CN210166798U - Fingerprint identification module and electronic equipment - Google Patents
Fingerprint identification module and electronic equipment Download PDFInfo
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- CN210166798U CN210166798U CN201921440218.3U CN201921440218U CN210166798U CN 210166798 U CN210166798 U CN 210166798U CN 201921440218 U CN201921440218 U CN 201921440218U CN 210166798 U CN210166798 U CN 210166798U
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Abstract
The utility model provides a fingerprint identification module and an electronic device, wherein the fingerprint identification module is arranged below a display screen of the electronic device to realize the detection of fingerprints under the screen; it includes: the fingerprint chip is provided with a photosensitive area and a non-photosensitive area, wherein the photosensitive area is provided with a plurality of photosensitive pixel points and is used for receiving signal light reflected by a user finger above the display screen; a color light transmission layer arranged in the light sensing area and covering the light sensing pixel points; the collimator is arranged above the color light-transmitting layer and is provided with a plurality of collimating holes corresponding to the light-sensitive areas. The utility model discloses the fingerprint identification module has thinner thickness size in order to realize anti-fake when gathering colored fingerprint information, satisfies the smaller thinner appeal of electronic equipment to the fingerprint identification module.
Description
Technical Field
The utility model relates to an optics technical field under the screen especially relates to a fingerprint identification module and electronic equipment.
Background
The technology of optical fingerprint recognition under screen is rapidly developed and applied because it does not occupy the surface space of electronic devices (e.g., smart phones). However, the optical fingerprint recognition module applied under the screen can only collect black and white fingerprint images, and the color of the finger of the user as part of the biological characteristics of the user cannot be collected, so that the anti-counterfeiting effect of fingerprint recognition is poor. Moreover, the thickness of the optical fingerprint identification module applied under the screen is large, which is not favorable for the development trend of light and thin electronic equipment.
SUMMERY OF THE UTILITY MODEL
Based on aforementioned prior art defect, the embodiment of the utility model provides an electronic equipment of this fingerprint identification module of fingerprint identification module and configuration, it can be when gathering colored fingerprint information in order to realize anti-fake, has thinner thickness dimension, satisfies the smaller thinner appeal of electronic equipment to the fingerprint identification module.
In order to achieve the above object, the present invention provides the following technical solutions.
A fingerprint identification module is arranged below a display screen of electronic equipment to realize fingerprint detection under the screen; the method comprises the following steps:
the fingerprint chip is provided with a photosensitive area and a non-photosensitive area, wherein the photosensitive area is provided with a plurality of photosensitive pixel points, and the photosensitive pixel points are used for receiving signal light reflected by a user finger above the display screen;
the color light-transmitting layer is arranged in the photosensitive area and covers the photosensitive pixel points, and the color light-transmitting layer is used for allowing color light to pass through;
and the collimator is arranged above the color euphotic layer and is provided with a plurality of collimation holes, and the plurality of collimation holes correspond to the photosensitive areas.
The utility model discloses fingerprint identification module, through set up the colored euphotic layer that can supply the various light to pass through on fingerprint chip's photosensitive area for colored fingerprint image can be gathered to the fingerprint chip, thereby whether the biological characteristic information that can reflect for the true finger of user can be gathered to the fingerprint identification module of application this fingerprint chip and the electronic equipment of configuration this fingerprint identification module, thereby makes electronic equipment have the anti-fake effect of preferred.
And, through set up the collimater above the colorful euphotic layer for do the collimation to signal light and handle, compare in the mode that adopts the camera lens to assemble the processing to signal light, but greatly reduced fingerprint identification module's thickness.
Therefore, the utility model discloses the fingerprint identification module can have thinner thickness size in order to realize anti-fake when gathering colored fingerprint information, satisfies the smaller thinner appeal of electronic equipment to the fingerprint identification module.
