CN209930719U - Sealing assembly for sealing circuit board - Google Patents
Sealing assembly for sealing circuit board Download PDFInfo
- Publication number
- CN209930719U CN209930719U CN201920225592.5U CN201920225592U CN209930719U CN 209930719 U CN209930719 U CN 209930719U CN 201920225592 U CN201920225592 U CN 201920225592U CN 209930719 U CN209930719 U CN 209930719U
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- circuit board
- storage tank
- bottom shell
- liquid storage
- sealing
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Abstract
The utility model relates to a sealing component for sealing a circuit board, which comprises a bottom shell fixed with the circuit board and an upper cover matched with the bottom shell and tightly covered; the circuit board is positioned inside the bottom shell; a first enclosure which corresponds to the circuit board and extends into the inner space of the bottom shell extends downwards from the lower surface of the upper cover; the horizontal height of the lower end part of the first enclosure is not higher than that of the circuit board; the circuit board is connected with a power line; a first wire passing through groove is formed in the side edge of the bottom shell; a first overflow liquid storage tank which is communicated with the first thread through groove and stores the discharged glue is arranged in the upper surface of the bottom shell; the first overflow liquid storage tank is a blind tank, and the height of the bottom of the first overflow liquid storage tank is lower than that of the bottom of the first wire passing through tank; a partition plate for partitioning the inner space of the first overflow liquid storage tank into a front storage tank and a rear storage tank is arranged in the first overflow liquid storage tank; the height of the partition plate is less than the depth of the first overflow liquid storage tank; the sealing assembly has the advantages of small glue injection amount, economy, environmental protection, good leakage-proof effect and the like.
Description
Technical Field
The utility model relates to a circuit board technical field, more specifically say, relate to a seal assembly for circuit board is sealed.
Background
A circuit board is an important electronic component on which a number of electronic components are carried. In order to ensure that the circuit board always has good working performance, as shown in fig. 9, a large amount of glue is often poured into the bottom case 11 to wrap the circuit board 10 with the glue, so as to create a sealed environment, and prevent external moisture from entering the circuit board and further affecting sensitive circuits and electronic components. However, in such a waterproof manner, the amount of glue used is large, and the application range is not wide enough, for example, the waterproof manner is not suitable for a circuit board (such as a circuit board with electronic components such as an indicator light, a communication circuit, an antenna, a microwave induction circuit, an infrared induction head, and the like) which cannot be filled with glue. Therefore, there is still a need for further improvement of the assembling mechanism to solve the above-mentioned disadvantages.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the present invention is to provide a sealing assembly for circuit board sealing and a circuit board sealing method, which are directed to the above-mentioned defects of the prior art.
The utility model provides a technical scheme that its technical problem adopted is:
in one aspect, a sealing assembly for sealing a circuit board is constructed, and comprises a bottom shell fixed with the circuit board and an upper cover matched and tightly covered with the bottom shell; the circuit board is positioned inside the bottom shell; a first enclosure which corresponds to the circuit board and extends into the inner space of the bottom shell extends downwards from the lower surface of the upper cover; the horizontal height of the lower end part of the first enclosure is not higher than that of the circuit board; the circuit board is connected with a power line for connecting with an external power supply; a first wire passing through groove communicated with the inner space of the bottom shell and used for the power wire to pass through is formed in the side edge of the bottom shell;
a first overflow liquid storage tank which is communicated with the first thread through groove and stores the discharged glue is arranged in the upper surface of the bottom shell; the first overflow liquid storage tank is a blind tank, and the height of the bottom of the first overflow liquid storage tank is lower than that of the bottom of the first wire passing through tank; a partition plate for partitioning the inner space of the first overflow liquid storage tank into a front storage tank and a rear storage tank is arranged in the first overflow liquid storage tank; the front storage tank and the rear storage tank are not communicated; the height of the partition plate is smaller than the depth of the first overflow liquid storage tank.
Preferably, along the penetrating direction of the power cord penetrating out of the bottom shell, the first overflow liquid storage tank and a second overflow liquid storage tank which is positioned right below the first wire passing through groove and communicated with the first wire passing through groove are arranged in the upper surface of the bottom shell; the second overflow liquid storage tank is a blind tank; the front storage tank and the rear storage tank are not communicated with the second overflow liquid storage tank.
Preferably, the first overflow liquid storage tank is in an inverted U shape; the back holding vessel is provided with two, and distributes in second overflow liquid holding vessel both sides.
Preferably, a supporting column for supporting the circuit board extends upwards from the inner bottom surface of the bottom shell; the supporting column is fixed with the circuit board; the horizontal height of the lower end of the first enclosure is lower than that of the circuit board.
Preferably, a C-shaped second enclosure is arranged in the bottom shell; the second enclosure divides the inner space of the bottom shell into an inner glue injection area and an outer overflow area; the supporting column and the circuit board are positioned in the glue injection area; the first enclosure extends into the glue injection area; the horizontal height of the upper end of the second enclosure is lower than the horizontal height of the upper surface of the bottom shell.
Preferably, the first wire passing through groove is communicated with the upper surface of the bottom shell; the upper cover is provided with a second wire passing through groove corresponding to the power line.
Preferably, the two sides of the upper cover are both provided with buckles; and a clamping groove corresponding to the buckle is formed in the outer surface of the bottom shell.
Preferably, an avoiding groove for avoiding the power line is arranged on the side edge of the first enclosure; the bottom shell is rectangular, and studs extend upwards from four corners inside the bottom shell; the stud is provided with a first screw hole for mounting a screw; the upper cover is provided with a second screw hole corresponding to the first screw hole.
Preferably, the upper cover is made of transparent material or light-transmitting material and is provided with a third screw hole for fixedly connecting with external equipment.
In another aspect, a circuit board sealing method is provided, based on the above sealing assembly for circuit board sealing, including:
the method comprises the following steps: the power line and the bottom shell are assembled through the first wire through groove;
step two: fixing a circuit board in the bottom shell;
step three: injecting glue into the bottom shell until the liquid level height of the glue in the bottom shell is not lower than the horizontal height of the lower end part of the first enclosure when the bottom shell and the upper cover are closed;
step four: and after the glue injection is finished, the upper cover and the bottom shell are covered, so that the circuit board sealing work is finished.
The beneficial effects of the utility model reside in that: on one hand, compared with the prior art that glue is continuously injected until the circuit board is completely soaked in the glue, the design has the advantages of small glue injection amount, economy and environmental protection, specifically, after glue is injected into the bottom shell, the glue liquid level in the bottom shell can continuously rise, when the glue liquid level is not lower than the horizontal height of the lower end part of the first enclosure when the bottom shell and the upper cover are closed, the glue injection can be stopped, and after the upper cover is closed, the circuit board is covered by the first enclosure, so that the circuit board is located in a sealing space formed by the first enclosure and the glue together, the sealing effect is good, and the glue injection amount is small; on the other hand, as the electronic components on the circuit board can not be covered by the glue in the whole glue injection process, the influence on the electronic components is small, so that the design is suitable for various types of circuit boards and has good applicability; on the other hand, because there is the clearance between power cord and the first line logical groove of crossing, consequently glue still can be followed this clearance and outwards overflowed, can store the glue of outside overflow through setting up first overflow liquid hold up tank, the leak protection is effectual, furthermore, realize the buffering speed reduction under sheltering from of baffle behind the glue inflow preceding hold up tank of overflow, and preceding hold up the full back glue of back just can cross the baffle and flow in back hold up tank, consequently compare with the reservoir that does not set up the baffle, the leak protection effect of the first overflow liquid hold up tank of this design is better.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the present invention will be further described below with reference to the accompanying drawings and embodiments, wherein the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained without inventive work according to the drawings:
fig. 1 is a schematic structural diagram of a sealing assembly for sealing a circuit board according to a preferred embodiment of the present invention;
fig. 2 is an exploded view of a seal assembly for circuit board sealing in accordance with a preferred embodiment of the present invention;
fig. 3 is an internal structure view (the dotted line indicates glue) of a sealing assembly for circuit board sealing according to a preferred embodiment of the present invention;
fig. 4 is a schematic structural diagram of an upper cover of a sealing assembly for sealing a circuit board according to a preferred embodiment of the present invention;
