functional components, has excellent real-time performance, power consumption control and the like, and has low development cost.
In an exemplary embodiment, the utility model discloses thermal resistance measuring device still includes magnetic coupling isolation module, the first end that magnetic coupling isolated the module with signal gating module connects, magnetic coupling isolation module includes the magnetic coupling isolation chip that all independently sets up on each way data channel for:
electrically isolating an external data signal from an internal data signal of the thermal resistance measurement device.
The embodiment of the utility model provides a through set up corresponding magnetic coupling isolation chip respectively for each data channel, carried out electrical isolation with the outside data signal of thermal resistance measuring device and inside data signal, guaranteed the safety and stability of the core components and parts including the MCU module in the thermal resistance measuring device.
In an exemplary embodiment, the thermal resistance measuring device of the present invention further comprises a front-end processing module for:
and preprocessing the thermal resistance signal received by the thermal resistance measuring device.
It should be noted that, the front-end processing module according to the embodiment of the present invention may include the following circuits: protection circuit, filtering and noise reduction circuit, etc. The algorithm involved in the preprocessing may include an arithmetic processing method existing in the related art.
In an exemplary embodiment, the utility model discloses thermal resistance measuring device still includes analog-to-digital conversion module, analog-to-digital conversion module's input is connected with front end processing module's output, the output with the second end of magnetic coupling isolation module is connected, analog-to-digital conversion module includes the analog-to-digital conversion chip that all independently set up on each way data channel for:
and performing analog-to-digital conversion processing on the data signal on the data channel through an analog-to-digital conversion chip on the data channel.
According to the above description, the two ends of the magnetic coupling isolation module according to the embodiment of the present invention are respectively connected to the module conversion module and the front-end processing module.
According to the embodiment of the invention, the analog-to-digital conversion chip is arranged for each data channel, so that the channel isolation of the data channels is realized, and the electrical connection between adjacent channels is avoided.
In an exemplary embodiment, the thermal resistance measuring device of the present invention further includes: the Field Programmable Gate Array (FPGA) module, the input port of FPGA module is connected with outside central controller, output port and the MCU module is connected for:
and receiving a control instruction from the central controller, converting the received control instruction into parallel port data, and sending the parallel port data to the MCU module.
In one exemplary embodiment, the FPGA module may be built primarily from an FPGA chip of model LFXP 2.
It should be noted that, the protocol conversion between the control command and the parallel port data in the embodiment of the information in the present application can be implemented by referring to the existing conversion method in the related art; the embodiment of the present invention provides a Control instruction, which may include an instruction of a High-Level Data Link Control protocol (HDLC). Because the adjustment takes place for the design of components and parts, the embodiment of the utility model provides a MCU that no longer chooses for use integrated HDLC protocol interface carries out control command's receipt and conversion, through the FPGA module of being connected with the MCU module, can reduce MCU's operand to promote thermal resistance measuring device's stability.
In an exemplary embodiment, the FPGA module is connected to the central controller via a redundant serial bus. Here, the serial bus connecting the FPGA module and the central controller includes, but is not limited to, a redundant RS485 serial bus. The central controller is the controller which is externally connected with the thermal resistance measuring device of the utility model.
In an exemplary embodiment, the thermal resistance measuring device FPGA module is connected with the MCU module through an internally integrated dual-port random access memory RAM.
It should be noted that the FPGA module and the MCU module of the embodiment of the present invention may also be connected in other manners; generally, to ensure stable output transmission, redundant communication lines are used for connection, and when a communication failure occurs in one channel, switching can be performed to a redundant channel, and redundant signals include, but are not limited to, clock redundancy and data redundancy.
In an exemplary embodiment, the thermal resistance measuring apparatus further includes an FPGA download debugging module for:
and downloading and debugging the FPGA module.
It should be noted that the FPGA download debugging module may include a corresponding data transmission line and a power supply circuit, and the FPGA module may be debugged in a serial download manner according to an embodiment of the present invention; the serial downloading mode requires less lead occupation for debugging, and the PCB wiring is convenient while the occupied space is reduced. The downloading and debugging of the FPGA module refers to that after the FPGA module is connected with the power supply circuit through the data transmission line, the application program is downloaded into the FPGA module, and then the debugging is performed by adopting the existing FPGA development principle in the related art, and the application and the downloading and debugging method related to the downloading and debugging can be performed by referring to the related principle of software development, which is not described herein again.
In an exemplary embodiment, the thermal resistance measuring device further includes: the FPGA resetting module is used for:
and resetting the FPGA module.
It should be noted that, the thermal resistance measuring apparatus according to the embodiment of the present invention may further include one or more of the following modules: the device comprises a power supply module, a power supply monitoring device, an MCU debugging and downloading module, an MCU resetting module and the like.
Compared with the related art, the technical scheme of the application comprises the following steps: the device comprises a Microcontroller (MCU) module and a signal gating module connected with the MCU module; the signal gating module is connected with a data channel with preset paths capable of supporting three-wire system and four-wire system wiring and used for gating the data channel through a multiplexer connected with the microcontroller. The embodiment of the utility model provides a thermal resistance measuring device's measurement accuracy has been promoted.
Fig. 2 is a block diagram of a thermal resistance measuring device according to another embodiment of the present invention, which, in addition to fig. 1, as shown in fig. 2, further includes one or more of the following modules: the device comprises a power supply module, power supply monitoring equipment, an MCU debugging and downloading module and an MCU resetting module;
in an exemplary embodiment, the power module is configured to: converting the accessed power supply into a power supply signal required by an internal component of the thermal resistance measuring device; here, the internal components that need to be powered include, but are not limited to: a power monitoring module and an LDO module (the LDO module mainly includes peripheral circuits necessary for chip operation, such as a voltage conversion chip, for example, a chip converting 5V to 3.3V or a chip converting 3.3V to 1.8V); the voltages of the power supply signals required by the internal components may include: 5 volts (V), 3.3V, 1.8V; the power supply module of the embodiment of the utility model can be arranged on the mainboard of the thermal resistance measuring device and is connected with a power supply through the European contact pin; the European pin can also be used for connecting redundant signal lines, address lines and the like.
In an exemplary embodiment, the thermal resistance measurement device further comprises a power monitoring module for: monitoring the working state of a power supply module (which can be used as an on-site power supply), and sending fault alarm information to an MCU module when the power supply module is monitored to have a fault; and after the MCU module sends the received fault information to an upper computer, the fault information is displayed by the upper computer. The MCU module and the upper computer can perform data transmission through a redundant RS485 channel. Through the work of power monitoring module and host computer, can promote thermal resistance measuring device's reliability.
In an exemplary embodiment, the thermal resistance measuring apparatus further includes an MCU debugging download module for: downloading and debugging the MCU module; the MCU module of the embodiment of the invention can adopt an SWD mode (the SWD mode is a simulation mode known by the technical personnel in the field) to carry out downloading debugging; the required lead wire of download debugging of this mode occupies fewly, when reducing the space and occupying, makes things convenient for Printed Circuit Board (PCB) wiring.
In an exemplary embodiment, the thermal resistance measurement device further comprises an MCU reset module for: and carrying out reset control on the MCU module. The MCU reset module and the FPGA reset module can be integrated according to the relevant principle of circuit design.
The embodiment of the utility model provides a thermal resistance measuring device has promoted measurement accuracy and anti EMC ability, has realized way isolation etc. has promoted thermal resistance measuring device's working property, makes thermal resistance measuring device can be applicable to and requires higher production place.
It will be understood by those skilled in the art that all or part of the steps of the above method may be implemented by a program instructing associated hardware (e.g., noise reduction circuit), and the program may be stored in a computer-readable storage medium, such as a read-only memory, a magnetic or optical disk, and the like. Alternatively, all or part of the steps of the above embodiments may be implemented using one or more integrated circuits. Accordingly, each module/unit in the above embodiments may be implemented in a form of hardware, for example, by an integrated circuit to implement its corresponding function, or may be implemented in a form of a software functional module, for example, by a noise reduction circuit to execute a program/instruction stored in a memory to implement its corresponding function. The present invention is not limited to any specific form of hardware or software combination.
Although the embodiments of the present invention have been described above, the description is only for the convenience of understanding the present invention, and the present invention is not limited thereto. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (9)
1. A thermal resistance measuring device, comprising: the system comprises a microcontroller MCU module and a signal gating module connected with the MCU module; wherein the content of the first and second substances,
the signal gating module comprises a multiplexer connected with the MCU module, is connected with each data channel with preset number of lines capable of supporting three-line system and four-line system wiring, and is used for gating the data channels through the multiplexer.
2. The thermal resistance measuring device according to claim 1, further comprising a magnetic coupling isolation module, wherein a first end of the magnetic coupling isolation module is connected to the signal gating module, and the magnetic coupling isolation module comprises magnetic coupling isolation chips independently disposed on each data channel, and configured to:
electrically isolating an external data signal from an internal data signal of the thermal resistance measurement device.
3. The thermal resistance measurement device of claim 2, further comprising a front end processing module to:
and preprocessing the thermal resistance signal received by the thermal resistance measuring device.
4. The thermal resistance measuring device of claim 3, further comprising an analog-to-digital conversion module, an input end of the analog-to-digital conversion module is connected to an output end of the front-end processing module, an output end of the analog-to-digital conversion module is connected to the second end of the magnetic coupling isolation module, and the analog-to-digital conversion module comprises analog-to-digital conversion chips independently arranged on each data channel, and is configured to:
and performing analog-to-digital conversion processing on the data signal on the data channel through an analog-to-digital conversion chip on the data channel.
5. A thermal resistance measuring device according to any one of claims 1 to 4, further comprising: the FPGA module, the input port of FPGA module is connected with outside central controller, output port with the MCU module is connected for:
and receiving a control instruction from the central controller, converting the received control instruction into parallel port data, and sending the parallel port data to the MCU module.
6. A thermal resistance measuring device according to claim 5, wherein the FPGA module is connected to the central controller via a redundant serial bus.
7. The thermal resistance measurement device according to claim 5, wherein the FPGA module is connected to the MCU module through an internally integrated dual port random access memory RAM.
8. The thermal resistance measurement device of claim 5, further comprising an FPGA download debug module configured to:
and downloading and debugging the FPGA module.
9. The thermal resistance measurement device of claim 5, further comprising: the FPGA resetting module is used for:
and resetting the FPGA module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921181000.0U CN210221334U (en) | 2019-07-25 | 2019-07-25 | Thermal resistance measuring device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921181000.0U CN210221334U (en) | 2019-07-25 | 2019-07-25 | Thermal resistance measuring device |
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| CN210221334U true CN210221334U (en) | 2020-03-31 |
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| CN201921181000.0U Active CN210221334U (en) | 2019-07-25 | 2019-07-25 | Thermal resistance measuring device |
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