Drawings
The drawings described herein are for illustration purposes only and are not intended to limit the scope of the present disclosure in any way. In addition, the shapes, the proportional sizes, and the like of the respective members in the drawings are merely schematic for helping the understanding of the present invention, and do not specifically limit the shapes, the proportional sizes, and the like of the respective members of the present invention. The skilled person in the art can, under the teaching of the present invention, choose various possible shapes and proportional dimensions to implement the invention according to the specific situation. In the drawings:
fig. 1 is a schematic structural diagram of a fingerprint identification module according to a first preferred embodiment of the present invention;
fig. 2 is a schematic structural diagram of an electronic device equipped with a fingerprint identification module according to a second preferred embodiment of the present invention;
fig. 3 is a schematic structural diagram of an electronic device equipped with a fingerprint identification module according to a third preferred embodiment of the present invention;
fig. 4 is a schematic structural diagram of an electronic device equipped with a fingerprint identification module according to a fourth preferred embodiment of the present invention;
fig. 5 is a schematic structural diagram of a fingerprint chip in the fingerprint identification module shown in fig. 1 to 4;
FIG. 6A is a schematic diagram of a first preferred embodiment of a color transparent layer in the fingerprint identification module shown in FIGS. 1 to 4;
FIG. 6B is a schematic diagram of a second preferred embodiment of a color transparent layer in the fingerprint identification module shown in FIGS. 1-4;
FIG. 6C is a schematic diagram of a third preferred embodiment of a color transparent layer in the fingerprint identification module shown in FIGS. 1 to 4;
fig. 6D is a schematic diagram of a fourth preferred embodiment of the color transparent layer in the fingerprint identification module shown in fig. 1 to 4.
Detailed Description
In order to make the technical solutions in the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall fall within the protection scope of the present invention.
It will be understood that when an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a single embodiment.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
In this specification, the direction of the fingerprint identification module of the embodiment of the present invention, which is directed or facing to the user in the normal use state, is defined as "up", and the opposite direction, or the direction away from the user is defined as "down". More specifically, an upward direction illustrated in fig. 1 to 4 is defined as "up", and a downward direction illustrated in fig. 1 to 4 is defined as "down".
It is worth noting that the definition of each direction in this specification is only for the convenience of the technical solution of the present invention, and is not limited by the direction of the fingerprint identification module in other scenes that may cause the direction of the fingerprint identification module to be reversed or the position to be changed, including but not limited by the use, the test, the transportation and the manufacture of the present invention.
The embodiment of the utility model provides a fingerprint identification module, it can apply to including but not limited to under the screen in scenes such as fingerprint unblock, user authentication, authority acquisition. Specifically, when the utility model discloses the fingerprint identification module is disposed in electronic equipment when, electronic equipment can acquire user's fingerprint characteristic information based on this fingerprint identification module for match with the fingerprint information of storage, with the realization to current user's authentication, thereby confirm whether it has corresponding authority to carry out relevant operation to electronic equipment.
It should be noted that the fingerprint information obtained as described above is only one common example of the user's biometric features. Within the scope that can be envisioned, those skilled in the art can extend the technical solution of the embodiments of the present invention to be applied in any suitable biometric authentication scenario. For example, a scene for verifying by acquiring biometric information of the iris of the user is not limited in the embodiments of the present invention.
The following is set forth in a scenario in which user fingerprint information is obtained as a main description. However, as can be seen from the above description, the scope of the embodiments of the present invention is not limited thereto.
The utility model discloses a fingerprint identification module for optical fingerprint under screen can be used in electronic equipment such as including but not limited to mobile smart mobile phone, dull and stereotyped electronic equipment, computer, GPS navigator, personal digital assistant, the wearable equipment of intelligence.
In order to realize the basic functions of the electronic device, the electronic device in the embodiments of the present invention may further include other necessary modules or components. Taking a mobile smart phone as an example, it may further include a communication module, a battery, and the like.
It should be noted that any other necessary modules or components included in the electronic device may be used in any suitable existing configuration. In order to clearly and briefly explain the technical solutions provided by the present invention, the above parts will not be described again, and the drawings in the specification are also simplified correspondingly. It will nevertheless be understood that no limitation of the scope of the invention is thereby intended.
As shown in fig. 1 to 4, the electronic device may be provided with a display screen 1. the display screen 1 may be a self-luminous display screen employing self-luminous elements as display pixels, such as an OLED display screen or an LED display screen, whereby the display screen 1 may serve as an excitation light source emitting excitation light ① toward a target organism (e.g., a user's finger).
When the display screen 1 is a passive light emitting display screen, the electronic device may be configured with an additional light source located below the display screen 1, and the additional light source serves as an excitation light source to emit an excitation light ① to the target organism.
When the user's finger presses, touches or approaches the display screen 1, the excitation light ① may be reflected at the surface of the user's finger, forming a signal light ② carrying fingerprint information.
The utility model discloses fingerprint identification module sets up in the below of display screen 1 to realize that the fingerprint detects under the screen. Can be equipped with the center among the electronic equipment, the fingerprint identification module is installed in the below of display screen 1 through this center to it is fixed to realize. And, relative and interval setting between fingerprint identification module and the display screen 1.
The fingerprint identification module according to an embodiment of the present invention will be explained and explained with reference to fig. 1 to 4. It should be noted that, for convenience of description, like reference numerals denote like parts in the embodiments of the present invention. And for the sake of brevity, detailed descriptions of the same components are omitted in different embodiments, and the descriptions of the same components may be mutually referred to and cited.
The fingerprint identification module comprises a fingerprint chip 2 used for converting an optical signal into an electric signal, wherein the fingerprint chip 2 is used for receiving signal light ② reflected by a user finger above the display screen 1, the signal light ② can be converted into the electric signal to generate a fingerprint image, and the fingerprint identification module further can provide the fingerprint image for a processing circuit (an image processor) to perform image processing to obtain a fingerprint signal and perform fingerprint identification on the fingerprint signal through an algorithm.
In the present embodiment, the thickness of the fingerprint chip 2 is 10 to 200 μm, preferably 30 to 150 μm, and more preferably 40 to 100 μm.
As shown in fig. 5, the fingerprint chip 2 has a photosensitive area 202a and a non-photosensitive area 202b, the photosensitive area 202a is provided with a plurality of photosensitive pixels 203, and the photosensitive pixels 203 are configured to receive signal light ② reflected from a user's finger above the display screen 1. specifically, the fingerprint chip 2 may include a substrate 201 and a photosensitive device 202. due to the thin thickness of the photosensitive device 202, the substrate 201 may be configured to support or carry the photosensitive device 202. the substrate 201 may be crystalline silicon.
The photosensitive device 202 may be a photodiode (PD, Photo-Diode) including an organic photodiode or an inorganic photodiode, and the photosensitive region 202a and the non-photosensitive region 202b may be formed on the upper surface of the photosensitive device 202, a photosensitive pixel array is disposed on the photosensitive region 202a, and the photosensitive pixel array includes photosensitive pixels 203 arranged in a rectangular array form for receiving the signal light ② and sensing the light intensity of the signal light ②.
The light sensing area 202a of the fingerprint chip 2 is provided with a color light transmission layer 3 for color light to pass through, which covers the light sensing pixel points 203 on the light sensing area 202a, the upper surface of the color light transmission layer 3 is flat, thereby avoiding light reflection caused by uneven surface and preventing light deviation, and further, the upper surface of the color light transmission layer 3 is provided with a plurality of micro lenses 204 corresponding to the light sensing pixel points 203 for further gathering the signal light ②.
As shown in fig. 6A to 6D, in order to allow color lights (covering different wavelength bands) to pass through, the color transparent layer 3 is configured with color blocks of different colors. Specifically, the color transparent layer 3 includes a carrier 301 made of a transparent material such as a glass substrate, a surface (e.g., an upper surface and/or a lower surface) of the carrier 301 has a plurality of pixel regions 302, and the plurality of pixel regions 302 may be arranged in a rectangular array. The plurality of pixel regions 302 are configured to include at least two different colors, and the pixel regions 302 of the at least two different colors are arranged in a staggered manner. Also, among the plurality of pixel regions 302, there may be some pixel regions 302 having the same color, but the pixel regions 302 having the same color are not adjacent. Further, the colors of the plurality of pixel regions 302 include at least one of three primary colors of red, green, and blue (RGB).
For example, in one illustrative embodiment, as shown in fig. 6A and 6B, pixel regions 302 are an n × n matrix of pixels, where n/2 pixel regions 302 are a first color and n/2 pixel regions 302 are a second color. The first color may be any one of three primary colors of red, green and blue, and the second color may be any other color, such as white (RGB values of 255, 255) or cyan (RGB values of 0, 255).
Alternatively, in another exemplary embodiment, as shown in FIG. 6C, the pixel regions 302 are an n matrix of pixels, where n/4 pixel regions 302 are a first color, n/4 pixel regions 302 are a second color, and n/2 pixel regions 302 are a third color. The first color, the second color and the third color are three primary colors of red, green and blue (RGB).
Still alternatively, in yet another exemplary embodiment, as shown in FIG. 6D, the pixel regions 302 are an n × n matrix of pixels, where n/4 pixel regions 302 are a first color, n/4 pixel regions 302 are a second color, n/4 pixel regions 302 are a third color, and n/4 pixel regions 302 are a fourth color. The first color, the second color, and the third color are three primary colors of red, green, and blue (RGB), and the fourth color may be any other color, such as white (RGB values of 255, and 255) or cyan (RGB values of 0, 255, and 255).
It should be noted that the color pattern (pattern) of the pixel region 302 of the color transparent layer 3 includes, but is not limited to, the above illustrated embodiments. In practice, the color pattern (pattern) of the pixel region 302 can be freely adjusted according to actual requirements, which is not limited by the embodiment of the present invention.
If only the fingerprint pattern image is collected regardless of the color of the user's finger, any other prosthesis having the same fingerprint pattern as the user's finger, for example, a fingerprint mold made of a synthetic material such as silica gel, white gel, etc., a forged fingerprint such as a 3D printed fingerprint image, etc., may make the fingerprint chip 2 obtain the same fingerprint image. Therefore, the fingerprint which can not be identified is not the real finger of the user, the identification of the authenticity of the finger is difficult to realize, and the anti-counterfeiting effect of the fingerprint identification is poor.
The embodiment of the present invention provides a color transparent layer 3 for color light to pass through on the photosensitive area 202a of the fingerprint chip 2, so that the photosensitive pixels on the photosensitive area 202a can receive the color signal light ②, and further obtain the color fingerprint image, since the color fingerprint image is to be obtained, the color requirement is rich, which is also the reason for the color area design of the embodiment of the present invention, in which the color transparent layer 3 has different patterns (pattern).
Therefore, the embodiment of the utility model provides a through set up the colored euphotic layer 3 that can supply the colored light to pass through on the photosensitive region 202a of fingerprint chip 2 for colored fingerprint image can be gathered to fingerprint chip 2, thereby whether the biological characteristic information that can reflect for the true finger of user can be gathered to the fingerprint identification module of application this fingerprint chip 2 and the electronic equipment of configuration this fingerprint identification module, makes electronic equipment have the anti-fake effect of preferred.
Further, a collimator 4 is disposed above the color transparent layer 3, the collimator 4 has a plurality of collimating holes 401, and the plurality of collimating holes 401 correspond to the photosensitive regions 202 a. As shown in fig. 1, in one embodiment, the collimator 4 is a single-layer structure, which may be a collimating lens, a fiber collimator, a tungsten alloy collimator, or the like, and this application does not intend to limit the present invention. The collimator 4 may be adhered to the photosensitive area 202a of the fingerprint chip 2 by an adhesive 5, such as daf (die Attach film) glue or film.
In this embodiment, the collimator 4 is disposed above the color transparent layer 3 for collimating the signal light ②, so that the thickness of the fingerprint identification module can be greatly reduced compared with a mode of converging the signal light ② by using a lens.
Practice has shown that the thickness of the collimator 4 in this embodiment can be cut down to 150um or less, and further, to 100um or less.
In this embodiment, the non-photosensitive region 202b is provided with a pad 205 connected to the plurality of photosensitive pixels 203, and the pad 205 is connected to a flexible printed circuit 6 (FPC). The non-photosensitive area 202b and the side wall of the collimator 4 are fixed through an adhesive layer 7, and part of the flexible circuit board 6 is wrapped by the adhesive layer 7. The outer end of the flexible circuit board 6 extends to the outside of the adhesive layer 7 for connection with an external circuit, so that the pad 205 of the fingerprint chip 2 is connected with the external circuit through the flexible circuit board 6.
In another embodiment, as shown in fig. 2 to 4, the fingerprint chip 2 is embedded in the collimator 4. Specifically, the lower surface of the collimator 4 is recessed inward to form an accommodating groove 402, the fingerprint chip 2 is accommodated in the accommodating groove 402, and a filling material 8 is arranged between the outer wall of the fingerprint chip 2 and the inner wall of the accommodating groove 402.
In this embodiment, the collimator 4 may be made of a silicon crystal, and the receiving recess 402 and the plurality of alignment holes 401 may be formed by chemical etching or photolithography, so that the receiving recess 402 and the plurality of alignment holes 401 are a part of the structure of the silicon crystal itself, or the receiving recess 402 and the plurality of alignment holes 401 are integrally or monolithically constructed with the silicon crystal.
In the present embodiment, the depth of the collimating holes 401 is 50 to 450 μm, preferably 100 to 350 μm, and more preferably 150 to 250 μm.
The filling material 8 is used for fixing the fingerprint chip 2 and can play a role of packaging to a certain extent. The filling material 8 may be underfill adhesive (underfill adhesive), which is cured in a heating manner after being injected between the outer wall of the fingerprint chip 2 and the inner wall of the accommodating recess 402, thereby fixing the fingerprint chip 2. In order to avoid the fixed strength from being affected by the presence of bubbles in the cured filler 8, after the filling of the filler 8 is completed, the filler 8 is pressurized to be deaerated so as to remove the bubbles in the filler 8.
Through forming the holding recess 402 that is used for acceping fingerprint chip 2 in collimator 4 to fix fingerprint chip 2 through filler material 8, when reducing fingerprint identification module thickness, very big improvement structural strength.
Further, the transparent adhesive layer 9 on the upper surface of the fingerprint chip 2, the fingerprint chip 2 can be adhered and fixed to the inner wall of the accommodating groove 402 by the transparent adhesive layer 9. since the transparent adhesive layer 9 is adhered to the upper surface of the fingerprint chip 2, in order to prevent the transparent adhesive layer 9 from blocking the signal light ②, the transparent adhesive layer 9 should have light transmittance, in this embodiment, the transparent adhesive layer 9 may be daf (die attach film) glue or film, or other adhesive material with light transmittance.
In the present embodiment, the thickness of the transparent adhesive layer 9 is 5 to 40 μm, preferably 10 to 35 μm, and more preferably 15 to 25 μm.
The plurality of alignment holes 401 are used for allowing the signal light ② to pass through and aligning the signal light ②, the plurality of alignment holes 401 correspond to the light sensing region 202a, and particularly, the projection of the plurality of alignment holes 401 towards the upper surface of the fingerprint chip 2 falls within the range of the light sensing region 202a, the plurality of alignment holes 401 are substantially perpendicular to the light sensing region 202a, and the plurality of alignment holes 401 can correspond to the light sensing pixels 203 on the light sensing region 202a one by one, the alignment holes 401 are filled with photoresist (not shown) to prevent external impurities or particles (particles) from entering.
As shown in fig. 2 and 3, in one embodiment, the bottom of the filling material 8 is provided with a protective layer 10 comprising a first conductive wiring layer 101a on the inner side and an insulating layer 101b on the outer side, wherein the first conductive wiring layer 101a is connected with the pad 205 of the fingerprint chip 2 through a conductive element, and the first conductive wiring layer 101a is provided with a pin 101c for connection with an external circuit.
The first conductive wiring layer 101a and the insulating layer 101b included in the protective layer 10 are superposed on each other, and the first conductive wiring layer 101a is pressed between the insulating layer 101b and the bottom of the filling material 8. By providing the protective layer 10 including the first conductive wiring layer 101a, connection of the fingerprint chip 2 to an external circuit can be achieved. The insulating layer 101b included in the protective layer 10 can protect the first conductive wiring layer 101 a.
In the present embodiment, the thickness of the passivation layer 10 is 10 to 100 μm, preferably 30 to 70 μm, and more preferably 40 to 60 μm.
As shown in fig. 2, in one embodiment, in order to connect the first conductive wiring layer 101a with the pad 205 of the fingerprint chip 2, the single package 200 further includes a supporting layer 11 disposed in the receiving groove 402, and the supporting layer 11 is encapsulated and fixed by the filling material 8. The conductive elements are conductive pillars 12 embedded in the supporting layer 11, and the upper ends of the conductive pillars 12 are connected to the pads 205 of the fingerprint chip 2 through the second conductive wiring layer 13.
Thereby, the connection of the first conductive wiring layer 101a and the pad 205 of the fingerprint chip 2 is indirectly achieved through the second conductive wiring layer 13 and the conductive pillar 12.
In this embodiment, the conductive posts 12 may be metal posts, and the supporting layer 11 may be made of any suitable conventional material. For example, the support layer 11 may be a PCB, and the second conductive wiring layer 13 may be formed on the surface or inside of the support layer 11 through a re-wiring process (RDL). Alternatively, the supporting layer 11 may be EMC (Epoxy Molding Compound), so that the side of the fingerprint chip 2 can be covered by a packaging process.
As shown in fig. 3, another embodiment for realizing the connection between the first conductive wiring layer 101a and the pad 205 of the fingerprint chip 2 may be that the conductive element is a third conductive wiring layer 14 formed on the fingerprint chip 2 by a TSV (Through Silicon Vias) process, the upper end of the third conductive wiring layer 14 is connected to the pad 205 of the fingerprint chip 2, and the lower end is connected to the first conductive wiring layer 101 a. Thereby, a direct connection of the first conductive wiring layer 101a with the pad 205 of the fingerprint chip 2 is achieved by the third conductive wiring layer 14.
In another embodiment, as shown in fig. 4, the fingerprint chip 2 may be connected to an external Circuit through a flexible Circuit board 6 (FPC). Specifically, the non-photosensitive region 202b of the fingerprint chip 2 is provided with the conductive bumps 206 connected to the photosensitive pixels 203, the conductive bumps 206 are connected to the flexible circuit board 6, and the flexible circuit board 6 extends to the outside of the accommodating groove 402, so that the fingerprint chip 2 is connected to an external circuit through the conductive bumps 206 and the flexible circuit board 6.
The sidewall of the accommodating recess 402 may be provided with a through hole for the flexible circuit board 6 to pass through. The Conductive bump 206 may have an ACF (Anisotropic Conductive Film)207 at an upper end thereof, and the flexible circuit board 6 is connected to the Conductive bump 206 of the fingerprint chip 2 through the ACF 207.
Further, a filter layer 15 may be disposed above the fingerprint chip 2 for filtering the signal light ② to filter noise light mixed in the signal light ②, so as to improve the signal-to-noise ratio of light reaching the fingerprint chip 2 and improve the imaging quality, the filter layer 15 may be combined with the collimator 4, further, the filter layer 15 may be a coating film formed on the upper surface or the lower surface of the collimator 4, in this embodiment, the thickness of the filter layer 15 is 1 to 20 μm, more preferably 8 to 15 μm, and still more preferably 10 to 12 μm.
Specifically, in some scenarios, when the display screen 1 is a self-luminous display screen, the display screen 1 is an excitation light source, the excitation light emitted by the display screen 1 is generally visible light, and the target signal light ② is also visible light.
In other scenarios, when the excitation light source is an invisible light source such as an infrared light source additionally disposed under the display screen 1, and both the excitation light emitted by the excitation light source and the target signal light ② are invisible light, then in such scenarios, the noise light is visible light in the ambient light, such as white light, and then the filter layer 15 is a visible light filter layer.
It should be noted that, in the description of the present invention, the terms "first", "second", and the like are used for descriptive purposes only and for distinguishing similar objects, and no order is shown between the two, and no indication or suggestion of relative importance is understood. In addition, in the description of the present invention, "a plurality" means two or more unless otherwise specified.
Any numerical value recited herein includes all values from the lower value to the upper value that are incremented by one unit, provided that there is a separation of at least two units between any lower value and any higher value. For example, if it is stated that the number of a component or a value of a process variable (e.g., temperature, pressure, time, etc.) is from 1 to 90, preferably from 21 to 80, and more preferably from 30 to 70, it is intended that equivalents such as 15 to 85, 22 to 68, 43 to 51, 30 to 32 are also expressly enumerated in this specification. For values less than 1, one unit is suitably considered to be 0.0001, 0.001, 0.01, 0.1. These are only examples of what is intended to be explicitly recited, and all possible combinations of numerical values between the lowest value and the highest value that are explicitly recited in the specification in a similar manner are to be considered.
Unless otherwise indicated, all ranges include the endpoints and all numbers between the endpoints. The use of "about" or "approximately" with a range applies to both endpoints of the range. Thus, "about 20 to about 30" is intended to cover "about 20 to about 30", including at least the endpoints specified.
The above description is only for the embodiments of the present invention, and those skilled in the art can make various changes or modifications to the embodiments of the present invention without departing from the spirit and scope of the present invention according to the disclosure of the application document.
Claims (14)
1. A fingerprint identification module is arranged below a display screen of electronic equipment to realize fingerprint detection under the screen; it is characterized by comprising:
the fingerprint chip is provided with a photosensitive area and a non-photosensitive area, wherein the photosensitive area is provided with a plurality of photosensitive pixel points, and the photosensitive pixel points are used for receiving signal light reflected by a user finger above the display screen;
the color light-transmitting layer is arranged in the photosensitive area and covers the photosensitive pixel points, and the color light-transmitting layer is used for allowing color light to pass through;
and the collimator is arranged above the color euphotic layer and is provided with a plurality of collimation holes, and the plurality of collimation holes correspond to the photosensitive areas.
2. The fingerprint identification module of claim 1, wherein the color transparent layer comprises a carrier, a surface of the carrier has a plurality of pixel regions, the plurality of pixel regions are configured to include at least two different colors, and the pixel regions of the at least two different colors are arranged in a staggered manner.
3. The fingerprint recognition module of claim 2 wherein there are some of said pixel regions that are the same color, but said pixel regions of the same color are not adjacent.
4. The fingerprint identification module of claim 1, wherein the collimator is a single layer structure that is adhesively secured to the photosensitive area of the fingerprint chip.
5. The fingerprint identification module of claim 4, wherein the non-photosensitive region has a pad connected to a plurality of photosensitive pixels, the pad being connected to the flexible circuit board; the non-photosensitive area and the side wall of the collimator are fixed through an adhesive layer, and part of the flexible circuit board is wrapped by the adhesive layer.
6. The fingerprint identification module of claim 1, wherein the lower surface of the collimator is recessed inward to form a receiving groove, the fingerprint chip is received in the receiving groove, and a filling material is disposed between an outer wall of the fingerprint chip and an inner wall of the receiving groove.
7. The fingerprint identification module of claim 6 wherein the filler material is provided with a protective layer at the bottom, the protective layer comprising a first conductive wiring layer at the inner side and an insulating layer at the outer side;
the non-photosensitive area is provided with a welding pad connected with the photosensitive pixel points, the first conductive wiring layer is connected with the welding pad through a conductive element, and the first conductive wiring layer is provided with a pin used for being connected with an external circuit.
8. The fingerprint identification module of claim 7, wherein a support layer is disposed in the receiving cavity, and the support layer is covered by the filling material; the conductive elements are conductive columns embedded in the supporting layer, and the upper ends of the conductive columns are connected with the welding pads through a second conductive wiring layer.
9. The fingerprint identification module of claim 7, wherein the conductive element is a third conductive wiring layer formed on the fingerprint chip by a TSV process, the third conductive wiring layer having an upper end connected to the pad and a lower end connected to the first conductive wiring layer.
10. The fingerprint identification module of claim 7, wherein the non-photosensitive area has a conductive bump connected to the plurality of photosensitive pixels, the conductive bump being connected to the flexible circuit board; the flexible circuit board penetrates through the side wall of the accommodating groove and extends to the outside.
11. The fingerprint identification module of claim 1, wherein the color transparent layer is provided with a micro lens corresponding to the plurality of photosensitive pixels.
12. The fingerprint recognition module of claim 1, wherein the collimator incorporates a filter layer for filtering the signal light to filter noise light included in the signal light.
13. The fingerprint identification module of claim 12 wherein the filter layer is a coating formed on an upper surface or a lower surface of the collimator.
14. An electronic device, comprising:
a display screen;
the fingerprint recognition module of any one of claims 1 to 13; the fingerprint identification module is arranged below the display screen.
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| CN201921440218.3U CN210166798U (en) | 2019-09-02 | 2019-09-02 | Fingerprint identification module and electronic equipment |
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| CN201921440218.3U CN210166798U (en) | 2019-09-02 | 2019-09-02 | Fingerprint identification module and electronic equipment |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111582131A (en) * | 2020-04-30 | 2020-08-25 | 上海思立微电子科技有限公司 | Thin optical fingerprint identification device under screen and fingerprint identification method |
| CN111611916A (en) * | 2020-05-20 | 2020-09-01 | 上海思立微电子科技有限公司 | Thin optical fingerprint chip module, manufacturing method thereof and electronic equipment |
| WO2023230742A1 (en) * | 2022-05-30 | 2023-12-07 | 京东方科技集团股份有限公司 | Pattern recognition module and display apparatus |
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2019
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| CN111582131B (en) * | 2020-04-30 | 2023-10-27 | 上海思立微电子科技有限公司 | Thin type under-screen optical fingerprint identification device and fingerprint identification method |
| CN111611916A (en) * | 2020-05-20 | 2020-09-01 | 上海思立微电子科技有限公司 | Thin optical fingerprint chip module, manufacturing method thereof and electronic equipment |
| CN111611916B (en) * | 2020-05-20 | 2023-09-22 | 上海思立微电子科技有限公司 | Thin optical fingerprint chip module, manufacturing method thereof and electronic equipment |
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