CN210052738U - 一种覆铜陶瓷基板母板结构 - Google Patents
一种覆铜陶瓷基板母板结构 Download PDFInfo
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- CN210052738U CN210052738U CN201921050588.6U CN201921050588U CN210052738U CN 210052738 U CN210052738 U CN 210052738U CN 201921050588 U CN201921050588 U CN 201921050588U CN 210052738 U CN210052738 U CN 210052738U
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CN110379793A (zh) * | 2019-07-08 | 2019-10-25 | 上海申和热磁电子有限公司 | 一种覆铜陶瓷基板母板结构 |
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Cited By (1)
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CN110379793A (zh) * | 2019-07-08 | 2019-10-25 | 上海申和热磁电子有限公司 | 一种覆铜陶瓷基板母板结构 |
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Effective date of registration: 20201110 Address after: 224200 No. 18 Hongda Road, Chengdong New District, Dongtai City, Yancheng City, Jiangsu Province Patentee after: JIANGSU FULEDE SEMICONDUCTOR TECHNOLOGY Co.,Ltd. Address before: 200444 Baoshan District, Baoshan City Industrial Park Road, No., Hill Road, No. 181 Patentee before: SHANGHAI SHENHE THERMO-MAGNETICS ELECTRONICS Co.,Ltd. |
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CP01 | Change in the name or title of a patent holder |
Address after: 224200 No. 18 Hongda Road, Chengdong New District, Dongtai City, Yancheng City, Jiangsu Province Patentee after: Jiangsu fulehua Semiconductor Technology Co.,Ltd. Address before: 224200 No. 18 Hongda Road, Chengdong New District, Dongtai City, Yancheng City, Jiangsu Province Patentee before: JIANGSU FULEDE SEMICONDUCTOR TECHNOLOGY Co.,Ltd. |
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CP01 | Change in the name or title of a patent holder |