CN210157587U - Anti-static integrated circuit power module - Google Patents
Anti-static integrated circuit power module Download PDFInfo
- Publication number
- CN210157587U CN210157587U CN201920721949.9U CN201920721949U CN210157587U CN 210157587 U CN210157587 U CN 210157587U CN 201920721949 U CN201920721949 U CN 201920721949U CN 210157587 U CN210157587 U CN 210157587U
- Authority
- CN
- China
- Prior art keywords
- power module
- circuit board
- static
- integrated circuit
- inner cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000003068 static effect Effects 0.000 claims abstract description 26
- 230000035939 shock Effects 0.000 claims abstract description 19
- 230000017525 heat dissipation Effects 0.000 claims abstract description 11
- 239000004065 semiconductor Substances 0.000 claims description 14
- 239000000428 dust Substances 0.000 claims description 11
- 239000002390 adhesive tape Substances 0.000 claims description 4
- 239000012528 membrane Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 14
- 239000012790 adhesive layer Substances 0.000 abstract description 8
- 238000004378 air conditioning Methods 0.000 abstract description 6
- 239000000463 material Substances 0.000 description 4
- 229920006267 polyester film Polymers 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000005679 Peltier effect Effects 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005057 refrigeration Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000013016 damping Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a prevent static integrated circuit power module belongs to electrical equipment technical field, prevent that static integrated circuit power module includes power module and circuit board, power module inner chamber fixed mounting has the circuit board, power module fixed surface pastes and is connected with the antistatic backing, power module fixed surface pastes and is connected with double-sided adhesive layer. The utility model has the advantages of being simple in structure, convenient operation and excellent in use effect, the antistatic film can effectively avoid static to transmit on power module surface, can transmit the static on power module surface to electrical equipment through electrostatic discharge ware, thereby with further promotion power module's antistatic effect, can accelerate the velocity of flow of air conditioning at the power module inner chamber through the radiator, thereby can effectively promote the radiating effect to the circuit board, and the shock pad can support the circuit board, the surface all can dispel the heat about the circuit board, make more even of heat dissipation.
Description
Technical Field
The utility model relates to an electrical equipment technical field especially relates to an prevent static integrated circuit power module.
Background
The power supply module is a power supply device which can be directly attached to a printed circuit board and is characterized by supplying power to an Application Specific Integrated Circuit (ASIC), a Digital Signal Processor (DSP), a microprocessor, a memory, a Field Programmable Gate Array (FPGA) and other digital or analog loads. Generally, such modules are referred to as point-of-load (POL) power supply systems or point-of-use power supply systems.
The existing integrated circuit power module is poor in anti-static effect, and meanwhile, the circuit board is not uniformly cooled, so that the power module is poor in operation stability.
Disclosure of Invention
The utility model provides a prevent static integrated circuit power module, moreover, the steam generator is simple in structure, convenient operation and excellent in use effect, prevent that the static membrane can effectively avoid static to transmit on power module surface, can transmit the static on power module surface to electrical equipment through electrostatic discharge ware, thereby with further promotion power module prevent the static effect, can accelerate air conditioning at the velocity of flow of power module inner chamber through the radiator, thereby can effectively promote the radiating effect to the circuit board, and the shock pad can support the circuit board, the surface all can dispel the heat about the circuit board, make radiating more even.
The utility model provides a specific technical scheme as follows:
the utility model provides a pair of prevent static integrated circuit power module, prevent that static integrated circuit power module includes power module and circuit board, power module inner chamber fixed mounting has the circuit board, power module surface fixed pasting is connected with anti-static membrane, fixed surface pastes and is connected with double faced adhesive tape under the power module, double faced adhesive tape fixed surface sets up flutedly, the fixed electrostatic discharge ware that is provided with of recess inner chamber, and electrostatic discharge ware top links to each other with power module surface fixed.
Optionally, the two ends of the lower surface of the circuit board are fixedly connected with shock pads in a sticking mode, and the circuit board is connected with the bottom of the inner cavity of the power module through the shock pads.
Optionally, the surfaces of the two ends of the power module are both fixedly provided with heat dissipation ports, and the inner cavities of the heat dissipation ports are fixedly welded with dust screens.
Optionally, a radiator is fixedly mounted at the top of the inner cavity of the power supply module, a semiconductor refrigerating sheet is fixedly mounted at the bottom of the radiator, supports are fixedly welded to two ends of the semiconductor refrigerating sheet, and the semiconductor refrigerating sheet is connected with the inner cavity wall of the power supply module through the supports.
The utility model has the advantages as follows:
1. the utility model discloses simple structure, convenient operation and excellent in use effect, the antistatic backing is as the substrate with the polyester film who prevents static processing, can effectively avoid static to transmit on power module surface, and polyester film has characteristics such as the high long service life of corrosion resistance to can effectively prolong power module's life.
2. The utility model discloses an electrostatic discharge ware can transmit the static on power module surface to electrical equipment in to with further promotion power module prevent the static effect.
3. The utility model discloses a radiator can accelerate air conditioning at the velocity of flow of power module inner chamber to can effectively promote the radiating effect to the circuit board, and the shock pad can support the circuit board, and the surface all can dispel the heat about the circuit board, makes the more even of heat dissipation.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic diagram of an overall structure of an anti-static integrated circuit power module according to an embodiment of the present invention;
fig. 2 is a schematic cross-sectional view of an anti-static ic power module according to an embodiment of the present invention;
in the figure: 1. a power supply module; 101. a circuit board; 2. an antistatic film; 201. a double-sided adhesive layer; 202. a groove; 203. an electrostatic discharger; 3. a shock pad; 4. a heat dissipation port; 401. a dust screen; 5. a heat sink; 601. a semiconductor refrigeration sheet; 602. and (4) a bracket.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the present invention will be described in further detail with reference to the accompanying drawings, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
An anti-static integrated circuit power module according to an embodiment of the present invention will be described in detail with reference to fig. 1 to 2.
Referring to fig. 1 and fig. 2, an embodiment of the present invention provides an anti-static integrated circuit power module, which includes a power module 1 and a circuit board 101, the power module 1 has an inner cavity fixedly mounted with the circuit board 101, the power module 1 has an outer surface fixedly bonded with an anti-static film 2, the power module 1 has a lower surface fixedly bonded with a double-sided adhesive layer 201, the double-sided adhesive layer 201 has a surface fixedly formed with a groove 202, the inner cavity fixedly formed with an electrostatic releaser 203, the top of the electrostatic releaser 203 is fixedly connected with the lower surface of the power module 1, the GP900G type power module 1 can be bonded to an electrical apparatus through the bottom double-sided adhesive layer 201, and is bonded and fixed through the double-sided adhesive layer 201, so that the power module can be mounted and fixed more conveniently, the integrated circuit can be supplied through the GP900G type circuit board 101 in the power module 1, meanwhile, the bottom of the circuit board 101 is connected with the power module 1 through the shock absorption pad 3, the shock absorption performance of the circuit board 101 can be effectively improved through the shock absorption pad 3, so that the stability of the circuit board 101 in working can be effectively improved, the anti-static film 2 is adhered and connected on the surface, the anti-static film 2 takes the polyester film subjected to the anti-static treatment as a base material, so that static electricity can be effectively prevented from being transmitted on the surface of the power module 1, the polyester film has the characteristics of high corrosion resistance, long service life and the like, so that the service life of the power module 1 can be effectively prolonged, the ZY184 type electrostatic releaser 203 is connected with a mounting surface during installation, the static electricity on the surface of the power module 1 can be transmitted into electrical equipment through the electrostatic releaser 203, so that the anti-static effect of the power module 1 can be further improved, the Peltier effect of semiconductor materials is utilized through series connection of TEC1-12706, when direct current passes through, can absorb the heat respectively and emit the heat at the both ends of galvanic couple, can release air conditioning, radiator 5 through A40 type can accelerate the velocity of flow of air conditioning at power module 1 inner chamber, thereby can effectively promote the radiating effect to circuit board 101, and shock pad 3 can support circuit board 101, the surface all can dispel the heat about the circuit board, make the more even of heat dissipation, steam accessible thermovent 4 discharges, and can carry out the separation to the dust through dust screen 401 and avoid the dust to enter into power module 1 inner chamber.
Referring to fig. 1, the embodiment of the utility model provides a pair of prevent static integrated circuit power module, the equal fixed paste in circuit board 101 lower surface both ends is connected with shock pad 3, circuit board 101 links to each other through shock pad 3 and power module 1 inner chamber bottom, and circuit board 101 bottom is connected with power module 1 through shock pad 3, can effectively promote the damping performance to circuit board 101 through shock pad 3 to can effectively promote the stability of circuit board 101 during operation.
Referring to fig. 1 and 2, the embodiment of the utility model provides a pair of prevent static integrated circuit power module, 1 both ends surface of power module is all fixed has been seted up thermovent 4, 4 inner chamber fixed welding of thermovent have a dust screen 401, and hot gas accessible thermovent 4 discharges, and can carry out the separation to the dust through dust screen 401 and avoid the dust to enter into power module 1 inner chamber.
Referring to fig. 1 and 2, in an anti-static ic power module according to an embodiment of the present invention, a heat sink 5 is fixedly installed on the top of an inner cavity of a power module 1, a semiconductor cooling plate 601 is fixedly installed on the bottom of the heat sink 5, two ends of the semiconductor cooling plate 601 are fixedly welded to a bracket 602, the semiconductor cooling plate 601 is connected to an inner cavity wall of the power module 1 through the bracket 602, and a Peltier effect of a semiconductor material is utilized by TEC1-12706, when a direct current passes through a couple formed by two different semiconductor materials connected in series, heat can be absorbed and released at two ends of the couple respectively, and cold air can be released, a flow rate of the cold air in the inner cavity of the power module 1 can be accelerated by the heat sink 5, so that a heat dissipation effect on a circuit board 101 can be effectively improved, a shock pad 3 can support the circuit board 101, and heat can be dissipated from upper, the heat dissipation is more uniform.
The embodiment of the utility model provides a prevent static integrated circuit power module, prevent that static integrated circuit power module includes power module and circuit board, power module inner chamber fixed mounting has the circuit board, power module surface fixed pasting is connected with antistatic backing, power module surface fixed pasting is connected with double-sided adhesive layer. The utility model has the advantages of being simple in structure, convenient operation and excellent in use effect, the antistatic film can effectively avoid static to transmit on power module surface, can transmit the static on power module surface to electrical equipment through electrostatic discharge ware, thereby with further promotion power module's antistatic effect, can accelerate the velocity of flow of air conditioning at the power module inner chamber through the radiator, thereby can effectively promote the radiating effect to the circuit board, and the shock pad can support the circuit board, the surface all can dispel the heat about the circuit board, make more even of heat dissipation.
The utility model discloses a power module 1, circuit board 101, antistatic backing 2, two-sided adhesive layer 201, recess 202, electrostatic discharge ware 203, shock pad 3, thermovent 4, dust screen 401, radiator 5, semiconductor refrigeration piece 601, support 602, the part is the part that general standard spare or technical personnel in the field know, and its structure and principle all are that this technical personnel all can learn through the technical manual or learn through conventional experimental method.
It is apparent that those skilled in the art can make various changes and modifications to the embodiments of the present invention without departing from the spirit and scope of the embodiments of the present invention. Thus, if such modifications and variations of the embodiments of the present invention fall within the scope of the claims and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (4)
1. The utility model provides an prevent static integrated circuit power module, its characterized in that, prevent static integrated circuit power module includes power module and circuit board, power module inner chamber fixed mounting has the circuit board, power module surface fixed pasting is connected with anti-static membrane, power module surface fixed pasting is connected with double faced adhesive tape, double faced adhesive tape fixed surface sets up flutedly, recess cavity is fixed and is provided with electrostatic discharge ware, and electrostatic discharge ware top links to each other with power module surface fixed.
2. The power supply module of claim 1, wherein shock absorbing pads are fixedly attached to both ends of the lower surface of the circuit board, and the circuit board is connected to the bottom of the inner cavity of the power supply module through the shock absorbing pads.
3. The power module as claimed in claim 1, wherein the power module has heat dissipation openings formed on both ends, and the inner cavity of each heat dissipation opening is welded with a dust screen.
4. The anti-static integrated circuit power module according to claim 1, wherein a radiator is fixedly mounted at the top of the inner cavity of the power module, a semiconductor refrigerating sheet is fixedly mounted at the bottom of the radiator, supports are fixedly welded to two ends of the semiconductor refrigerating sheet, and the semiconductor refrigerating sheet is connected with the inner cavity wall of the power module through the supports.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920721949.9U CN210157587U (en) | 2019-05-20 | 2019-05-20 | Anti-static integrated circuit power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920721949.9U CN210157587U (en) | 2019-05-20 | 2019-05-20 | Anti-static integrated circuit power module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210157587U true CN210157587U (en) | 2020-03-17 |
Family
ID=69759672
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920721949.9U Expired - Fee Related CN210157587U (en) | 2019-05-20 | 2019-05-20 | Anti-static integrated circuit power module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210157587U (en) |
-
2019
- 2019-05-20 CN CN201920721949.9U patent/CN210157587U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200317 |