CN210120754U - Packaging structure of power module and display panel - Google Patents
Packaging structure of power module and display panel Download PDFInfo
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- CN210120754U CN210120754U CN201920372464.3U CN201920372464U CN210120754U CN 210120754 U CN210120754 U CN 210120754U CN 201920372464 U CN201920372464 U CN 201920372464U CN 210120754 U CN210120754 U CN 210120754U
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Abstract
The utility model relates to a power module's packaging structure and display panel, wherein power module's packaging structure includes: the circuit board is provided with a first heat dissipation hole; the power module is packaged on the circuit board to form a packaging body, part of the packaging body is positioned on the first heat dissipation hole, and the interior of the packaging body is communicated with the first heat dissipation hole; the power module comprises a first power supply unit and a second power supply unit, wherein the first power supply unit and the second power supply unit are respectively positioned on two sides of the first heat dissipation hole. The packaging structure of the power module can integrate each power supply unit in the same package, can release heat in the package in time, and avoids the problem that the temperature of the power supply unit is too high due to heat accumulation.
Description
Technical Field
The utility model relates to a power module encapsulates technical field, especially relates to a power module's packaging structure and display panel.
Background
In the liquid crystal display panel, in order to save cost, each power supply unit is generally integrated in the same package, and since each power supply unit generates heat during operation and the heat generated during operation of each power supply unit after packaging cannot be released in time, the heat in the package will be accumulated, thereby causing the problem of over-high temperature of the power supply unit in the package.
SUMMERY OF THE UTILITY MODEL
Therefore, in order to solve the above problems, it is necessary to provide a power module package structure and a display panel, which can integrate each power unit in the same package, and release the heat in the package in time, thereby avoiding the problem of over-high temperature of the power unit caused by heat accumulation.
The circuit board is provided with a first heat dissipation hole;
the power module is packaged on the circuit board to form a packaging body, part of the packaging body is positioned on the first heat dissipation hole, and the interior of the packaging body is communicated with the first heat dissipation hole;
the power module comprises a first power supply unit and a second power supply unit, wherein the first power supply unit and the second power supply unit are respectively positioned on two sides of the first heat dissipation hole.
In one embodiment, the first power supply unit includes a power management chip.
In one embodiment, the second power supply unit includes a gamma voltage generating chip and a voltage converting chip.
In one embodiment, in a direction perpendicular to a connection direction where the first power supply unit and the second power supply unit are located, the length of the first heat dissipation hole is greater than or equal to 1.1 times the length of the first power supply unit.
In one embodiment, the circuit board is further provided with a plurality of second heat dissipation holes connected with the first heat dissipation holes.
In one embodiment, a plurality of heat dissipation columns are fixed on the inner wall of the packaging body, one end of each heat dissipation column is connected with the inner wall of the packaging body, and the other end of each heat dissipation column extends to the second heat dissipation hole and is flush with the circuit board;
the plurality of second heat dissipation holes are located on the same straight line and are arranged at intervals.
In one embodiment, the heat-dissipating stud is located between the first power supply unit and the second power supply unit.
In one embodiment, the second heat dissipation hole is located on a side close to the first power supply unit.
A package structure of a power module, comprising:
the circuit board is provided with a first radiating hole and a plurality of second radiating holes connected with the first radiating hole, and the second radiating holes are positioned on the same straight line and are arranged at intervals;
the power module is packaged on the circuit board to form a packaging body, part of the packaging body is positioned on the first heat dissipation hole, and the interior of the packaging body is communicated with the first heat dissipation hole;
the power supply module comprises a first power supply unit and a second power supply unit, wherein the first power supply unit and the second power supply unit are respectively positioned at two sides of the first heat dissipation hole;
the first power supply unit comprises a power supply management chip; the second power supply unit includes a gamma voltage generating chip and a voltage converting chip;
a plurality of heat dissipation columns are fixed on the inner wall of the packaging body, and are positioned between the first power supply unit and the second power supply unit and close to one side of the first power supply unit; one end of the heat dissipation column is connected with the inner wall of the packaging body, and the other end of the heat dissipation column extends to the second heat dissipation hole and is flush with the circuit board;
and in the direction perpendicular to the connecting line direction of the first power supply unit and the second power supply unit, the length of the first heat dissipation hole is greater than or equal to 1.1 times of the length of the first power supply unit.
According to the packaging structure of the power module, the circuit board is provided with the first heat dissipation hole, and the interior of the packaging body is communicated with the first heat dissipation hole, so that each power supply unit can be integrated in the same package, the heat in the package can be released in time, and the problem that the temperature of the power supply unit is overhigh due to heat accumulation is avoided; the power supply unit in the power supply module is divided into a heating part and a part which does not generate heat or generates less heat, and the two parts are respectively positioned at two sides of the first heat dissipation hole, so that the accumulation of heat is effectively reduced, and the heat dissipation effect inside the package is further enhanced.
A display panel comprises the packaging structure of the power supply module.
Above-mentioned display panel can be integrated each power supply unit in same encapsulation, can make the heat in the encapsulation in time obtain the release again, avoids appearing the problem that heat accumulation leads to power supply unit's high temperature, reducible volume, increase of service life simultaneously.
Drawings
FIG. 1 is a diagram illustrating a package structure of a power module according to an embodiment;
FIG. 2 is a diagram illustrating a package structure of a power module according to another embodiment;
fig. 3 is a schematic diagram of a package structure of a power module in one embodiment.
Detailed Description
In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
Fig. 1 is a schematic diagram of a package structure of a power module in an embodiment, the package structure of the power module includes a circuit board 100 and the power module, wherein a first heat dissipation hole 101 is formed on the circuit board 100, the power module is packaged on the circuit board 100 to form a package 200, a portion of the package 200 is located on the first heat dissipation hole 101, and an interior of the package 200 is communicated with the first heat dissipation hole 101, so that heat in the package 200 can be released through the first heat dissipation hole 101.
Specifically, the power module includes first power supply unit and second power supply unit, and first power supply unit and second power supply unit are located the both sides of first louvre 101 respectively, have effectively reduced thermal accumulation, make the inside radiating effect of encapsulation obtain further reinforcing. The first power supply unit may be a part of the power supply unit which generates a large amount of heat during operation, and the second power supply unit may be a part of the power supply unit which does not generate heat or generates a small amount of heat during operation.
As shown in fig. 1, the first power unit includes a power management chip 201, the second power unit includes a gamma voltage generation chip 202 and a voltage conversion chip 203, the power management chip 201 is located at one side of the first heat dissipation hole 101, the gamma voltage generation chip 202 and the voltage conversion chip 203 are located at the other side of the first heat dissipation hole 101, and are spaced apart from the power management chip 201, and the gamma voltage generation chip 202 and the voltage conversion chip 203 may be disposed adjacent to each other or spaced apart from each other, in this embodiment, in order to reduce the volume of the package 200, the gamma voltage generation chip 202 and the voltage conversion chip 203 are disposed adjacent to each other; to simplify the wiring, the gamma voltage generation chip 202 is located at a side close to the power management chip 201.
In the packaging structure of the power module, the circuit board 100 is provided with the first heat dissipation hole 101, and the interior of the packaging body 200 is communicated with the first heat dissipation hole 101, so that each power supply unit can be integrated in the same package, the heat in the package can be released in time, and the problem of overhigh temperature of the power supply unit caused by heat accumulation is avoided; the power supply unit in the power supply module is divided into a heating part and a part which does not generate heat or generates less heat, and the two parts are respectively positioned at two sides of the first heat dissipation hole, so that the accumulation of heat is effectively reduced, and the heat dissipation effect inside the package is further enhanced.
Fig. 2 is a schematic view of another embodiment of a package structure of a power module, in which a circuit board 100 is further provided with a plurality of second heat dissipation holes 102 connected to first heat dissipation holes 101. The second heat dissipation holes 102 can increase the heat dissipation area of the structure, improve the heat dissipation efficiency, and can be used for inserting heat conduction members such as heat conduction fins to improve the heat dissipation capability of the structure.
Fig. 3 is a schematic view illustrating a package structure of a power module according to an embodiment, in the package structure of the power module, a circuit board 100 is further provided with a plurality of second heat dissipation holes 102 connected to the first heat dissipation hole 101, and the plurality of second heat dissipation holes 102 are arranged at intervals; a plurality of heat dissipation pillars 204 are fixed on the inner wall of the package 200, one end of each heat dissipation pillar 204 is connected to the inner wall of the package 200, and the other end extends to the second heat dissipation hole 102 and is flush with the circuit board 100. The heat dissipation posts 204 extend from the inner wall of the package 200 to the second heat dissipation holes 102 arranged at intervals, and guide the heat in the package 200 to the second heat dissipation holes 102 and then release the heat to the outside air; a gap exists between each heat dissipation column 204, so that the heat dissipation effect is enhanced, and meanwhile, the routing between the power management chip 201 and the gamma voltage generation chip 202 and the voltage conversion chip 203 is not affected.
Optionally, the heat dissipation pillar 204 is located between the first power supply unit and the second power supply unit, that is, the heat dissipation pillar 204 is located between the power management chip 201 and the gamma voltage generation chip 202, and since the power management chip 201 generates more heat, the heat at the side (i.e., the high temperature side) where the power management chip 201 is located is transferred to the side (i.e., the low temperature side) where the gamma voltage generation chip 202 and the voltage conversion chip 203 are located. In the heat transfer process, when a part of heat passes through the heat dissipation pillar 204, the part of heat is guided to the second heat dissipation hole 102 by the heat dissipation pillar 204 and then is released to the outside air; when a part of heat passes through the upper part of the first heat dissipation hole 101, the first heat dissipation hole 101 guides the heat to the outside air; the residual heat which can be transferred to the low-temperature side is only a small part, and most of the heat in the packaging body 200 is released in time in the process of transferring from the high-temperature side to the low-temperature side, so that the problem of overhigh temperature in the packaging body 200 caused by heat accumulation is avoided.
The second heat dissipation hole 102 may be located at a side close to the first power unit, may be located at a side far from the first power unit, or may be periodically disposed at two sides of the first heat dissipation hole 101. In this embodiment, the second heat dissipation hole 102 is located at a side close to the first power unit, so that the connection direction between the second heat dissipation hole 102 and the first heat dissipation hole 101 is the same as the heat transfer direction, and when the second heat dissipation hole 102 is dissipating heat, the heat that cannot be timely conducted out of the heat dissipation column 204 can be released from the first heat dissipation hole 101.
The number of the heat dissipation posts 204 is less than or equal to the number of the second heat dissipation holes 102. The number of the heat dissipation posts 204 is equal to the number of the second heat dissipation holes 102, and each heat dissipation post 204 corresponds to one second heat dissipation hole 102, so that the function of the second heat dissipation holes 102 is maximized.
As shown in fig. 3, in the direction perpendicular to the heat transfer direction, i.e., the direction perpendicular to the connection direction of the first power unit and the second power unit, the length m of the first heat dissipation hole 101 in the above embodiment is greater than or equal to 1.1 times the length a of the first power unit, the width n thereof is greater than 1 mm, and the distance d between the first power unit and the second power unit is greater than 3 mm, so as to ensure that the heat in the package 200 can be effectively released without affecting the routing between the first power unit and the second power unit.
In the package structure of the power module, the heat dissipation posts 204 extend from the inner wall of the package body 200 to the second heat dissipation holes 102 arranged at intervals, so that heat in the package body 200 is guided to the second heat dissipation holes 102 and then released to the outside air, thereby further enhancing the heat dissipation effect; a gap exists between each heat dissipation column 204, so that the routing between the power management chip 201 and the gamma voltage generation chip 202 and the voltage conversion chip 203 is not affected; most of heat in the packaging body 200 is released in time in the process of transferring from the high temperature side to the low temperature side, so that the problem of overhigh temperature in the packaging body 200 caused by heat accumulation is avoided.
A display panel is also provided, which includes the package structure of the power module in the above embodiment.
The display panel can integrate each power supply unit in the same package, can release heat in the package in time, avoids the problem that the temperature of the power supply unit is too high due to heat accumulation, can reduce the size, and has prolonged service life.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. A power module package structure, comprising:
the circuit board is provided with a first heat dissipation hole;
the power module is packaged on the circuit board to form a packaging body, part of the packaging body is positioned on the first heat dissipation hole, and the interior of the packaging body is communicated with the first heat dissipation hole;
the power module comprises a first power supply unit and a second power supply unit, wherein the first power supply unit and the second power supply unit are respectively positioned on two sides of the first heat dissipation hole.
2. The power module package structure of claim 1, wherein the first power unit comprises a power management chip.
3. The package structure of a power module according to claim 1, wherein the second power supply unit includes a gamma voltage generating chip and a voltage converting chip.
4. The package structure of a power module according to claim 1, wherein a length of the first heat dissipation hole is greater than or equal to 1.1 times a length of the first power unit in a direction perpendicular to a connection direction in which the first power unit and the second power unit are located.
5. The package structure of a power module as claimed in claim 1, wherein the circuit board further has a plurality of second heat dissipation holes connected to the first heat dissipation holes.
6. The package structure of a power module as claimed in claim 5, wherein the package body has a plurality of heat dissipation posts fixed on an inner wall thereof, one end of each of the heat dissipation posts is connected to the inner wall of the package body, and the other end extends to the second heat dissipation hole and is flush with the circuit board;
the plurality of second heat dissipation holes are located on the same straight line and are arranged at intervals.
7. The power module package structure of claim 6, wherein the heat-dissipating stud is located between the first power unit and the second power unit.
8. The package structure of claim 7, wherein the second heat dissipation hole is located at a side close to the first power unit.
9. A power module package structure, comprising:
the circuit board is provided with a first radiating hole and a plurality of second radiating holes connected with the first radiating hole, and the second radiating holes are positioned on the same straight line and are arranged at intervals;
the power module is packaged on the circuit board to form a packaging body, part of the packaging body is positioned on the first heat dissipation hole, and the interior of the packaging body is communicated with the first heat dissipation hole;
the power supply module comprises a first power supply unit and a second power supply unit, wherein the first power supply unit and the second power supply unit are respectively positioned at two sides of the first heat dissipation hole;
the first power supply unit comprises a power supply management chip; the second power supply unit includes a gamma voltage generating chip and a voltage converting chip;
a plurality of heat dissipation columns are fixed on the inner wall of the packaging body, and are positioned between the first power supply unit and the second power supply unit and close to one side of the first power supply unit; one end of the heat dissipation column is connected with the inner wall of the packaging body, and the other end of the heat dissipation column extends to the second heat dissipation hole and is flush with the circuit board;
and in the direction perpendicular to the connecting line direction of the first power supply unit and the second power supply unit, the length of the first heat dissipation hole is greater than or equal to 1.1 times of the length of the first power supply unit.
10. A display panel characterized by comprising the packaging structure of the power supply module as set forth in any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920372464.3U CN210120754U (en) | 2019-03-22 | 2019-03-22 | Packaging structure of power module and display panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920372464.3U CN210120754U (en) | 2019-03-22 | 2019-03-22 | Packaging structure of power module and display panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210120754U true CN210120754U (en) | 2020-02-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920372464.3U Active CN210120754U (en) | 2019-03-22 | 2019-03-22 | Packaging structure of power module and display panel |
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| Country | Link |
|---|---|
| CN (1) | CN210120754U (en) |
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- 2019-03-22 CN CN201920372464.3U patent/CN210120754U/en active Active
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