CN109769364B - Sealing assembly and method for sealing circuit board - Google Patents
Sealing assembly and method for sealing circuit board Download PDFInfo
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- CN109769364B CN109769364B CN201910133539.7A CN201910133539A CN109769364B CN 109769364 B CN109769364 B CN 109769364B CN 201910133539 A CN201910133539 A CN 201910133539A CN 109769364 B CN109769364 B CN 109769364B
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- circuit board
- storage tank
- bottom shell
- sealing
- liquid storage
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Abstract
The invention relates to a sealing component for sealing a circuit board, which comprises a bottom shell fixed with the circuit board and an upper cover matched with the bottom shell for tightly covering; the circuit board is positioned in the bottom shell; the lower surface of the upper cover downwards extends to form a first enclosure which corresponds to the circuit board and extends into the inner space of the bottom shell; the horizontal height of the lower end part of the first enclosure is not higher than that of the circuit board; the circuit board is connected with a power line; a first wire passing through groove is formed in the side edge of the bottom shell; a first overflow liquid storage tank communicated with the first line through tank and used for storing the glue discharged by the first line through tank is arranged in the upper surface of the bottom shell; the first overflow liquid storage tank is a blind tank, and the height of the tank bottom is lower than that of the first line passing through tank; a partition board for partitioning the internal space of the first overflow liquid storage tank into a front storage tank and a rear storage tank is arranged in the first overflow liquid storage tank; the height of the partition plate is smaller than the depth of the first overflow liquid storage tank; the sealing assembly has the advantages of small glue injection amount, economy, environmental protection, good leakage prevention effect and the like.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a sealing assembly and a sealing method for sealing a circuit board.
Background
A circuit board is an important electronic component on which many electronic components are carried. In order to ensure good working performance of the circuit board all the time, as shown in fig. 9, a large amount of glue is often poured into the bottom shell 11 to wrap the circuit board 10 with the glue, thereby creating a sealed environment to avoid external moisture entering the circuit board to affect sensitive circuits and electronic components. However, such a waterproof method has a large usage amount of glue, and is not suitable for a wide range of applications, such as a circuit board (e.g., a circuit board with electronic components such as an indicator light, a communication, an antenna, microwave induction, and an infrared induction head) that cannot be filled with glue. Accordingly, there remains a need for further improvements in the assembly mechanisms to address the above-described deficiencies.
Disclosure of Invention
The technical problem to be solved by the present invention is to provide a sealing assembly for sealing a circuit board and a sealing method for a circuit board, aiming at the above-mentioned defects of the prior art.
The technical scheme adopted for solving the technical problems is as follows:
in one aspect, a seal assembly for sealing a circuit board is configured, comprising a bottom shell fixed with the circuit board, and an upper cover matched with the bottom shell for tightly covering; the circuit board is positioned in the bottom shell; the first enclosure cover which corresponds to the circuit board and extends into the inner space of the bottom shell extends downwards from the lower surface of the upper cover; the horizontal height of the lower end part of the first enclosure is not higher than that of the circuit board; the circuit board is connected with a power line for connecting with an external power supply; a first wire passing through groove which is communicated with the inner space of the bottom shell and is used for the power wire to pass through is formed in the side edge of the bottom shell;
a first overflow liquid storage tank communicated with the first line through tank and used for storing the glue discharged by the first line through tank is arranged in the upper surface of the bottom shell; the first overflow liquid storage tank is a blind tank, and the height of the tank bottom is lower than that of the first line passing through tank; a partition board for partitioning the internal space of the first overflow liquid storage tank into a front storage tank and a rear storage tank is arranged in the first overflow liquid storage tank; the front storage tank is not communicated with the rear storage tank; the height of the partition plate is smaller than the depth of the first overflow liquid storage tank.
Preferably, the first overflow liquid storage tank and the second overflow liquid storage tank which are positioned right below the first wire passing through tank and communicated with the first wire passing through tank are arranged in the upper surface of the bottom shell along the penetrating-out direction of the power wire penetrating out of the bottom shell; the second overflow liquid storage tank is a blind tank; the front storage tank and the rear storage tank are not communicated with the second overflow liquid storage tank.
Preferably, the first overflow liquid storage tank is in an inverted U shape; the two rear storage tanks are arranged and distributed on two sides of the second overflow liquid storage tank.
Preferably, the inner bottom surface of the bottom shell extends upwards to form a supporting column for supporting the circuit board; the support column is fixed with the circuit board; the horizontal height of the lower end part of the first enclosure is lower than that of the circuit board.
Preferably, a C-shaped second enclosure is arranged in the bottom shell; the second enclosure divides the inner space of the bottom shell into an inner glue injection area and an outer overflow area; the support columns and the circuit board are positioned in the glue injection area; the first enclosure extends into the glue injection area; the upper end of the second enclosure is lower than the upper surface of the bottom shell.
Preferably, the first wire passing through groove is communicated with the upper surface of the bottom shell; the upper cover is provided with a second wire passing through groove corresponding to the power wire.
Preferably, the two sides of the upper cover are provided with buckles; the outer surface of the bottom shell is provided with a clamping groove corresponding to the buckle.
Preferably, an avoidance groove for avoiding the power line is formed in the side edge of the first enclosure; the bottom shell is rectangular, and studs extend upwards from four corners of the inside; the stud is provided with a first screw hole for installing a screw; the upper cover is provided with a second screw hole corresponding to the first screw hole.
Preferably, the upper cover is made of transparent material or light-transmitting material, and is provided with a third screw hole for fixedly connecting with external equipment.
In another aspect, a circuit board sealing method is provided, based on the sealing assembly for sealing a circuit board, including:
step one: the assembly of the power line and the bottom shell is completed through the first line passing through groove;
step two: fixing a circuit board in the bottom shell;
step three: injecting glue into the bottom shell until the liquid level of the glue in the bottom shell is not lower than the horizontal height of the lower end part of the first enclosure when the bottom shell and the upper cover are covered;
step four: after the glue injection is completed, the upper cover and the bottom shell are covered, so that the sealing work of the circuit board is completed.
The invention has the beneficial effects that: on the one hand, compared with the traditional continuous glue injection until the circuit board is completely immersed in glue, the design has the advantages of small glue injection amount, economy and environmental protection, specifically, after the glue is injected into the bottom shell, the glue liquid level in the bottom shell continuously rises, when the glue liquid level is not lower than the horizontal height of the lower end part of the first enclosure cover when the bottom shell and the upper cover are covered, the glue injection can be stopped, and after the upper cover is covered, the first enclosure cover covers the circuit board, so that the circuit board is positioned in a sealing space formed by the first enclosure cover and the glue together, the sealing effect is good, and the glue injection amount is small; on the other hand, as the electronic components on the circuit board are not covered by glue in the whole glue injection process, the electronic components are less affected, so that the design is suitable for various types of circuit boards and has good applicability; on the other hand, because there is the clearance between power cord and the first line logical groove that crosses, consequently glue still can follow this clearance outside overflow, can store the glue of outside overflow through setting up first overflow liquid holding vessel, leak protection effect is good, and further, realize buffering speed reduction after the baffle before the overflow glue flows into the holding vessel, and before the holding vessel holds full back glue and can cross the baffle and flow into back holding vessel, consequently compare with the liquid reserve tank that does not set up the baffle, the leak protection effect of the first overflow liquid holding vessel of this design is better.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the present invention will be further described with reference to the accompanying drawings and embodiments, in which the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained by those skilled in the art without inventive effort:
FIG. 1 is a schematic view of a seal assembly for sealing a circuit board according to a preferred embodiment of the present invention;
FIG. 2 is an exploded view of a seal assembly for a circuit board seal in accordance with a preferred embodiment of the present invention;
FIG. 3 is an internal structural view of a sealing assembly for circuit board sealing (with broken line portions referring to glue) according to a preferred embodiment of the present invention;
FIG. 4 is a schematic view showing the structure of an upper cover in a sealing assembly for sealing a circuit board according to a preferred embodiment of the present invention;
FIG. 5 is a top view of a bottom housing of a seal assembly for circuit board sealing in accordance with a preferred embodiment of the present invention;
FIG. 6 is a schematic diagram of a prior art fluid storage process;
FIG. 7 is a schematic illustration of a fluid reservoir process of a seal assembly for circuit board sealing in accordance with a preferred embodiment of the present invention;
FIG. 8 is a flow chart showing a method for sealing a circuit board according to a preferred embodiment of the present invention;
fig. 9 is a prior art seal assembly.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the following description will be made in detail with reference to the technical solutions in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by a person skilled in the art without any inventive effort, are intended to be within the scope of the present invention, based on the embodiments of the present invention.
A sealing assembly for sealing a circuit board according to a preferred embodiment of the present invention is shown in fig. 1, and also referring to fig. 2 to 9; comprises a bottom shell 11 fixed with a circuit board 10 and an upper cover 12 matched and tightly covered with the bottom shell 11; the circuit board 10 is positioned inside the bottom shell 11; the lower surface of the upper cover 12 extends downward to form a first enclosure 13 corresponding to the circuit board 10 and extending into the inner space of the bottom shell 11; the lower end of the first enclosure 13 has a level not higher than that of the circuit board 10; the circuit board 10 is connected with a power line 14 for connecting with an external power supply; the side of the bottom shell 11 is provided with a first wire passing through groove 180 which is communicated with the inner space of the bottom shell and through which the power wire 14 passes;
a first overflow liquid storage tank 181 which is communicated with the first line through groove 180 and stores the glue discharged by the first line through groove 180 is arranged in the upper surface of the bottom shell 11; the first overflow liquid storage tank 181 is a blind tank, and the height of the tank bottom is lower than that of the first line passing through tank 180; a partition 15 for partitioning the inner space of the first overflow liquid storage tank 181 into a front storage tank 182 and a rear storage tank 183 is provided in the first overflow liquid storage tank 181; the front reservoir 182 and the rear reservoir 183 are not in communication; on the one hand, compared with the traditional method of continuously injecting glue until the circuit board 10 is completely immersed in glue, the design has the advantages of small glue injection amount, economy and environmental protection, specifically, after the glue is injected into the bottom shell 11, the glue liquid level in the bottom shell 11 can continuously rise, when the glue liquid level is not lower than the horizontal height of the lower end part of the first enclosure 13 when the bottom shell 11 and the upper cover 12 are covered, the glue injection can be stopped, after the upper cover 12 is covered, the first enclosure 13 covers the circuit board 10, so that the circuit board 10 is positioned in a sealing space formed by the first enclosure 13 and the glue together, the sealing effect is good, and the glue injection amount is small; on the other hand, as the electronic components on the circuit board 10 are not covered by glue in the whole glue injection process, the electronic components are less affected, so that the design is suitable for various types of circuit boards and has good applicability; on the other hand, since there is a gap between the power line 14 and the first line through groove 180, the glue still overflows from the gap, the glue overflowed outwards can be stored by setting the first overflow liquid storage groove 181, the leakage-proof effect is good, further, buffer deceleration is realized under the shielding of the partition plate 15 after the overflowed glue flows into the front storage groove 182, and the glue can flow into the rear storage groove 183 after the front storage groove 182 is fully stored beyond the partition plate 15, so that compared with the liquid storage groove (shown in fig. 6) without the partition plate 15, the liquid storage amount of the first overflow liquid storage groove 181 (shown in fig. 7) of the design is larger, and the leakage-proof effect is better.
As shown in fig. 2 and fig. 5, along the direction in which the power cord 14 passes through the bottom case 11, a first overflow liquid storage tank 181 and a second overflow liquid storage tank 184 are disposed in the upper surface of the bottom case 11 and are located directly below and in communication with the first line through tank 180, most of the overflow liquid will drop down into the first overflow liquid storage tank 181, but a small part will still leak out along the power cord 14, so that the second overflow liquid storage tank 184 is disposed at the rear end to receive the overflow liquid, further enhancing the leakage-proof effect; the second overflow liquid reservoir 184 is a blind tank; the front storage tank 182 and the rear storage tank 183 are not communicated with the second overflow liquid storage tank 184, so that the liquid storage work of each storage tank is independent and cannot interfere with each other, and a user can adjust the subsequent glue injection speed and glue injection amount according to the liquid storage condition of each storage tank.
As shown in fig. 5, the first overflow liquid storage tank 181 has an inverted U shape; the two rear storage tanks 183 are disposed on both sides of the second overflow liquid storage tank 184, so that the first overflow liquid storage tank 181 has a larger liquid storage capacity.
As shown in fig. 2 and 3, the inner bottom surface of the bottom case 11 is upwardly extended with support columns 16 for supporting the circuit board 10; the support column 16 is fixed with the circuit board 10; the horizontal height of the lower end part of the first enclosure 13 is lower than that of the circuit board, the circuit board 10 is lifted, and meanwhile, the lower end part of the first enclosure 13 descends to extend into the glue liquid level, so that the circuit board 10 is not polluted by glue, and the negative influence of glue injection on the working performance of the circuit board 10 is reduced.
As shown in fig. 2 and 3, a C-shaped second enclosure 17 is provided in the bottom case 11; the second enclosure 17 divides the inner space of the bottom shell 11 into an inner glue injection area 185 and an outer overflow area 186, so that the space occupied by the glue injection area 185 is reduced, the sealing effect is not affected, the glue injection amount is reduced, and the cost is reduced; the support posts 16 and the circuit board 10 are located within the glue injection zone 185; the first enclosure 13 extends into the glue injection zone 185; the upper end of the second enclosure 17 has a lower level than the upper surface of the bottom shell 11, and when the glue injection area 185 is full, the glue can flow into the overflow area 186 beyond the second enclosure 17 without leaking out directly, so that the leakage-proof effect is good.
As shown in fig. 2 and 4, the first wire passing through groove 180 communicates with the upper surface of the bottom chassis 11; the upper cover 12 is provided with a second wire passing through groove 187 corresponding to the power wire 14.
As shown in fig. 1, 4 and 5, the two sides of the upper cover 12 are provided with buckles 18; the surface of drain pan 11 is provided with the draw-in groove 188 that corresponds with buckle 18, through the cooperation of buckle 18 and draw-in groove 188, can accomplish the assembly work of upper cover 12 and drain pan 11 fast, connects firmly, with low costs simultaneously.
As shown in fig. 4 and 5, the side of the first enclosure 13 is provided with an escape groove 189 that escapes from the power cord 14; the bottom shell 11 is rectangular, and studs 19 extend upwards at four corners of the interior; the stud 19 is provided with a first screw hole for mounting a screw; the upper cover 12 is provided with a second screw hole corresponding to the first screw hole, so that the installation is convenient, and the connection is stable.
As shown in fig. 2, the upper cover 12 is made of transparent material or light-transmitting material, and is provided with a third screw hole 1810 for fixedly connecting with external equipment, and before the upper cover 12 is finally determined, the condition that the first enclosure 13 is immersed in glue can be observed through the upper cover 12, so that the glue injection amount can be adjusted in time.
The circuit board sealing method according to the preferred embodiment of the present invention, based on the above-mentioned sealing assembly for sealing a circuit board, as shown in fig. 8, includes:
step S101: and the assembly of the power line and the bottom shell is completed through the first line passing through groove.
Step S102: the circuit board is fixed in the bottom shell.
Step S103: injecting glue into the bottom shell until the liquid level of the glue in the bottom shell is not lower than the horizontal height of the lower end part of the first enclosure when the bottom shell and the upper cover are covered.
Step S104: after the glue injection is completed, the upper cover and the bottom shell are covered, so that the sealing work of the circuit board is completed.
It will be understood that modifications and variations will be apparent to those skilled in the art from the foregoing description, and it is intended that all such modifications and variations be included within the scope of the following claims.
Claims (10)
1. A sealing assembly for sealing a circuit board comprises a bottom shell fixed with the circuit board and an upper cover matched with the bottom shell for tightly covering; the circuit board is positioned in the bottom shell; the circuit board is characterized in that the lower surface of the upper cover downwards extends to form a first enclosure which corresponds to the circuit board and extends into the inner space of the bottom shell; the horizontal height of the lower end part of the first enclosure is not higher than that of the circuit board; the circuit board is connected with a power line for connecting with an external power supply; a first wire passing through groove which is communicated with the inner space of the bottom shell and is used for the power wire to pass through is formed in the side edge of the bottom shell;
a first overflow liquid storage tank communicated with the first line through tank and used for storing the glue discharged by the first line through tank is arranged in the upper surface of the bottom shell; the first overflow liquid storage tank is a blind tank, and the height of the tank bottom is lower than that of the first line passing through tank; a partition board for partitioning the internal space of the first overflow liquid storage tank into a front storage tank and a rear storage tank is arranged in the first overflow liquid storage tank; the front storage tank is not communicated with the rear storage tank; the height of the partition plate is smaller than the depth of the first overflow liquid storage tank.
2. The sealing assembly for circuit board sealing according to claim 1, wherein the first overflow liquid storage tank and the second overflow liquid storage tank are provided in the upper surface of the bottom case along the direction in which the power cord passes out of the bottom case, and the second overflow liquid storage tank is located right under and in communication with the first through-cord passage; the second overflow liquid storage tank is a blind tank; the front storage tank and the rear storage tank are not communicated with the second overflow liquid storage tank.
3. The seal assembly for circuit board sealing of claim 2, wherein the first overflow liquid reservoir is inverted U-shaped; the two rear storage tanks are arranged and distributed on two sides of the second overflow liquid storage tank.
4. The sealing assembly for sealing a circuit board according to claim 1, wherein the inner bottom surface of the bottom case is upwardly extended with a support column for supporting the circuit board; the support column is fixed with the circuit board; the horizontal height of the lower end part of the first enclosure is lower than that of the circuit board.
5. The seal assembly for circuit board sealing of claim 4, wherein a second enclosure of C-type is disposed within the bottom housing; the second enclosure divides the inner space of the bottom shell into an inner glue injection area and an outer overflow area; the support columns and the circuit board are positioned in the glue injection area; the first enclosure extends into the glue injection area; the upper end of the second enclosure is lower than the upper surface of the bottom shell.
6. The seal assembly for circuit board sealing of claim 1, wherein the first wire through slot communicates with an upper surface of the bottom case; the upper cover is provided with a second wire passing through groove corresponding to the power wire.
7. The sealing assembly for sealing a circuit board according to claim 1, wherein both sides of the upper cover are provided with a buckle; the outer surface of the bottom shell is provided with a clamping groove corresponding to the buckle.
8. The sealing assembly for circuit board sealing of claim 1, wherein a side edge of the first enclosure is provided with an escape groove that escapes from the power cord; the bottom shell is rectangular, and studs extend upwards from four corners of the inside; the stud is provided with a first screw hole for installing a screw; the upper cover is provided with a second screw hole corresponding to the first screw hole.
9. The sealing assembly for circuit board sealing according to claim 1, wherein the upper cover is made of a transparent material or a light-transmitting material, and is provided with a third screw hole for fixedly connecting with external equipment.
10. A circuit board sealing method, based on the sealing assembly for circuit board sealing according to any one of claims 1 to 9, comprising:
step one: the assembly of the power line and the bottom shell is completed through the first line passing through groove;
step two: fixing a circuit board in the bottom shell;
step three: injecting glue into the bottom shell until the liquid level of the glue in the bottom shell is not lower than the horizontal height of the lower end part of the first enclosure when the bottom shell and the upper cover are covered;
step four: after the glue injection is completed, the upper cover and the bottom shell are covered, so that the sealing work of the circuit board is completed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910133539.7A CN109769364B (en) | 2019-02-22 | 2019-02-22 | Sealing assembly and method for sealing circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910133539.7A CN109769364B (en) | 2019-02-22 | 2019-02-22 | Sealing assembly and method for sealing circuit board |
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| Publication Number | Publication Date |
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| CN109769364A CN109769364A (en) | 2019-05-17 |
| CN109769364B true CN109769364B (en) | 2023-05-30 |
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| CN201910133539.7A Active CN109769364B (en) | 2019-02-22 | 2019-02-22 | Sealing assembly and method for sealing circuit board |
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| CN201435885Y (en) * | 2009-06-03 | 2010-03-31 | 天津市松正电动科技有限公司 | Electric motorcar controller |
| CN201571263U (en) * | 2009-11-03 | 2010-09-01 | 天津市松正电动科技有限公司 | Casing structure of waterproof controller |
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| CN209930719U (en) * | 2019-02-22 | 2020-01-10 | 深圳源创智能照明有限公司 | Sealing assembly for sealing circuit board |
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| CN203038948U (en) * | 2012-11-13 | 2013-07-03 | 海南英利新能源有限公司 | Solar cell junction box |
| CN207382746U (en) * | 2017-09-20 | 2018-05-18 | 辽宁民生智能仪表有限公司 | A kind of electronic module waterproof sealing box with external lead wire and replaceable battery |
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