CN209949758U - Electronic component with good heat dissipation effect - Google Patents

Abstract

The utility model discloses an electronic components that radiating effect is good, including electronic components body, side slider and locating piece, the lower surface welding of electronic components body has the fin, built-in groove passes through inside spring and built-in board interconnect, the side slider sets up the inside at the side spout, locating piece symmetric welding is in the inside lower surface both sides of built-in board, the perforation has all been seted up to the inside of bottom plate and built-in board, inside middle spring and the fixed block interconnect of all passing through in the upper surface both sides of bottom plate, the intermediate position of bracing piece is through the one end interconnect of middle pivot and connecting rod, the side-mounting of stopper has the side spring. This electronic components that radiating effect is good through fin and perforation, can be with the heat outside transmission that the electronic components body produced, rotate the support of connecting the setting simultaneously, can use built-in board protection electronic components body when removing the device.

Description

Electronic component with good heat dissipation effect

Technical Field

The utility model relates to an electronic components technical field specifically is an electronic components that radiating effect is good.

Background

The development history of electronic components is a concentrated development history of electronics, which is developed into a micro device by pursuing larger area, the rapid development of electronic components becomes an important mark of the development of modern science and technology, the development history of electronic components is composed of a plurality of parts, the development history of electronic components is widely used in electronic products, components required by circuits are concentrated together, the installation, connection and maintenance are convenient, and the transfer reaction is rapid, and the development history becomes an essential part in the modern technology, but most of the electronic components are concentrated together at present, the heat generated during the use is larger, the heat generated when the electronic components are installed in the electronic products is not convenient to be dissipated to the outside, and after most of the electronic components are installed together, due to the fact that the external shapes of the electronic components are different, the electronic components are easy to rub to the welding position when the electronic components are moved, is not favorable for use. Aiming at the problems, the innovative design is carried out on the basis of the original electronic components.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

The utility model provides a not enough to prior art, the utility model provides an electronic components that the radiating effect is good has solved present most electronic components and has concentrated the installation together, and the heat that produces during the use is great to the heat that its inside that installs at the electronic product produced is not convenient for to dispel to the outside, and most electronic components installs back together simultaneously, because electronic components external shape size differs from each other, rubs electronic components very easily during the removal, influences its welding position, is unfavorable for the problem of use.

(II) technical scheme

In order to achieve the above object, the utility model provides a following technical scheme: an electronic component with good heat dissipation effect comprises an electronic component body, side sliders and positioning blocks, wherein heat dissipation fins are welded on the lower surface of the electronic component body, the electronic component body is connected with a support through an internal rotating shaft, an internal groove is formed in the lower portion of the support, the internal groove is connected with an internal plate through an internal spring, an accommodating groove is reserved in the lower surface of the internal plate, side sliding grooves are symmetrically formed in two sides of the accommodating groove, the side sliders are arranged in the side sliding grooves and symmetrically arranged on two sides of the outer portion of a baffle plate, the positioning blocks are symmetrically welded on two sides of the inner lower surface of the internal plate, the positioning blocks are connected with a bottom plate through positioning grooves, the positioning grooves are symmetrically reserved on two sides of the lower surface of the bottom plate, the bottom plate and the internal plate are both provided with through holes, and the outer two sides of the bottom plate are symmetrically provided with external sliding, and the external sliding grooves are connected with the electronic component body through the external sliding blocks, the external sliding blocks are symmetrically fixed at two inner sides of the electronic component body, the inner parts of two sides of the upper surface of the bottom plate are connected with the fixed block through the middle spring, the fixed block is connected with one end of the supporting rod through the lower rotating shaft, the other end of the supporting rod is connected with the electronic component body through the upper rotating shaft, the middle position of the supporting rod is connected with one end of the connecting rod through the middle rotating shaft, the other end of the connecting rod is connected with the limiting block through the side rotating shaft, the limiting block is arranged inside the placing groove, the placing groove is arranged on the upper surface of the bottom plate, the side spring is arranged at the side surface of the limiting block, the lower surface of the limiting block is fixed with the bottom sliding block, and, and the bottom sliding groove is arranged on the lower surface of the placing groove.

Preferably, the electronic component body and the bottom plate form a sliding structure through an external sliding block and an external sliding groove, the bottom plate and the built-in plate are provided with through holes at equal intervals, and the through holes correspond to the radiating fins.

Preferably, the support and the electronic component body form a rotating structure through an internal rotating shaft, the rotating angle range of the rotating structure is 0-180 degrees, and the internal distance of each of the 2 corresponding supports is equal to the external length of the electronic component body.

Preferably, the built-in plate forms a lifting structure with the support through the built-in groove, the built-in plate is elastically connected with the built-in groove through an internal spring, and the built-in plate is connected with the bottom plate clamping groove through a positioning block and a positioning groove.

Preferably, the baffle plates and the built-in plates form a sliding structure through the side sliding blocks and the side sliding grooves, the sum of the lengths of the 2 baffle plates is larger than the length of the distribution range of the through holes, and the front view of the built-in plates is in an H shape.

Preferably, one end of the supporting rod forms a rotating structure with the electronic component body through an upper rotating shaft, the other end of the supporting rod is rotatably connected with the fixing block through a lower rotating shaft, and the fixing block forms an elastic structure with the bottom plate through an intermediate spring.

Preferably, the one end of connecting rod is rotated with the bracing piece through middle pivot and is connected, and the other end of connecting rod passes through the side pivot and constitutes revolution mechanic with the stopper to the stopper passes through side spring and standing groove elastic connection, and the stopper passes through bottom slider and bottom spout simultaneously and constitutes sliding construction with the bottom plate.

(III) advantageous effects

The utility model provides an electronic components that the radiating effect is good. The method has the following beneficial effects:

(1) this electronic components that radiating effect is good, through the baffle that sliding connection set up, when using the electronic components body, can remove the baffle to both sides through the side slider, will perforate the position show out, the fin is through perforating the heat that the electronic components body produced to the outside transmission, improves the radiating effect of electronic components body, prolongs life, has increased the device's practicality.

(2) This electronic components that the radiating effect is good connects the support that sets up through rotating to and the built-in board that elevation structure set up, when removing the electronic components body, can rotate the angle of support through inside pivot, make built-in board be in directly over the electronic components body, use built-in board protection electronic components body, prevent that the in-process that it removed from receiving foreign object friction to influence its welding point, increased the device's performance.

(3) This electronic components that the radiating effect is good connects bracing piece and the connecting rod that sets up through rotating to and the fixed block that elastic structure set up, can weaken the vibrations that electronic components body produced when erection joint, maintain the stability of electronic components body, produce vibrations when preventing the erection joint and lead to electronic components body position slope, influence the use in later stage, increased the device's stability.

Drawings

FIG. 1 is a schematic front sectional view of the present invention;

FIG. 2 is a schematic view of the left side structure of the present invention;

FIG. 3 is a schematic view of the sectional structure of the right side of the inner board of the present invention;

fig. 4 is an enlarged schematic structural view of a portion a in fig. 1 according to the present invention.

In the figure: 1. an electronic component body; 2. a heat sink; 3. an inner rotating shaft; 4. a support; 5. a built-in groove; 6. an inner spring; 7. a built-in plate; 8. a receiving groove; 9. a side chute; 10. a side slider; 11. a baffle plate; 12. positioning blocks; 13. positioning a groove; 14. a base plate; 15. perforating; 16. an external chute; 17. an outer slider; 18. a middle spring; 19. a fixed block; 20. a lower rotating shaft; 21. a support bar; 22. an upper rotating shaft; 23. an intermediate rotating shaft; 24. a connecting rod; 25. a side rotating shaft; 26. a limiting block; 27. a placement groove; 28. a side spring; 29. a bottom slider; 30. a bottom chute.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