fig. 5 is a top view of a bottom housing of a sealing assembly for sealing a circuit board according to a preferred embodiment of the present invention;
FIG. 6 is a schematic diagram of a prior art stock solution process;
fig. 7 is a schematic diagram illustrating a liquid storage process of a sealing assembly for sealing a circuit board according to a preferred embodiment of the present invention;
fig. 8 is a flowchart illustrating a method for sealing a circuit board according to a preferred embodiment of the present invention;
fig. 9 is a prior art seal assembly.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, a clear and complete description will be given below with reference to the technical solutions of the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
A sealing assembly for sealing a circuit board according to a preferred embodiment of the present invention is shown in fig. 1, with reference to fig. 2 to 9; comprises a bottom shell 11 fixed with the circuit board 10 and an upper cover 12 tightly matched with the bottom shell 11; the circuit board 10 is located inside the bottom case 11; a first enclosure 13 corresponding to the circuit board 10 and extending into the inner space of the bottom case 11 extends downwards from the lower surface of the upper cover 12; the lower end of the first enclosure 13 has a horizontal height not higher than that of the circuit board 10; the circuit board 10 is connected with a power line 14 for connecting with an external power supply; a first wire passing through groove 180 communicated with the inner space of the bottom shell 11 and used for a power wire 14 to pass through is formed in the side edge of the bottom shell 11;
a first overflow liquid storage tank 181 which is communicated with the first through-line groove 180 and stores the discharged glue is arranged in the upper surface of the bottom shell 11; the first overflow liquid storage tank 181 is a blind tank, and the height of the tank bottom is lower than that of the first through line-passing tank 180; a partition plate 15 for partitioning the inner space of the first overflow liquid storage tank 181 into a front storage tank 182 and a rear storage tank 183 is arranged in the first overflow liquid storage tank 181; the front reservoir tank 182 and the rear reservoir tank 183 are not communicated; the height of the partition plate 15 is smaller than the depth of the first overflow liquid storage tank 181, on one hand, compared with the prior art that glue is continuously injected until the circuit board 10 is completely soaked in the glue, the design has the advantages of small glue injection amount, economy and environmental protection, specifically, after the glue is injected into the bottom shell 11, the glue liquid level in the bottom shell 11 can continuously rise, when the glue liquid level is not lower than the horizontal height of the lower end part of the first enclosure 13 when the bottom shell 11 and the upper cover 12 are covered, the glue injection can be stopped, after the upper cover 12 is covered, the first enclosure 13 covers the circuit board 10, so that the circuit board 10 is located in a sealed space formed by the first enclosure 13 and the glue together, the sealing effect is good, and the glue injection amount is small; on the other hand, since the electronic components on the circuit board 10 are not covered by the glue in the whole glue injection process, the influence on the electronic components is small, so that the design is suitable for various types of circuit boards and has good applicability; on the other hand, because there is the clearance between power cord 14 and the first line through groove 180, therefore glue still can outwards overflow from this clearance, can store the glue that outwards overflows through setting up first overflow liquid storage tank 181, the leak protection is effectual, furthermore, the glue that overflows realizes buffering speed reduction under the sheltering from of baffle 15 after flowing into preceding storage tank 182, and just can cross baffle 15 and flow into back storage tank 183 after preceding storage tank 182 holds full, therefore compare with the reservoir (as shown in fig. 6) that does not set up baffle 15, the stock solution volume of first overflow liquid storage tank 181 of this design (as shown in fig. 7) is bigger, the leak protection effect is better.
As shown in fig. 2 and 5, along the penetrating direction of the power cord 14 penetrating through the bottom case 11, a first overflow liquid storage tank 181 is disposed in the upper surface of the bottom case 11, and a second overflow liquid storage tank 184 is disposed under the first wire passing through groove 180 and communicated therewith, so that most of the overflow liquid can drop down to enter the first overflow liquid storage tank 181, but a small part of the overflow liquid can continuously leak out along the power cord 14, and therefore, the second overflow liquid storage tank 184 is disposed at the rear end to receive the overflow liquid, thereby further enhancing the leakage-proof effect; the second overflow reservoir 184 is a blind reservoir; preceding hold up tank 182 and back hold up tank 183 all do not communicate with second overflow liquid hold up tank 184 for the stock solution work of each hold up tank is independent, can not mutual interference, so that the user adjusts subsequent injecting glue speed and injecting glue volume according to the stock solution condition of each hold up tank.
As shown in fig. 5, the first overflow liquid storage tank 181 is in an inverted U shape; the rear storage tank 183 is provided with two and distributed on two sides of the second overflow liquid storage tank 184, so that the first overflow liquid storage tank 181 has a larger storage capacity.
As shown in fig. 2 and 3, a supporting column 16 for supporting the circuit board 10 extends upward from the inner bottom surface of the bottom case 11; the supporting column 16 is fixed with the circuit board 10; the horizontal height of the lower end of the first enclosure 13 is lower than that of the circuit board, the circuit board 10 is lifted, and meanwhile, the lower end of the first enclosure 13 extends downwards into the glue liquid level, so that the circuit board 10 cannot be contaminated by glue, and the negative influence of glue injection on the working performance of the circuit board 10 is reduced.
As shown in fig. 2 and 3, a C-shaped second enclosure 17 is provided in the bottom case 11; the second enclosure 17 divides the internal space of the bottom case 11 into an inner glue injection area 185 and an outer overflow area 186, so that the space occupied by the glue injection area 185 is reduced, the sealing effect is not affected, the glue injection amount is reduced, and the cost is reduced; the support posts 16 and the circuit board 10 are located in the glue injection area 185; the first enclosure 13 extends into the glue injection zone 185; the level of the upper end of the second enclosure 17 is lower than the level of the upper surface of the bottom shell 11, and when the glue injection area 185 is filled, the glue can flow into the overflow area 186 over the second enclosure 17, so that leakage can not be directly leaked outwards, and the leakage prevention effect is good.
As shown in fig. 2 and 4, first wire passing through groove 180 communicates with the upper surface of bottom case 11; the upper cover 12 is provided with a second wire passing through groove 187 corresponding to the power cord 14.
As shown in fig. 1, 4 and 5, two sides of the upper cover 12 are provided with buckles 18; the outer surface of the bottom shell 11 is provided with a clamping groove 188 corresponding to the buckle 18, and the assembly work of the upper cover 12 and the bottom shell 11 can be completed quickly through the matching of the buckle 18 and the clamping groove 188, and meanwhile, the connection is stable and the cost is low.
As shown in fig. 4 and 5, the side edge of the first enclosure 13 is provided with an avoidance groove 189 which avoids the power cord 14; the bottom shell 11 is rectangular, and studs 19 extend upwards from four corners inside the bottom shell; the stud 19 is provided with a first screw hole for mounting a screw; the upper cover 12 is provided with a second screw hole corresponding to the first screw hole, so that the installation is convenient and the connection is stable.
As shown in fig. 2, the upper cover 12 is made of a transparent material or a light-transmitting material, and is provided with a third screw hole 1810 for fixedly connecting with an external device, so that before the upper cover 12 is finally determined to be covered, the condition that the first enclosure 13 is immersed in the glue can be observed through the upper cover 12, and the glue injection amount can be adjusted in time.
The present invention provides a circuit board sealing method, based on the above sealing assembly for circuit board sealing, as shown in fig. 8, including:
step S101: the assembly of the power line and the bottom shell is completed through the first wire passing through groove.
Step S102: the circuit board is fixed in the bottom shell.
Step S103: and injecting glue into the bottom shell until the liquid level height of the glue in the bottom shell is not lower than the horizontal height of the lower end part of the first enclosure when the bottom shell and the upper cover are covered.
Step S104: and after the glue injection is finished, the upper cover and the bottom shell are covered, so that the circuit board sealing work is finished.
It will be understood that modifications and variations can be made by persons skilled in the art in light of the above teachings and all such modifications and variations are considered to be within the scope of the invention as defined by the following claims.
Claims (9)
1. A sealing assembly for sealing a circuit board comprises a bottom shell fixed with the circuit board and an upper cover matched and tightly covered with the bottom shell; the circuit board is positioned inside the bottom shell; the lower surface of the upper cover extends downwards to form a first enclosure which corresponds to the circuit board and extends into the inner space of the bottom shell; the horizontal height of the lower end part of the first enclosure is not higher than that of the circuit board; the circuit board is connected with a power line for connecting with an external power supply; a first wire passing through groove communicated with the inner space of the bottom shell and used for the power wire to pass through is formed in the side edge of the bottom shell;
a first overflow liquid storage tank which is communicated with the first thread through groove and stores the discharged glue is arranged in the upper surface of the bottom shell; the first overflow liquid storage tank is a blind tank, and the height of the bottom of the first overflow liquid storage tank is lower than that of the bottom of the first wire passing through tank; a partition plate for partitioning the inner space of the first overflow liquid storage tank into a front storage tank and a rear storage tank is arranged in the first overflow liquid storage tank; the front storage tank and the rear storage tank are not communicated; the height of the partition plate is smaller than the depth of the first overflow liquid storage tank.
2. The sealing assembly for sealing the circuit board according to claim 1, wherein along a direction in which the power cord penetrates out of the bottom case, the upper surface of the bottom case is provided with the first overflow liquid storage tank and a second overflow liquid storage tank located right below the first wire through groove and communicated therewith; the second overflow liquid storage tank is a blind tank; the front storage tank and the rear storage tank are not communicated with the second overflow liquid storage tank.
3. The seal assembly for circuit board sealing of claim 2, wherein said first overflow reservoir is inverted U-shaped; the back holding vessel is provided with two, and distributes in second overflow liquid holding vessel both sides.
4. The sealing assembly for circuit board sealing according to claim 1, wherein a support post for supporting the circuit board extends upward from an inner bottom surface of the bottom case; the supporting column is fixed with the circuit board; the horizontal height of the lower end of the first enclosure is lower than that of the circuit board.
5. The seal assembly for circuit board sealing of claim 4, wherein a C-shaped second enclosure is disposed within said bottom shell; the second enclosure divides the inner space of the bottom shell into an inner glue injection area and an outer overflow area; the supporting column and the circuit board are positioned in the glue injection area; the first enclosure extends into the glue injection area; the horizontal height of the upper end of the second enclosure is lower than the horizontal height of the upper surface of the bottom shell.
6. The seal assembly for a circuit board seal of claim 1, wherein said first wire-passing channel is in communication with an upper surface of said bottom shell; the upper cover is provided with a second wire passing through groove corresponding to the power line.
7. The seal assembly for circuit board sealing of claim 1, wherein said upper cover is provided with a snap on both sides; and a clamping groove corresponding to the buckle is formed in the outer surface of the bottom shell.
8. The sealing assembly for circuit board sealing according to claim 1, wherein the side of the first enclosure is provided with an avoidance groove for avoiding the power supply line; the bottom shell is rectangular, and studs extend upwards from four corners inside the bottom shell; the stud is provided with a first screw hole for mounting a screw; the upper cover is provided with a second screw hole corresponding to the first screw hole.
9. The sealing assembly for circuit board sealing according to claim 1, wherein the upper cover is made of transparent material or light-transmitting material and is provided with a third screw hole for fixedly connecting with an external device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920225592.5U CN209930719U (en) | 2019-02-22 | 2019-02-22 | Sealing assembly for sealing circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920225592.5U CN209930719U (en) | 2019-02-22 | 2019-02-22 | Sealing assembly for sealing circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209930719U true CN209930719U (en) | 2020-01-10 |
Family
ID=69068360
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920225592.5U Withdrawn - After Issue CN209930719U (en) | 2019-02-22 | 2019-02-22 | Sealing assembly for sealing circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209930719U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109769364A (en) * | 2019-02-22 | 2019-05-17 | 深圳源创智能照明有限公司 | A kind of seal assembly and method for circuit board sealing |
-
2019
- 2019-02-22 CN CN201920225592.5U patent/CN209930719U/en not_active Withdrawn - After Issue
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109769364A (en) * | 2019-02-22 | 2019-05-17 | 深圳源创智能照明有限公司 | A kind of seal assembly and method for circuit board sealing |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210220 Address after: 518000 Wutong street, Baoan District, Shenzhen, Guangdong, China. The 5 floor of 13A building, Taihua Indus Industrial Park Patentee after: Shenzhen Yuanyuan Intelligent Lighting Co.,Ltd. Address before: 518000 13A, 6-7F, Taihua Wutong Industrial Park, Baoan District Xixiang street, Shenzhen, Guangdong Patentee before: SOCREAT ELECTRONICS TECHNOLOGY Ltd. |
|
| TR01 | Transfer of patent right | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20200110 Effective date of abandoning: 20230530 |
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| AV01 | Patent right actively abandoned |
Granted publication date: 20200110 Effective date of abandoning: 20230530 |
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| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |