CN210137564U

CN210137564U - Radiating fin capable of radiating transversely

Info

Publication number: CN210137564U
Application number: CN201920434897.7U
Authority: CN
Inventors: 陈宥嘉; 白尧; 张英润; 雷天林; 方惠杰
Original assignee: Dongguan Qianfeng Special Adhesive Products Co Ltd
Current assignee: DONGGUAN JAZZ ADVANCED ELECTRONIC APPLICATION MATERIALS Co.,Ltd.
Priority date: 2019-03-29
Filing date: 2019-03-29
Publication date: 2020-03-10
Anticipated expiration: 2029-03-29

Abstract

The utility model provides a horizontal radiating fin, it is including: the metal foil layer is used for enabling an electronic element of the electronic product to be attached to the top surface of the metal foil layer; a first adhesive layer combined on the bottom surface of the metal foil layer; a heat insulation layer combined with the bottom surface of the first adhesive layer; and the second adhesive layer is combined on the bottom surface of the heat insulation layer and used for integrally attaching the radiating fin to the back plate of the electronic product. Therefore, the heat dissipation device is used for solving the problem of low heat dissipation efficiency in the prior art and has the effect of improving the heat dissipation efficiency.

Description

Radiating fin capable of radiating transversely

Technical Field

The present invention relates to a heat sink with a lateral heat dissipation function, and more particularly to a heat sink with a thermal insulation layer for forcing a portion of waste heat to be conducted laterally on a metal foil layer.

Background

As shown in fig. 1, the conventional heat sink 10 is formed by bonding an adhesive layer 12 on a bottom surface of a metal foil layer 11, attaching the adhesive layer 12 to a back plate 21 of an electronic product, and making an electronic component 22 of the electronic product abut on a top surface of the metal foil layer 11, so as to directly conduct waste heat of the electronic component 22 from a Z-axis direction to the back plate 21 through the metal foil layer 11 and the adhesive layer 12 for heat dissipation; however, in the direct-type heat dissipation design, waste heat is concentrated near the contact area between the metal foil layer 11 and the electronic component 22, and the non-contact area between the metal foil layer 11 and the electronic component 22 hardly plays a heat dissipation role, so that the performance of the electronic component 22 is affected due to low heat dissipation efficiency, the hand feeling of rolling and ironing the local area of the back plate 21 is caused, and the use comfort of a user is seriously affected.

SUMMERY OF THE UTILITY MODEL

The main objective of the present invention is to solve the problem of low heat dissipation efficiency of the prior art, and to have the efficacy of improving the heat dissipation efficiency.

Another objective of the present invention is to provide a method for improving the comfort of electronic products.

Another objective of the present invention is to provide an electronic device with a long service life.

In order to achieve the above function, the structural features of the present invention include: the metal foil layer is used for enabling an electronic element of the electronic product to be attached to the top surface of the metal foil layer; a first adhesive layer combined on the bottom surface of the metal foil layer; a heat insulation layer combined with the bottom surface of the first adhesive layer; and the second adhesive layer is combined on the bottom surface of the heat insulation layer and used for integrally attaching the radiating fin to the back plate of the electronic product.

In addition, the metal foil layer is copper foil or aluminum foil, and the thermal insulation layer is high compression ratio foam; in addition, the thickness of the metal foil layer is 0.035 mm-0.260 mm, the thickness of the first adhesive layer is 0.025 mm-0.035 mm, the thickness of the heat insulation layer is 1 mm-10 mm, and the thickness of the second adhesive layer is 0.025 mm-0.035 mm.

Therefore, the high heat resistance of the thermal insulation layer in the Z-axis direction weakens the conduction quantity of the waste heat of the electronic element in the Z-axis direction of the thermal insulation layer, and forces partial waste heat to conduct transversely in the X-axis direction and the Y-axis direction of the metal foil layer, so that the heat dissipation area of the metal foil layer is effectively utilized.

Drawings

Fig. 1 is a structural sectional view of a conventional heat sink.

Fig. 2 is an exploded perspective view of the present invention.

Fig. 3 is a perspective view of the structure assembly of the present invention.

Fig. 4 is a structural sectional view of the present invention.

Description of reference numerals: 10 a heat sink; 11 a metal foil layer; 12 an adhesive layer; 21 a back plate; 22 an electronic component; 30 heat radiating fins; 31 a metal foil layer; 32 a first adhesive layer; 33 a heat insulation layer; 34 second adhesive layer.

Detailed Description

First, referring to fig. 2 to 4, the heat sink 30 of the present invention includes: a metal foil layer 31, which can be a copper foil or an aluminum foil with a thickness of 0.035 mm-0.260 mm, for the electronic component 22 of the electronic product to be attached to the top surface of the metal foil layer 31; a first adhesive layer 32, which is combined with the bottom surface of the metal foil layer 31 and has a thickness of 0.025 mm-0.035 mm; a heat insulation layer 33 combined with the bottom surface of the first adhesive layer 32, wherein the heat insulation layer 33 can be high compression ratio foam with the thickness of 1 mm-10 mm; and a second adhesive layer 34, which is combined with the bottom surface of the heat insulation layer 33, has a thickness of 0.025mm to 0.035mm, and is used for integrally attaching the heat sink 30 to the back plate 21 of the electronic product.

Based on the structure, the utility model discloses utilize the high thermal resistance of insulating layer 33 in the Z axle direction, weakened the conduction quantity of the used heat of electronic component 22 in insulating layer 33Z axle direction, force partial used heat to carry out horizontal conduction in the X axle of metal foil layer 31 and Y axle direction, let the heat radiating area of metal foil layer 31 obtain effectively utilizing, the radiating effect can improve more than 10% at least, and has the efficiency that promotes the radiating efficiency; moreover, since the waste heat is dispersed to the whole area of the metal foil layer 31 and is not concentrated to the local area of the metal foil layer 31, the back plate 21 is not heated in the local area, and the use comfort of the electronic product is improved; in addition, when the thermal insulation layer 33 is made of foam with a high compression ratio, the electronic component 22 can be protected from impact, and the service life of the electronic component can be prolonged.

The foregoing description is intended to be illustrative rather than limiting, and it will be appreciated by those skilled in the art that many modifications, variations or equivalents may be made without departing from the spirit and scope of the invention as defined in the appended claims.

Claims

1. A transverse radiating fin is characterized by comprising:

a metal foil layer;

a first adhesive layer combined on the bottom surface of the metal foil layer;

a heat insulation layer combined with the bottom surface of the first adhesive layer; and

a second adhesive layer combined on the bottom surface of the heat insulation layer.

2. A heat sink sheet according to claim 1 wherein the metal foil layer is copper foil or aluminum foil and the thermal insulation layer is high compression ratio foam.

3. A heat sink sheet according to claim 1 or 2, wherein the metal foil layer has a thickness of 0.035mm to 0.260mm, the first adhesive layer has a thickness of 0.025mm to 0.035mm, the thermal insulation layer has a thickness of 1mm to 10mm, and the second adhesive layer has a thickness of 0.025mm to 0.035 mm.