As shown in fig. 1-4, the utility model provides a technical solution: an electronic component with good heat dissipation effect comprises an electronic component body 1, a heat dissipation fin 2, an internal rotating shaft 3, a support 4, an internal groove 5, an internal spring 6, an internal plate 7, a containing groove 8, a side sliding groove 9, a side sliding block 10, a baffle plate 11, a positioning block 12, a positioning groove 13, a bottom plate 14, a perforation 15, an external sliding groove 16, an external sliding block 17, a middle spring 18, a fixing block 19, a lower rotating shaft 20, a support rod 21, an upper rotating shaft 22, a middle rotating shaft 23, a connecting rod 24, a side rotating shaft 25, a limiting block 26, a placing groove 27, a side spring 28, a bottom sliding block 29 and a bottom sliding groove 30, wherein the heat dissipation fin 2 is welded on the lower surface of the electronic component body 1, the electronic component body 1 is connected with the support 4 through the internal rotating shaft 3, the internal groove 5 is formed in the lower part of the support 4, the internal groove 5 is connected, the lower surface of the built-in plate 7 is reserved with an accommodating groove 8, two sides of the accommodating groove 8 are symmetrically provided with side sliding grooves 9, side sliding blocks 10 are arranged inside the side sliding grooves 9, the side sliding blocks 10 are symmetrically arranged on two outer sides of the baffle plate 11, positioning blocks 12 are symmetrically welded on two sides of the inner lower surface of the built-in plate 7, the positioning blocks 12 are connected with a bottom plate 14 through positioning grooves 13, the positioning grooves 13 are symmetrically reserved on two sides of the lower surface of the bottom plate 14, the bottom plate 14 and the built-in plate 7 are both provided with through holes 15, two outer sides of the bottom plate 14 are symmetrically provided with outer sliding grooves 16, the outer sliding grooves 16 are connected with an electronic component body 1 through outer sliding blocks 17, the outer sliding blocks 17 are symmetrically fixed on two inner sides of the electronic component body 1, two inner sides of the upper surface of the bottom plate 14 are both connected with, the fixing block 19 is connected with one end of the support rod 21 through the lower rotating shaft 20, the other end of the support rod 21 is connected with the electronic component body 1 through the upper rotating shaft 22, the middle position of the support rod 21 is connected with one end of the connecting rod 24 through the middle rotating shaft 23, the other end of the connecting rod 24 is connected with the limiting block 26 through the side rotating shaft 25, the limiting block 26 is arranged inside the placing groove 27, the placing groove 27 is formed in the upper surface of the bottom plate 14, the side spring 28 is arranged on the side surface of the limiting block 26, the bottom sliding block 29 is fixed on the lower surface of the limiting block 26, the bottom sliding block 29 is connected with the bottom plate 14 through the bottom sliding groove 30, and the bottom sliding groove 30 is formed in the lower surface of the placing;

the electronic component body 1 and the bottom plate 14 form a sliding structure through the external sliding block 17 and the external sliding groove 16, the through holes 15 are formed in the bottom plate 14 and the built-in plate 7 at equal intervals, the positions of the through holes 15 correspond to the positions of the radiating fins 2, heat generated on the electronic component body 1 is transferred to the radiating fins 2, and the radiating fins 2 radiate the heat to the outside through the through holes 15;

the support 4 and the electronic component body 1 form a rotating structure through the internal rotating shaft 3, the rotating angle range of the rotating structure is 0-180 degrees, the internal distance of the corresponding 2 supports 4 is equal to the external length of the electronic component body 1, and the internal plate 7 can be used for protecting the electronic component body 1 when the device is moved by rotating the angle position of the support 4 through the internal rotating shaft 3;

the built-in board 7 and the support 4 form a lifting structure through the built-in groove 5, the built-in board 7 is elastically connected with the built-in groove 5 through the internal spring 6, the built-in board 7 is connected with the clamping groove of the bottom plate 14 through the positioning block 12 and the positioning groove 13, when the electronic component body 1 is used, the built-in board 7 is positioned under the electronic component body 1 by rotating the angle of the support 4, and the built-in board 7 is connected with the clamping groove of the bottom plate 14 through the positioning groove 13 and the positioning block 12 by moving the position of the built-in board 7 through the built-in groove 5;

the baffle 11 forms a sliding structure with the built-in plate 7 through the side sliding block 10 and the side sliding groove 9, the sum of the lengths of the 2 baffles 11 is greater than the length of the distribution range of the through holes 15, the front view of the built-in plate 7 is in an H shape, the position of the baffle 11 is moved in the side sliding groove 9 through the side sliding block 10, the position of the through hole 15 is exposed, and heat dissipation is facilitated;

when the electronic component body 1 is mounted and connected, in order to prevent vibration from affecting the welding point of the electronic component body 1, two ends of the supporting rod 21 rotate through the upper rotating shaft 22 and the lower rotating shaft 20, and the fixing block 19 is pushed to compress the middle spring 18 downwards;

one end of the connecting rod 24 is rotatably connected with the supporting rod 21 through the middle rotating shaft 23, the other end of the connecting rod 24 forms a rotating structure through the side rotating shaft 25 and the limiting block 26, the limiting block 26 is elastically connected with the placing groove 27 through the side spring 28, the limiting block 26 forms a sliding structure with the bottom plate 14 through the bottom sliding block 29 and the bottom sliding groove 30, and when the supporting rod 21 rotates, the two ends of the connecting rod 24 rotate through the middle rotating shaft 23 and the side rotating shaft 25.

When the electronic component is used, firstly, the built-in plate 7 is ensured to be positioned right above the electronic component body 1 during movement, the electronic component body 1 is protected from external friction, the electronic component body 1 is moved to a use place, a locking nut outside the internal rotating shaft 3 is loosened, the angle position of the support 4 is rotated through the internal rotating shaft 3, the built-in plate 7 is positioned right below the electronic component body 1, the locking nut outside the internal rotating shaft 3 is rotated reversely to fix the electronic component body, a threaded rod outside the support 4 is loosened, the position of the built-in plate 7 is adjusted through the built-in groove 5, the built-in plate 7 compresses the internal spring 6 upwards at the moment, and when the built-in plate 7 is connected with a clamping groove of the bottom plate 14 through the positioning block 12 and the positioning groove 13, the threaded rod outside the reversely rotating support 4 fixes the position of;

then the electronic component body 1 is arranged inside the electronic product and is connected with each other, because the electronic component body 1 has a small structure, the welding point of the electronic component body 1 is easy to loosen in the process of installation and connection, so that the electronic component body 1 is inclined and affects the use, at the moment, the electronic component body 1 moves downwards in the external sliding chute 16 through the external sliding block 17, two ends of the supporting rod 21 respectively rotate through the upper rotating shaft 22 and the lower rotating shaft 20, the fixing block 19 compresses the middle spring 18 downwards, meanwhile, the two ends of the connecting rod 24 rotate through the middle rotating shaft 23 and the side rotating shaft 25 respectively, the connecting rod 24 pushes the limiting block 26 to move in the bottom sliding groove 30 through the bottom sliding block 29, the limiting block 26 compresses the side spring 28 inwards, the arrangement of the structure can weaken the vibration generated by the electronic component body 1 during installation and connection, and maintain the stability of the electronic component body 1;

next, the bolt on the lower surface of the baffle 11 is loosened, the position of the baffle 11 is moved to both sides in the side sliding groove 9 through the side sliding block 10, when the baffle 11 is moved to the most lateral position, the bolt on the lower surface of the baffle 11 is rotated reversely to fix the baffle, the electronic component body 1 generates more heat after long-term use and is difficult to radiate the heat to the outside, at this time, the heat is transferred to the surface of the heat sink 2, and the heat on the heat sink 2 is radiated to the outside through the through hole 15.

In conclusion, the electronic component with good heat dissipation effect can be obtained, by the baffle 11 arranged in the sliding connection, when the electronic component body 1 is used, the baffle 11 can be moved towards two sides through the side slide block 10, the position of the through hole 15 is exposed, the heat generated by the electronic component body 1 is transferred to the outside through the through hole 15 by the heat radiating fin 2, the heat dissipation effect of the electronic component body 1 is improved, the service life is prolonged, the practicability of the device is increased, by rotating the support 4 arranged in the connection and the built-in plate 7 arranged in the lifting structure, when the electronic component body 1 is moved, the angle of the support 4 can be rotated through the internal rotating shaft 3, so that the built-in plate 7 is positioned right above the electronic component body 1, the electronic component body 1 is protected by the built-in plate 7, and the welding point is prevented from being influenced by the friction of foreign objects in, the device's performance has been increased, through rotating bracing piece 21 and the connecting rod 24 of connecting the setting to and the fixed block 19 that elastic structure set up, can weaken the vibrations that electronic components body 1 produced when erection joint, maintain electronic components body 1's stability, produce vibrations when preventing erection joint and lead to electronic components body 1 position slope, influence the use in later stage, increased the device's stability.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (7)

1. The utility model provides an electronic components that radiating effect is good, includes electronic components body (1), side slider (10) and locating piece (12), its characterized in that: the electronic component comprises an electronic component body (1), wherein a radiating fin (2) is welded on the lower surface of the electronic component body (1), the electronic component body (1) is connected with a support (4) through an internal rotating shaft (3), a built-in groove (5) is formed in the lower portion of the support (4), the built-in groove (5) is connected with a built-in plate (7) through an internal spring (6), a containing groove (8) is reserved on the lower surface of the built-in plate (7), side sliding grooves (9) are symmetrically formed in two sides of the containing groove (8), side sliding blocks (10) are arranged in the side sliding grooves (9), the side sliding blocks (10) are symmetrically arranged on two outer sides of a baffle plate (11), positioning blocks (12) are symmetrically welded on two sides of the inner lower surface of the built-in plate (7), the positioning blocks (12) are connected with a bottom plate (14) through positioning grooves (13), and the positioning grooves (13) are symmetrically reserved on two lower surfaces of the bottom plate, the inner parts of the bottom plate (14) and the built-in plate (7) are provided with through holes (15), the two outer sides of the bottom plate (14) are symmetrically provided with outer sliding grooves (16), the outer sliding grooves (16) are connected with the electronic component body (1) through outer sliding blocks (17), the outer sliding blocks (17) are symmetrically fixed on the two inner sides of the electronic component body (1), the inner parts of the two sides of the upper surface of the bottom plate (14) are connected with fixed blocks (19) through middle springs (18), the fixed blocks (19) are connected with one end of a supporting rod (21) through a lower rotating shaft (20), the other end of the supporting rod (21) is connected with the electronic component body (1) through an upper rotating shaft (22), the middle position of the supporting rod (21) is connected with one end of a connecting rod (24) through a middle rotating shaft (23), and the other end of connecting rod (24) passes through side pivot (25) and stopper (26) interconnect to stopper (26) set up in the inside of standing groove (27), and standing groove (27) set up the upper surface at bottom plate (14) simultaneously, side spring (28) are installed to the side of stopper (26), and the lower fixed surface of stopper (26) has bottom slider (29), and bottom slider (29) are through bottom spout (30) and bottom plate (14) interconnect, and bottom spout (30) set up the lower surface at standing groove (27) simultaneously.

2. An electronic component with good heat dissipation effect as claimed in claim 1, wherein: the electronic component body (1) forms a sliding structure with the bottom plate (14) through the external sliding block (17) and the external sliding groove (16), the bottom plate (14) and the built-in plate (7) are provided with through holes (15) at equal intervals, and the positions of the through holes (15) correspond to the positions of the radiating fins (2).

3. An electronic component with good heat dissipation effect as claimed in claim 1, wherein: the support (4) forms a rotating structure with the electronic component body (1) through the internal rotating shaft (3), the rotating angle range of the rotating structure is 0-180 degrees, and the internal distance of the corresponding 2 supports (4) is equal to the external length of the electronic component body (1).

4. An electronic component with good heat dissipation effect as claimed in claim 1, wherein: the built-in plate (7) forms a lifting structure with the support (4) through the built-in groove (5), the built-in plate (7) is elastically connected with the built-in groove (5) through the internal spring (6), and the built-in plate (7) is connected with the clamping groove of the bottom plate (14) through the positioning block (12) and the positioning groove (13).

5. An electronic component with good heat dissipation effect as claimed in claim 1, wherein: the baffle (11) and the built-in plate (7) form a sliding structure through the side sliding block (10) and the side sliding groove (9), the sum of the lengths of the 2 baffles (11) is larger than the length of the distribution range of the through holes (15), and the front view of the built-in plate (7) is in an H shape.

6. An electronic component with good heat dissipation effect as claimed in claim 1, wherein: one end of the supporting rod (21) forms a rotating structure with the electronic component body (1) through an upper rotating shaft (22), the other end of the supporting rod (21) is rotatably connected with the fixing block (19) through a lower rotating shaft (20), and the fixing block (19) forms an elastic structure with the bottom plate (14) through the middle spring (18).

7. An electronic component with good heat dissipation effect as claimed in claim 1, wherein: one end of the connecting rod (24) is rotatably connected with the supporting rod (21) through the middle rotating shaft (23), the other end of the connecting rod (24) forms a rotating structure with the limiting block (26) through the side rotating shaft (25), the limiting block (26) is elastically connected with the placing groove (27) through the side spring (28), and meanwhile the limiting block (26) forms a sliding structure with the bottom plate (14) through the bottom sliding block (29) and the bottom sliding groove (30).

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