CN210182339U

CN210182339U - LED die bonder

Info

Publication number: CN210182339U
Application number: CN201921146419.2U
Authority: CN
Inventors: Junhua Wang; 王俊华
Original assignee: Guangdong LCLED Lighting Co Ltd
Current assignee: Guangdong LCLED Lighting Co Ltd
Priority date: 2019-07-19
Filing date: 2019-07-19
Publication date: 2020-03-24
Anticipated expiration: 2029-07-19

Abstract

The utility model discloses a solid brilliant machine of LED, including the solid brilliant mechanism that is used for carrying out solid brilliant processing, be used for accomodating the storage mechanism of handling, be used for the product follow after solid brilliant the solid brilliant mechanism transport extremely it is right to accomodate conveying mechanism in the storage mechanism with be used for accomodating the fan that the solidification was handled is bloied to the product in the storage mechanism. The utility model discloses in, operating personnel only need place the PCB board at conveying mechanism's input side, and conveying mechanism can transport the PCB board to solid brilliant mechanism in, solid brilliant mechanism can carry out solid brilliant processing to PCB board and LED, then conveying mechanism can continue to transport the product after solid brilliant to accomodating the storage mechanism from the output side in, adopts the fan to accelerate the solidification of product simultaneously, the utility model discloses can realize solid brilliant, transportation and the storage of PCB board and LED to can also shorten curing time, improve production efficiency greatly.

Description

LED die bonder

Technical Field

The utility model relates to a LED technical field, in particular to solid brilliant machine of LED.

Background

At present, for an LED die bonder in the market, during operation, a PCB to be die bonded needs to be fixed on a bracket, and then the PCB is subjected to dispensing, and then the LED is sucked by a suction cup after dispensing, and placed in a dispensing area on the PCB, thereby completing die bonding of the PCB and the LED. However, after the die bonding treatment is completed, the die-bonded products need to be manually taken out and manually placed in a ventilation area one by one for ventilation, so that the curing is facilitated, the operation is troublesome, the curing time is long, and the production efficiency is greatly influenced.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to solve one of the technical problem that exists among the prior art at least, provide a solid brilliant machine of LED, can realize solid brilliant, transportation and the storage of PCB board and LED to can also shorten the curing time greatly, improve production efficiency greatly.

The utility model provides a LED die bonder, which comprises a die bonder mechanism for die bonder treatment, a storage mechanism for storage treatment, a conveying mechanism for conveying die-bonded products from the die bonder mechanism to the storage mechanism, and a fan for blowing and curing the products in the storage mechanism;

the die bonding mechanism comprises a workbench, a channel penetrating through the conveying mechanism is formed in the workbench, a dispensing assembly used for dispensing the PCB on the conveying mechanism is arranged above the channel, a placing table used for stacking LEDs and a swing arm conveying assembly used for adsorbing and conveying the LEDs on the placing table to dispensing positions on the PCB are further arranged in the channel;

the accommodating and storing mechanism comprises a lifting platform and an accommodating frame arranged on the lifting platform, the accommodating frame comprises more than ten partition plates which are arranged at intervals up and down, and an accommodating cavity for accommodating a solid crystal product is formed between every two adjacent partition plates;

the conveying mechanism penetrates through the channel of the workbench, and the output side of the conveying mechanism is close to the containing cavity.

According to a LED die bonder, the point subassembly includes that first lift cylinder, lifter plate and setting are in the head is glued to the point of lifter plate bottom, first lift cylinder is installed on the workstation, the bottom of first lift cylinder is connected to the lifter plate, the lifter plate is located conveying mechanism's top.

According to a LED die bonder, swing arm transportation subassembly include motor, drive belt and swing arm, the pivot of motor is passed through the drive belt drives the one end of swing arm is rotated, the bottom of the other end of swing arm is provided with and is used for carrying out absorbent sucking disc to LED, the sucking disc make a round trip under the swing of swing arm move about in place the platform with between the conveying mechanism.

According to a LED die bonder, a stopper is erect to conveying mechanism's input side top, the stopper with highly be greater than a PCB plate thickness and be less than two PCB plate thicknesses between the conveying mechanism.

According to LED solid brilliant machine, conveying mechanism includes conveyer belt or transport guide rail.

According to LED solid brilliant machine, accomodate and store mechanism still includes second lift cylinder, second lift cylinder drives the elevating platform removes.

According to a LED die bonder, set up the ventilation hole that is the matrix arrangement and sets up on the baffle.

The utility model discloses a solid brilliant machine of LED has following beneficial effect at least: the utility model discloses a solid brilliant machine of LED, including the solid brilliant mechanism that is used for carrying out solid brilliant processing, be used for accomodating the storage mechanism of taking in of handling, be used for the product follow after solid brilliant the solid brilliant mechanism transport extremely it is right to accomodate conveying mechanism in the storage mechanism with be used for accomodating the fan that the product in the storage mechanism was bloied and is solidified and is handled. The utility model discloses in, operating personnel only need place the PCB board at conveying mechanism's input side, and conveying mechanism can transport the PCB board to solid brilliant mechanism in, solid brilliant mechanism can carry out solid brilliant processing to PCB board and LED, then conveying mechanism can continue to transport the product after solid brilliant to accomodating the storage mechanism from the output side in, adopts the fan to accelerate the solidification of product simultaneously, the utility model discloses can realize solid brilliant, transportation and the storage of PCB board and LED to can also shorten curing time, improve production efficiency greatly.

Drawings

The invention is further described with reference to the following figures and examples.

Fig. 1 is a schematic side view of an LED die bonder according to an embodiment of the present invention;

fig. 2 is a schematic front view of an internal structure of an LED die bonder according to an embodiment of the present invention.

Detailed Description

This section will describe in detail the embodiments of the present invention, preferred embodiments of the present invention are shown in the attached drawings, which are used to supplement the description of the text part of the specification with figures, so that one can intuitively and vividly understand each technical feature and the whole technical solution of the present invention, but they cannot be understood as the limitation of the protection scope of the present invention.

In the description of the present invention, it should be understood that the orientation or positional relationship indicated with respect to the orientation description, such as up, down, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

In the description of the present invention, a plurality of means are one or more, a plurality of means are two or more, and the terms greater than, less than, exceeding, etc. are understood as not including the number, and the terms greater than, less than, within, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.

In the description of the present invention, unless there is an explicit limitation, the words such as setting, installation, connection, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in combination with the specific contents of the technical solution.

Referring to fig. 1-2, an embodiment of the present invention provides an LED die bonder, which includes a die bonder 200 for die bonder, a storage mechanism 300 for storage, a conveying mechanism 100 for conveying die-bonded products from the die bonder 200 to the storage mechanism 300, and a fan 400 for blowing air to cure the products in the storage mechanism 300;

the die bonding mechanism 200 comprises a workbench 210, a channel 211 for penetrating through the conveying mechanism 100 is formed in the workbench 210, a dispensing assembly for dispensing the PCB on the conveying mechanism 100 is arranged above the channel 211, a placing table 240 for stacking LEDs and a swing arm conveying assembly for adsorbing and conveying the LEDs on the placing table 240 to dispensing positions on the PCB are further arranged in the channel 211;

the storage mechanism 300 comprises a lifting table 310 and a storage rack 320 arranged on the lifting table 310, wherein the storage rack 320 comprises more than ten partition plates 321 which are arranged at intervals up and down, and a storage cavity 322 for storing a die-bonded product is formed between every two adjacent partition plates 321;

the conveying mechanism 100 penetrates through the channel 211 of the workbench 210, and the output side of the conveying mechanism 100 is close to the receiving cavity 322.

In this embodiment, operating personnel only need place the PCB board at conveying mechanism 100's input side, conveying mechanism 100 can transport the PCB board to solid brilliant mechanism 200 in, solid brilliant mechanism 200 can carry out solid brilliant processing to PCB board and LED, then conveying mechanism 100 can continue to transport the product after solid brilliant to accomodating storage mechanism 300 from the output side and store, adopt fan 400 to accelerate the solidification of product simultaneously, this embodiment can realize the solid brilliant of PCB board and LED, transportation and storage, and can also shorten the curing time, the production efficiency is greatly improved.

Specifically, during the use period, the operator only needs to place the PCB on the input side of the conveying mechanism 100, the conveying mechanism 100 transports the PCB into the channel 211 of the die bonder 200, then the dispensing assembly performs dispensing on the surface of the PCB, after the dispensing operation is finished, the swing arm transporting assembly adsorbs and transports the LEDs stacked on the placing table 240 to the dispensing position of the PCB, thereby realizing die bonding processing between the PCB and the LEDs, next, a lifting cylinder is connected below the placing table 240, after one LED is adsorbed and transported away, the placing table 240 responds to lift a small distance, so that the topmost LED is close to the initial adsorption position of the swing arm transporting assembly, after die bonding processing is finished, the die bonded product continues to be output to the storage cavity 322 between the two partition boards 321 through the conveying mechanism 100, when one storage cavity 322 is fully loaded, the lifting table 310 responds to drive the storage rack 320 to move, make next unloaded storage cavity 322 remove and be close to the output side to conveying mechanism 100, and then be used for receiving the product after the next solid brilliant, adopt fan 400 to accelerate the solidification of product simultaneously, the solid brilliant of PCB board and LED, transportation and storage can be realized to this embodiment to can also shorten the curing time, improve production efficiency greatly.

Based on the above embodiment, the utility model discloses another embodiment provides a LED die bonder, the point subassembly includes first lift cylinder 221, lifter plate 222 and sets up the head 223 is glued to the point of lifter plate 222 bottom, first lift cylinder 221 is installed on the workstation 210, the bottom of first lift cylinder 221 is connected to lifter plate 222, lifter plate 222 is located conveying mechanism 100's top. When the dispensing treatment is carried out on the PCB, the first lifting cylinder 221 drives the lifting plate 222 to move downwards, when the dispensing head 223 at the bottom of the lifting plate 222 is close to the surface of the PCB, the first lifting cylinder 221 stops moving, and simultaneously dispensing is carried out on the surface of the PCB through the dispensing head 223, after dispensing is completed, the first lifting cylinder 221 responds to reset and rises, so that the lifting plate 222 and the dispensing head 223 are far away from the surface of the PCB, and blocking caused by carrying of subsequent LEDs is avoided.

Based on the above embodiment, the utility model discloses another embodiment provides a LED die bonder, swing arm transportation subassembly includes motor 231, drive belt 232 and swing arm 233, the pivot of motor 231 is passed through drive belt 232 drives the one end of swing arm 233 is rotated, the bottom of the other end of swing arm 233 is provided with and is used for carrying out absorbent sucking disc 234 to LED, sucking disc 234 under the swing of swing arm 233 make a round trip to move about in place platform 240 with between the conveying mechanism 100. When the point is glued and is handled, motor 231 can respond the action, drives the one end of swing arm 233 through drive belt 232 and rotates to make the wobbling other end realize the swing, when the other end swing of swing arm 233 to the LED surface of placing on placing platform 240, install sucking disc 234 at swing arm 233 and can respond to and adsorb LED, afterwards, swing arm 233 can swing to the point of PCB board surface and put, and sucking disc 234 releases LED simultaneously, makes and accomplishes the solid brilliant processing between LED and the PCB board.

Based on the above embodiment, the utility model discloses an another embodiment provides a solid brilliant machine of LED, spacing block 250 has been erect to conveying mechanism 100's input side top, spacing block 250 with highly be greater than a PCB plate thickness and be less than two PCB plate thicknesses between conveying mechanism 100. In order to prevent more than two PCB boards from being stacked and transported on the conveying mechanism 100, the limiting block 250 is erected above the input side of the conveying mechanism 100 in the embodiment, so that the gap between the limiting block 250 and the conveying mechanism 100 can only pass through one PCB board, and misoperation is avoided.

Based on the above embodiment, the utility model discloses another embodiment provides a solid brilliant machine of LED, conveying mechanism 100 includes the conveyer belt or carries the guide rail.

Based on the above embodiment, the utility model discloses another embodiment provides a solid brilliant machine of LED, accomodate storage mechanism 300 and still include second lift cylinder 330, second lift cylinder 330 drives elevating platform 310 removes.

Based on the above embodiment, the utility model discloses a another embodiment provides a solid brilliant machine of LED, set up the ventilation hole 323 that is the matrix arrangement and sets up on the baffle 321. The ventilation holes 323 are formed in the partition plate 321, so that the air circulation effect is greatly improved, the curing time is further shortened, and the production efficiency is greatly improved.

The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge of those skilled in the art.

Claims

1. An LED die bonder is characterized in that: the device comprises a die bonding mechanism for die bonding, a storage mechanism for storage, a conveying mechanism for conveying die-bonded products from the die bonding mechanism into the storage mechanism, and a fan for blowing and curing the products in the storage mechanism;

2. The LED die bonder of claim 1, wherein: the dispensing assembly comprises a first lifting cylinder, a lifting plate and a dispensing head arranged at the bottom of the lifting plate, the first lifting cylinder is installed on the workbench, the bottom of the first lifting cylinder is connected to the lifting plate, and the lifting plate is located above the conveying mechanism.

3. The LED die bonder of claim 1, wherein: swing arm transportation subassembly includes motor, drive belt and swing arm, the pivot of motor is passed through the drive belt drives the one end of swing arm is rotated, the bottom of the other end of swing arm is provided with and is used for carrying out absorbent sucking disc to LED, the sucking disc make a round trip to move about under the swing of swing arm place the platform with between the conveying mechanism.

4. The LED die bonder of claim 1, wherein: a limiting block is erected above the input side of the conveying mechanism, and the height between the limiting block and the conveying mechanism is larger than the thickness of one PCB and smaller than the thickness of two PCBs.

5. The LED die bonder according to claim 1 or 4, wherein: the conveying mechanism comprises a conveying belt or a conveying guide rail.

6. The LED die bonder of claim 1, wherein: the storage mechanism further comprises a second lifting cylinder, and the second lifting cylinder drives the lifting table to move.

7. The LED die bonder of claim 1, wherein: the partition board is provided with vent holes arranged in a matrix.