CN220252526U - Novel inclined radiator - Google Patents
Novel inclined radiator Download PDFInfo
- Publication number
- CN220252526U CN220252526U CN202321338236.7U CN202321338236U CN220252526U CN 220252526 U CN220252526 U CN 220252526U CN 202321338236 U CN202321338236 U CN 202321338236U CN 220252526 U CN220252526 U CN 220252526U
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- heat
- main board
- radiator
- locking plate
- shaped
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910052802 copper Inorganic materials 0.000 claims abstract description 12
- 239000010949 copper Substances 0.000 claims abstract description 12
- 230000005855 radiation Effects 0.000 claims abstract description 7
- 239000004519 grease Substances 0.000 claims description 13
- 229920001296 polysiloxane Polymers 0.000 claims description 13
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 3
- 238000009434 installation Methods 0.000 abstract description 9
- 238000000034 method Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 8
- 230000000694 effects Effects 0.000 description 6
- 230000007547 defect Effects 0.000 description 5
- 230000009471 action Effects 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to the technical field of radiators, and discloses a novel inclined radiator, which comprises: a main board; a heat radiation fan vertically arranged above the main board; a heat radiation fin; u-shaped heat dissipation copper pipe; and a heat conducting base. According to the utility model, the radiator can be installed on the main board in a vertical mode, the space above the main board is utilized by the radiating fan and the radiating fins, the installation space of other computer accessories on the upper surface of the main board is not occupied, and the saved space can be used for installing other computer components. Still disclose a buckle structure, it can fix novel inclined radiator, include: the U-shaped locking plate is provided with two locking plates; the heat conduction base can be clamped and installed between the two U-shaped locking plates, and two ends of the locking plate are detachably connected with the two U-shaped locking plates respectively. The buckle structure can conveniently mount or dismount the radiator.
Description
Technical Field
The utility model relates to the technical field of radiators, in particular to a novel inclined radiator.
Background
The current patent publication number is CN 215987212U's chinese patent document, and it discloses a computer motherboard radiator of swift installation, including the computer motherboard main part, heat abstractor is installed to the upper end of computer motherboard main part, the last symmetry of heat abstractor is provided with two mounting structure, two all be provided with a spacing spring on the mounting structure, two all be provided with a fixing device in the outside that is located two spacing springs on the mounting structure, fixing device contains the connecting plate, the lower extreme of connecting plate is provided with the fixed block.
The above patent documents have certain technical drawbacks in the process of use and installation thereof, and are specifically as follows:
the technical drawbacks that exist during use are pointed out: referring to fig. 1 of the drawings in the specification of the patent document, a heat dissipating device is mounted on a main body of a computer motherboard, the heat dissipating device is mounted on the main body of the computer motherboard in a horizontal manner, and after the heat dissipating device is mounted on the main body of the computer motherboard in a horizontal manner, more motherboard space is occupied;
the technical drawbacks of this during installation are pointed out: in combination with the drawing of the specification of the patent document, two fixing clamping grooves are formed in two opposite sides of the main body of the computer main board in the drawing of the patent document, fixing devices are symmetrically arranged on two sides of the heat dissipation device in the drawing of the patent document, the fixing devices comprise a connecting plate, fixing blocks are arranged at the lower end of the connecting plate, and an arc-shaped fixing groove is formed in the outer ends of the two fixing blocks.
In fact, when the dimensions of the two fixing blocks are the same as those of the two fixing slots, the two fixing blocks cannot be installed into the two fixing slots through the arc-shaped fixing slots, that is, a phenomenon of "jamming" occurs in the assembly process, so that the fixing manner does not actually conform to the actual assembly specification.
For this purpose, a novel inclined radiator is now proposed.
Disclosure of Invention
The utility model aims to solve the defects in the prior art and provides a novel inclined radiator.
In order to achieve the above purpose, the present utility model provides the following technical solutions:
a novel angled heat sink comprising:
a main board;
a heat radiation fan vertically arranged above the main board;
the heat dissipation fins are arranged in a plurality, and the heat dissipation fins are fixedly arranged on the rear side wall of the heat dissipation fan from top to bottom;
the U-shaped heat dissipation copper pipes are arranged in a parallel mode, and the U-shaped heat dissipation copper pipes are fixedly arranged on the plurality of heat dissipation fins; and
and the heat conduction base is fixedly arranged at the bottom between the plurality of U-shaped heat dissipation copper pipes.
The utility model also provides a buckle structure which can fix the novel inclined radiator, comprising:
the U-shaped locking plates are symmetrically and fixedly arranged on two opposite sides of the upper surface of the main board;
install the treater at the upper surface of mainboard and be located between two U type hasp boards, heat conduction base can the joint be installed between two U type hasp boards, and after heat conduction base joint is installed between two U type hasp boards, heat conduction base's lower surface can laminate mutually with the upper surface of treater, just be provided with on the heat conduction base and be used for above-mentioned novel inclined radiator with the fixed closure board of treater laminating on the mainboard, the both ends of closure board are connected with two U type hasp boards detachable respectively.
The buckle structure comprises: the upper surface of the processor is coated with a heat-conducting silicone grease coating, and when the lower surface of the heat-conducting base is attached to the upper surface of the processor, the heat-conducting silicone grease is positioned between the heat-conducting base and the processor.
The buckle structure comprises: the locking plate is a metal piece, and a plurality of fixing holes are formed in the locking plate, so that the novel inclined radiator can be quickly installed through locking bolts at two ends of the locking plate.
The buckle structure comprises: locking bolts are arranged at two ends of the locking plate, and the locking plate and the two U-shaped locking plates can be fastened and connected through the two locking bolts.
The buckle structure comprises: the lower surface of the main board is fixedly provided with a mounting backboard which can be attached to the main board.
Compared with the prior art, the utility model has the beneficial effects that:
1. in the utility model, the radiator can be vertically arranged on the main board, the radiating fan and the radiating fins use the space above the main board and do not occupy the space on the upper surface of the main board, and the inclined design of the radiator can save the space for arranging other computer components, for example, the saved space can be used for arranging more memory strips, can be used for arranging a hard disk, can be used for arranging a solid state disk and the like.
2. According to the utility model, the buckle structure can be used for conveniently mounting or dismounting the radiator.
3. In the utility model, the locking bolts are arranged at both ends of the locking plate, the locking plate and the two U-shaped locking plates can be fastened and connected through the two locking bolts, when the locking plate is disassembled, the locking plate can be disassembled only by unscrewing the two locking bolts, and when the locking plate is disassembled, the radiator can be taken down from the main board, otherwise, under the action of the locking plate and the two locking bolts, the radiator can be conveniently fixed on the main board, so that the radiator dissipates heat of the processor, the operation process is simple, and the actual operation and maintenance are convenient.
4. According to the utility model, the upper surface of the processor is coated with the heat-conducting silicone grease coating, when the lower surface of the heat-conducting base is attached to the upper surface of the processor, the heat-conducting silicone grease is positioned between the heat-conducting base and the processor, and the heat dissipation effect of the heat-conducting base on the processor can be enhanced under the action of the heat-conducting silicone grease coating.
5. In the utility model, the locking plate is a metal piece, and the locking plate is provided with a plurality of fixing holes, and the locking holes are matched with locking bolts at two ends of the locking plate, so that the purpose of quickly installing the inclined radiator can be realized.
Drawings
FIG. 1 is a schematic three-dimensional structure of a novel combination of an inclined radiator and a buckle structure according to the present utility model;
FIG. 2 is a schematic view of a rear view of a novel combination of an inclined heat sink and a buckle structure according to the present utility model;
fig. 3 is a schematic view showing a bottom view of a combination of a novel inclined radiator and a buckle structure according to the present utility model.
In the figure: 1. a heat radiation fan; 2. a heat radiation fin; 3. u-shaped heat dissipation copper pipe; 4. a thermally conductive base; 5. a main board; 6. mounting a backboard; 7. u-shaped locking plate; 8. a locking plate; 9. and locking the bolts.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Example 1
The current chinese patent document of patent publication No. CN215987212U discloses a computer motherboard radiator of swift installation, including computer motherboard main part, heat abstractor is installed to computer motherboard main part's upper end, and the last symmetry of heat abstractor is provided with two mounting structures, all is provided with a spacing spring on two mounting structures, all is provided with a fixing device in the outside that is located two spacing springs on two mounting structures, and fixing device contains the connecting plate, and the lower extreme of connecting plate is provided with the fixed block.
The above patent documents have certain technical drawbacks in the process of use and installation thereof, and are specifically as follows:
the technical drawbacks that exist during use are pointed out: referring to fig. 1 of the drawings in the specification of the patent document, a heat dissipating device is mounted on a main body of a computer motherboard, the heat dissipating device is mounted on the main body of the computer motherboard in a horizontal manner, and after the heat dissipating device is mounted on the main body of the computer motherboard in a horizontal manner, more motherboard space is occupied;
the technical drawbacks of this during installation are pointed out: in combination with the drawing of the specification of the patent document, two fixing clamping grooves are formed in two opposite sides of the main body of the computer main board in the drawing of the patent document, fixing devices are symmetrically arranged on two sides of the heat dissipation device in the drawing of the patent document, the fixing devices comprise a connecting plate, fixing blocks are arranged at the lower end of the connecting plate, and an arc-shaped fixing groove is formed in the outer ends of the two fixing blocks.
In fact, when the dimensions of the two fixing blocks are the same as those of the two fixing slots, the two fixing blocks cannot be installed into the two fixing slots through the arc-shaped fixing slots, that is, a phenomenon of "jamming" occurs in the assembly process, so that the fixing manner does not actually conform to the actual assembly specification.
In order to overcome the technical defect that the heat dissipating device occupies more main board space after being mounted on the main body of the computer main board in a horizontal mounting manner in the above patent document, the present inventors have adopted the following technical scheme:
example 1
As shown in fig. 1-3, the present embodiment provides a novel inclined radiator, which includes:
a main board 5; a heat radiation fan 1 vertically disposed above the main board 5; a plurality of radiating fins 2, wherein the radiating fins 2 are fixedly arranged on the rear side wall of the radiating fan 1 from top to bottom; a plurality of U-shaped heat dissipation copper pipes 3 are arranged in parallel, and the plurality of U-shaped heat dissipation copper pipes 3 are fixedly arranged on the plurality of heat dissipation fins 2; and a heat conduction base 4 fixedly installed at the bottom between the plurality of U-shaped heat dissipation copper pipes 3.
In this embodiment, the radiator can be installed on the motherboard 5 in a vertical manner, the radiator fan 1 and the plurality of radiating fins 2 utilize the space above the motherboard 5 and do not occupy the space on the upper surface of the motherboard 5, so that the saved space can be used for installing other computer components, for example, the saved space can be used for installing more memory banks, can be used for installing a hard disk, and can be used for installing a solid state disk.
Example two
The inventor aims to overcome the technical defect that when the two fixing blocks have the same size as the two fixing slots, the two fixing blocks cannot be installed in the two fixing slots through the arc-shaped fixing slots, namely, the phenomenon of blocking can occur in the assembling process, so that the fixing mode does not actually accord with the actual assembling specification, and adopts a technical scheme different from the quick-installation computer motherboard radiator disclosed in the patent publication No. CN215987212U, which is specifically as follows:
referring to fig. 1-3, the present embodiment provides a buckle structure capable of fixing a novel inclined radiator, comprising:
the U-shaped locking plates 7 are arranged in two, and the two U-shaped locking plates 7 are symmetrically and fixedly arranged on two opposite sides of the upper surface of the main board 5;
install the treater at the upper surface of mainboard 5 and be located between two U type hasp boards 7, heat conduction base 4 can the joint be installed between two U type hasp boards 7, and after heat conduction base 4 joint is installed between two U type hasp boards 7, the lower surface of heat conduction base 4 can laminate mutually with the upper surface of treater, and be provided with on the heat conduction base 4 and be used for the novel inclined radiator in embodiment 1 and the fixed closure board 8 of treater laminating on the mainboard 5, the both ends of closure board 8 are connected with two U type hasp boards 7 detachable respectively.
In this embodiment, the fastener structure can be used for conveniently installing or detaching the radiator, and the fastener structure overcomes the installation defect between the computer motherboard radiator and the computer motherboard main body, which is disclosed by the patent publication number CN215987212U and is installed quickly.
Example III
As shown in fig. 1-3, the improvement is based on the second embodiment:
further, the upper surface of the processor is coated with a heat-conducting silicone grease coating, when the lower surface of the heat-conducting base 4 is attached to the upper surface of the processor, the heat-conducting silicone grease is positioned between the heat-conducting base 4 and the processor, and the heat dissipation effect of the heat-conducting base 4 on the processor can be enhanced under the action of the heat-conducting silicone grease coating.
Further, the locking plate 8 is a metal piece, the metal piece can be a copper plate, and a plurality of fixing holes are formed in the locking plate 8, so that the novel inclined radiator can be quickly installed through locking bolts 9 at two ends of the locking plate 8.
Further, locking bolt 9 is all installed at the both ends of locking plate 8, locking plate 8 and two U type hasp boards 7 can pass through two locking bolt 9 fastening connection, when dismantling locking plate 8, only need unscrew two locking bolt 9, can lift down locking plate 8, after locking plate 8 lifts down, can take off the radiator from mainboard 5, on the contrary, under the effect of locking plate 8 and two locking bolt 9, can be convenient fix the radiator on mainboard 5 to make this radiator dispel the heat to the treater, operation process is simple, convenient actual operation and maintenance.
Further, the lower surface of the main board 5 is fixedly provided with a mounting backboard 6 which can be attached to the main board, the mounting backboard 6 is provided with plastic sliders with adjustable mounting hole positions, and the mounting hole positions of different main boards can be supported by moving the plastic sliders so as to be convenient for mounting the main boards with different models.
In summary, the working procedure of the utility model: the radiator can be vertically arranged on the main board 5, the radiating fan 1 and the radiating fins 2 use the space above the main board 5 and do not occupy the space on the upper surface of the main board 5, so that the saved space can be used for installing other computer components, for example, the saved space can be used for installing more memory strips, hard disks, solid state disks and the like;
the buckle structure can conveniently mount or dismount the radiator, and overcomes the mounting defect between the computer main board radiator and the computer main board main body, which is disclosed by the patent publication No. CN215987212U and is rapidly mounted;
the upper surface of the processor is coated with a heat-conducting silicone grease coating, when the lower surface of the heat-conducting base 4 is attached to the upper surface of the processor, the heat-conducting silicone grease is positioned between the heat-conducting base 4 and the processor, and the heat dissipation effect of the heat-conducting base 4 on the processor can be enhanced under the effect of the heat-conducting silicone grease coating;
locking bolt 9 is all installed at the both ends of lock plate 8, and locking plate 8 and two U type hasp boards 7 can pass through two locking bolt 9 fastening connection, when dismantling lock plate 8, only need unscrew two locking bolt 9, can lift down lock plate 8, and after lock plate 8 lifted down, can take off the radiator from mainboard 5, otherwise, under the effect of locking plate 8 and two locking bolt 9, can be convenient fix the radiator on mainboard 5 to make this radiator dispel the heat to the treater, operation simple process makes things convenient for actual operation and maintenance.
The above-mentioned different embodiments can be mutually combined, replaced and matched for use.
None of the utility models are related to the same or are capable of being practiced in the prior art. Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. A novel angled heat sink, comprising:
a main board (5);
a heat radiation fan (1) vertically arranged above the main board (5);
the radiating fins (2) are arranged in a plurality, and the radiating fins (2) are fixedly arranged on the rear side wall of the radiating fan (1) from top to bottom;
a plurality of U-shaped heat dissipation copper pipes (3) are arranged in parallel, and the U-shaped heat dissipation copper pipes (3) are fixedly arranged on a plurality of heat dissipation fins (2); and
the heat conduction base (4) is fixedly arranged at the bottom among the plurality of U-shaped heat dissipation copper pipes (3);
still include the buckle structure, the buckle structure includes:
the U-shaped locking plates (7) are arranged, and the two U-shaped locking plates (7) are symmetrically and fixedly arranged on two opposite sides of the upper surface of the main board (5);
install the treater between upper surface and being located two U type hasp boards (7) of mainboard (5), heat conduction base (4) can the joint install between two U type hasp boards (7), and after heat conduction base (4) joint is installed between two U type hasp boards (7), the lower surface of heat conduction base (4) can laminate mutually with the upper surface of treater, just be provided with on heat conduction base (4) be used for with it with the fixed closure board (8) of treater laminating on mainboard (5), the both ends of closure board (8) are connected with two U type hasp boards (7) detachable respectively.
2. A novel inclined radiator according to claim 1, wherein: the upper surface of the processor is coated with a heat-conducting silicone grease coating, and when the lower surface of the heat-conducting base (4) is attached to the upper surface of the processor, the heat-conducting silicone grease is positioned between the heat-conducting base (4) and the processor.
3. A novel inclined radiator according to claim 2, wherein: the locking plate (8) is a metal piece, and a plurality of fixing holes are formed in the locking plate (8), so that the novel inclined radiator in claim 1 can be quickly installed through locking bolts (9) at two ends of the locking plate (8).
4. A novel inclined radiator according to claim 3, wherein: locking bolts (9) are arranged at two ends of the locking plate (8), and the locking plate (8) and the two U-shaped locking plates (7) can be fastened and connected through the two locking bolts (9).
5. A novel inclined radiator according to claim 1, wherein: the lower surface of the main board (5) is fixedly provided with a mounting backboard (6) which can be attached to the main board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321338236.7U CN220252526U (en) | 2023-05-30 | 2023-05-30 | Novel inclined radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321338236.7U CN220252526U (en) | 2023-05-30 | 2023-05-30 | Novel inclined radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220252526U true CN220252526U (en) | 2023-12-26 |
Family
ID=89229122
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321338236.7U Active CN220252526U (en) | 2023-05-30 | 2023-05-30 | Novel inclined radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220252526U (en) |
-
2023
- 2023-05-30 CN CN202321338236.7U patent/CN220252526U/en active Active
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