CN213024289U - Heat radiation module suitable for computer CPU - Google Patents
Heat radiation module suitable for computer CPU Download PDFInfo
- Publication number
- CN213024289U CN213024289U CN202021819624.3U CN202021819624U CN213024289U CN 213024289 U CN213024289 U CN 213024289U CN 202021819624 U CN202021819624 U CN 202021819624U CN 213024289 U CN213024289 U CN 213024289U
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- China
- Prior art keywords
- heat dissipation
- baffle
- computer cpu
- template
- groove
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- Expired - Fee Related
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- 230000005855 radiation Effects 0.000 title description 2
- 230000017525 heat dissipation Effects 0.000 claims abstract description 69
- 239000012634 fragment Substances 0.000 claims abstract description 4
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 3
- YCKOAAUKSGOOJH-UHFFFAOYSA-N copper silver Chemical compound [Cu].[Ag].[Ag] YCKOAAUKSGOOJH-UHFFFAOYSA-N 0.000 claims description 3
- 238000009434 installation Methods 0.000 abstract description 12
- 239000006185 dispersion Substances 0.000 abstract description 6
- 238000001816 cooling Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 6
- 230000009471 action Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a microcomputer spare part technical field just discloses a heat dissipation module suitable for computer CPU, including the heat dissipation template, the mounting groove has been seted up in the front of heat dissipation template. This heat dissipation module suitable for computer CPU, through setting up the radiating template, the conducting strip group, radiating fin and fan, at computer CPU during operation, at the radiating template, the cooperation heat dissipation of conducting strip group and radiating fin, the fan also can carry out the heat dissipation cooling to computer CPU simultaneously, through setting up the spout, the slider, the baffle, the fixed block, recess and spliced pole, upward shift up the baffle, when the spliced pole shifts out the recess, the rotating baffle just can put into the mounting groove with computer CPU, move the spliced pole into the recess again, promote the baffle downwards, make the shell fragment fully contact with computer CPU, thereby complete installation dismantlement, through setting up the shape of falling T draw-in groove, it can align with the draw-in groove to put into the mounting groove with computer CPU, thereby the misloading has been prevented, heat dispersion is poor, be not convenient for the installation.
Description
Technical Field
The utility model relates to a microcomputer spare part technical field specifically is a heat dissipation module suitable for computer CPU.
Background
The heat dissipation module is a module unit applied to systems, devices, equipment and other heat dissipation purposes, and now the heat dissipation device specially designed for notebook computers is used, and the heat dissipation device of desktop computers, projectors and the like using heat pipes is expanded and named afterwards.
The heat dissipation module is used for solving the problems that the existing heat dissipation module suitable for the computer CPU has poor heat dissipation performance, so that the computer CPU cannot dissipate heat in time, the use performance of the computer CPU is influenced, the existing heat dissipation module suitable for the computer CPU is inconvenient to install the computer CPU, is not attached to an installation structure, and can generate the condition of wrong installation, and the heat dissipation module suitable for the computer CPU is inconvenient to use.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
Not enough to prior art, the utility model provides a heat dissipation module suitable for computer CPU possesses the advantage that heat dispersion is good, be convenient for install, prevent the misloading, has solved the problem that heat dispersion is poor, be not convenient for install, misloading.
(II) technical scheme
For the purpose that realizes that above-mentioned heat dispersion is good, be convenient for the installation, prevent the misloading, the utility model provides a following technical scheme: a heat dissipation module suitable for a computer CPU comprises a heat dissipation template, wherein the front surface of the heat dissipation template is provided with a mounting groove, the front surface of the heat dissipation template is provided with a clamping groove communicated with the mounting groove, the left side and the right side of the inner wall of the mounting groove are fixedly provided with fixed blocks, the inside of each fixed block is provided with a groove, the back surface of the heat dissipation template is fixedly provided with a heat conducting sheet set, the back surface of the heat conducting sheet set is fixedly provided with heat dissipation fins, the back surface of the heat dissipation template is fixedly provided with a support at the bottom of the heat conducting sheet set, the top of the support is fixedly provided with a support rod, the top of the support rod is fixedly provided with a fan, the inside of the heat dissipation template is provided with chutes communicated with the mounting groove at the, the front of baffle has seted up the louvre, the back of baffle and the outside fixed mounting that is located the louvre have the shell fragment.
Preferably, the baffle passes through spliced pole and recess sliding connection, the front of baffle and the top fixed mounting that is located the louvre have the piece of drawing, and draw the positive fixedly connected with antiskid line of piece.
Preferably, the clamping groove is in an inverted T shape, the baffle is fixedly connected with the elastic sheet through the abutting block, and the elastic sheet is in an arc shape.
Preferably, the slider is rotatably connected with the baffle through a support, and the area of the heat dissipation hole is far larger than that of the clamping groove.
Preferably, the number of the support rods is two, and the two support rods are symmetrically and uniformly distributed at the top of the support.
Preferably, the heat dissipation template, the heat conducting plate group and the heat dissipation fins are all made of copper-silver alloy.
(III) advantageous effects
Compared with the prior art, the utility model provides a heat dissipation module suitable for computer CPU possesses following beneficial effect:
this heat dissipation module suitable for computer CPU, through setting up the radiating template, the conducting strip group, radiating fin and fan, at computer CPU during operation, at the radiating template, the cooperation heat dissipation of conducting strip group and radiating fin, the fan also can carry out the heat dissipation cooling to computer CPU simultaneously, through setting up the spout, the slider, the baffle, the fixed block, recess and spliced pole, upward shift up the baffle, when the spliced pole shifts out the recess, the rotating baffle just can put into the mounting groove with computer CPU, move the spliced pole into the recess again, promote the baffle downwards, make the shell fragment fully contact with computer CPU, thereby complete installation dismantlement, through setting up the shape of falling T draw-in groove, it can align with the draw-in groove to put into the mounting groove with computer CPU, thereby the misloading has been prevented, heat dispersion is poor, be not convenient for the installation.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the back side of the structure of the present invention;
FIG. 3 is a schematic view of the back side of the baffle of the present invention;
fig. 4 is a schematic side view of the structure spring of the present invention.
In the figure: the heat dissipation structure comprises a heat dissipation template 1, heat dissipation holes 2, a baffle 3, a clamping groove 4, a mounting groove 5, a sliding block 6, a sliding groove 7, heat dissipation fins 8, a fixing block 9, a groove 10, a fan 11, a support rod 12, a support 13, a heat conduction plate group 14 and a spring plate 15.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, a heat dissipation module suitable for a computer CPU includes a heat dissipation template 1, wherein the heat dissipation template 1, a heat conduction plate group 14 and heat dissipation fins 8 are made of copper-silver alloy, the front surface of the heat dissipation template 1 is provided with an installation groove 5, the front surface of the heat dissipation template 1 is provided with a clamping groove 4 communicated with the installation groove 5, the clamping groove 4 is in an inverted T shape, a baffle 3 is fixedly connected with an elastic sheet 15 through a supporting block, the elastic sheet 15 is in an arc shape, fixing blocks 9 are fixedly installed on the left side and the right side of the inner wall of the installation groove 5, a groove 10 is formed inside the fixing block 9, the back surface of the heat dissipation template 1 is fixedly provided with the heat conduction plate group 14, the back surface of the heat conduction plate group 14 is fixedly provided with the heat dissipation fins 8, the back surface of the heat dissipation template, and two bracing pieces 12 symmetry evenly distributed are at the top of support 13, the top fixed mounting of bracing piece 12 has fan 11, the inside of radiator mould board 1 and the left and right sides that is located mounting groove 5 all set up the spout 7 that is linked together with mounting groove 5, the inner wall sliding connection of spout 7 has slider 6, slider 6 rotates with baffle 3 through the pillar to be connected, the area of louvre 2 is far greater than the area of draw-in groove 4, the right side of slider 6 rotates and is connected with baffle 3, baffle 3 passes through spliced pole and recess 10 sliding connection, the front of baffle 3 and the top fixed mounting that is located louvre 2 have the piece of drawing, and draw the positive fixedly connected with anti-skidding line of piece, louvre 2 has been seted up in the front of baffle 3, the back of baffle 3 and the outside fixed mounting.
In summary, the heat dissipation module for computer CPU is provided with the heat dissipation template 1, the heat conduction plate group 14, the heat dissipation fins 8 and the fan 11, when the CPU of the computer works, the heat dissipation template 1, the heat conduction plate group 14 and the heat dissipation fins 8 are matched for heat dissipation, meanwhile, the fan 11 can also carry out heat dissipation and temperature reduction on the computer CPU, the baffle 3 is moved upwards by arranging the sliding chute 7, the sliding block 6, the baffle 3, the fixed block 9, the groove 10 and the connecting column, when the connecting column moves out of the groove 10, the baffle 3 is rotated to place the computer CPU into the mounting groove 5, then the connecting column moves into the groove 10, the baffle 3 is pushed downwards, so that the elastic sheet 15 can be fully contacted with the computer CPU, thereby complete installation is dismantled, through setting up the shape of falling T draw-in groove 4, puts into mounting groove 5 with computer CPU and can align with draw-in groove 4 to prevent the misloading, solved the problem that heat dispersion is poor, be not convenient for installation, misloading.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a heat dissipation module suitable for computer CPU, includes heat dissipation template (1), its characterized in that: the heat dissipation die plate comprises a heat dissipation die plate (1), wherein a mounting groove (5) is formed in the front of the heat dissipation die plate (1), a clamping groove (4) communicated with the mounting groove (5) is formed in the front of the heat dissipation die plate (1), fixed blocks (9) are fixedly mounted on the left side and the right side of the inner wall of the mounting groove (5), a groove (10) is formed in the fixed blocks (9), a heat conducting plate group (14) is fixedly mounted on the back of the heat dissipation die plate (1), heat dissipation fins (8) are fixedly mounted on the back of the heat conducting plate group (14), a support (13) is fixedly mounted on the back of the heat dissipation die plate (1) and located at the bottom of the heat conducting plate group (14), a support rod (12) is fixedly mounted at the top of the support rod (13), a fan (11) is fixedly mounted at the top of the support rod (12), and sliding, the inner wall sliding connection of spout (7) has slider (6), the right side of slider (6) is rotated and is connected with baffle (3), louvre (2) have been seted up in the front of baffle (3), the back of baffle (3) just is located the outside fixed mounting of louvre (2) and has shell fragment (15).
2. The heat dissipation module of claim 1, wherein: baffle (3) are through spliced pole and recess (10) sliding connection, the front of baffle (3) and the top fixed mounting who is located louvre (2) have the piece of drawing, and draw the positive fixedly connected with antiskid line of piece.
3. The heat dissipation module of claim 1, wherein: the clamping groove (4) is inverted T-shaped, the baffle (3) is fixedly connected with the elastic sheet (15) through the abutting block, and the elastic sheet (15) is arc-shaped.
4. The heat dissipation module of claim 1, wherein: the sliding block (6) is rotatably connected with the baffle (3) through the support, and the area of the heat dissipation hole (2) is far larger than that of the clamping groove (4).
5. The heat dissipation module of claim 1, wherein: the number of the support rods (12) is two, and the two support rods (12) are symmetrically and uniformly distributed at the top of the support (13).
6. The heat dissipation module of claim 1, wherein: the heat dissipation template (1), the heat conducting plate group (14) and the heat dissipation fins (8) are all made of copper-silver alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021819624.3U CN213024289U (en) | 2020-08-25 | 2020-08-25 | Heat radiation module suitable for computer CPU |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021819624.3U CN213024289U (en) | 2020-08-25 | 2020-08-25 | Heat radiation module suitable for computer CPU |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213024289U true CN213024289U (en) | 2021-04-20 |
Family
ID=75470948
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021819624.3U Expired - Fee Related CN213024289U (en) | 2020-08-25 | 2020-08-25 | Heat radiation module suitable for computer CPU |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213024289U (en) |
-
2020
- 2020-08-25 CN CN202021819624.3U patent/CN213024289U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210420 |