CN114850517A - Polycrystalline diamond cutter and machining method thereof - Google Patents
Polycrystalline diamond cutter and machining method thereof Download PDFInfo
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- CN114850517A CN114850517A CN202210167794.5A CN202210167794A CN114850517A CN 114850517 A CN114850517 A CN 114850517A CN 202210167794 A CN202210167794 A CN 202210167794A CN 114850517 A CN114850517 A CN 114850517A
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- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 326
- 239000010432 diamond Substances 0.000 title claims abstract description 326
- 238000000034 method Methods 0.000 title claims abstract description 39
- 238000003754 machining Methods 0.000 title claims abstract description 32
- 238000005520 cutting process Methods 0.000 claims abstract description 118
- 238000012545 processing Methods 0.000 claims abstract description 44
- 238000002161 passivation Methods 0.000 claims abstract description 40
- 238000007781 pre-processing Methods 0.000 claims abstract description 12
- 238000003466 welding Methods 0.000 claims description 33
- 230000004907 flux Effects 0.000 claims description 10
- 238000003672 processing method Methods 0.000 claims description 9
- 239000003960 organic solvent Substances 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 238000004140 cleaning Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 238000005498 polishing Methods 0.000 claims description 4
- 230000000630 rising effect Effects 0.000 claims description 3
- 230000008569 process Effects 0.000 description 15
- 239000002131 composite material Substances 0.000 description 7
- 238000000227 grinding Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000004321 preservation Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000003801 milling Methods 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 239000006247 magnetic powder Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 125000003158 alcohol group Chemical group 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B27/00—Tools for turning or boring machines; Tools of a similar kind in general; Accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B27/00—Tools for turning or boring machines; Tools of a similar kind in general; Accessories therefor
- B23B27/14—Cutting tools of which the bits or tips or cutting inserts are of special material
- B23B27/18—Cutting tools of which the bits or tips or cutting inserts are of special material with cutting bits or tips or cutting inserts rigidly mounted, e.g. by brazing
- B23B27/20—Cutting tools of which the bits or tips or cutting inserts are of special material with cutting bits or tips or cutting inserts rigidly mounted, e.g. by brazing with diamond bits or cutting inserts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B2226/00—Materials of tools or workpieces not comprising a metal
- B23B2226/31—Diamond
- B23B2226/315—Diamond polycrystalline [PCD]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/20—Tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
A machining method of a polycrystalline diamond cutter comprises the following steps: providing a polycrystalline diamond preprocessing cutter, wherein the polycrystalline diamond preprocessing cutter comprises a polycrystalline diamond blade; causing a rake surface of the polycrystalline diamond blade to face the laser; adjusting the laser focus to the straight edge position of the front cutter edge of the polycrystalline diamond blade, performing rear angle cutting processing on the straight edge of the polycrystalline diamond blade by using the laser focus to form a straight edge cutting edge of the blade on the polycrystalline diamond blade, and cutting the laser power W of the polycrystalline diamond blade 1 ，40W≤W 1 Less than or equal to 70W; adjusting the distance between the straight edge of the polycrystalline diamond blade and the laser focus and the included angle between the front cutter face of the polycrystalline diamond blade and the laser irradiation direction,carrying out primary passivation processing on the straight-edge cutting edge of the polycrystalline diamond blade by utilizing residual light outside a laser focus to obtain a blunt round cutting edge, and carrying out primary passivation processing on the straight-edge cutting edge by using laser power W 2 ，10W≤W 2 Less than or equal to 20W. Also relates to a polycrystalline diamond cutter manufactured by the method.
Description
Technical Field
The application relates to the technical field of polycrystalline diamond cutters, in particular to a machining method of a polycrystalline diamond cutter with a blunt circular cutting edge and the polycrystalline diamond cutter.
Background
When a metal product, such as an AL7075 aluminum alloy, is machined, if a large plane of the product needs to be machined, and the requirements on the surface flatness and the smoothness of the large product are high, the conventional polycrystalline diamond (PCD) cutter often has difficulty in achieving an ideal milling effect. In order to meet the requirements of customers and enable large products to have good surface flatness and smoothness, a blunt-round edge cutter is needed to mill the workpiece, the part of the workpiece machined by the cutter is designed to be a blunt circle, and the blunt circle of the machining part of the cutter is used for extruding and milling the product, so that the product can obtain good surface flatness and smoothness. The traditional process is generally to passivate the cutting edge of the PCD blade by using magnetic powder, the cutting edge sawtooth formed by the PCD blade passivating process is generally about 0.003mm, and the circular arc radius (commonly called as R angle or R in the industry) of the blunt cutting edge of the cutting edge is about 0.0017 mm. Therefore, the passivation R realized by magnetic powder passivation is smaller, the processing efficiency is low, and the milling effect of the PCD blade passivated like this is difficult to meet the quality requirement.
Disclosure of Invention
In view of this, it is necessary to provide a method for machining a polycrystalline diamond cutter and a polycrystalline diamond cutter, which are capable of machining a cutter with a blunt circular cutting edge meeting the requirement, and improving the surface flatness and smoothness of a machined product.
The embodiment of the application provides a processing method of a polycrystalline diamond cutter, which comprises the following steps: providing a polycrystalline diamond preprocessing cutter, wherein the polycrystalline diamond preprocessing cutter comprises a polycrystalline diamond blade; facing a rake surface of the polycrystalline diamond blade toward a laser; adjusting a laser focus to a straight edge position of a front cutter edge of the polycrystalline diamond blade, performing rear angle cutting processing on the straight edge of the polycrystalline diamond blade by using the laser focus, forming a straight edge cutting edge of the blade on the polycrystalline diamond blade, and cutting the laser power W of the polycrystalline diamond blade 1 ，40W≤W 1 Less than or equal to 70W; adjusting the distance between the straight-edge cutting edge of the polycrystalline diamond blade and the laser focus, and adjusting the distance between the rake face of the polycrystalline diamond blade and the laser irradiation directionAn included angle, utilizing the residual light outside the laser focus to carry out primary passivation processing on the straight edge cutting edge of the polycrystalline diamond blade so as to obtain a blunt circular cutting edge, and carrying out primary passivation processing on the straight edge cutting edge to obtain the laser power W used for the primary passivation processing 2 ，10W≤W 2 ≤20W。
In this embodiment, the polycrystalline diamond blade is cut using a laser, wherein the laser power W is used to cut the polycrystalline diamond blade 1 Cutting the polycrystalline diamond blade, adjusting the included angle between the polycrystalline diamond blade and the laser, and processing the cutting edge of the polycrystalline diamond blade again by using the residual light of the laser, wherein the laser power is W 2 Is less than the laser power W 1 The strength of the tool is improved, so that the tool can be rounded, and a large plane of a workpiece can be better machined.
In at least one embodiment, the method of manufacturing the polycrystalline diamond pre-machining tool includes the steps of: providing a polycrystalline diamond blank, and cutting the polycrystalline diamond blank to obtain a plurality of polycrystalline diamond blades; polishing the surface of the polycrystalline diamond blade to be welded, and removing burrs on the surface; providing a tool handle, and cleaning the tool handle and the polycrystalline diamond blade after deburring by using an organic solvent; and coating a welding flux on the cutter groove of the cutter handle, arranging the polycrystalline diamond blade at the cutter groove, and placing the polycrystalline diamond blade and the cutter handle in a welding machine for welding.
In at least one embodiment, in the step of performing primary passivation processing on the straight-edge cutting edge of the polycrystalline diamond blade by using residual light outside the laser focus, the laser focus is formed through a laser focusing convex lens, and the distance between the laser focusing convex lens and the polycrystalline diamond blade is smaller than the focal length of the laser focusing convex lens.
In this embodiment, the distance between the convex laser focusing lens and the polycrystalline diamond blade is adjusted so that different positions of the blade can be machined by the residual light of the light spot, for example, after the blade is obliquely arranged by taking the position of the most edge of the blade as a boundary line, the residual light of the light spot can machine the part of the blade below the most edge to form a partially obtuse-rounded design.
In at least one embodiment, the method further comprises the steps of adjusting the distance between the polycrystalline diamond blade and the laser focus, enabling the distance between the laser focusing convex lens and the blunt circular cutting edge of the polycrystalline diamond blade to be larger than the focal length of the laser focusing convex lens, passivating the blunt circular cutting edge of the polycrystalline diamond blade again by using residual light outside the laser focus, and enabling the laser power for passivating the blunt circular cutting edge again to be smaller than that for passivating the blunt circular cutting edge for the first time.
In this embodiment, by adjusting the distance between the laser focusing convex lens and the blade, different positions of the blade can be processed by the residual light of the light spot, and the power of the residual light is smaller than the power of the primary passivation, so that the part of the blade close to the laser focusing convex lens can be processed.
In at least one embodiment, the included angle between the rake surface of the polycrystalline diamond blade in the secondary laser passivation processing and the laser irradiation direction is the same as the included angle between the rake surface of the polycrystalline diamond blade in the primary laser passivation processing and the laser irradiation direction.
In at least one embodiment, the laser light is incident at an angle θ in a range of 4 ° to 6 ° when machining the polycrystalline diamond blade.
In the embodiment, the included angle between the residual light of the light spot and the processing part of the blade is set to be 4-6 degrees so as to fully utilize the energy of the light spot, meanwhile, the energy of the residual light is not very strong, and the condition that a cutter is damaged in the processing process is improved.
In at least one embodiment, in the step of "coating flux at the tool groove of the tool shank, disposing the polycrystalline diamond blade at the tool groove, and welding the polycrystalline diamond blade and the tool shank in a welding machine", the method includes:
controlling the welding temperature to rise from the room temperature to a first preset temperature, after a first preset time, rising the first preset temperature to a second preset temperature, after the second preset time, reducing the second preset temperature to a third preset temperature, and after the third preset time, finishing welding, wherein the first preset time is 3-5 minutes, the second preset time is 4-6 minutes, and the third preset time is 3-5 minutes.
In at least one embodiment, the diameter of a focusing point light spot of the laser is D, and D is more than or equal to 0.018mm and less than or equal to 0.022 mm.
In at least one embodiment, the focusing point light spot cuts the polycrystalline diamond blade by a distance H in the first direction 1 ，0.015mm≤H 1 Not more than 0.03mm, and the distance between the focusing point light spot and the polycrystalline diamond blade is H along the second direction 2 ，0.03mm≤H 2 Be less than or equal to 0.07mm, just first direction is the thickness direction of polycrystalline diamond blade, the second direction is the width direction of polycrystalline diamond blade.
Another embodiment of the application provides a polycrystalline diamond cutter, polycrystalline diamond cutter adopts the processing method as above-mentioned polycrystalline diamond cutter to make, polycrystalline diamond cutter includes the handle of a knife and locates polycrystalline diamond blade on the handle of a knife, the curvature radius r of straight flange cutting edge department of polycrystalline diamond blade is level and smooth gradual change along the cutting direction, and this curvature radius r's scope is 0.003mm and is less than or equal to r and is less than or equal to 0.01mm, the straight flange cutting edge is formed with the sawtooth, the length of sawtooth is L, and 0.015mm is less than or equal to L and is less than or equal to 0.002 mm.
The application provides a polycrystalline diamond cutter's processing method and polycrystalline diamond cutter cuts polycrystalline diamond blade through utilizing laser, utilizes laser again after the cutting to carry out the blunt circle to polycrystalline diamond blade to process out the blade that has the blunt circle blade, thereby can be better process the big plane of work piece.
Drawings
Fig. 1 is a flow chart illustrating a method of machining a polycrystalline diamond cutter according to an embodiment of the present disclosure.
Fig. 2 is a flowchart of a processing method of the polycrystalline diamond pre-processing tool in the embodiment shown in fig. 1.
Fig. 3 is a schematic perspective view of a polycrystalline diamond cutter manufactured by a method of machining the polycrystalline diamond cutter.
Fig. 4 is an exploded view of the polycrystalline diamond cutter of fig. 3.
Fig. 5 is a schematic diagram of a laser machining polycrystalline diamond blade in a method of machining a polycrystalline diamond cutter.
Fig. 6 is a schematic diagram of a polycrystalline diamond blade cut by a laser in a cutter processing method.
Fig. 7 is a schematic diagram of processing the polycrystalline diamond blade by using the residual light of the light spot in the processing method of the polycrystalline diamond cutter based on fig. 6.
Fig. 8 is another schematic view of the polycrystalline diamond tool blade machined by the polycrystalline diamond tool machining method using the residual light of the light spot based on fig. 7.
Fig. 9 is a perspective view of a polycrystalline diamond cutter and a cutter disc in another embodiment of the present disclosure.
Description of the main elements
Knife handle 10
Knife groove 11
Mirror 32
Focusing convex lens 33
Light spot A
First preset length M
A second predetermined length N
Normal line O
Distance H 1 、H 2
Incident angle theta
Detailed Description
The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments.
It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. When an element is referred to as being "on" another element, it can be directly on the other element or intervening elements may also be present. The terms "top," "bottom," "upper," "lower," "left," "right," "front," "rear," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the present application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
The embodiment of the application provides a processing method of a polycrystalline diamond cutter, which comprises the following steps: providing a polycrystalline diamond preprocessing cutter, wherein the polycrystalline diamond preprocessing cutter comprises a polycrystalline diamond blade; facing a rake surface of the polycrystalline diamond blade toward a laser; adjusting a laser focus to a straight edge position of a front cutter edge of the polycrystalline diamond blade, performing rear angle cutting processing on the straight edge of the polycrystalline diamond blade by using the laser focus, forming a straight edge cutting edge of the blade on the polycrystalline diamond blade, and cutting the laser power W of the polycrystalline diamond blade 1 ，40W≤W 1 Less than or equal to 70W; adjust the saidPolycrystalline diamond blade straight flange blade with the distance of laser focus, and adjustment polycrystalline diamond blade rake face with the contained angle of laser irradiation direction utilizes the outer afterglow of laser focus is right polycrystalline diamond blade straight flange blade carries out primary passivation processing to obtain a blunt round blade, right the straight flange blade carries out the used laser power W of primary passivation processing 2 ，10W≤W 2 ≤20W。
In this embodiment, the polycrystalline diamond blade is cut using a laser, wherein the laser power W may be passed 1 Cutting the polycrystalline diamond blade, adjusting the included angle between the polycrystalline diamond blade and the laser, and processing the cutting edge of the polycrystalline diamond blade again by using the residual light of the laser, wherein the laser power is W 2 Is less than the laser power W 1 The strength of the tool is improved, so that the tool can be rounded, and a large plane of a workpiece can be better machined.
Some embodiments will be described below with reference to the accompanying drawings. The embodiments described below and the features of the embodiments can be combined with each other without conflict.
Referring to fig. 1, a method for machining a polycrystalline diamond cutter is provided, including the steps of:
s100: providing a polycrystalline diamond preprocessing cutter, wherein the polycrystalline diamond preprocessing cutter comprises a polycrystalline diamond blade;
s200: facing a rake surface of the polycrystalline diamond blade toward a laser;
s300: adjusting a laser focus to a straight edge position of a front cutter edge of the polycrystalline diamond blade, performing rear angle cutting processing on the straight edge of the polycrystalline diamond blade by using the laser focus, forming a straight edge cutting edge of the blade on the polycrystalline diamond blade, and cutting the laser power W of the polycrystalline diamond blade 1 ，40W≤W 1 ≤70W；
S400: adjusting the distance between the straight-edge cutting edge of the polycrystalline diamond blade and the laser focus, adjusting the included angle between the rake face of the polycrystalline diamond blade and the laser irradiation direction, and utilizing the residual light outside the laser focusThe polycrystalline diamond blade straight edge is subjected to primary passivation processing to obtain a blunt round edge, and the straight edge is subjected to primary passivation processing by using laser power W 2 ，10W≤W 2 ≤20W。
Step S100: providing a polycrystalline diamond preparation cutter, wherein the polycrystalline diamond preparation cutter comprises a polycrystalline diamond blade.
Referring to fig. 2, in this step, a polycrystalline diamond preparation tool is provided, which includes a polycrystalline diamond blade. The manufacturing method of the polycrystalline diamond preprocessing cutter comprises the following steps:
p100: providing a polycrystalline diamond blank, and cutting the polycrystalline diamond blank to obtain a plurality of polycrystalline diamond blades;
p200: polishing the surface of the polycrystalline diamond blade to be welded, and removing burrs on the surface;
p300: providing a tool handle, and cleaning the tool handle and the polycrystalline diamond blade after deburring by using an organic solvent;
p400: and coating a welding flux on the cutter groove of the cutter handle, arranging the polycrystalline diamond blade at the cutter groove, and placing the polycrystalline diamond blade and the cutter handle in a welding machine for welding.
Step P100: providing a polycrystalline diamond blank, and cutting the polycrystalline diamond blank to obtain a plurality of polycrystalline diamond blades.
In this step, a polycrystalline diamond blank is provided, and is cut, and the polycrystalline diamond blank is cut into a plurality of pieces as required, thereby obtaining a plurality of polycrystalline diamond blades. Specifically, provide a diameter and be 58 mm's diamond circular composite piece, cut into a plurality of pieces with diamond circular composite piece through the blanking machine, the thickness of every piece of composite piece after the cutting is 1 mm.
It is understood that polycrystalline diamond blanks may also be materials of other materials and may be of different shapes and sizes in other embodiments. For example, square or other shaped structures of material are also possible.
Step P200: and grinding the surface of the polycrystalline diamond blade to be welded, and removing burrs on the surface.
In this step, the cut polycrystalline diamond blade is polished and deburred by a polishing member, and further, the welding surface on the cut polycrystalline diamond blade is polished and deburred. For example, after the polycrystalline diamond blade is formed by cutting a diamond round composite sheet, the diamond round composite sheet is held by a hand, and a tungsten steel welding surface of the diamond round composite sheet is polished by an electro-plating diamond pneumatic grinding head and burrs are removed.
It is understood that in other embodiments, the grinding member for grinding and deburring the polycrystalline diamond blade may be replaced by other structures with equivalent functions or effects, and the grinding member may be replaced correspondingly according to different grinding materials.
Step P300: and providing a tool handle, and cleaning the tool handle and the polycrystalline diamond blade after deburring by using an organic solvent.
Referring to fig. 3, in this step, a tool shank 10 is provided and the tool shank 10 and polycrystalline diamond blade 20 are cleaned with an organic solvent. Further, the tool holder 10 and the polycrystalline diamond blade 20 are made of the same material, the organic solvent is alcohol, the tool holder 10 and the polycrystalline diamond blade 20 are washed with alcohol, and the tool holder 10 and the polycrystalline diamond blade 20 are dried after washing. The tool handle 10 and the polycrystalline diamond blade 20 are cleaned by alcohol, so that the loss of cobalt in the material can be avoided.
It is understood that in other embodiments, the organic solvent may be replaced by other solvents having equivalent efficacy or function, for example, a screen-like cleaning agent may be used to clean the tool shank 10 and the polycrystalline diamond blade 20.
Step P400: and coating a welding flux on the cutter groove of the cutter handle, arranging the polycrystalline diamond blade at the cutter groove, and placing the polycrystalline diamond blade and the cutter handle in a welding machine for welding.
Referring to fig. 4, in this step, a tool holder 10 is provided with a pocket 11, the pocket 11 is used for accommodating a polycrystalline diamond blade 20, flux is applied to the pocket 11, a surface of the polycrystalline diamond blade 20 to be ground and deburred corresponds to the pocket 11 coated with flux, and the polycrystalline diamond blade 20 is provided at the pocket 11. The tool shank 10 and polycrystalline diamond blade 20 are placed in a welding machine and have been welded. Further, the cutter groove 11 is coated with low-temperature flux, and the position between the cutter handle 10 and the polycrystalline diamond blade 20 can be adjusted at any time before the cutter handle and the polycrystalline diamond blade are placed in a welding machine by adopting the low-temperature flux, so that the situation that the polycrystalline diamond blade 20 deviates from the position of the cutter groove 11 and cannot be adjusted is avoided.
In one embodiment, the method further comprises the following steps: controlling the welding temperature to rise from the room temperature to a first preset temperature, after a first preset time, rising the first preset temperature to a second preset temperature, after the second preset time, reducing the second preset temperature to a third preset temperature, and after the third preset time, finishing welding, wherein the first preset time is 3-5 minutes, the second preset time is 4-6 minutes, and the third preset time is 3-5 minutes.
Specifically, the tool shank 10 and the polycrystalline diamond cutter 100 are placed in a vacuum welding machine, the temperature of the vacuum welding machine is controlled to rise from room temperature to 500 ℃, wherein the time required by the temperature rise is 4 minutes, after the temperature rises to 500 ℃, the tool shank 10 and the polycrystalline diamond cutter 20 are subjected to heat preservation for a period of time, the first heat preservation time is a first preset time, and the first preset time is 4 minutes. And after the first heat preservation is finished, the temperature of the vacuum welding machine is increased from 500 ℃ to 750 ℃, wherein the time required by the temperature increase is 5 minutes, after the temperature is increased to 750 ℃, the heat preservation is carried out on the cutter handle 10 and the polycrystalline diamond blade 20 again for a period of time, the second heat preservation time is a second preset time, and the second preset time is 5 minutes. And after the second heat preservation is finished, reducing the temperature of the vacuum welding part from 750 ℃ to 400 ℃, wherein the time required for reducing the temperature is 8 minutes, the time for preserving the temperature and reducing the temperature to the room temperature after the temperature is reduced to 400 ℃ is a third preset time, the third preset time is 4 minutes, and the time for the welding process is 30 minutes.
It is understood that in other embodiments, the temperature and the holding time for welding the tool shank 10 and the polycrystalline diamond cutter 100 may be set as desired.
Step S200: the rake surface of the polycrystalline diamond blade is faced toward the laser.
In this step, the rake face of the polycrystalline diamond blade is faced with a laser to be processed by the laser.
Step S300: adjusting a laser focus to a straight edge position of a front cutter edge of the polycrystalline diamond blade, performing rear angle cutting processing on the straight edge of the polycrystalline diamond blade by using the laser focus, forming a straight edge cutting edge of the blade on the polycrystalline diamond blade, and cutting the laser power W of the polycrystalline diamond blade 1 ，40W≤W 1 ≤70W。
Referring to fig. 5, in this step, the polycrystalline diamond blade 20 after welding is roughly machined by a laser machine 300. Specifically, the laser machine tool 300 includes a laser 31, a reflector 32, a focusing convex lens 33, a numerical control device 34 and a working machine 35, the tool holder 10 with the polycrystalline diamond blade 20 is placed on the working machine 35, the numerical control device 34 is connected with the working machine 35 and can control the working machine 35 to adjust the angle, a power supply (not shown) and a light source (not shown) are connected with the laser 31, the light source irradiates the laser 31, the laser 31 emits an original laser beam to irradiate the reflector 32, the original laser beam is reflected by the reflector 32 and then emits a focused laser beam through the focusing convex lens 33, the focused laser beam is focused to form a focusing point spot a, the focusing point spot a is also a laser focus, and the polycrystalline diamond blade 20 is cut by the focusing point spot a.
Before cutting the polycrystalline diamond blade 20, the polycrystalline diamond blade 20 is placed on the working machine 35, and a distance between the focusing convex lens 33 and the polycrystalline diamond blade 20 is a first preset length M, which is also a focal length of the focusing convex lens 33. After the positions of the focusing convex lens 33 and the polycrystalline diamond blade 20 are set, the laser focus is adjusted to be in front of the polycrystalline diamond blade 20And (3) cutting the straight edge of the blade tip of the polycrystalline diamond blade 20 by utilizing the laser focus at the straight edge position of the blade tip of the cutter surface, and forming a blade straight edge cutting edge on the polycrystalline diamond blade 20 after cutting. Laser power W while cutting polycrystalline diamond blade 20 1 In the range of 50W to W 1 Less than or equal to 70W. After the laser focus cuts polycrystalline diamond blade 20, a straight-edge cutting edge 21 is formed on polycrystalline diamond blade 20, and the straight-edge cutting edge 21 is used for processing a large plane of a product.
Referring to fig. 6, in an embodiment, the cutting position of the polycrystalline diamond blade 20 is set in the numerical control device 34, for example, the cutting position of the polycrystalline diamond blade 20 is set in the numerical control device 34, the cutting angle of the laser is set in the numerical control device 34, and the laser has a taper angle corresponding to the cutting angle of the polycrystalline diamond blade 20, the taper angle of the laser is 16 ° when the laser is used for cutting the polycrystalline diamond blade 20. Laser power W while cutting polycrystalline diamond blade 20 1 60W to enable the laser energy to smoothly perform the relief cutting of the straight edge of the polycrystalline diamond blade 20. While cutting polycrystalline diamond blade 20, polycrystalline diamond blade 20 is rotated.
It will be appreciated that in other embodiments, if the arrangement of the straight edge of the cutting edge is different, the taper of the laser will vary accordingly.
It is understood that in other embodiments, the laser power W may be used to cut the polycrystalline diamond blade 20 1 But also 40W, 45W, 50W, 55W, 65W, 70W and the like.
Step S400: adjusting the polycrystalline diamond blade straight edge cutting edge with the distance of laser focus, and adjusting polycrystalline diamond blade rake face with the contained angle of laser irradiation direction, utilize the outer afterglow of laser focus is right polycrystalline diamond blade straight edge cutting edge carries out primary passivation processing to obtain a blunt round cutting edge, right the straight edge cutting edge carries out the used laser power W of primary passivation processing 2 ，10W≤W 2 ≤20W。
In this step, after the laser cuts the polycrystalline diamond blade 20, the straight-edge cutting edge 21 formed after the cutting process is relatively sharp, and further processing of the straight-edge cutting edge 21 is required to avoid damaging the product by the sharp straight-edge cutting edge 21. In order to process a large plane of a product and enable the flatness and the smoothness of the large plane to meet certain requirements, the distance between the straight-edge cutting edge 21 of the polycrystalline diamond blade 20 and the laser focus is adjusted, and the included angle between the rake face of the polycrystalline diamond blade 20 and the laser irradiation direction is adjusted, that is, the distance between the focusing convex lens 33 and the polycrystalline diamond blade 20 is made to be the second preset length N by adjusting the polycrystalline diamond blade 20, and the included angle between the focusing convex lens 33 and the polycrystalline diamond blade 20 is adjusted at the same time. After the distance between the focusing convex lens 33 and the polycrystalline diamond blade 20 is changed, the focusing point light spot a is not concentrated at the straight-edge cutting edge 21 of the polycrystalline diamond cutter 100, but the residual light of the focusing point light spot a is irradiated at the position of the straight-edge cutting edge 21, and the energy of the residual light is further utilized to perform primary passivation treatment on the straight-edge cutting edge 21, so that a blunt circular cutting edge can be obtained for the polycrystalline diamond blade 20, and a large product can be processed.
The laser power W is applied during the initial passivation of the polycrystalline diamond blade 20 2 Is set to be 10W or less 2 Between 20W is equaled or less, can utilize the low light energy of laser to process polycrystalline diamond blade 20, can be further passivated with polycrystalline diamond blade 20 by the straight flange blade 21 that forms after the cutting to become dull and round cutting edge with sharp-pointed straight flange blade 21 processing originally, make straight flange blade 21 can process the surface of major possession product, improve machining efficiency, also improve the condition that straight flange blade 21 can mark the damage product.
In one embodiment, in the step of performing primary passivation processing on the straight-edge cutting edge of the polycrystalline diamond blade by using residual light outside the laser focus: the distance between the laser focus convex lens and the polycrystalline diamond blade is smaller than the focal length of the laser focus convex lens.
The second preset length N is larger than the first preset length M, and the laser power W for primary passivation of the straight edge cutting edge 21 is achieved 2 Is 15W.
Referring to fig. 7, the polycrystalline diamond blade 20 is adjusted, the position of the laser focusing convex lens 33 is not changed, so that the second preset length N between the laser focusing convex lens 33 and the polycrystalline diamond blade 20 is smaller than the first preset length M, that is, after the polycrystalline diamond blade 20 is cut by the laser, the polycrystalline diamond blade 20 is adjusted, so that the distance between the laser focusing convex lens 33 and the polycrystalline diamond blade 20 is reduced. The laser cuts the polycrystalline diamond blade 20 through the focusing point light spot A, and then the straight-edge cutting edge 21 is passivated by using residual light scattered by the focusing point light spot A. And after the polycrystalline diamond blade 20 is adjusted, the focus point light spot A moves downwards, and light scattered by the focus point light spot A is emitted to a position which is lower in the middle of the straight edge 21, so that primary passivation processing is performed on part of the straight edge 21. During the primary passivation process, polycrystalline diamond blade 20 is rotated simultaneously to pour out a circumferentially rounded edge of polycrystalline diamond blade 20.
The area of the part of the polycrystalline diamond blade 20 below the straight edge 21 is large, so that the laser power W is reduced 2 When the setting is 15W, the distance irradiated by the residual light of the light spot A is farther, so that a blunt circular cutting edge with a larger area can be formed.
It is understood that in other embodiments, the laser power W is processed for different polycrystalline diamond cutters 100 2 Settings may also be set to 16W, 17W, 18W, 19W, 20W, etc.
In another embodiment, the method further comprises the steps of: adjusting polycrystalline diamond blade with the distance of laser focus makes laser focus convex lens with the distance of polycrystalline diamond blade blunt circle blade is greater than laser focus convex lens's focus, and utilize the outer afterglow of laser focus is right polycrystalline diamond blade blunt circle blade carries out passivation once more, right the used laser power of passivation once more processing is less than the used laser power of primary passivation processing to blunt circle blade.
Referring to fig. 8, the polycrystalline diamond blade 20 is adjusted, the position of the laser focusing convex lens 33 is not changed, so that the second preset length N between the laser focusing convex lens 33 and the polycrystalline diamond blade 20 is greater than the first preset length M, that is, after the polycrystalline diamond blade 20 is cut by the laser, the polycrystalline diamond blade 20 is adjusted, so that the distance between the laser focusing convex lens 33 and the polycrystalline diamond blade 20 is increased. The laser cuts the polycrystalline diamond blade 20 through the focusing point light spot A, residual light scattered out of the light spot A is used for primary passivation of the straight-edge cutting edge 21, and after the polycrystalline diamond blade 20 is continuously adjusted, the residual light scattered out of the light spot A is used for secondary passivation of the straight-edge cutting edge 21. After the polycrystalline diamond blade 20 is adjusted, the focus point light spot A moves upwards, and light scattered by the light spot A irradiates the upper middle position of the straight edge 21 so as to passivate the other part of the straight edge 21. During the passivation process, polycrystalline diamond blade 20 is rotated to pour out a rounded edge along the circumferential direction from polycrystalline diamond blade 20.
The area of the upper part of the straight edge 21 of the polycrystalline diamond blade 20 is smaller, so that the laser power W is reduced 2 When the laser power W is set to 12W, the distance irradiated by the residual light of the light spot A is smaller, and the situation that the polycrystalline diamond blade 20 is damaged by the residual light is improved, so that the laser power W is used 2 The setting is smaller.
It is understood that in other embodiments, the laser power W may be different for different polycrystalline diamond cutters 100, for example, depending on the thickness of the polycrystalline diamond cutter 100 2 Settings may also be set to 10W, 11W, 12W, 13W, 14W, etc.
And passivating the upper part and the lower part of the straight-edge cutting edge 21 by utilizing the residual light scattered by the light spots A, and finally forming a complete blunt circular cutting edge on the straight-edge cutting edge 21 so as to process the surface of a large piece.
Alternatively, when machining the upper or lower position of the straight edge 21 with the margin of the spot a, the machining order can be adjusted. For example, the portion of the straight-side cutting edge 21 that is located above may be machined first, and then the portion of the straight-side cutting edge 21 that is located below may be machined.
In one embodiment, when the polycrystalline diamond blade 20 is cut by laser, the incidence angle θ of the laser is in a range of 4 ° to 6 °. The angle of incidence is the angle between the light emitted by the laser and the normal O, as shown in fig. 6.
Specifically, when the polycrystalline diamond blade 20 is cut, the incidence angle θ of the laser light is 6 °.
When the polycrystalline diamond blade 20 is passivated by using laser in the step S400, an included angle between the rake face of the polycrystalline diamond blade and the laser irradiation direction in the secondary laser passivation processing is the same as an included angle between the rake face of the polycrystalline diamond blade and the laser irradiation direction in the primary laser passivation processing. The range of the incident angle theta of the residual light scattered from the spot a is 4 deg..
When the polycrystalline diamond blade 20 is machined by using laser, the pulse width of the laser is 0.8 microsecond, the laser frequency is 2000 Hz, and further, the diameter of a focus spot A of the laser is D, wherein D is more than or equal to 0.018mm and less than or equal to 0.022 mm.
Specifically, when the polycrystalline diamond blade 20 is cut by using laser, the diameter D of the focal point spot a of the laser is 0.02 mm.
It will be appreciated that in other embodiments, the angle of incidence, pulse width and laser frequency may be set according to particular needs. The diameter of the spot a when cutting the polycrystalline diamond blade 20 may also be set according to the different polycrystalline diamond blades 20.
After the straight-edge cutting edge 21 is passivated, the radius R of the straight-edge cutting edge 21 is within the range of 0.003mm to 0.01 mm. In the above embodiment, the radius r of the straight-edge cutting edge 21 after passivation is 0.006mm, and the radius r is set to 0.006mm, so as to facilitate processing of the surface of a large product.
It is understood that in other embodiments, the radius R may also be 0.003mm, 0.004 mm, 0.006mm, 0.007mm, 0.008mm, 0.009 mm.
After the straight-edge cutting edge 21 is passivated, sawteeth are formed on the surface of the straight-edge cutting edge 21, the distance between the end part of the sawteeth far away from the surface of the straight-edge cutting edge 21 and the straight-edge cutting edge 21 is L, and L is more than or equal to 0.015mm and less than or equal to 0.002 mm. After the serrations are formed on the surface of the straight-edged edge 21, a large product is processed.
When the polycrystalline diamond blade 20 is cut by laser, an unnecessary portion needs to be cut off to form the straight-edge cutting edge 21. Specifically, along the first direction, the distance that the focusing point light spot a cuts the polycrystalline diamond blade 20 is H 1 ，0.015mm≤H 1 Not more than 0.03mm, and the distance between the focus spot A and the polycrystalline diamond blade 20 is H along the second direction 2 ，0.03mm≤H 2 Less than or equal to 0.07mm and a distance H 1 And a distance H 2 As shown in fig. 7, the first direction is a thickness direction of the polycrystalline diamond blade 20, the second direction is a width direction of the polycrystalline diamond blade 20, and the first direction and the second direction may be perpendicular to each other or may have an angle.
In step S300, when the polycrystalline diamond blade is cut, the depth of the single cutting of the polycrystalline diamond blade is 0.03mm, and the width of the single cutting of the polycrystalline diamond blade is 0.07 mm. In step S400, the polycrystalline diamond blade is adjusted for the first time, so that when the second preset length between the laser focusing convex lens and the polycrystalline diamond blade is smaller than the first preset length, the depth of cutting the polycrystalline diamond blade at a single time is 0.025mm, and the width of cutting the polycrystalline diamond blade is 0.03 mm. And adjusting the polycrystalline diamond blade for the second time, wherein when the second preset length between the laser focusing convex lens and the polycrystalline diamond blade is greater than the first preset length, the depth of the blade cut by a single time is 0.015mm, and the width of the blade cut by the single time is 0.03 mm.
In one embodiment, after multiple passes of cutting and passivating the polycrystalline diamond blade, the test data is as follows in table 1:
from the above table, it can be understood that when the laser power W is applied 2 When 12W is set, a straight edge 21 with a radius r of 0.006mm can be obtained, the surface roughness is small, and the removal of the edge tip during processing of the polycrystalline diamond blade 20 can be avoided, so that the laser power is better.
Referring to fig. 3 and 4, an embodiment of the present disclosure further provides a polycrystalline diamond cutter 100, where the polycrystalline diamond cutter 100 is manufactured by the above-described cutter machining method. The polycrystalline diamond cutter 100 comprises a cutter handle 10 and a polycrystalline diamond blade 20 arranged on the cutter handle 10, wherein the polycrystalline diamond blade 20 comprises a straight-edge cutting edge 21, and the curvature radius r at the straight-edge cutting edge 21 is within the range of 0.003mm or more and less than or equal to 0.01 mm.
The straight-edge cutting edge 21 formed by laser machining of the polycrystalline diamond blade 20 is an edge portion of the polycrystalline diamond blade 20. The surface of a large product is processed after the straight-edge cutting edges 21 of the polycrystalline diamond blade 20 are passivated.
Referring to fig. 9, after a plurality of polycrystalline diamond blades 20 are processed by laser, the polycrystalline diamond cutter 100 provided with the processed polycrystalline diamond blades 20 is disposed on a cutter head 400, and the cutter head 400 is mounted in a machine table to process a workpiece.
To sum up, in the embodiment of the present application, a processing method of the polycrystalline diamond cutter 100 and the polycrystalline diamond cutter 100 are provided, after the polycrystalline diamond blade 20 is cut by using laser, a distance between the laser focusing convex lens and the polycrystalline diamond blade 20 is adjusted, and then the polycrystalline diamond blade 20 is passivated by using residual light of the light spot a, so that a blunt circular cutting edge capable of processing the surface of a large product is formed. The polycrystalline diamond blade 20 after laser processing is adopted to process the product, the precision of the surface of the processed large product meets the composite requirement, the processed surface reaches high brightness, the chip removal in the process of processing the large product is smooth, and the service life of the polycrystalline diamond cutter 100 is prolonged.
In addition, those skilled in the art should realize that the above embodiments are illustrative only and not limiting to the present application, and that suitable changes and modifications to the above embodiments are within the scope of the disclosure of the present application as long as they are within the true spirit and scope of the present application.
Claims (10)
1. A processing method of a polycrystalline diamond cutter is characterized by comprising the following steps:
providing a polycrystalline diamond preprocessing cutter, wherein the polycrystalline diamond preprocessing cutter comprises a polycrystalline diamond blade;
facing a rake surface of the polycrystalline diamond blade toward a laser;
adjusting a laser focus to a straight edge position of a front cutter edge of the polycrystalline diamond blade, performing rear angle cutting processing on the straight edge of the polycrystalline diamond blade by using the laser focus, forming a straight edge cutting edge of the blade on the polycrystalline diamond blade, and cutting the laser power W of the polycrystalline diamond blade 1 ，40W≤W 1 ≤70W；
Adjusting the polycrystalline diamond blade straight edge cutting edge with the distance of laser focus, and adjusting polycrystalline diamond blade rake face with the contained angle of laser irradiation direction, utilize the outer afterglow of laser focus is right polycrystalline diamond blade straight edge cutting edge carries out primary passivation processing to obtain a blunt round cutting edge, right the straight edge cutting edge carries out the used laser power W of primary passivation processing 2 ，10W≤W 2 ≤20W。
2. The method of machining a polycrystalline diamond cutter according to claim 1, wherein the method of manufacturing the polycrystalline diamond pre-machining cutter comprises the steps of:
providing a polycrystalline diamond blank, and cutting the polycrystalline diamond blank to obtain a plurality of polycrystalline diamond blades;
polishing the surface of the polycrystalline diamond blade to be welded, and removing burrs on the surface;
providing a tool handle, and cleaning the tool handle and the polycrystalline diamond blade after deburring by using an organic solvent;
and coating a welding flux on the cutter groove of the cutter handle, arranging the polycrystalline diamond blade at the cutter groove, and placing the polycrystalline diamond blade and the cutter handle in a welding machine for welding.
3. The method of machining a polycrystalline diamond cutter according to claim 1, wherein in the step of performing primary passivation machining on the straight-edge cutting edge of the polycrystalline diamond blade by using residual light outside the laser focus, the laser focus is formed by a laser focusing convex lens, and a distance between the laser focusing convex lens and the polycrystalline diamond blade is smaller than a focal length of the laser focusing convex lens.
4. The method of machining a polycrystalline diamond cutter according to claim 3, further comprising:
adjusting polycrystalline diamond blade with the distance of laser focus makes laser focus convex lens with the distance of polycrystalline diamond blade blunt circle blade is greater than laser focus convex lens's focus, and utilize the outer afterglow of laser focus is right polycrystalline diamond blade blunt circle blade carries out passivation once more, right the used laser power of passivation once more processing is less than the used laser power of primary passivation processing to blunt circle blade.
5. The method of machining a polycrystalline diamond cutter according to claim 4, wherein an angle between the rake face of the polycrystalline diamond blade in the secondary laser passivation machining and a laser irradiation direction is the same as an angle between the rake face of the polycrystalline diamond blade in the primary laser passivation machining and the laser irradiation direction.
6. The method of machining a polycrystalline diamond cutter according to claim 1, wherein the incidence angle θ of the laser light during machining of the polycrystalline diamond cutter blade is in a range of 4 ° to 6 °.
7. The method of manufacturing a polycrystalline diamond cutter according to claim 2, wherein the step of applying a flux to the tool groove of the tool shank, disposing the polycrystalline diamond blade in the tool groove, and welding the polycrystalline diamond blade and the tool shank in a welding machine comprises:
controlling the welding temperature to rise from the room temperature to a first preset temperature, after a first preset time, rising the first preset temperature to a second preset temperature, after the second preset time, reducing the second preset temperature to a third preset temperature, and after the third preset time, finishing welding, wherein the first preset time is 3-5 minutes, the second preset time is 4-6 minutes, and the third preset time is 3-5 minutes.
8. The method of claim 1, wherein a diameter of a focal spot of the laser is D, and D is 0.018mm or less and D is 0.022mm or less.
9. The method of machining the polycrystalline diamond cutter of claim 8, wherein the focus spot cuts the polycrystalline diamond blade a distance H in the first direction 1 ，0.015mm≤H 1 Not more than 0.03mm, and the distance between the focusing point light spot and the polycrystalline diamond blade is H along the second direction 2 ，0.03mm≤H 2 Be less than or equal to 0.07mm, just first direction is the thickness direction of polycrystalline diamond blade, the second direction is the width direction of polycrystalline diamond blade.
10. The polycrystalline diamond cutter is characterized by being manufactured by the machining method of the polycrystalline diamond cutter according to any one of claims 1 to 9, and comprising a cutter handle and a polycrystalline diamond blade arranged on the cutter handle, wherein the curvature radius r at the straight edge of the polycrystalline diamond blade is smoothly and gradually changed along the cutting direction, the curvature radius r ranges from 0.003mm to 0.01mm, sawteeth are formed on the straight edge, the length of each sawtooth is L, and the L is not less than 0.015mm and not more than 0.002 mm.
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