CN210129508U - Power module and power module of multichannel power supply overall arrangement wiring - Google Patents
Power module and power module of multichannel power supply overall arrangement wiring Download PDFInfo
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- CN210129508U CN210129508U CN201920266394.3U CN201920266394U CN210129508U CN 210129508 U CN210129508 U CN 210129508U CN 201920266394 U CN201920266394 U CN 201920266394U CN 210129508 U CN210129508 U CN 210129508U
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
- H01L2224/331—Disposition
- H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
- H01L2224/33181—On opposite sides of the body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Abstract
For overcoming prior art's problem, the utility model provides a power module and power module of multichannel power supply overall arrangement wiring. A power module for multi-path power supply layout wiring comprises a bottom plate, a power unit, an output electrode and two input electrodes; the two input electrodes comprise a first input electrode and a second input electrode; the bottom plate comprises a lower bottom plate and an upper bottom plate; the power unit comprises an upper power unit and a lower power unit; a lower power unit is formed on the lower bottom plate, and an upper power unit is formed on the upper bottom plate; the upper power unit comprises a second input conductive layer, a plurality of hollowed areas are formed on the second input conductive layer, the hollowed areas are of non-completely closed structures, and drainage sheets are arranged in the hollowed areas; the second input conductive layer is provided with a plurality of second input connecting parts. The utility model provides a power module and power module of multichannel power supply overall arrangement wiring is equipped with multichannel second input connecting portion on its second input conducting layer, so, can conveniently adjust the current distribution on each way.
Description
Technical Field
The utility model relates to a power module field.
Background
The power module is a power switch formed by combining and packaging power electronic power devices such as MOS (Metal-Oxide-Semiconductor Field-Effect Transistor) transistors, IGBTs (insulated gate Bipolar Transistor) and FRDs (fast recovery diodes) according to certain functions, and is mainly used for power conversion of electric automobiles, photovoltaic power generation, wind power generation, industrial frequency conversion and other occasions.
Taking MOS transistors as an example, as shown in fig. 1, it is usually composed of two MOS transistors connected in series up and down to form a bridge circuit. The drain electrode D of the MOS tube in the upper bridge is connected with the anode P + of the power supply, the source electrode S is connected with the drain electrode D of the MOS tube on the lower bridge, the source electrode of the MOS tube on the lower bridge is connected with the cathode P-, and the source electrode S of the MOS tube on the upper bridge and the drain electrode D of the MOS tube on the lower bridge are used as output ends Out. And the G poles of the upper bridge MOS tube and the lower bridge MOS tube are connected with a control signal.
The common power module is a single-sided power module generally and comprises a bottom plate and a plurality of power units formed on the bottom plate, and the requirement of the single-sided power module on a radiator is high, so that the double-sided heat dissipation type power module comprises the bottom plate and the power units, wherein the bottom plate is divided into an upper bottom plate and a lower bottom plate, the power units are divided into an upper power unit and a lower power unit, a plurality of conductive pattern layers for arranging chips and carrying out current layout are generally arranged on the upper power unit and the lower power unit, and the conductive pattern layers generally comprise a positive conductive layer, a negative conductive layer, an output conductive layer and the like; for example, an input electrode (typically a positive electrode) and an output electrode are typically led out on the lower power cell; an input electrode (usually a negative electrode) is led out from the upper power unit.
At present, a negative conductive layer and a negative electrode in a conductive pattern layer are connected through only one current path, so that the connection stress is large, the current distribution is uneven, and the parasitic inductance is large.
SUMMERY OF THE UTILITY MODEL
The negative conductive layer is connected with the negative electrode through only one current path in the conductive pattern layer in the prior art, so that the connection stress is large, the current is not uniformly distributed, and the parasitic inductance is large. The utility model provides a power module and power module of multichannel power supply overall arrangement wiring.
The utility model provides a power module of multi-path power supply layout wiring on one hand, which comprises a bottom plate, a power unit, an output electrode and two input electrodes; the two input electrodes comprise a first input electrode and a second input electrode; the bottom plate comprises a lower bottom plate and an upper bottom plate; the power unit comprises an upper power unit and a lower power unit; a lower power unit is formed on the lower bottom plate, and an upper power unit is formed on the upper bottom plate;
the lower power unit comprises a lower substrate and a circuit copper layer arranged on the lower substrate, wherein the circuit copper layer comprises a first input drainage layer, a first input conductive layer and an output conductive layer;
the first input drainage layer is electrically connected with the first input electrode, the first input drainage layer is also electrically connected with the first input conductive layer through an electric connecting piece, and the output conductive layer is electrically connected with the output electrode; wherein, a plurality of groups of upper bridge chips are arranged on the first input conducting layer, and a plurality of groups of lower bridge chips are arranged on the output conducting layer;
the upper power unit comprises a second input conductive layer, a plurality of hollowed areas are formed on the second input conductive layer, the hollowed areas are of non-completely closed structures, and drainage sheets are arranged in the hollowed areas; a plurality of paths of second input connecting parts are arranged on the second input conductive layer;
a plurality of first metal pressing blocks are arranged on the upper bridge chip, the metal pressing blocks are electrically connected with the drainage sheet, and then the drainage sheet is electrically connected with the output conducting layer through second metal pressing blocks;
a plurality of third metal pressing blocks are arranged on the lower bridge chip and are electrically connected with the second input conducting layer;
the multi-path second input connecting part is electrically connected with the second input electrode.
Further, the first input electrode comprises a first external connection part, a first main body part and a first internal connection part; the first interconnecting part is electrically connected with the first input drainage layer;
the second input electrode comprises a second external part, a second main body part and a second internal connection part; the second interconnecting part is electrically connected with the multi-path second input connecting part;
the output electrode comprises an output external connection part, an output main body part and an output internal connection part; the output interconnection is electrically connected to the output conductive layer.
Furthermore, a first external connection part is arranged on the first input electrode, two second external connection parts are arranged on the second input electrode, and the first input electrode and the second input electrode are arranged in a stacked mode;
the first external connection part extends outwards from the center of the first main body part to the power module, and the two second external connection parts extend outwards from the two sides of the second main body part to the power module respectively, so that the first external connection part of the first input electrode and the two second external connection parts of the second input electrode are arranged at intervals.
Furthermore, the first input electrode, the second input electrode and the output electrode are all in a straight line shape or a zigzag shape.
Further, the second interconnection portion of the second input electrode includes a plurality of second interconnection branches, and the plurality of second interconnection branches are electrically connected to the plurality of second input connection portions, respectively.
Further, the first interconnection portion of the first input electrode includes a plurality of first interconnection branches, and the plurality of first interconnection branches are electrically connected to the first input conductive layer, respectively.
Further, the output interconnection portion of the output electrode includes a plurality of output interconnection branches, and the plurality of output interconnection branches are electrically connected to the output conductive layer, respectively.
Furthermore, the second input conductive layer comprises a plurality of second input connecting parts, a connecting through area and a plurality of connecting passages connected between the plurality of second input connecting parts and the connecting through area, and the connecting through area is electrically connected with the lower bridge chip; and a plurality of non-completely closed hollowed areas are defined among the multi-path connecting passage, the multi-path second input connecting part and the connecting passage area.
The utility model discloses the second aspect still provides a power module, including power module and electric capacity module, wherein, power module is foretell power module.
The utility model provides a power module and power module of multichannel power supply overall arrangement wiring is equipped with multichannel second input connecting portion on its second input conducting layer, so, can conveniently adjust the current distribution on each way. The width of the multi-path second input connecting part can be adjusted to adjust the current distribution between the second input conductive layer and the second input electrode, and the parasitic inductance on the multi-path second input connecting part and the current distribution passing through each power chip are directly influenced.
Drawings
FIG. 1 is a schematic circuit diagram of a prior art power module;
fig. 2a is a schematic perspective view of a power module of a certain type according to an embodiment of the present invention;
fig. 2b is a schematic diagram of a power module of a certain type provided in an embodiment of the present invention after removal of the insulating frame;
FIG. 2c is the schematic view of FIG. 2b with the upper plate removed;
fig. 3 is an exploded schematic view of a power module of a certain type provided in an embodiment of the present invention;
fig. 4 is a schematic diagram of a lower power unit in a power module of a certain type according to an embodiment of the present invention;
fig. 5 is a schematic diagram of an upper power unit in a power module of a certain type according to an embodiment of the present invention;
fig. 6 is a schematic front view of a power module of a certain type provided in an embodiment of the present invention;
fig. 7 is a schematic diagram of a connection between a second input electrode and a second input conductive layer according to an embodiment of the present invention;
fig. 8 is a schematic connection diagram of the first input electrode and the second input electrode provided in the embodiment of the present invention;
fig. 9 is a schematic diagram of the connection of the first input electrode and the output electrode with the lower power unit according to the embodiment of the present invention.
The reference numbers are as follows:
1000. a power module;
1. a power unit; 1A, a lower power unit; 1B, an upper power unit; 11. a circuit copper layer; 12. a substrate; 13. a power chip; 13a, an upper bridge chip; 13b, a lower bridge chip; 14. a data pin;
111. a first input drainage layer; 112. a second input conductive layer; 113. a first input conductive layer; 114. An output conductive layer; 1121. a second input connection; 1122. a connection path; 1123. connecting the through region.
2. A base plate; 21. a lower base plate; 22. an upper base plate;
3. a second input electrode; 31. a second outer connection portion; 32. a second main body portion; 33. a second interconnector portion; 311. A second external connection hole; 331. a second interconnecting branch;
4. a first input electrode; 41. a first external connection part; 42. a first main body portion; 43. a first interconnector portion; 411. A first external connection hole; 431. a first interconnecting branch;
5. an output electrode; 51. an output external connection part; 52. an output main body section; 53. an output interconnector; 511. an output outer connection hole; 531. an output interconnection branch;
6. an insulating frame;
10c, a drainage sheet; 10d, pressing a first metal block; 10e, second metal pressing blocks; 10f, pressing the third metal block.
Detailed Description
In order to make the technical problem, technical solution and advantageous effects solved by the present invention more clearly understood, the following description is given in conjunction with the accompanying drawings and embodiments to further explain the present invention in detail. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Examples
As shown in fig. 2a to 8, the present embodiment will be described by a power module 1000 and a power module of a certain type, so as to further illustrate the following innovative points to be protected by the present invention: regarding the layout design of the circuit copper layers in the power module 1000.
As shown in fig. 2a, 2b, and 2c, the power module 1000 disclosed in this example is a double-sided heat dissipation type power module 1000 in the power module 1000, and includes a base plate 2 enclosed in an insulating frame 6, a power unit 1 formed on the base plate 2, and two input electrodes and two output electrodes 5 electrically connected to the power unit 1. The two input electrodes comprise a first input electrode 4 and a second input electrode 3, respectively.
As shown in fig. 3, in the double-sided heat dissipation type power module 1000 disclosed in this example, the base plate 2 includes a lower base plate 21 and an upper base plate 22; a lower power unit 1A is arranged on a lower bottom plate 21, and an upper power unit 1B is arranged on an upper bottom plate 22; the upper plate 22 and the lower plate 21 are arranged so that a double-sided heat dissipation effect can be achieved. The upper power unit 1B and the lower power unit 1A integrally form the power unit 1 to implement the functions of a bridge circuit shown in fig. 1. The base plate 2 is typically made of a metal material, such as any one of copper, copper alloy, aluminum alloy, aluminum silicon carbide, for the purpose of dissipating heat in the power unit 1 through the base plate 2.
As shown in fig. 3 and 4, the lower power unit 1A includes a lower substrate 12 and a circuit copper layer 11 disposed on the lower substrate 12, wherein the circuit copper layer 11 includes a first input current guiding layer 111, a first input conductive layer 113 and an output conductive layer 114; as is well known, the semiconductor device further includes a control conductive layer (not shown) electrically connected to the gate of each power chip through a bonding wire.
Wherein the first input drainage layer 111 is used to electrically connect with the first input electrode 4, and meanwhile, the first input drainage layer 111 is also electrically connected with the first input conductive layer 113 by binding wires (or other electrical connectors, not marked in this example); wherein, a plurality of groups of upper bridge chips 13a are arranged on the first input conductive layer 113; the output conductive layer 114 has a plurality of sets of lower bridge chips 13b arranged thereon.
The upper bridge chip 13a and the lower bridge chip 13b form two groups connected in parallel respectively; the power supply unit is called as a first bridge arm power chipset and a second bridge arm power chipset respectively, which are called as a first power chipset and a second power chipset for short, or called as an upper bridge power chipset and a lower bridge power chipset (for example, the second bridge arm power chipset is used as the upper bridge power chipset, and the first bridge arm power chipset is used as the lower bridge power chipset); the power unit 1 is formed by connecting power electronic devices comprising an upper MOS tube and a lower MOS tube or an IGBT in series, is respectively connected between two input electrodes, and takes an extraction electrode between the two MOS tubes or the IGBT as an output electrode 5.
MOS transistors are known, which comprise 3 electrodes: the grid G is used as an input control electrode and is used for inputting a control signal and controlling the connection and disconnection between the source S and the drain D. By output from the source S or the drain D. IGBTs are also known, which also comprise three electrodes: a gate G, a collector C and an emitter E; the gate G corresponds to the grid G of the MOS tube, and the collector C corresponds to the drain D of the MOS tube; the emitter E corresponds to a source S of the MOS tube; the gate G is used as an input control electrode and also controls the connection and disconnection between the emitter E and the collector C; both controls are also substantially the same. For convenience, the following embodiments will be specifically explained by taking MOS transistors as examples.
The input electrode and the output electrode 5 are commonly referred to collectively as power electrodes. In addition to the power electrodes (or power pins), the power unit 1 is provided with a data pin 14 for sampling or controlling.
In this example, as shown in fig. 2a to 8, the first input electrode 4 is a positive electrode, and the second input electrode 3 is a negative electrode. The first input electrode 4 includes a first external connection portion 41, a first main body portion 42 and a first internal connection portion 43, and the first external connection portion 41 is provided with a first external connection hole 411; the first interconnector 43 is electrically connected to the first input current guiding layer 111; the second input electrode 3 includes a second external connection portion 31, a second body portion 32, and a second internal connection portion 33; the second interconnect 33 is electrically connected to the second input conductive layer 112; the second outer connecting portion 31 is provided with a second outer connecting hole 311. The output electrode 5 includes an output external connection portion 51, an output main body portion 52, and an output internal connection portion 53; the output external connection part 51 is provided with an output external connection hole 511. The first external connection hole 411, the second external connection hole 311 and the output external connection hole 511 are used for electrically connecting with an external power source and a load through the cooperation of bolts and nuts. In this example, the first input conductive layer 113 serves as a positive conductive layer, and the second input conductive layer 112 serves as a negative conductive layer.
As shown in fig. 5, the upper power unit 1B includes a second input conductive layer 112, and a plurality of hollow areas are formed on the second input conductive layer 112, and the hollow areas are not completely enclosed structures, and the current guiding plate 10c is disposed in the hollow areas. The second input conductive layer 112 includes a plurality of second input connection portions 1121 for electrically connecting to the second input electrodes 3, and electrically connecting to the second input electrodes 3 in a plurality of ways. As shown in the figure, the left side of the second input conductive layer 112 is divided into 5 branches, i.e. 5 second input connection portions 1121, for electrically connecting with the second input electrode 3. The left side of the bottom bridge chip is a connection through region 1123 formed by a large piece of copper foil and electrically connected with the bottom bridge chip 13b, the connection through region 1123 is connected with the multiple second input connection parts 1121 through 5 connection paths 1122, and 4 non-completely closed hollowed regions are defined between the 5 connection paths 1122 and the 5 second input connection parts 1121 and the connection through region 1123.
Preferably, as shown in fig. 7, the second interconnection 33 of the second input electrode 3 may be formed as a multi-path finger, that is, the second interconnection 33 includes a plurality of second interconnection branches 331, the plurality of second interconnection branches 331 are electrically connected to the multi-path second input connection portion 1121, and the second input electrode 3 and the second input connection portion 1121 are formed as a finger to release stress (due to the difference between the coefficients of expansion of the circuit copper layer 11 and the substrate 12). Meanwhile, the current distribution of the chips of the lower bridge chip is adjusted by adjusting the width of the current path copper sheet 1122 and the width of each branch 331 of the electrode. This way, the stability and overload capacity of the module operation can be further improved.
Similarly, as shown in fig. 8 and 9, the first interconnecting portion 43 of the first input electrode 4 may be formed into a similar multi-path finger shape, that is, the first interconnecting portion 43 includes a plurality of first interconnecting branches 431, and the plurality of first interconnecting branches 431 are electrically connected to the first input conductive layer 113 respectively.
Similarly, as shown in fig. 9, the output interconnection 53 of the output electrode 5 may be formed into a similar multi-way finger shape, that is, the output interconnection 53 includes a plurality of output interconnection branches 531, and the plurality of output interconnection branches 531 are electrically connected to the output conductive layer 114, respectively.
As shown in fig. 4, a plurality of first metal compacts 10d are disposed on the upper bridge chip 13a, the first metal compacts 10d are electrically connected to the current guiding sheet 10c, the source of the upper bridge chip 13a is electrically connected to the current guiding sheet 10c through the first metal compacts 10d (for example, the source is electrically connected by means of press welding), and then the current guiding sheet 10c is electrically connected to the output conductive layer 114 through the second metal compact 10 e.
A plurality of third metal pressing blocks 10f are arranged on the lower bridge chip 13b, and the third metal pressing blocks 10f are electrically connected with the second input conductive layer 112, so that the source electrode of the lower bridge chip 13b is electrically connected with the second input conductive layer 112 through the third metal pressing blocks 10 f.
The first input electrode 4 is provided with a first external connection portion 41, the second input electrode 3 is provided with two second external connection portions 31, the first input electrode 4 and the second input electrode 3 are arranged in a stacked manner, the first external connection portion 41 extends from the center of the first main body portion 2 to the outside of the power module 1000, and the two second external connection portions 31 extend from the two sides of the second main body portion 32 to the outside of the power module 1000. The first external connection portion 41 of the first input electrode 4 and the two second external connection portions 31 of the second input electrode 3 are arranged at an interval, that is, the first external connection portion 41 of the first input electrode 4 is arranged between the two second external connection portions 31 of the second input electrode 3.
The first input electrode 4, the second input electrode 3, and the output electrode 5 are designed in a straight line, and the first input electrode 4 and the second input electrode 3 are disposed in a stacked arrangement.
As shown in fig. 6, the double-sided heat dissipation power module 1000 disclosed in this embodiment can form two current loops, where the working current flowing in the first loop from the first input electrode 4 enters the first input current guiding layer 111, then enters the first input conductive layer 113 through the binding line, then enters the upper bridge chip 13a through the drain of the upper bridge chip 13a, enters the current guiding sheet from the source of the upper bridge chip 13a through the first metal pressing block 10d, enters the output conductive layer 114 from the current guiding sheet through the second metal pressing block 10e, and is output from the output conductive layer 114 through the output electrode 5. The free-wheeling current flowing in from the second input electrode 3 in the second loop enters the second input conductive layer 112, then enters the lower bridge chip 13b from the source of the lower bridge chip 13b through the third metal pressing block 10f, then enters the output conductive layer 114 from the drain of the lower bridge chip 13b, and is output from the output conductive layer 114 through the output electrode 5.
Also disclosed in this example is a power module comprising a power module 1000 and a capacitor module. Since the capacitor module and the connection relationship between the capacitor module and the power module are known to the public, they are not described in detail.
The utility model provides a power module 1000 and power module of multichannel power supply overall arrangement wiring, it is equipped with multichannel second input connecting portion 1121 on second input conducting layer 112, so, can conveniently adjust the current distribution on each way. The current distribution between the second input conductive layer 112 and the second input electrode 3 can also be adjusted by adjusting the width of the multiple second input connection portion 1121 and the connection via 1122, which directly affects the parasitic inductance thereon and the current distribution passing through each power chip 13.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (9)
1. A power module for multi-path power supply layout wiring is characterized by comprising a bottom plate, a power unit, an output electrode and two input electrodes; the two input electrodes comprise a first input electrode and a second input electrode; the bottom plate comprises a lower bottom plate and an upper bottom plate; the power unit comprises an upper power unit and a lower power unit; a lower power unit is formed on the lower bottom plate, and an upper power unit is formed on the upper bottom plate;
the lower power unit comprises a lower substrate and a circuit copper layer arranged on the lower substrate, wherein the circuit copper layer comprises a first input drainage layer, a first input conductive layer and an output conductive layer;
the first input drainage layer is electrically connected with the first input electrode, the first input drainage layer is also electrically connected with the first input conductive layer through an electric connecting piece, and the output conductive layer is electrically connected with the output electrode; wherein, a plurality of groups of upper bridge chips are arranged on the first input conducting layer, and a plurality of groups of lower bridge chips are arranged on the output conducting layer;
the upper power unit comprises a second input conductive layer, a plurality of hollowed areas are formed on the second input conductive layer, the hollowed areas are of non-completely closed structures, and drainage sheets are arranged in the hollowed areas; a plurality of paths of second input connecting parts are arranged on the second input conductive layer;
a plurality of first metal pressing blocks are arranged on the upper bridge chip, the metal pressing blocks are electrically connected with the drainage sheet, and then the drainage sheet is electrically connected with the output conducting layer through second metal pressing blocks;
a plurality of third metal pressing blocks are arranged on the lower bridge chip and are electrically connected with the second input conducting layer;
the multi-path second input connecting part is electrically connected with the second input electrode.
2. The multi-power supply topology wired power module of claim 1, wherein the first input electrode comprises a first external connection portion, a first main body portion, and a first internal connection portion; the first interconnecting part is electrically connected with the first input drainage layer;
the second input electrode comprises a second external part, a second main body part and a second internal connection part; the second interconnecting part is electrically connected with the multi-path second input connecting part;
the output electrode comprises an output external connection part, an output main body part and an output internal connection part; the output interconnection is electrically connected to the output conductive layer.
3. The multi-power-supply layout power module as claimed in claim 2, wherein the first input electrode is provided with a first external connection portion, the second input electrode is provided with two second external connection portions, and the first input electrode and the second input electrode are stacked;
the first external connection part extends outwards from the center of the first main body part to the power module, and the two second external connection parts extend outwards from the two sides of the second main body part to the power module respectively, so that the first external connection part of the first input electrode and the two second external connection parts of the second input electrode are arranged at intervals.
4. The multi-feed power distribution and routing power module of claim 2, wherein the first input electrode, the second input electrode, and the output electrode are all in-line or zigzag.
5. The multi-path power supply distribution and routing power module of claim 2, wherein the second interconnection portion of the second input electrode comprises a plurality of second interconnection branches, and the plurality of second interconnection branches are electrically connected to the plurality of second input connection portions, respectively.
6. The multi-power-supply layout power module of claim 2, wherein the first interconnection portion of the first input electrode comprises a plurality of first interconnection branches, and the plurality of first interconnection branches are electrically connected to the first input conductive layer, respectively.
7. The multi-power-supply layout power module of claim 2, wherein the output interconnection of the output electrode comprises a plurality of output interconnection branches, and the plurality of output interconnection branches are electrically connected to the output conductive layer, respectively.
8. The multi-power-supply layout-routed power module of claim 2, wherein the second input conductive layer comprises a plurality of second input connections, a connection through area, and a plurality of connection vias connected between the plurality of second input connections and the connection through area, the connection through area being electrically connected to the under-bridge chip; and a plurality of non-completely closed hollowed areas are defined among the multi-path connecting passage, the multi-path second input connecting part and the connecting passage area.
9. A power module for multi-path power supply layout wiring, comprising a power module and a capacitor module, wherein the power module is the power module according to any one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920266394.3U CN210129508U (en) | 2019-03-01 | 2019-03-01 | Power module and power module of multichannel power supply overall arrangement wiring |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920266394.3U CN210129508U (en) | 2019-03-01 | 2019-03-01 | Power module and power module of multichannel power supply overall arrangement wiring |
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| CN210129508U true CN210129508U (en) | 2020-03-06 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109887899A (en) * | 2019-03-01 | 2019-06-14 | 深圳市慧成功率电子有限公司 | The power module and power modules of multiple-way supply placement-and-routing |
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- 2019-03-01 CN CN201920266394.3U patent/CN210129508U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109887899A (en) * | 2019-03-01 | 2019-06-14 | 深圳市慧成功率电子有限公司 | The power module and power modules of multiple-way supply placement-and-routing |
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