CN210167353U - Copper clip for chip packaging and chip packaging structure - Google Patents

Copper clip for chip packaging and chip packaging structure Download PDF

Info

Publication number
CN210167353U
CN210167353U CN201921073633.XU CN201921073633U CN210167353U CN 210167353 U CN210167353 U CN 210167353U CN 201921073633 U CN201921073633 U CN 201921073633U CN 210167353 U CN210167353 U CN 210167353U
Authority
CN
China
Prior art keywords
copper
chip
welding
boss
copper clamp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201921073633.XU
Other languages
Chinese (zh)
Inventor
杨建伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Style Science And Technology Ltd
Original Assignee
Guangdong Style Science And Technology Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangdong Style Science And Technology Ltd filed Critical Guangdong Style Science And Technology Ltd
Priority to CN201921073633.XU priority Critical patent/CN210167353U/en
Application granted granted Critical
Publication of CN210167353U publication Critical patent/CN210167353U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H01L2224/37001—Core members of the connector
    • H01L2224/37099—Material
    • H01L2224/371—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/37138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/37147—Copper [Cu] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The utility model relates to a copper that chip package used presss from both sides and chip package structure, chip package structure includes that chip and copper press from both sides, be equipped with welding material on the chip, the copper presss from both sides and passes through welding material welds on the chip, the copper presss from both sides including the copper presss from both sides the body, be equipped with at least one boss on the face of weld of copper clamp body, the through-hole has still been seted up around the boss. The copper clamp adopts a special structure, the welding surface of the copper clamp body is provided with the lug boss, the through holes are also formed around the lug boss, and the lug boss plays a role in supporting in welding, so that the copper clamp is effectively prevented from inclining in the welding process; during welding, air in the welding material escapes from the through hole under the action of heat and buoyancy, so that the problem of bubbles is effectively solved, the welding quality is improved, and the electrical property, the heat conduction property and the reliability of the product are improved.

Description

Copper clip for chip packaging and chip packaging structure
Technical Field
The utility model relates to a chip package technical field especially relates to a copper clamp and chip package structure that chip package used.
Background
The applicant provides a copper clip stacked chip structure and a packaging method thereof in patent application No. 201811512267.3 with the invention name of "a copper clip stacked chip structure and a packaging method thereof", so that the defects of low current and poor heat dissipation of the traditional metal wire connection are overcome, and the copper clip stacked chip structure and the packaging method thereof can be widely applied to chip packaging products with high power, high current, low power consumption and high heat dissipation requirements. However, the following problems exist in realizing the production process: firstly, in the copper clamp welding process, due to the characteristics (large area) of a welding material and a copper clamp, air cannot effectively escape, a large number of air holes are formed in a welding layer between the copper clamp and a chip, the area of the air holes is increased along with the increase of the welding area of the copper clamp and the chip, the air holes in the welding layer can reduce the heat-conducting property of a product, an electric signal is influenced, the quality and the reliability of the product are reduced, the influence on a copper clamp packaged chip product with high heat conduction and high electric conduction requirements is larger, and the problem of the air holes needs to be solved urgently; secondly, in the reflow soldering process, the soldering material can be melted into a liquid state, so that the soldering material cannot provide stable support for the copper clip placed on the upper portion of the soldering material, the copper clip can incline and be uneven in height due to the action of gravity, the soldering inclination of the copper clip can occur during reflow cooling, the thickness of the soldering material between the copper clip and the chip is uneven, the electric output and the heat conduction of the copper clip are uneven, the performance of the product is affected, and the high performance requirement of the product cannot be met.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a copper clamp and chip packaging structure for chip package effectively solves the technical problem that produces gas pocket and copper clamp welding slope in the welding layer.
The utility model discloses a realize like this: the copper clamp for chip packaging comprises a copper clamp body, wherein at least one boss is arranged on a welding surface of the copper clamp body, and through holes are formed in the periphery of the boss.
Wherein, the boss is a frustum structure with a wide upper part and a narrow lower part.
Wherein, the boss is a circular frustum or a strip frustum or an arc frustum.
Wherein, the through-hole is the through-hole of multistage formula or single section formula around the boss.
Wherein, the through-hole is a strip through-hole or an arc through-hole.
Wherein the width of the through hole is 100-500 μm.
Wherein the height of the boss is 30-60 μm, the diameter of the root of the boss is 50-100 μm, or the width of the root of the boss is 50-100 μm.
The utility model provides another kind of technical scheme does: a chip packaging structure comprises a chip and a copper clamp, wherein the copper clamp is arranged on the chip, and a welding material is arranged on the chip, and the copper clamp is welded on the chip through the welding material.
The utility model has the advantages that: the copper clamp adopts a special structure, the boss is arranged on the welding surface of the copper clamp body, the through holes are also formed around the boss, the height of the boss is determined according to the thickness of the welding layer of a product, the size, the position and the quantity of the boss and the through holes are correspondingly matched with or adjusted with the shape and the size of the welding layer between the copper clamp and a chip, firstly, the boss plays a role of supporting in welding, when a welding material is changed into a liquid state, the copper clamp is under the action of gravity, the boss can be firstly contacted with the welding surface of the chip to form stable support, and the inclination in the welding process of the copper clamp is effectively prevented; when the copper clamp is placed on a chip, the requirement on the stability is reduced, and even if the copper clamp has a certain degree of inclination, the inclination angle of the copper clamp can be corrected by utilizing the gravity of the copper clamp and the supporting action of the lug boss during reflow soldering, so that the product requirement is met; secondly, through holes are formed around the lug boss, air in welding materials escapes from the through holes under the action of heat and buoyancy, the through holes have a gathering effect (tin climbing phenomenon) on the welding materials (generally solder paste, can be in a dispensing mode or a printing mode) buckled below the copper clamp in a pressing mode, air in the molten liquid welding materials is further extruded and discharged, no bubbles or few bubbles are guaranteed on a welding layer between the copper clamp and a chip, the problem of bubbles is effectively solved, the welding quality is improved, the electrical property, the heat conductivity and the reliability of a product are improved, the gathering effect of the through holes on the liquid welding materials can also prevent the liquid welding materials from overflowing at the edge positions of the copper clamp and the chip, and the problems of short circuit, contamination and the like caused by overflow of the welding materials during welding are solved; during subsequent plastic packaging, plastic packaging materials can enter the through holes to play a role in locking the copper clamp, the bonding force between the surface of the copper clamp and the two materials of the plastic packaging materials is enhanced, the risk of layering of the surface of the copper clamp and the plastic packaging materials is reduced, the reliability of products is improved, and the quality and reliability advantages are more obvious especially for the products in a high-temperature working environment (more than 200 ℃).
Drawings
Fig. 1 is a cross-sectional structure diagram of an embodiment of the chip package structure of the present invention;
FIG. 2 is a schematic view of the copper clip of the present invention after being welded to a chip;
fig. 3 is a bottom view of a first embodiment of the copper clip of the present invention;
FIG. 4 is a schematic cross-sectional view of a copper clip according to an embodiment of the present invention;
fig. 5 is a bottom view of a second embodiment of the copper clip of the present invention;
fig. 6 is a bottom view of a third embodiment of the copper clip of the present invention;
fig. 7 is a bottom view of a fourth embodiment of the copper clip of the present invention;
fig. 8 is a bottom view of a copper clip according to a fifth embodiment of the present invention.
In order to distinguish the bosses and the through holes, hatched portions in fig. 3, 5 to 8 are the bosses.
Wherein, 1, the copper clip body; 2. a boss; 3. a through hole; 4. a chip; 5. welding materials; 6. plastic packaging material; 7. a lead frame.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
As an embodiment one of chip package structure and copper clamp, as shown in fig. 1 to 4, chip package structure includes chip 4 and copper clamp, be equipped with welding material 5 on chip 4, the copper clamp passes through welding material 5 welds on chip 4, the copper clamp includes copper clamp body 1, be equipped with at least one boss 2 on the face of weld of copper clamp body 1, 3 holes have still been seted up on every side of boss 2. When the boss 2 is small in volume, it may be referred to as a bump.
The copper clamp of the utility model adopts a special structure, a boss 2 is arranged on the welding surface of a copper clamp body 1, a through hole 3 is also arranged around the boss 2, the height of the boss 2 is determined according to the thickness of the welding layer of a product, the size, the position and the quantity of the boss 2 and the through hole 3 are correspondingly matched with or adjusted with the shape and the size of the welding layer between the copper clamp and a chip, firstly, the boss 2 plays a role of supporting in the welding process, when a welding material 5 becomes liquid, the copper clamp is under the action of gravity, the boss 2 can firstly contact with the welding surface of the chip 4 to form stable support, and the inclination in the welding process of the copper clamp is effectively prevented; when the copper clamp is placed on the chip 4, the requirement on the stability is reduced, and even if the copper clamp has a certain degree of inclination, the inclination angle of the copper clamp can be corrected by utilizing the gravity of the copper clamp and the supporting action of the boss 2 during reflow soldering so as to meet the product requirement; secondly, the through holes 3 are formed around the boss 2, when welding is carried out, air in the welding material 5 escapes from the through holes 3 under the action of heat and buoyancy, the through holes 3 have a gathering effect (tin climbing phenomenon) on the welding material 5 (generally solder paste, which can be in a dispensing mode or a printing mode) pressed and buckled below the copper clamp, air in the molten liquid welding material 5 is further extruded and discharged, no bubble or few bubbles are guaranteed in a welding layer between the copper clamp and the chip 4, the bubble problem is effectively solved, welding quality is improved, electrical property, heat conduction performance and reliability of a product are improved, the gathering effect of the through holes 3 on the liquid welding material 5 can also prevent the liquid welding material from overflowing at the edge positions of the copper clamp and the chip, and the problems of short circuit, contamination and the like caused by the overflow of the welding material during welding are solved; during subsequent plastic packaging, the plastic packaging material 6 can enter the through hole 3 to play a role in locking the copper clamp, the bonding force between the surface of the copper clamp and the plastic packaging material 6 is enhanced, the risk of layering the surface of the copper clamp and the plastic packaging material 6 is reduced, the reliability of a product is improved, and the quality and reliability advantages are more obvious especially for the product in a high-temperature working environment (more than 200 ℃).
In the present embodiment, the boss 2 is a circular frustum as shown in fig. 3, but may also be a strip-shaped frustum as shown in fig. 7, or an arc-shaped frustum as shown in fig. 8, which only differs in shape but functions in a same way. Accordingly, the through hole 3 may be an arc-shaped through hole as shown in fig. 3 and 8, or a strip-shaped through hole as shown in fig. 7.
In the embodiment, the boss 2 is a frustum structure with a wide top and a narrow bottom, and the inclined side has a guiding effect on gas, so that air in the welding material can move along the side of the boss and can escape from the through hole 3 around the boss 2.
In the embodiment, the height of the boss 2 is 30-60 μm, the height of the boss 2 needs to be determined according to the thickness of a welding layer of a product, the boss 2 cannot be too high, only the boss 2 is welded with the chip 4, other positions are not welded (welding tin is insufficient), and serious insufficient welding occurs; the height of the boss 2 cannot be too small, if the boss cannot contact the chip 4 during welding, the boss cannot play a role in stable support, and the copper clamp still has welding inclination. The diameter of the root of the boss 2 is preferably 50 to 100 μm when the boss 2 is a circular cone, or the width of the root of the boss is preferably 50 to 100 μm when the boss 2 is a bar or an arc.
In this embodiment, the through hole 3 is a single-segment through hole surrounding the boss 2, but may also be a multi-segment through hole as shown in fig. 6, and the effect is substantially the same.
In the present embodiment, the width of the through hole 3 is also suitable, and the preferred value is 100-. The through hole 3 is too narrow, and the particle size requirement to the plastic package material 6 is also high, appears inadequately easily and packs, and the through hole 3 is too wide, has very big influence to the holistic thermal diffusivity of product, is unfavorable for the heat dissipation.
The utility model discloses in, corresponding matching or adjustment will be done with the shape and the size of welding layer between copper clamp and the chip to the size, position and the quantity of boss and through-hole, can adopt various array modes in a flexible way. The method is suitable for chips with different sizes, and has more obvious effects of exhausting gas and improving inclination of the chip with large welding area. The boss is mainly manufactured in a stamping mode, and the through hole can be manufactured in a stamping mode, an etching mode or a laser hole forming mode.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims (4)

1. The copper clip for chip packaging is characterized by comprising a copper clip body, wherein at least one boss is arranged on a welding surface of the copper clip body, through holes are further formed in the periphery of the boss, the boss is of a frustum structure with a wide upper part and a narrow lower part, the boss is a circular frustum or a strip-shaped frustum or an arc-shaped frustum, the through holes are multi-section or single-section through holes around the boss, and the through holes are strip-shaped through holes or arc-shaped through holes.
2. The copper clip for chip packaging according to claim 1, wherein the width of the through hole is 100-500 μm.
3. The copper clip for chip packaging according to claim 1, wherein the height of the bump is 30-60 μm, the diameter of the root of the bump is 50-100 μm, or the width of the root of the bump is 50-100 μm.
4. A chip package structure, comprising a chip and the copper clip of any one of claims 1 to 3, wherein the chip is provided with a solder material, and the copper clip is soldered on the chip by the solder material.
CN201921073633.XU 2019-07-10 2019-07-10 Copper clip for chip packaging and chip packaging structure Active CN210167353U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921073633.XU CN210167353U (en) 2019-07-10 2019-07-10 Copper clip for chip packaging and chip packaging structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921073633.XU CN210167353U (en) 2019-07-10 2019-07-10 Copper clip for chip packaging and chip packaging structure

Publications (1)

Publication Number Publication Date
CN210167353U true CN210167353U (en) 2020-03-20

Family

ID=69794546

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201921073633.XU Active CN210167353U (en) 2019-07-10 2019-07-10 Copper clip for chip packaging and chip packaging structure

Country Status (1)

Country Link
CN (1) CN210167353U (en)

Similar Documents

Publication Publication Date Title
CN103367615B (en) Light-emitting device is with being packaged into body and used its light-emitting device
CN104701291B (en) For the PCB thermal pad of QFN chip, QFN chip and PCB welding method
CN211481596U (en) Grounding bonding pad and chip
AU2003203941A1 (en) Adhesive type led lead frame
CN209804635U (en) Large-current semiconductor power device beneficial to welding
JP2006080141A (en) Luminescent device, leadframe used therefor and manufacturing method of leadframe
CN210167353U (en) Copper clip for chip packaging and chip packaging structure
CN212113710U (en) Chip packaging structure of lead frame and welding aluminium foil
CN116072647B (en) MOS chip packaging structure and packaging method thereof
CN110211942A (en) A kind of the copper folder and chip-packaging structure of chip package
CN204792892U (en) High -power LED packaging structure of back -off formula small -size
CN107482001A (en) A kind of super high power COB light source and its manufacture craft
CN211656532U (en) PCB paster structure of D2PAK encapsulation MOS pipe
CN211238214U (en) Chip for controlling solder overflow
CN207250511U (en) A kind of super high power COB light source
CN117156668B (en) Chip packaging structure and realization method for reducing heat dissipation pad welding cavity
CN219476674U (en) Chip packaging structure
CN212628649U (en) Welding disc copper sheet grooving structure for preventing small-package tombstone effect
CN104966774A (en) Reverse-buckling type small-dimension large-power LED packaging structure
CN213288988U (en) Structure for reducing welding voidage of power tube
JP2011086743A (en) Power semiconductor device and method for manufacturing the power semiconductor device
CN111785822A (en) LED flip chip packaging device and packaging process thereof
CN212182315U (en) Lead frame and flip chip packaging structure
CN110211887A (en) A kind of lock material hole copper sheet welding procedure for large-current electric source module wire bonding
CN219678837U (en) Steel mesh and bonding pad structure of PCB

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant