TWI510987B - Testing device for touch panel - Google Patents
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- TWI510987B TWI510987B TW102125088A TW102125088A TWI510987B TW I510987 B TWI510987 B TW I510987B TW 102125088 A TW102125088 A TW 102125088A TW 102125088 A TW102125088 A TW 102125088A TW I510987 B TWI510987 B TW I510987B
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/006—Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays
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Description
本發明係有關於一種測試裝置，尤指一種觸控面板的測試裝置。The invention relates to a testing device, in particular to a testing device for a touch panel.
傳統電容式觸控面板包括上導電板和下導電板，上、下導電板透過光學膠貼後形成一觸控面板。對這一類雙層疊構觸控面板的測試，目前業界的作法是在上、下導電板貼合之後透過電容測試來檢測不良品。舉例來說，在傳統的測試方式中，首先是將上、下導電板利用光學膠進行貼合，接著將其放置於專用的測試裝置中，然後經過探針模組或矽橡膠連接器(俗稱斑馬條)將其接合墊(Bonding Pad)亦即測試接觸點連接至轉接板上，再經由測試主機板和程式進行測試，從而區分良品和不良品。The conventional capacitive touch panel includes an upper conductive plate and a lower conductive plate, and the upper and lower conductive plates are optically pasted to form a touch panel. For the testing of this type of double-stacked touch panel, the current practice in the industry is to pass the capacitance test to detect defective products after the upper and lower conductive plates are bonded together. For example, in the traditional test method, the upper and lower conductive plates are first bonded by optical glue, and then placed in a dedicated test device, and then passed through a probe module or a rubber connector (commonly known as The zebra strips connect their Bonding Pads, the test contacts, to the adapter board, and then test them through test boards and programs to distinguish between good and bad products.
然而，貼合後才進行測試，不良品的檢測增加了貼合工藝成本，且上、下導電板其中任意一個的不良將導致整個觸控面板不良而報廢，浪費成本。因此，如何改善上述問題，已成為該項事業人士所欲解決的重要課題。However, the test is performed after the bonding, and the detection of the defective product increases the cost of the bonding process, and any one of the upper and lower conductive plates may cause the entire touch panel to be defective and scrapped, thereby wasting cost. Therefore, how to improve the above problems has become an important issue that the business person wants to solve.
本發明實施例在於提供一種觸控面板的測試裝置，其能夠藉由模擬基板與待測基板模擬貼合後進行測試，以改善傳統用光學膠貼合後才進行測試，使得不良品的檢測增加了貼合工藝成本等問題。An embodiment of the present invention provides a test device for a touch panel, which can be tested by analogly pasting a substrate and a substrate to be tested, so as to improve the conventional optical glue bonding test, thereby increasing the detection of defective products. Problems such as the cost of the process.
本發明其中一實施例提供一種觸控面板的測試裝置，包括：一模擬基板，包括多個第一電極及一電性連接於第一電極的第一 連接埠；一測試模組，包括一第一測試埠及一第二測試埠，其中第一測試埠電性連接於模擬基板的第一連接埠。其中，模擬基板用於與一待測基板壓合以模擬一觸控面板，其中該待測基板包括多個第二電極及電性連接於第二電極的多個一第二連接埠，第二連接埠電性連接於第二測試埠，第一電極與第二電極相互絕緣且交叉分布。An embodiment of the present invention provides a test device for a touch panel, including: an analog substrate, including a plurality of first electrodes and a first electrically connected to the first electrodes A test module includes a first test port and a second test port, wherein the first test port is electrically connected to the first port of the analog substrate. The analog substrate is used for pressing a substrate to be tested to simulate a touch panel, wherein the substrate to be tested includes a plurality of second electrodes and a plurality of second ports electrically connected to the second electrodes, and second The connection is electrically connected to the second test port, and the first electrode and the second electrode are insulated from each other and cross-distributed.
進一步的，模擬基板具有一讓位口，讓位口的位置對應於待測基板的第二連接埠。Further, the analog substrate has a yielding port, and the position of the location port corresponds to the second connection port of the substrate to be tested.
進一步的，讓位口與第一連接埠位於模擬基板的一相同側邊。Further, the position port and the first port are located on the same side of the analog substrate.
進一步的，第一電極設置於模擬基板的一上表面，第一連接埠設置於與模擬基板的上表面相對的一下表面。Further, the first electrode is disposed on an upper surface of the dummy substrate, and the first connection port is disposed on a lower surface opposite to the upper surface of the dummy substrate.
進一步的，第二電極及第二連接埠設置於待測基板的一下表面。Further, the second electrode and the second connecting port are disposed on a lower surface of the substrate to be tested.
進一步的，模擬基板包括一第一絕緣層，第一絕緣層覆蓋在第一電極上，待測基板包括一第二絕緣層，第二絕緣層覆蓋在第二電極層上。Further, the dummy substrate includes a first insulating layer covering the first electrode, the substrate to be tested includes a second insulating layer, and the second insulating layer covers the second electrode layer.
進一步的，第一連接埠具有多個第一接觸點，第二連接埠具有多個第二接觸點，第一測試埠具有多個第一測試點，第二測試埠具有多個第二測試點，其中第一接觸點與第一測試點電性連接，第二接觸點與第二測試點電性連接。Further, the first port has a plurality of first contact points, the second port has a plurality of second contacts, the first test port has a plurality of first test points, and the second test port has a plurality of second test points The first contact point is electrically connected to the first test point, and the second contact point is electrically connected to the second test point.
進一步的，更包括一線纜模組，線纜模組電性連接於第一測試埠及該第一連接埠之間。Further, the cable module is electrically connected between the first test port and the first port.
進一步的，更包括一測試頭模組，測試頭模組電性連接於第二測試埠及第二連接埠之間。Further, the test head module is electrically connected between the second test port and the second port.
進一步的，更包括一壓抵板，其配置在模擬基板上，壓抵板用於壓合待測基板和模擬基板。Further, a pressing plate is disposed on the dummy substrate, and the pressing plate is used for pressing the substrate to be tested and the dummy substrate.
進一步的，模擬基板為印刷電路板。Further, the analog substrate is a printed circuit board.
綜上所述，本發明實施例所提供的觸控面板的測試裝置，其 可透過模擬基板和待測基板的模擬貼合來模擬真實的觸控面板以進行待測基板的測試。可改善傳統用光學膠貼合後才進行測試，使得不良品的檢測增加了貼合工藝成本等問題。In summary, the test device for a touch panel provided by the embodiment of the present invention is The real touch panel can be simulated by the analog bonding of the analog substrate and the substrate to be tested to test the substrate to be tested. It can improve the traditional optical glue bonding before testing, so that the detection of defective products increases the cost of the bonding process.
為使能更進一步瞭解本發明之特徵及技術內容，請參閱以下有關本發明之詳細說明與附圖，然而所附圖式僅提供參考與說明用，並非用來對本發明加以限制者。For a better understanding of the features and technical aspects of the present invention, reference should be made to the accompanying drawings.
Z‧‧‧觸控面板的測試裝置Z‧‧‧Testing device for touch panel
1‧‧‧模擬基板1‧‧‧Simulated substrate
1a‧‧‧上表面1a‧‧‧ upper surface
1b‧‧‧下表面1b‧‧‧ lower surface
10‧‧‧第一電極10‧‧‧First electrode
11‧‧‧第一連接埠11‧‧‧First connection埠
111‧‧‧第一接觸點111‧‧‧First touch point
13‧‧‧第一絕緣層13‧‧‧First insulation
14‧‧‧讓位口14‧‧‧Let the mouth
2‧‧‧待測基板2‧‧‧Substrate to be tested
2b‧‧‧下表面2b‧‧‧lower surface
20‧‧‧第二電極20‧‧‧second electrode
22‧‧‧第二連接埠22‧‧‧Second connection
221‧‧‧第二接觸點221‧‧‧second touch point
23‧‧‧第二絕緣層23‧‧‧Second insulation
3‧‧‧測試模組3‧‧‧Test module
31‧‧‧第一測試埠31‧‧‧First test埠
311‧‧‧第一測試點311‧‧‧First test point
32‧‧‧第二測試埠32‧‧‧Second test
321‧‧‧第二測試點321‧‧‧ second test point
4‧‧‧線纜模組4‧‧‧ Cable Module
5‧‧‧測試頭模組5‧‧‧Test head module
6‧‧‧壓抵板6‧‧‧Pressing board
7‧‧‧氣缸7‧‧‧ cylinder
圖1A為本發明一實施例待測基板的示意圖(一)。1A is a schematic view (1) of a substrate to be tested according to an embodiment of the invention.
圖1B為本發明一實施例模擬基板的示意圖(一)。FIG. 1B is a schematic view (1) of a dummy substrate according to an embodiment of the invention.
圖2為本發明一實施例的測試狀態示意圖(一)。2 is a schematic diagram (1) of a test state according to an embodiment of the present invention.
圖3為本發明一實施例測試裝置的示意圖。3 is a schematic diagram of a test apparatus according to an embodiment of the present invention.
圖4A為本發明另一實施例待測基板的示意圖(二)。4A is a schematic view (2) of a substrate to be tested according to another embodiment of the present invention.
圖4B為本發明另一實施例模擬基板的示意圖(二)。4B is a schematic view (2) of a dummy substrate according to another embodiment of the present invention.
圖5為本發明另一實施例的測試狀態示意圖(二)。FIG. 5 is a schematic diagram (2) of a test state according to another embodiment of the present invention.
首先，請同時參閱圖1A至圖5。由上述圖中可知，本發明第一實施例提供一種觸控面板的測試裝置Z，包括模擬基板1及測試模組3。模擬基板1包括多個第一電極10及一電性連接於該些第一電極10的第一連接埠11。測試模組3包括第一測試埠31及第二測試埠32，其中第一測試埠31電性連接於第一連接埠11。模擬基板用於與一待測基板2壓合，使其模擬出一觸控面板。該待測基板2包括多個第二電極20及電性連接於第二電極20的第二連接埠22。同時，使待測基板2的第二連接埠22電性連接測試模組3的第二測試埠32，第一電極10與第二電極20相互絕緣且交叉分布。須注意的是，本發明實施例所提供的觸控面板的測試裝置Z，於實際實施時並非以此圖為限，可依實際設計需要作調整。First, please refer to FIG. 1A to FIG. 5 at the same time. As shown in the above figure, the first embodiment of the present invention provides a test device Z for a touch panel, including a dummy substrate 1 and a test module 3. The analog substrate 1 includes a plurality of first electrodes 10 and a first connection port 11 electrically connected to the first electrodes 10 . The test module 3 includes a first test port 31 and a second test port 32, wherein the first test port 31 is electrically connected to the first port 11 . The analog substrate is used for pressing with a substrate 2 to be tested to simulate a touch panel. The substrate 2 to be tested includes a plurality of second electrodes 20 and a second connection port 22 electrically connected to the second electrode 20 . At the same time, the second connection port 22 of the substrate 2 to be tested is electrically connected to the second test port 32 of the test module 3, and the first electrode 10 and the second electrode 20 are insulated from each other and cross-distributed. It should be noted that the test device Z of the touch panel provided by the embodiment of the present invention is not limited to this figure in actual implementation, and can be adjusted according to actual design requirements.
請結合參照圖1B及圖2，模擬基板1包括多個第一電極10 及電性連接於第一電極10的第一連接埠11。第一電極10設置於模擬基板1的一上表面1a上，第一連接埠11設置於模擬基板1的一下表面1b上，該上表面1a與該下表面1b相對設置。第一電極10的排列方向可根據待測基板2的第二電極20的方向而設計。例如，如圖1B所示，該些第一電極10沿第一軸向(例如水平軸向)平行排列。或者，如圖4B所示，該些第一電極10沿第二軸向(例如垂直軸向)平行排列。另外，第一連接埠11設置在模擬基板1的邊緣處，且第一連接埠11具有多個相互間隔的第一接觸點111，而該些第一接觸點111分別電性連接於該些第一電極10。此外，模擬基板1還包括一第一絕緣層13及一讓位口14。絕緣層13覆蓋在第一電極10上，用於避免第一電極10受環境的侵蝕。讓位口14的位置對應於待測基板2的第二連接埠22的位置，藉此，待測基板2與模擬基板1壓合時，待測基板2的第二連接埠22透過模擬基板1的讓位口14而不致於被模擬基板1所遮擋。讓位口14的位置可根據待測基板2的第二連接埠22的位置而設計，例如，如圖1B所示，讓位口14位於基板1的邊緣處，其位置相異於第一連接埠11的位置，但與第一連接埠11位於基板1的相同側邊。或者，如圖4B所示，讓位口14位於基板1的一側邊的中部，其位置相異於第一連接埠11的位置，但與第一連接埠11位於基板1的相同側邊。Referring to FIG. 1B and FIG. 2 together, the analog substrate 1 includes a plurality of first electrodes 10 And electrically connected to the first connection port 11 of the first electrode 10. The first electrode 10 is disposed on an upper surface 1a of the dummy substrate 1, and the first connection port 11 is disposed on the lower surface 1b of the dummy substrate 1, and the upper surface 1a is disposed opposite to the lower surface 1b. The arrangement direction of the first electrodes 10 can be designed according to the direction of the second electrodes 20 of the substrate 2 to be tested. For example, as shown in FIG. 1B, the first electrodes 10 are arranged in parallel along a first axial direction (for example, a horizontal axis). Alternatively, as shown in FIG. 4B, the first electrodes 10 are arranged in parallel along the second axial direction (for example, the vertical axis). In addition, the first connection port 11 is disposed at an edge of the analog substrate 1, and the first connection port 11 has a plurality of first contact points 111 spaced apart from each other, and the first contact points 111 are electrically connected to the first An electrode 10. In addition, the dummy substrate 1 further includes a first insulating layer 13 and a yielding port 14. The insulating layer 13 is covered on the first electrode 10 for preventing the first electrode 10 from being corroded by the environment. The position of the position port 14 corresponds to the position of the second port 22 of the substrate 2 to be tested, whereby when the substrate 2 to be tested is pressed against the dummy substrate 1, the second port 22 of the substrate 2 to be tested is transmitted through the dummy substrate 1 The position port 14 is not blocked by the dummy substrate 1. The position of the position port 14 can be designed according to the position of the second connection port 22 of the substrate 2 to be tested. For example, as shown in FIG. 1B, the position port 14 is located at the edge of the substrate 1, and its position is different from the first connection. The position of the crucible 11 is located on the same side of the substrate 1 as the first connection port 11. Alternatively, as shown in FIG. 4B, the placement port 14 is located at the middle of one side of the substrate 1, and its position is different from the position of the first connection port 11, but is located on the same side of the substrate 1 as the first connection port 11.
於實務中，上述模擬基板1可為印刷電路板(PCB)，上述第一電極10可為導電的銅線(trace)，上述第一絕緣層13可為絕緣油墨，上述該些第一接觸點111可為導電的材質例如銅箔。更進一步地說，採用PCB作為模擬基板1與待測基板2壓合後進行待測基板2的測試，PCB製程較簡單，技術較成熟，所以作為第一電極10的銅線的寬度能夠較精確的控制，亦即偏差較小，因此，本發明的觸控面板的測試裝置Z，可有效地減小測試的不確定性、降低測試過程中的誤判率，並提高產品的測試良率。另外，PCB 相較於傳統的玻璃導電基板不易破裂，成本低。In the practice, the analog substrate 1 may be a printed circuit board (PCB), the first electrode 10 may be a conductive copper wire, the first insulating layer 13 may be an insulating ink, and the first contact points are 111 may be a conductive material such as copper foil. Furthermore, the PCB is used as the analog substrate 1 and the substrate 2 to be tested is pressed together to test the substrate 2 to be tested. The PCB process is simple and the technology is mature, so the width of the copper wire as the first electrode 10 can be more precise. The control device, that is, the deviation is small. Therefore, the test device Z of the touch panel of the present invention can effectively reduce the uncertainty of the test, reduce the false positive rate during the test, and improve the test yield of the product. In addition, PCB Compared with the conventional glass conductive substrate, it is not easy to be broken and the cost is low.
請結合參照圖1A及圖2，待測基板2包括多個第二電極20及電性連接於第二電極20的第二連接埠22。第二電極20及第二連接埠22成形於待測基板2的一下表面2b。舉例來說，上述第二電極20可為透明的電極層。於本發明一實例中，如圖1A所示，該些第二電極20呈平行排列，且共同具有第二軸向(例如垂直軸向)。於本發明另一實例中，如圖4A所示，該些第二電極20呈平行排列，且共同具有第一軸向(例如水平軸向)。另外，第二連接埠22設置在待測基板2的其中一邊緣處，其位置與模擬基板1的讓位口14的位置相對應，藉此，待測基板2與模擬基板1壓合時，待測基板2的第二連接埠22透過模擬基板1的讓位口14而不致於被模擬基板1遮擋。第二連接埠22具有多個相互間隔的第二接觸點221，而該些第二接觸點221分別電性連接於該些第二電極20。此外，待測基板2還包括一第二絕緣層23，其覆蓋在第二電極20上以避免第二電極20受環境的侵蝕。於實務中，上述待測基板2可為導電玻璃或導電薄膜，上述第二絕緣層23可為絕緣油墨，上述第二接觸點221可為導電的材質例如銅箔。Referring to FIG. 1A and FIG. 2 , the substrate 2 to be tested includes a plurality of second electrodes 20 and a second connection port 22 electrically connected to the second electrode 20 . The second electrode 20 and the second connection port 22 are formed on the lower surface 2b of the substrate 2 to be tested. For example, the second electrode 20 may be a transparent electrode layer. In an example of the present invention, as shown in FIG. 1A, the second electrodes 20 are arranged in parallel and have a second axial direction (for example, a vertical axis). In another example of the present invention, as shown in FIG. 4A, the second electrodes 20 are arranged in parallel and have a first axial direction (for example, a horizontal axis). In addition, the second connection port 22 is disposed at one of the edges of the substrate 2 to be tested, and the position thereof corresponds to the position of the yielding port 14 of the analog substrate 1 , whereby when the substrate 2 to be tested is pressed against the dummy substrate 1 The second port 22 of the substrate 2 to be tested passes through the yielding port 14 of the dummy substrate 1 without being blocked by the dummy substrate 1. The second connection port 22 has a plurality of second contact points 221 spaced apart from each other, and the second contact points 221 are electrically connected to the second electrodes 20, respectively. In addition, the substrate 2 to be tested further includes a second insulating layer 23 covering the second electrode 20 to prevent the second electrode 20 from being corroded by the environment. In practice, the substrate 2 to be tested may be a conductive glass or a conductive film, the second insulating layer 23 may be an insulating ink, and the second contact 221 may be a conductive material such as a copper foil.
如圖2、圖3及圖5所示，測試模組3包括一電性連接於模擬基板1的第一連接埠11的第一測試埠31及一電性連接於待測基板2的第二連接埠22的第二測試埠32。舉例來說，第一測試埠31具有多個相互間隔的第一測試點311，第二測試埠32具有多個相互間隔的第二測試點321。模擬基板1的第一接觸點111與測試模組3的第一測試點311分別電性連接，待測基板2的第二接觸點221與測試模組3的第二測試點321電性連接。於實務中，上述第一測試點311及第二測試點321可為導電的材質例如銅箔。As shown in FIG. 2, FIG. 3 and FIG. 5, the test module 3 includes a first test port 31 electrically connected to the first port 11 of the analog substrate 1, and a second electrode electrically connected to the substrate 2 to be tested. The second test port 32 of the port 22 is connected. For example, the first test cartridge 31 has a plurality of first test points 311 spaced apart from each other, and the second test cartridge 32 has a plurality of second test points 321 spaced apart from each other. The first contact point 111 of the analog substrate 1 is electrically connected to the first test point 311 of the test module 3, and the second contact point 221 of the substrate 2 to be tested is electrically connected to the second test point 321 of the test module 3. In practice, the first test point 311 and the second test point 321 may be conductive materials such as copper foil.
此外，該測試裝置Z還包括線纜模組4、測試頭模組5及壓抵板6。線纜模組4電性連接於測試模組3的第一測試埠31及模擬基板1的第一連接埠11之間。測試頭模組5配置在該測試模組 3與該待測基板2之間。壓抵板6配置在該模擬基板1上方，當一待測基板2放置在模擬基板1上時，壓抵板6將該待測基板2抵壓於模擬基板1上，以確保模擬基板1與待測基板2之間是正常接觸以模擬一真實貼合後的觸控面板。於一實施例中，測試裝置Z還包括一氣缸7，氣缸7設置於壓抵板6上方，壓抵板6可透過氣缸7的作用使待測基板2與模擬基板1壓合。於實務中，上述線纜模組4可為軟性印刷電路板(FPC)，上述測試頭模組5可為探針或矽橡膠連接器的型式。In addition, the testing device Z further includes a cable module 4, a test head module 5 and a pressing plate 6. The cable module 4 is electrically connected between the first test port 31 of the test module 3 and the first port 11 of the analog substrate 1. The test head module 5 is disposed in the test module 3 is between the substrate 2 to be tested. The pressing plate 6 is disposed above the dummy substrate 1. When a substrate 2 to be tested is placed on the dummy substrate 1, the pressing plate 6 presses the substrate 2 to be tested against the dummy substrate 1 to ensure the dummy substrate 1 and The substrate to be tested 2 is in normal contact to simulate a true touch panel. In an embodiment, the testing device Z further includes a cylinder 7 disposed above the pressing plate 6. The pressing plate 6 can press the substrate 2 to be tested and the dummy substrate 1 through the action of the cylinder 7. In practice, the cable module 4 may be a flexible printed circuit board (FPC), and the test head module 5 may be in the form of a probe or a rubber connector.
於一具體實施例，如圖2所示，並請同時配合參閱圖1A及圖1B，或如圖5所示，并同時配合參閱圖4A及圖4B。首先，模擬基板1固定於觸控面板的測試裝置Z上，接著將待測基板2壓合於模擬基板1上，其中，待測基板2的下表面2b壓合於模擬基板1的上表面1a。模擬基板1的讓位口14對應於待測基板2的第二連接埠22。第一電極10與第二電極20之間透過第一絕緣層13和第二絕緣層23相互電性絕緣，且呈相互交叉分布，從而形成類似網格狀的圖樣(圖未示)。然後將測試模組3的第一測試埠31透過線纜模組4電性連接模擬基板1的第一連接埠11，將測試模組3的第二測試埠32透過測試頭模組5電性連接待測基板2的第二連接埠22。最後，在模擬貼合並通電後，藉由量測在第一電極10與第二電極20交叉點處所形成的互感電容的方式，以實現對待測基板2之檢測。本發明根據待測基板2，例如導電玻璃的第一電極10的結構方向，而設計一塊模擬基板1的結構，藉由模擬基板1的設計，以改善傳統觸控面板需要貼合後才進行測試，使得不良品的檢測增加了貼合工藝成本等問題。另外，待測基板2與模擬基板1壓合後，因模擬基板1上設置有讓位口14，待測基板2上的第二連接埠22的位置對應於讓位口14，使得第二連接埠22不會被模擬基板1所遮蓋，而模擬基板1上的第一連接埠11因設置於模擬基板1的下表面1b，所以第一連接埠11也不會被待測基板 2所遮蓋。換言之，採用此測試裝置，只需要在模擬基板1上設置讓位口，待測基板2上不需要設置讓位口，可節省在待測基板2上製作讓位口的程序。進一步的，當待測基板2為觸控面板的上導電蓋板時，由於上導電蓋板一般為玻璃材質，且作為外部觸控物體的直接接觸面，故較難在上導電蓋板上面設置讓位口，本發明提供的測試裝置可解決觸控面板上導電蓋板不易設置讓位口的問題。In a specific embodiment, as shown in FIG. 2, please refer to FIG. 1A and FIG. 1B at the same time, or as shown in FIG. 5, and refer to FIG. 4A and FIG. 4B at the same time. First, the dummy substrate 1 is fixed on the test device Z of the touch panel, and then the substrate 2 to be tested is pressed onto the dummy substrate 1 , wherein the lower surface 2 b of the substrate 2 to be tested is pressed against the upper surface 1 a of the dummy substrate 1 . . The yielding port 14 of the analog substrate 1 corresponds to the second port 22 of the substrate 2 to be tested. The first electrode 10 and the second electrode 20 are electrically insulated from each other through the first insulating layer 13 and the second insulating layer 23, and are distributed to each other to form a grid-like pattern (not shown). The first test port 31 of the test module 3 is electrically connected to the first port 11 of the analog substrate 1 through the cable module 4, and the second test port 32 of the test module 3 is electrically transmitted through the test head module 5. The second connection port 22 of the substrate 2 to be tested is connected. Finally, after the analog paste is combined and energized, the detection of the substrate 2 to be tested is performed by measuring the mutual inductance formed at the intersection of the first electrode 10 and the second electrode 20. The invention designs a structure of the analog substrate 1 according to the structural direction of the substrate 2 to be tested, for example, the first electrode 10 of the conductive glass, and simulates the design of the substrate 1 to improve the traditional touch panel to be tested before being tested. This makes the detection of defective products increase the cost of the bonding process. In addition, after the substrate 2 to be tested is pressed together with the dummy substrate 1, the position of the second port 22 on the substrate 2 to be tested is corresponding to the position port 14 so that the second connection is made. The first connection port 11 on the dummy substrate 1 is not disposed on the lower surface 1b of the dummy substrate 1 because the first connection port 11 on the dummy substrate 1 is not covered by the substrate to be tested. 2 covered. In other words, with the test device, it is only necessary to provide a retaining port on the analog substrate 1. The substrate to be tested does not need to be provided with a retaining port, and the program for making the retaining port on the substrate 2 to be tested can be saved. Further, when the substrate 2 to be tested is the upper conductive cover of the touch panel, since the upper conductive cover is generally made of glass and serves as a direct contact surface of the external touch object, it is difficult to set on the upper conductive cover. The test device provided by the present invention can solve the problem that the conductive cover on the touch panel is not easy to set the position.
綜上所述，本發明實施例所提供的觸控面板的測試裝置，其可透過模擬基板和待測基板的模擬貼合來模擬觸控面板結構以進行測試，模擬基板的製程簡單，誤差小，成本低。測試時，待測基板的第二連接埠透過模擬基板的讓位口而不被模擬基板所遮擋，以使得本發明的觸控面板的測試裝置能夠提升測試效率，提高測試便利性。In summary, the test device for the touch panel provided by the embodiment of the present invention can simulate the structure of the touch panel through the analog bonding of the analog substrate and the substrate to be tested for testing, and the process of simulating the substrate is simple and the error is small. ,low cost. During the test, the second connection port of the substrate to be tested is blocked by the embedding port of the analog substrate without being blocked by the analog substrate, so that the test device of the touch panel of the present invention can improve test efficiency and improve test convenience.
以上所述僅為本發明之較佳可行實施例，非因此侷限本發明之專利範圍，故舉凡運用本發明說明書及圖式內容所為之等效技術變化，均包含於本發明之範圍內。The above are only the preferred embodiments of the present invention, and are not intended to limit the scope of the invention, and the equivalents of the invention are included in the scope of the invention.
Z‧‧‧觸控面板的測試裝置Z‧‧‧Testing device for touch panel
1‧‧‧模擬基板1‧‧‧Simulated substrate
1a‧‧‧上表面1a‧‧‧ upper surface
1b‧‧‧下表面1b‧‧‧ lower surface
11‧‧‧第一連接埠11‧‧‧First connection埠
111‧‧‧第一接觸點111‧‧‧First touch point
2‧‧‧待測基板2‧‧‧Substrate to be tested
2b‧‧‧下表面2b‧‧‧lower surface
22‧‧‧第二連接埠22‧‧‧Second connection
221‧‧‧第二接觸點221‧‧‧second touch point
3‧‧‧測試模組3‧‧‧Test module
31‧‧‧第一測試埠31‧‧‧First test埠
311‧‧‧第一測試點311‧‧‧First test point
32‧‧‧第二測試埠32‧‧‧Second test
321‧‧‧第二測試點321‧‧‧ second test point
4‧‧‧線纜模組4‧‧‧ Cable Module
5‧‧‧測試頭模組5‧‧‧Test head module
6‧‧‧壓抵板6‧‧‧Pressing board
14‧‧‧讓位口14‧‧‧Let the mouth
Claims (10)
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| CN201310020911.6A CN103941109B (en) | 2013-01-21 | 2013-01-21 | The test device of contact panel |
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| TW201430649A TW201430649A (en) | 2014-08-01 |
| TWI510987B true TWI510987B (en) | 2015-12-01 |
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| CN (1) | CN103941109B (en) |
| TW (1) | TWI510987B (en) |
| WO (1) | WO2014110941A1 (en) |
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| CN104407737A (en) * | 2014-11-19 | 2015-03-11 | 上海天马微电子有限公司 | Display module and display device thereof |
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| CN105224153A (en) * | 2015-08-31 | 2016-01-06 | 京东方科技集团股份有限公司 | The electric property pick-up unit of touch control electrode and detection method |
| CN105183225B (en) * | 2015-09-07 | 2018-05-08 | 京东方科技集团股份有限公司 | Test device and the test method using the test device |
| CN106370967B (en) | 2016-09-12 | 2019-06-28 | 京东方科技集团股份有限公司 | A kind of touch-control structure, its test method, touch screen and display device |
| CN110178075B (en) * | 2017-01-27 | 2022-05-03 | 默克专利股份有限公司 | Method for detecting substrate fracture of switchable optical element and switchable optical device |
| CN110673765A (en) * | 2019-08-30 | 2020-01-10 | 广州视源电子科技股份有限公司 | Manufacturing method of capacitive screen |
| CN113485584B (en) * | 2021-07-27 | 2022-11-01 | 武汉华星光电半导体显示技术有限公司 | Touch display device and test method thereof |
| CN115291026B (en) * | 2022-10-08 | 2022-12-20 | 苏州锐思突破电子科技有限公司 | Intelligent detection device of embedded equipment |
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| WO2014110941A1 (en) | 2014-07-24 |
| CN103941109B (en) | 2017-07-28 |
| CN103941109A (en) | 2014-07-23 |
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