CN210136853U - Chip quick-sticking device - Google Patents
Chip quick-sticking device Download PDFInfo
- Publication number
- CN210136853U CN210136853U CN201921129745.2U CN201921129745U CN210136853U CN 210136853 U CN210136853 U CN 210136853U CN 201921129745 U CN201921129745 U CN 201921129745U CN 210136853 U CN210136853 U CN 210136853U
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- CN
- China
- Prior art keywords
- chip
- negative pressure
- driving motor
- manipulator
- base
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- Expired - Fee Related
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model discloses a chip pastes device fast, absorb the manipulator including controller, first driving motor, second driving motor, vacuum device, rubberizing manipulator and negative pressure. The utility model can quickly absorb the chip and finish gluing, quickly and accurately paste the chip on the circuit board, and adopts mechanical automatic chip absorption, thereby ensuring the consistent direction of the chip absorbed each time and avoiding the condition that the directions of the pins of the chip are not uniform on different circuit boards; the chip is pre-pasted on the circuit board, so that the chip welding is convenient, and the production efficiency is improved.
Description
Technical Field
The utility model belongs to the technical field of mechanical automation, especially, relate to chip pastes device fast.
Background
The existing chip welding is to directly place a chip on a circuit board, so that the welding efficiency is low; meanwhile, the placing direction and position of the chip need manual calibration, so that direction placing errors are easy to occur, the pins of the chip are not uniform, and the chip welding efficiency is low; in addition, the chip is easy to damage in the grabbing process due to the tiny chip, and the cost is high.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the problems and provide a chip quick-pasting device, which comprises a controller, a first driving motor, a second driving motor, a negative pressure device, a gluing manipulator and a negative pressure suction manipulator; the controller is respectively connected with the first driving motor and the second driving motor; the first driving motor is connected with the gluing manipulator; the gluing manipulator is provided with a rubber tube; the glue outlet of the rubber tube is arranged at one end of the gluing manipulator and used for distributing glue; one end of the negative pressure suction manipulator is provided with a negative pressure port; the negative pressure device is used for providing negative pressure for the negative pressure port; the second driving motor is connected with the negative pressure suction manipulator; the negative pressure port is used for sucking the chip under negative pressure.
The beneficial effects of the utility model reside in that: the utility model can quickly absorb the chip and finish gluing, quickly and accurately paste the chip on the circuit board, and adopts mechanical automatic chip absorption, thereby ensuring the consistent direction of the chip absorbed each time and avoiding the condition that the directions of the pins of the chip are not uniform on different circuit boards; the chip is pre-pasted on the circuit board, so that the chip welding is convenient, and the production efficiency is improved.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
In the figure: 1-a controller; 2-a first drive motor; 3-a second drive motor; 4-a negative pressure device; 5-gluing mechanical arm; 6-glue outlet; 7-negative pressure suction manipulator; 8-a negative pressure port; 9-a circuit board; 10-a first base; 11-a second base; 12-display.
Detailed Description
The present invention will be further explained with reference to the accompanying drawings:
as shown in fig. 1, the chip rapid bonding device of the present invention comprises a controller, a first driving motor, a second driving motor, a negative pressure device, a gluing manipulator and a negative pressure suction manipulator; the controller is respectively connected with the first driving motor and the second driving motor; the first driving motor is connected with the gluing manipulator; the gluing manipulator is provided with a rubber tube; the glue outlet of the rubber tube is arranged at one end of the gluing manipulator and used for distributing glue; one end of the negative pressure suction manipulator is provided with a negative pressure port; the negative pressure device is used for providing negative pressure for the negative pressure port; the second driving motor is connected with the negative pressure suction manipulator; the negative pressure port is used for sucking the chip under negative pressure.
Further, the device also comprises a proximity sensor and a first base for placing the circuit board; the proximity sensor is connected with the controller and used for detecting the position of the circuit board.
Furthermore, first base sets up in rubberizing manipulator below, first base below is connected with a horizontal drive motor.
Further, the display device also comprises a second base and a display, wherein the second base is used for placing the chip; an image acquisition device is fixedly arranged above the second base, and the image acquisition device and the display are respectively connected with the controller.
Furthermore, the second base is arranged below the negative pressure suction manipulator, and a second horizontal driving motor is connected below the second base.
Further, the negative pressure device comprises a pressure sensor and a negative pressure pump; the pressure sensor is connected with the input end of the controller; the negative pressure pump is connected with the output end of the controller.
The glue outlet of the rubber tube is arranged at one end of the gluing manipulator, and when the proximity sensor detects that the circuit board is in place on the first base, the controller controls the gluing manipulator to move under the driving of the first driving motor, so that the gluing process is completed.
The negative pressure device adopts a negative pressure pump, and the air outlet of the negative pressure pump is connected with the thin tube; one end of the thin tube is arranged at one end of the negative pressure suction manipulator. The negative pressure suction manipulator is driven by the second horizontal driving motor to move to the position above the second base for placing the chip to be taken, and the chip placing process is completed.
After the negative pressure suction manipulator sucks the chip, the image acquisition device detects the residual chip on the second base and determines the position distribution of the chip on the second base; the controller controls the second horizontal driving motor to move, so that the center position of the next chip is the same as that of the previous chip, and the chips are accurately and quickly sucked.
First horizontal driving motor is linked below the first base, and the first horizontal driving motor drives the circuit board to move, ensures that the circuit board is under the rubberizing manipulator, and ensures that the rubberizing point accurately falls on the fixed position of the circuit board.
The display displays the acquired image of the chip in a coordinate mode, and the chip position monitoring can be realized.
The utility model can quickly absorb the chip and finish gluing, quickly and accurately paste the chip on the circuit board, and adopts mechanical automatic chip absorption, thereby ensuring the consistent direction of the chip absorbed each time and avoiding the condition that the directions of the pins of the chip are not uniform on different circuit boards; the chip is pre-pasted on the circuit board, so that the chip welding is convenient, and the production efficiency is improved.
The technical scheme of the utility model is not limited to the restriction of above-mentioned specific embodiment, all according to the utility model discloses a technical scheme makes technical deformation, all falls into within the protection scope of the utility model.
Claims (6)
1. The chip quick-pasting device is characterized by comprising a controller, a first driving motor, a second driving motor, a negative pressure device, a gluing manipulator and a negative pressure suction manipulator; the controller is respectively connected with the first driving motor and the second driving motor; the first driving motor is connected with the gluing manipulator; the gluing manipulator is provided with a rubber tube; the glue outlet of the rubber tube is arranged at one end of the gluing manipulator and used for distributing glue; one end of the negative pressure suction manipulator is provided with a negative pressure port; the negative pressure device is used for providing negative pressure for the negative pressure port; the second driving motor is connected with the negative pressure suction manipulator; the negative pressure port is used for sucking the chip under negative pressure.
2. The chip quick-attaching device according to claim 1, further comprising a proximity sensor and a first base for placing a circuit board; the proximity sensor is connected with the controller and used for detecting the position of the circuit board.
3. The chip quick-adhering device according to claim 2, wherein said first base is disposed under the gluing manipulator, and a first horizontal driving motor is connected under said first base.
4. The chip quick-pasting device according to claim 1, further comprising a second base for placing the chip and a display; an image acquisition device is fixedly arranged above the second base, and the image acquisition device and the display are respectively connected with the controller.
5. The chip quick-adhering device according to claim 4, wherein said second base is disposed under said negative pressure suction manipulator, and a second horizontal driving motor is connected under said second base.
6. The chip quick-bonding device according to claim 1, wherein the negative pressure device comprises a pressure sensor and a negative pressure pump; the pressure sensor is connected with the input end of the controller; the negative pressure pump is connected with the output end of the controller.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921129745.2U CN210136853U (en) | 2019-07-18 | 2019-07-18 | Chip quick-sticking device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921129745.2U CN210136853U (en) | 2019-07-18 | 2019-07-18 | Chip quick-sticking device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210136853U true CN210136853U (en) | 2020-03-10 |
Family
ID=69708702
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921129745.2U Expired - Fee Related CN210136853U (en) | 2019-07-18 | 2019-07-18 | Chip quick-sticking device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210136853U (en) |
-
2019
- 2019-07-18 CN CN201921129745.2U patent/CN210136853U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200310 Termination date: 20200718 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |