CN210160578U - Laser processing PCD diamond cutter sharpening device - Google Patents
Laser processing PCD diamond cutter sharpening device Download PDFInfo
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- CN210160578U CN210160578U CN201920454302.4U CN201920454302U CN210160578U CN 210160578 U CN210160578 U CN 210160578U CN 201920454302 U CN201920454302 U CN 201920454302U CN 210160578 U CN210160578 U CN 210160578U
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Abstract
The utility model discloses a laser processing PCD diamond cutter sharpening device, which comprises a laser light path part and a sample clamping part; the laser optical path part comprises a laser, a laser outer optical path and a galvanometer which are connected in sequence; the sample clamping part comprises a first positioning support, a second positioning support, a control lifting stud, a vertical lifting platform, a sample base and a clamping device shell; wherein the sample base is designed for specific diamond bit size, when processing the drill bit of not unidimensional, can realize processing through changing the sample base, the sample base is located on the vertical lift platform, through the cooperation of sample base and vertical lift platform, the position of accurate positioning sample, the vertical lift platform passes through the screw thread and is connected with control lift double-screw bolt, control lift double-screw bolt links to each other with the motor, drive the rotation of control lift double-screw bolt through the motor, realize the accurate lift of vertical lift platform, thereby realize the lift and the location of adding man-hour.
Description
Technical Field
The utility model relates to a laser beam machining technical field, concretely relates to laser beam machining PCD diamond cutter sharpening device.
Background
PCD (polycrystalline diamond) is a polycrystalline diamond polymer which is formed by sintering high-quality diamond (0.5-50 mu m) at high temperature and high pressure (1450-1700 ℃ and 5.5-7.0 GPa) by adding a catalyst with certain components. PCD, by virtue of its extremely high hardness and excellent wear resistance, has long been used in a variety of fields, particularly in the field of cutting tools, and is playing an increasingly important role. PCD not only can be used for producing turning tools and boring cutters, but also can be used for producing complex props such as milling cutters, drill bits, reamers, saws, routing cutters, punches and the like. In the fields of automobile, aviation and base material processing, PCD cutters have been widely used, and processing materials include nonferrous metals such as aluminum, copper and the like and alloys thereof, and also can be used for processing materials such as non-metallic and fiber reinforced materials such as wood, plastics, graphite, stone, ceramics, rubber and the like, hard alloys, metal matrix composite materials and the like.
The production process of the PCD drill bit comprises three procedures of cutting, welding and sharpening of the PCD compact. The high hardness and the high wear resistance of PCD make the sharpening of PCD cutters very difficult, which is mainly reflected in that the material has small removal rate, large abrasion loss, low cutter efficiency, difficult control of the saw tooth degree of a cutting edge and the like. Mechanical sharpening with diamond grinding wheels is still the main mode of sharpening PCD tools at present, but the sharpening efficiency is very low. Although the grinding efficiency of PCD is improved by the methods of ultrasonic vibration grinding, electric spark machining and the like, the methods still have the defects of poor machining surface quality meeting the requirements of a cutting tool, too large saw tooth degree, difficult control of precision and the like.
SUMMERY OF THE UTILITY MODEL
In view of this, in order to solve the above-mentioned problem among the prior art, the utility model provides a laser beam machining PCD diamond cutter sharpening device when guaranteeing the cutter performance, improves sharpening efficiency to solve the problem of sample location difficulty in the production process.
The utility model discloses an above-mentioned problem is solved to following technical means:
a PCD diamond cutter sharpening device for laser processing comprises a laser light path part and a sample clamping part;
the laser optical path part comprises a laser, a laser outer optical path and a galvanometer which are connected in sequence;
the laser emits pulse laser with pulse width at picosecond or femtosecond level, the laser emitted by the laser is adjusted into parallel light by an external light path of the laser, the energy density of the laser is dispersed, an optical element behind the light path is protected, a vibrating mirror comprises an internal reflecting mirror and a focusing lens at a light emitting position, the laser scans a focal plane through the rotation of the internal reflecting mirror, different parts are machined, the laser is focused by the focusing lens, the energy of the laser is concentrated at a certain point, and the focal point is always positioned on the same plane when the laser swings at different positions;
the sample clamping part comprises a first positioning support, a second positioning support, a control lifting stud, a vertical lifting platform, a sample base and a clamping device shell;
a positioning groove matched with the sample base is arranged in the middle of the vertical lifting platform, the sample base is arranged in the positioning groove, and a semicircle is arranged beside the positioning groove, so that the sample base is convenient to take and place;
the shell of the clamping device comprises two planes which are vertically intersected, the vertical lifting platform is arranged above one plane, and a baffle plate is enclosed on the edge of the other plane facing the vertical lifting platform to form a cavity;
the first positioning support and the second positioning support penetrate through the vertical lifting platform through holes, and the two ends of the first positioning support and the second positioning support are respectively connected with one plane of the clamping device shell and a baffle on the other square meter through the holes;
the lifting stud is controlled to penetrate through the vertical lifting platform through a threaded hole, and the two ends of the lifting stud are respectively connected with a plane of the clamping device shell and a baffle on the other square meter through holes; the lifting stud is controlled to be arranged between the first positioning support column and the second positioning support column.
Further, the laser is a picosecond or femtosecond laser.
Compared with the prior art, the beneficial effects of the utility model include at least:
the utility model discloses use picosecond or femto second laser, it is little to add the heat affected zone man-hour, can realize cold processing, can not change the organizational performance of diamond, makes the performance of diamond bit can reach the application requirement. The existing diamond drill sharpening technology mainly grinds diamond grinding wheels through the diamond grinding wheels, and diamond cutters with special shapes are difficult to process on certain specific parts. The utility model discloses can change the size of laser facula through the adjustment of camera lens and outer light path, can make the machining precision very high for some special cutters of shape also easily process.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a laser machining PCD diamond tool sharpening device;
FIG. 2 is a schematic view of the structure of a sample holding portion;
FIG. 3 is a schematic diagram of a sample base of a diamond drill bit;
FIG. 4 is a schematic structural view of the vertical lift platform;
fig. 5 is a schematic structural view of a housing of the clamping device.
Description of reference numerals:
1. picosecond or femtosecond lasers; 2. an external laser path; 3. a galvanometer; 4. emitting laser; 5. a first positioning pillar; 6. a second positioning strut; 7. controlling the lifting stud; 8. a PCD diamond drill bit; 9. a vertical lifting platform; 10. a sample base; 11. a clamping device housing.
Detailed Description
In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments accompanying the drawings are described in detail below. It should be noted that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by those skilled in the art without any inventive work are within the scope of the present invention.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a laser processing PCD diamond cutter sharpening device, including a laser light path portion and a sample holding portion;
the laser optical path part comprises a picosecond or femtosecond laser 1, a laser outer optical path 2 and a galvanometer 3 which are connected in sequence;
the picosecond or femtosecond laser 1 emits pulse laser with the pulse width of picosecond or femtosecond level, the laser emitted by the laser is adjusted into parallel light by the laser external light path 2, the laser energy density is dispersed, an optical element behind the light path is protected, the vibrating mirror 3 comprises an internal reflecting mirror and a focusing lens at a light emitting position, the laser scans on a focal plane through the rotation of the internal reflecting mirror, different parts are machined, the laser is focused through the focusing lens, the energy of the laser is concentrated at a certain point, and when the laser swings at different positions, the focal point is always positioned on the same plane;
the sample clamping part comprises a first positioning support column 5, a second positioning support column 6, a control lifting stud 7, a vertical lifting platform 9, a sample base 10 and a clamping device shell 11;
a positioning groove matched with the sample base 10 is arranged in the middle of the vertical lifting platform 9, the sample base 10 is arranged in the positioning groove, and a semicircle is arranged beside the positioning groove, so that the sample base 10 can be conveniently taken and placed;
the clamping device shell 11 comprises two planes which are vertically intersected, the vertical lifting platform 9 is arranged above one of the planes, and a baffle is enclosed on the edge of the other plane facing the vertical lifting platform 9 to form a cavity;
the first positioning support column 5 and the second positioning support column 6 penetrate through the vertical lifting platform 9 through holes, and the two ends of the first positioning support column and the second positioning support column are respectively connected with a plane of the clamping device shell 11 and a baffle on the other square meter through holes;
the lifting control stud 7 penetrates through the vertical lifting platform 9 through a threaded hole, and the two ends of the lifting control stud are respectively connected with a plane of the clamping device shell 11 and a baffle on the other square meter through holes; the control lifting stud 7 is arranged between the first positioning pillar 5 and the second positioning pillar 6.
Please refer to fig. 1. In the figure, 1, 2 and 3 jointly form the optical path part of the laser. The 1 is picosecond or femtosecond laser, which is composed of internal luminescent crystal, acousto-optic modulator and other elements, and can emit pulsed laser with pulse width of picosecond or femtosecond level. And 2, an external optical path of the laser, which generally comprises elements such as a refractor and a beam expander, wherein the beam expander is used for adjusting laser emitted by the laser into parallel light, dispersing laser energy density and protecting optical elements behind the optical path. The 3 is a vibrating mirror, which usually has an internal reflector, a focusing lens is arranged at the light-emitting position, the laser can scan on a focal plane through the rotation of the internal reflector, so as to process different parts, the focusing lens can focus the laser, the energy of the laser is concentrated at a certain point, and the focal point is always in the same plane when the vibrating mirror swings at different positions.
Please refer to fig. 1 and fig. 2. In the figure, 8 represents a PCD diamond drill bit, and the device not only can be suitable for processing the diamond drill bit, but also can be suitable for processing all small samples manufactured by laser material reduction, and can meet the processing requirements of various samples. In the figure, 5, 6, 7, 9, 10 and 11 jointly form a sample clamping part during sample processing, wherein 5 and 6 are positioning pillars, ensure the level of the vertical lifting platform 9 through the cooperation with the vertical lifting platform 9, and are used as guide rails when the vertical lifting platform 9 ascends or descends. And 7, a control lifting bolt for controlling the vertical lifting platform 9 to move is meshed with the internal thread of the vertical lifting platform 9 and is connected with an external motor, the motor drives the control lifting bolt 7 to rotate, and the lifting of the vertical lifting platform 9 is realized through thread conduction. In order to facilitate the connection of the control lifting stud 7 with an external motor, the control lifting stud 7 can be lengthened appropriately or the clamping device housing 11 can be modified accordingly. The sample base 10 is a sample base, and different shapes of different samples need to be manufactured on the sample base 10, but the shape of the bottom of the sample base is stored and kept unchanged, and the sample base is matched with the positioning groove of the vertical lifting platform 9 to realize accurate positioning of the samples. And 9, a vertical lifting platform, which is engaged with the lifting control bolt 7 to lift, so that the sample rises, and the material reduction manufacturing of laser processing is realized. 11 is a shell of the clamping device, can provide support for the positioning pillars (6, 7), and enables the sample clamping part to be easily moved, thereby facilitating the position change in the production and processing.
Please refer to fig. 3, fig. 4, and fig. 5. FIG. 3 is a sample base schematic view, digs out the used constant head tank of sample on the cuboid of a specific size, and the constant head tank can produce different overall dimension for different samples to adapt to different production demands, the cuboid appearance need with lift platform cooperation, consequently can not change its overall dimension. Fig. 4 is a schematic view of the vertical lifting platform, three holes matched with the support columns are drilled on the cuboid, the middle hole needs to be matched with the control lifting stud 7 and is carved with an internal thread meshed with the control lifting stud 7, the positioning groove in the middle of the vertical lifting platform 9 needs to be matched with the sample base 10, and the shape and the size cannot be changed. In this embodiment, a semicircular groove is formed beside the positioning groove, so as to facilitate the taking and placing of the sample base 10. Fig. 5 shows a schematic view of a housing of the clamping device, the shape of which can be modified according to different production environments, but the positions of the two positioning struts (6, 7) and the control lifting stud (7) must be kept unchanged.
The utility model discloses need use picosecond or femto second pulse laser, outer light path and mirror that shakes. The laser emitted by the laser device is reflected by the external light path and the vibrating mirror and focused on the surface of the diamond drill bit, so that the local temperature of the diamond drill bit is raised and gasified, and the reflecting position of the laser is controlled by the vibrating mirror, thereby realizing the processing of the diamond drill bit. When the diamond is processed by laser, a layer of material on the upper surface of the diamond can be removed by scanning each time, and at the moment, the sample needs to be moved upwards by the same distance, so that the surface of the sample is always in a focus position. In the processing process, the circular shape processed by the laser must be coaxial with the sample, thereby generating the problem of difficult positioning in the batch processing of the sample. The utility model provides a clamping device when solving the difficult problem of location, can also realize the sample translation that makes progress in real time.
The sample used in this example was a 16mm diameter by 16mm high PCD diamond compact and the laser used was an infrared picosecond laser. The specific implementation steps are as follows:
step S01: placing the vertical lifting platform 9 at a position corresponding to the clamping device shell 11, and keeping the holes to be matched coaxial;
step S02: inserting the first positioning support 6 and the second positioning support 7 from the holes above the clamping device shell 11, and passing through the corresponding holes of the vertical lifting platform 9 for fixing;
step S03: inserting the control lifting stud 7 from the upper part of the clamping device shell 11, and engaging with the thread of the vertical lifting platform 9, connecting the control lifting stud 7 with an external motor, thereby controlling the rotation of the control lifting stud;
step S04: placing the sample base 10 at a corresponding position of the vertical lifting platform 9;
step S05: placing the sample in the corresponding position of the sample base 10;
step S06: and starting the laser 1, and realizing the cutter sharpening of the PCD diamond drill bit by controlling the laser scanning and the rotation of the motor.
The utility model discloses the sample that the example used is PCD diamond bit, has designed the accurate positioning clamping device of drill bit, uses the laser instrument to process the drill bit to realize the sharpening of drill bit. The utility model discloses can change clamping device's overall dimension according to the difference of sample, random meeting an emergency, be applicable to various processing occasions.
The utility model discloses use picosecond or femto second laser, it is little to add the heat affected zone man-hour, can realize cold processing, can not change the organizational performance of diamond, makes the performance of diamond bit can reach the application requirement. The existing diamond drill sharpening technology mainly grinds diamond grinding wheels through the diamond grinding wheels, and diamond cutters with special shapes are difficult to process on certain specific parts. The utility model discloses can change the size of laser facula through the adjustment of camera lens and outer light path, can make the machining precision very high for some special cutters of shape also easily process.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (2)
1. A PCD diamond cutter sharpening device for laser processing is characterized by comprising a laser light path part and a sample clamping part;
the laser optical path part comprises a laser, a laser outer optical path and a galvanometer which are connected in sequence;
the laser emits pulse laser with pulse width at picosecond or femtosecond level, the laser emitted by the laser is adjusted into parallel light by an external light path of the laser, the energy density of the laser is dispersed, an optical element behind the light path is protected, a vibrating mirror comprises an internal reflecting mirror and a focusing lens at a light emitting position, the laser scans a focal plane through the rotation of the internal reflecting mirror, different parts are machined, the laser is focused by the focusing lens, the energy of the laser is concentrated at a certain point, and the focal point is always positioned on the same plane when the laser swings at different positions;
the sample clamping part comprises a first positioning support, a second positioning support, a control lifting stud, a vertical lifting platform, a sample base and a clamping device shell;
a positioning groove matched with the sample base is arranged in the middle of the vertical lifting platform, the sample base is arranged in the positioning groove, and a semicircle is arranged beside the positioning groove, so that the sample base is convenient to take and place;
the shell of the clamping device comprises two planes which are vertically intersected, the vertical lifting platform is arranged above one plane, and a baffle plate is enclosed on the edge of the other plane facing the vertical lifting platform to form a cavity;
the first positioning support and the second positioning support penetrate through the vertical lifting platform through holes, and the two ends of the first positioning support and the second positioning support are respectively connected with one plane of the clamping device shell and a baffle on the other square meter through the holes;
the lifting stud is controlled to penetrate through the vertical lifting platform through a threaded hole, and the two ends of the lifting stud are respectively connected with a plane of the clamping device shell and a baffle on the other square meter through holes; the lifting stud is controlled to be arranged between the first positioning support column and the second positioning support column.
2. The laser-machined PCD diamond tool sharpening device of claim 1, wherein the laser is a picosecond or femtosecond laser.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201920454302.4U CN210160578U (en) | 2019-04-04 | 2019-04-04 | Laser processing PCD diamond cutter sharpening device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201920454302.4U CN210160578U (en) | 2019-04-04 | 2019-04-04 | Laser processing PCD diamond cutter sharpening device |
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| CN210160578U true CN210160578U (en) | 2020-03-20 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110000467A (en) * | 2019-04-04 | 2019-07-12 | 华南师范大学 | Laser machine PCD diamond cutter Sharpening device and method |
| CN113427140A (en) * | 2020-03-21 | 2021-09-24 | 赣州市普希德工具有限公司 | Five-axis linkage laser processing equipment for processing PCD (polycrystalline Diamond) cutter |
| CN114850517A (en) * | 2022-02-23 | 2022-08-05 | 深圳精匠云创科技有限公司 | Polycrystalline diamond cutter and machining method thereof |
-
2019
- 2019-04-04 CN CN201920454302.4U patent/CN210160578U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110000467A (en) * | 2019-04-04 | 2019-07-12 | 华南师范大学 | Laser machine PCD diamond cutter Sharpening device and method |
| CN113427140A (en) * | 2020-03-21 | 2021-09-24 | 赣州市普希德工具有限公司 | Five-axis linkage laser processing equipment for processing PCD (polycrystalline Diamond) cutter |
| CN114850517A (en) * | 2022-02-23 | 2022-08-05 | 深圳精匠云创科技有限公司 | Polycrystalline diamond cutter and machining method thereof |
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