CN209964400U

CN209964400U - Pressure head device for realizing one-time lamination of conductive layer and flexible circuit board

Info

Publication number: CN209964400U
Application number: CN201822192967.0U
Authority: CN
Inventors: 魏国; 徐强
Original assignee: YILI (GUANGZHOU) ELECTRONIC TECHNOLOGY Co Ltd
Current assignee: YILI (GUANGZHOU) ELECTRONIC TECHNOLOGY Co Ltd; EELY Guangzhou Electronic Technology Co Ltd
Priority date: 2018-12-25
Filing date: 2018-12-25
Publication date: 2020-01-17
Anticipated expiration: 2028-12-25

Abstract

The utility model discloses a realize pressure head device of pressfitting of conducting layer and flexible circuit board, it includes drive disk assembly and a plurality of pressfitting parts, drive disk assembly is used for being connected with the hot press, a plurality of pressfitting part intervals set up in drive disk assembly's bottom, and at least two pressfitting part's pressfitting face is located different planes. This pressure head device is through setting up a plurality of pressfitting parts at same drive disk assembly, and the pressfitting face of two at least pressfitting parts in a plurality of pressfitting parts lies in different planar modes, can realize different planar upper conducting film and lower floor conducting film and flexible circuit board's a pressfitting, effectively reduces the pressfitting cost and improves pressfitting efficiency.

Description

Pressure head device for realizing one-time lamination of conductive layer and flexible circuit board

Technical Field

The utility model relates to a touch-sensitive screen field especially relates to a realize pressure head device of pressfitting of conducting layer and flexible circuit board.

Background

The screen laminating technology is required to be involved in the touch screen processing of the touch screen type electronic equipment, and the GFF laminating technology is high in yield, low in cost and popular with people. Screens produced using GFF lamination technology are referred to as GFF structural screens, which are generally composed of a display screen and a conductive layer. In practical production, the conductive layer is formed by bonding an upper conductive film and a lower conductive film, the conductive film is often an indium tin oxide film, and the bonding adhesive is often an optical adhesive. The conducting layer needs to be attached to the flexible circuit board before being attached to the display screen, and because the areas, to which the upper conducting film and the lower conducting film need to be attached to the flexible circuit board, are not on the same plane, a twice pressing mode is needed to be adopted to press the upper conducting film and the flexible circuit board and press the lower conducting film and the flexible circuit board. However, the adoption of the pressing mode needs two pressing head devices, and the pressing is needed twice, so that the repeated operation leads to the cost improvement of replacing the pressing head devices and the low pressing efficiency.

SUMMERY OF THE UTILITY MODEL

The utility model discloses a realize pressure head device of pressfitting of conducting layer and flexible circuit board can realize a pressfitting of conducting layer and flexible circuit board, practices thrift the running cost and improves pressfitting efficiency.

In order to achieve the above object, the utility model provides a pressure head device for realizing one-time press-fit of a conductive layer and a flexible circuit board, which comprises a transmission part, wherein the transmission part is used for being connected with a hot press; and the pressing components are arranged at the bottom of the transmission component at intervals, and the pressing surfaces of at least two pressing components are positioned on different planes.

As an optional implementation manner, the number of the pressing components is three, and the three pressing components are respectively a first pressing component, a second pressing component and a third pressing component, the pressing surfaces of the first pressing component and the third pressing component are located on the same plane, and the pressing surface of the second pressing component and the pressing surface of the first pressing component are located on different planes.

As an optional embodiment, a height difference between the pressing surface of the first pressing member and the pressing surface of the second pressing member is 45 ± 5 um.

As an optional implementation manner, the pressing surface of the first pressing component, the pressing surface of the second pressing component, and the pressing surface of the third pressing component are all parallel to the bottom surface of the transmission component, and the distance from the second pressing component to the bottom surface of the transmission component is greater than the distance from the first pressing component to the bottom surface of the transmission component.

As an optional implementation manner, the first pressing component, the second pressing component, and the third pressing component are linearly arranged at the bottom of the transmission component, and the second pressing component is located between the first pressing component and the third pressing component.

As an optional implementation manner, a gap between the second pressing part and the first pressing part is 0.1mm to 1mm, and a gap between the second pressing part and the third pressing part is 0.1mm to 1 mm.

As an optional implementation manner, the cross sections of the first pressing part, the second pressing part and the third pressing part are all rectangular, the length of the rectangle is 2mm-40mm, and the width of the rectangle is 1mm-2 mm.

As an optional implementation manner, the pressing head device further includes a silica gel layer, the silica gel layer is detachably wrapped on the pressing surfaces of the three pressing members, and the silica gel layer is used for transmitting the pressure on the three pressing members to test the parallelism of the pressing surfaces of the three pressing members.

In an alternative embodiment, the bottom of the transmission component is conical, and the pressing component is arranged on the conical top of the conical transmission component.

As an optional implementation manner, a plurality of mounting holes are formed in the transmission component, and the mounting holes are used for realizing connection between the transmission component and the hot press.

The embodiment provides a realize pressure head device of pressfitting of conducting layer and flexible circuit board, through setting up a plurality of pressfitting parts at same drive disk assembly, and the pressfitting face of two at least pressfitting parts in a plurality of pressfitting parts lies in the mode on different planes, can realize the pressfitting of the upper conducting film and lower floor conducting film and flexible circuit board on different planes, effectively reduces the pressfitting cost and improves pressfitting efficiency.

In addition, a silica gel layer is coated on the plurality of pressing parts simultaneously, and the pressure sensing paper is placed at the corresponding position of the three pressure head devices coated with the silica gel layer, so that the parallelism of the three pressure head devices can be detected by judging the color condition of the silica gel layer formed on the pressure sensing paper after the pressing of the hot press. By adopting the mode, the parallelism of the plurality of pressing parts can be quickly and conveniently adjusted, so that the parallelism of the plurality of pressing parts meets the requirement, the pressed conductive particles are uniformly blasted and meet the requirement, and the conductivity is good.

Drawings

Fig. 1 is a schematic view of a ram device according to an embodiment of the present invention;

FIG. 2 is a side view of FIG. 1;

fig. 3 is a schematic diagram of an indenter device provided by an embodiment of the present invention in an application;

Detailed Description

In the present invention, the terms "upper", "lower", "top", "bottom", "middle", "vertical", "oblique", "vertical", "horizontal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings. These terms are used primarily to better describe the invention and its embodiments, and are not intended to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.

Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meaning of these terms in the present invention can be understood by those of ordinary skill in the art as appropriate.

Furthermore, the terms "disposed," "secured," "connected," and "secured" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

Furthermore, the terms "first," "second," and the like, are used primarily to distinguish one device, element, or component from another (the specific nature and configuration may be the same or different), and are not used to indicate or imply the relative importance or number of the indicated devices, elements, or components. "plurality" means two or more unless otherwise specified.

The technical solution of the present invention will be further described with reference to the following embodiments and the accompanying drawings.

Referring to fig. 1 to fig. 3, an embodiment of the present invention provides a pressure head device for implementing one-time pressing of a conductive layer 30 and a flexible circuit board 20, which includes a transmission component 10 and a plurality of pressing components, wherein the transmission component 10 is used for being connected with a hot press, the plurality of pressing components are disposed at a bottom 101 of the transmission component at intervals, and pressing surfaces of at least two pressing components are located on different planes.

In this embodiment, the pressing head device is installed on a hot press, and the hot press drives the pressing head device to move downward to press the conductive layer 30 and the flexible circuit board 20. It is known that the conductive layer 30 is mainly composed of an upper conductive film 301 and a lower conductive film 302. The flexible circuit board 20 and the Conductive layer 30 are bonded by using an Anisotropic Conductive Film (ACF) to connect the flexible circuit board 20 and the upper Conductive Film 301 and the lower Conductive Film 302.

Further, the transmission component 10 is a part of the pressing head device connected to the hot press, and the transmission component 10 also simultaneously transmits the power of the hot press to drive the pressing component to move downward so that the pressing surface of the pressing component presses the conductive layer 30 and the flexible circuit board 20, and moves upward after the pressing is completed to leave the pressing area, thereby waiting for the next pressing operation.

Further, a plurality of mounting holes 102 are formed in the transmission component 10, and the mounting holes 102 are used for realizing connection between the transmission component 10 and the hot press. Preferably, the mounting holes 102 are provided in two and uniformly arranged on the transmission member 10. The mounting hole can be used for penetrating and connecting a screw, a bolt or a screw rod of the hot press, so that the transmission component is connected with the hot press.

Referring to fig. 2 and 3, in the present embodiment, the bottom 101 of the transmission component is conical, and the pressing component is disposed on the conical top. Preferably, the transmission member 10 is a rectangular parallelepiped with a tapered bottom.

Further, the pressing head apparatus provided in this embodiment is used for pressing the upper conductive film 301 and the lower conductive film 302 in different planes. The pressing components on the bottom 101 of the transmission component are arranged at intervals, so that the pressing components respectively press the conductive film and the flexible circuit board 20 which need to be pressed by themselves, but do not press the conductive film and the flexible circuit board 20 which need to be pressed by other pressing components. In order to press the conductive films and the flexible circuit board 20 on different planes, at least two pressing members are arranged to be pressing members with different lengths, so that the pressing surfaces of the at least two pressing members are located on different planes.

In this embodiment, the number of the pressing components is preferably three, which are the first pressing component 11, the second pressing component 12 and the third pressing component 13, the pressing surfaces 131 of the first pressing component 11 and the third pressing component 13 are located on the same plane, and the pressing surface 121 of the second pressing component 12 and the pressing surface 111 of the first pressing component 11 are located on different planes.

Specifically, the first pressing member 11 and the third pressing member 13 are used for pressing the flexible circuit board 20 and the upper conductive film 301, the second pressing member 12 is used for pressing the flexible circuit board 20 and the lower conductive film 302, and because a height difference exists between the upper conductive film 301 and the lower conductive film 302, the pressing surface 121 of the second pressing member 12, the pressing surface 111 of the first pressing member 11, and the pressing surface 131 of the third pressing member 13 are disposed on different planes, so that one-time pressing of the flexible circuit board 20 and the conductive films on different planes can be realized.

In the present embodiment, the pressing surface 111 of the first pressing member 11, the pressing surface 121 of the second pressing member 12, and the pressing surface 131 of the third pressing member 13 are all parallel to the bottom surface of the transmission member 10, and the distance from the second pressing member 12 to the bottom surface of the transmission member 10 is greater than the distance from the first pressing member 11 to the bottom surface of the transmission member 10. And the height difference h between the pressing surface 111 of the first pressing member 11 and the pressing surface 121 of the second pressing member 12 is 45 ± 5 um.

Specifically, the first press part 11, the second press part 12 and the third press part 13 are all the same press part, but different in length. The length of the second press-fit member 12 is greater than the lengths of the first press-fit member 11 and the third press-fit member 13, so that it is used to press-fit the lower flexible circuit board 20 and the lower conductive film 302.

Preferably, the cross sections of the first press element 11, the second press element 12 and the third press element 13 are rectangular, and the length of the rectangle is 2mm-40mm, and the width of the rectangle is 1mm-2 mm. Specifically, the length and width dimensions of the rectangle are suitable for the present embodiment, and the length and width of the rectangle can be appropriately changed according to different product requirements and process changes. In addition, the cross-sections of the first press part, the second press part and the third press part may also have other shapes, such as a trapezoid, a pentagon or a hexagon, etc.

In this embodiment, the silicone layer (not shown) is detachably wrapped on the pressing surfaces of the three pressing members, and the silicone layer is used for transmitting the pressure on the three pressing members to test the parallelism of the pressing surfaces of the three pressing members. After the pressing head device is installed on the hot press, the pressing surfaces of the three pressing components are required to be parallel to each other. If the three laminating surfaces are not parallel to each other, uneven stress may be applied to the ACF during the laminating process, and the conductive particles in the ACF cannot uniformly connect the flexible circuit board 20 and the upper conductive film 301, so that a good conductive path cannot be formed, and thus the portion of the touch screen which is not conductive cannot be used normally. It is very important to detect the parallelism of the press faces of the three press members. However, since the length of the second press member 12 is greater than that of the first press member 11 and the third press member 13, the parallelism of the three press members cannot be tested at the same time.

Therefore, in this embodiment, a silica gel layer with a thickness of approximately 0.25mm is coated on the laminating surfaces of the three laminating parts, the three laminating surfaces are communicated into one surface by the silica gel layer, the pressure sensing paper is placed at the corresponding position below the three laminating parts, and the hot press is driven to laminate the silica gel layer below the laminating parts to the pressure sensing paper. And obtaining information whether the three pressing surfaces are parallel or not by comparing the colors on the sensing paper, and adjusting the three pressing parts according to the color depth on the sensing paper until the three pressing surfaces are parallel to each other. And then the silica gel layer is disassembled, and the parallelism test and debugging of the three pressing parts are completed.

In this embodiment, the first pressing member 11, the second pressing member 12 and the third pressing member 13 are arranged in a straight line at the bottom 101 of the transmission member, and the second pressing member 12 is located between the first pressing member 11 and the third pressing member 13. The three pressing components are arranged linearly, so that the detection mode of the silica gel layer is more accurate, and the design and implementation of the pressing head device are facilitated.

Further, the gap between the second pressing part 12 and the first pressing part 11 is 0.1mm-1mm, and the gap between the second pressing part 12 and the third pressing part 13 is 0.1mm-1 mm. Preferably, the size of the gap between the second press part 12 and the first press part 11 and the size of the gap between the second press part 12 and the third press part 13 may be equal or different, for example, the gap between the second press part 12 and the first press part 11 may be 0.4mm, and the gap between the second press part 12 and the third press part 13 may be 0.6mm, and so on. Preferably, in order to facilitate the arrangement of the three stitching members on the transmission member 10, the gap between the second stitching member 12 and the first stitching member 11 may be equal to the gap between the second stitching member 12 and the third stitching member 13. The gap may be 0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1 mm.

More preferably, the gap is 0.5 mm. If the gap is small, the risk that the second press member 12 presses the upper conductive film 301 may increase; if the gap is large, it is difficult for the first pressing member 11 and the third pressing member 13 to press the upper conductive film 301 close to the second pressing member 12.

Adopt the embodiment of the utility model provides a pair of realize pressure head device of pressfitting of conducting layer and flexible circuit board, with the pressfitting parts integration to the transmission part of different length, realized a pressfitting of conducting layer and flexible circuit board. The cost of two pressure head devices originally is saved, the pressing efficiency is improved, and the whole pressing time is shortened.

In addition, the pressing head device is installed on the hot press, the silica gel layer is coated on the pressing surfaces of the three pressing parts, the pressure sensing paper is placed below the silica gel layer, the hot press is driven to enable the three pressing parts to press down the pressure sensing paper, the parallelism of the three pressing parts is adjusted by comparing the color depth of the pressure sensing paper, the condition that the three pressing parts are not parallel to each other is avoided, the conductive particles in the ACF glue are uniformly blasted, a stable conductive path can be formed, and the using effect of the touch screen is good.

The pressure head device for realizing the one-time lamination of the conductive layer and the flexible circuit board disclosed by the embodiment of the invention is described in detail above, a specific embodiment is applied in the text to explain the principle and the implementation mode of the invention, and the description of the above embodiment is only used for helping to understand the pressure head device for realizing the one-time lamination of the conductive layer and the flexible circuit board and the core idea thereof; meanwhile, for the general technical personnel in the field, according to the idea of the present invention, there are changes in the specific implementation and application scope, to sum up, the content of the present specification should not be understood as the limitation of the present invention.

Claims

1. A pressure head device for realizing one-time lamination of a conductive layer and a flexible circuit board is characterized by comprising

A transmission member; and

the pressing components are arranged at the bottom of the transmission component at intervals, and the pressing surfaces of at least two pressing components are positioned on different planes.

2. The ram apparatus of claim 1, wherein the pressing members are three, namely a first pressing member, a second pressing member and a third pressing member, the pressing surfaces of the first pressing member and the third pressing member are located on the same plane, and the pressing surface of the second pressing member and the pressing surface of the first pressing member are located on different planes.

3. A ram apparatus according to claim 2, wherein the difference in height between the pressing surface of the first pressing member and the pressing surface of the second pressing member is 45 ± 5 um.

4. The ram apparatus of claim 3, wherein the pressing surface of the first pressing member, the pressing surface of the second pressing member, and the pressing surface of the third pressing member are parallel to the bottom surface of the transmission member, and the distance from the second pressing member to the bottom surface of the transmission member is greater than the distance from the first pressing member to the bottom surface of the transmission member.

5. A ram apparatus according to any one of claims 2 to 4, wherein the first pressing member, the second pressing member and the third pressing member are arranged in a line at the bottom of the transmission member, and the second pressing member is located between the first pressing member and the third pressing member.

6. A ram apparatus according to any one of claims 2 to 4, wherein the gap between the second stitching member and the first stitching member is 0.1mm-1mm, and the gap between the second stitching member and the third stitching member is 0.1mm-1 mm.

7. A ram apparatus according to claim 5, wherein the first stitching member, the second stitching member and the third stitching member are rectangular in cross-section, the rectangle being 2mm-40mm long and 1mm-2mm wide.

8. The indenter device of claim 7, further comprising a silicone layer detachably covering the pressing surfaces of the three pressing members, wherein the silicone layer is used for transmitting the pressure on the three pressing members to test the parallelism of the pressing surfaces of the three pressing members.

9. A ram assembly according to any one of claims 1 to 4, wherein the base of the drive member is tapered and the pressing member is located on the top of the taper.

10. A ram assembly as claimed in any one of claims 1 to 4, wherein the drive assembly includes mounting holes for connection of the drive assembly to the press.