CN209930738U - Circuit board sealing structure - Google Patents
Circuit board sealing structure Download PDFInfo
- Publication number
- CN209930738U CN209930738U CN201920225069.2U CN201920225069U CN209930738U CN 209930738 U CN209930738 U CN 209930738U CN 201920225069 U CN201920225069 U CN 201920225069U CN 209930738 U CN209930738 U CN 209930738U
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- circuit board
- storage tank
- bottom shell
- sealing structure
- enclosure
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Abstract
The utility model relates to a circuit board sealing structure and a circuit board sealing method, the circuit board sealing structure comprises a bottom shell fixed with a circuit board and an upper cover matched with the bottom shell and tightly covered; the circuit board is positioned inside the bottom shell; the upper cover extends to form an enclosure which corresponds to the circuit board and extends into the inner space of the bottom shell; the horizontal height of the lower end part of the enclosure is not higher than that of the circuit board; the circuit board is provided with a power line; a power line tail clip is sleeved on the power line; a mounting through groove is formed in the side edge of the bottom shell; an overflow liquid storage tank for storing glue discharged from the installation through groove is arranged in the upper surface of the bottom shell; the overflow liquid storage tank comprises a longitudinal sub storage tank A extending downwards from the upper surface of the bottom shell and a sub storage tank B communicated with the side wall of the sub storage tank A and extending towards the installation through groove; the sub storage tank B is positioned below the installation through groove and communicated with the bottom of the installation through groove; the structure has the advantages of small glue injection amount, economy, environmental protection, good leakage-proof effect and the like.
Description
Technical Field
The utility model relates to a circuit board technical field, more specifically say, relate to a circuit board seal structure.
Background
A circuit board is an important electronic component on which a number of electronic components are carried. In order to ensure that the circuit board always has good working performance, as shown in fig. 8, a large amount of glue is often poured into the bottom case 11 to wrap the circuit board 10 with the glue, so as to create a sealed environment, and prevent external moisture from entering the circuit board and further affecting sensitive circuits and electronic components. However, in such a waterproof manner, the amount of glue used is large, and the application range is not wide enough, for example, the waterproof manner is not suitable for a circuit board (such as a circuit board with electronic components such as an indicator light, a communication circuit, an antenna, a microwave induction circuit, an infrared induction head, and the like) which cannot be filled with glue. Therefore, there is still a need for further improvement of the assembling mechanism to solve the above-mentioned disadvantages.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the present invention is to provide a circuit board sealing structure and a circuit board sealing method for the above-mentioned defects of the prior art.
The utility model provides a technical scheme that its technical problem adopted is:
in one aspect, a circuit board sealing structure is constructed, which comprises a bottom shell fixed with a circuit board, and an upper cover matched with the bottom shell and tightly covered with the bottom shell; the circuit board is positioned inside the bottom shell; an enclosure which corresponds to the circuit board and extends into the inner space of the bottom shell extends downwards from the lower surface of the upper cover; the horizontal height of the lower end part of the enclosure is not higher than that of the circuit board; the circuit board is provided with a power line for connecting with an external power supply; a power line tail clip is sleeved on the power line; the side edge of the bottom shell is provided with an installation through groove which is communicated with the inner space of the bottom shell and corresponds to the power line tail card; an overflow liquid storage tank for storing the glue discharged from the mounting through groove is arranged in the upper surface of the bottom shell; the overflow liquid storage tank is a blind tank; the overflow liquid storage tank comprises a longitudinal sub storage tank A extending downwards from the upper surface of the bottom shell and a sub storage tank B communicated with the side wall of the sub storage tank A and extending towards the installation through groove; the sub storage tank B is positioned below the installation through tank and communicated with the bottom of the installation through tank.
Preferably, a supporting column for supporting the circuit board extends upwards from the inner bottom surface of the bottom shell; the supporting column is fixed with the circuit board; the lower end of the enclosure is lower than the circuit board.
Preferably, the circuit board is connected with a plurality of groups of power lines; a plurality of installation through grooves corresponding to the power lines one to one are formed in the side edge of the bottom shell; the overflow liquid storage tanks are not communicated with each other.
Preferably, the circuit board is connected with two groups of power lines; the lower surface of the upper cover is provided with two aligning blocks; the alignment block corresponds to the sub storage tank A and extends into the inner space of the sub storage tank A.
Preferably, an avoiding groove for avoiding the power line is arranged on the side edge of the enclosure; a plurality of reinforcing support blocks extend downwards from the lower surface of the upper cover; the reinforcing support blocks are fixed to the side surfaces of the enclosure.
Preferably, the bottom shell is rectangular, and studs extend upwards from four corners inside the bottom shell; the stud is provided with a first screw hole for mounting a screw; the upper cover is made of transparent materials or light-transmitting materials and is provided with second screw holes corresponding to the first screw holes.
Preferably, the supporting column is a frustum; the wide end of the supporting column is fixed with the bottom shell, and the narrow end of the supporting column is fixed with the circuit board.
Preferably, the circuit board is provided with a third screw hole for mounting a screw; and a fourth screw hole corresponding to the third screw hole is formed in the narrow end of the supporting column.
Preferably, the overflow liquid storage tank is U-shaped, and the two ends of the sub storage tank B are both communicated with the sub storage tank A.
On the other hand, a circuit board sealing method is provided, which is based on the above circuit board sealing structure, and includes:
the method comprises the following steps: assembling the tail clamp and the bottom shell of the power line through the installation through groove;
step two: fixing a circuit board in the bottom shell;
step three: injecting glue into the bottom shell until the liquid level height of the glue in the bottom shell is not lower than the horizontal height of the lower end part of the enclosure when the bottom shell and the upper cover are closed;
step four: and after the glue injection is finished, the upper cover and the bottom shell are covered, so that the circuit board sealing work is finished.
The beneficial effects of the utility model reside in that: on one hand, compared with the prior art that glue is continuously injected until the circuit board is completely soaked in the glue, the design has the advantages of small glue injection amount, economy and environmental protection, specifically, after glue is injected into the bottom shell, the glue liquid level in the bottom shell can continuously rise, when the glue liquid level is not lower than the horizontal height of the lower end part of the enclosure when the bottom shell and the upper cover are closed, the glue injection can be stopped, and after the upper cover is closed, the enclosure covers the circuit board, so that the circuit board is located in a sealing space formed by the enclosure and the glue together, the sealing effect is good, and the glue injection amount is small; on the other hand, as the electronic components on the circuit board can not be covered by the glue in the whole glue injection process, the influence on the electronic components is small, so that the design is suitable for various types of circuit boards and has good applicability; on the other hand, because there is the clearance between power cord tail-end catch and the power cord line, consequently glue still can outwards overflow from this clearance, can store the glue of outside overflow through setting up overflow liquid hold up tank, and the leak protection is effectual, and when not covering the upper cover, the sub-hold up tank A of accessible simultaneously is direct to know how much of overflow volume to the user adjusts subsequent injecting glue speed and injecting glue volume.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the present invention will be further described below with reference to the accompanying drawings and embodiments, wherein the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained without inventive work according to the drawings:
fig. 1 is a front view of a circuit board sealing structure according to a preferred embodiment of the present invention;
fig. 2 is an internal structure diagram of a circuit board sealing structure according to a preferred embodiment of the present invention (the cutting position and the view direction are shown in fig. 1, and the dotted line indicates glue);
fig. 3 is an exploded view of a circuit board sealing structure according to a preferred embodiment of the present invention;
fig. 4 is a top view of a bottom case of a circuit board sealing structure according to a preferred embodiment of the present invention;
fig. 5 is a cross-sectional view of a bottom case in a sealing structure of a circuit board according to a preferred embodiment of the present invention (the cutting position and the view direction are shown in fig. 4);
fig. 6 is a schematic structural view of an upper cover in a sealing structure of a circuit board according to a preferred embodiment of the present invention;
fig. 7 is a flowchart illustrating a method for sealing a circuit board according to a preferred embodiment of the present invention;
fig. 8 is a conventional seal structure.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, a clear and complete description will be given below with reference to the technical solutions of the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
Fig. 1 shows a circuit board sealing structure according to a preferred embodiment of the present invention, and fig. 2 to 8 are also shown; comprises a bottom shell 11 fixed with the circuit board 10 and an upper cover 12 tightly matched with the bottom shell 11; the circuit board 10 is located inside the bottom case 11; an enclosure 13 corresponding to the circuit board 10 and extending into the inner space of the bottom case 11 extends downwards from the lower surface of the upper cover 12; the lower end of the enclosure 13 has a level not higher than that of the circuit board 10; the circuit board 10 is provided with a power line 14 for connection with an external power supply; a power line tail card 15 is sleeved on the power line 14; a mounting through groove 180 which is communicated with the inner space of the bottom shell 11 and corresponds to the power line tail card 15 is formed in the side edge of the bottom shell 11; an overflow liquid storage tank 181 for storing the glue discharged from the installation through groove 180 is arranged in the upper surface of the bottom shell 11; the overflow liquid storage tank 181 is a blind tank; the overflow liquid storage tank 181 includes a longitudinal sub-storage tank a182 extending downward from the upper surface of the bottom case 11, and a sub-storage tank B183 communicating with the side wall of the sub-storage tank a182 and extending toward the mounting through-groove 180; the sub storage tank B183 is located below the installation through groove 180 and communicated with the tank bottom, on one hand, compared with the prior art that glue is continuously injected until the circuit board 10 is completely soaked in the glue, the design has the advantages of small glue injection amount, economy and environmental protection, specifically, after the glue is injected into the bottom shell 11, the glue level in the bottom shell 11 can continuously rise, when the glue level is not lower than the level of the lower end part of the enclosure 13 when the bottom shell 11 and the upper cover 12 are covered, the glue injection can be stopped, and after the upper cover 12 is covered, the enclosure 13 covers the circuit board 10, so that the circuit board 10 is located in a sealed space formed by the enclosure 13 and the glue together, the sealing effect is good, and the glue injection amount is small; on the other hand, since the electronic components on the circuit board 10 are not covered by the glue in the whole glue injection process, the influence on the electronic components is small, so that the design is suitable for various types of circuit boards and has good applicability; on the other hand, because there is the clearance between power cord tail card 15 and power cord 14, therefore glue still can outwards overflow from this clearance, can store the glue of outside overflow through setting up overflow liquid hold up tank 181, and the leak protection is effectual, and when not covering the upper cover, the accessible sub-hold up tank A182 is directly perceived the volume of overflow simultaneously to the user adjusts subsequent injecting glue speed and injecting glue volume.
As shown in fig. 2 to 5, a supporting column 16 for supporting the circuit board 10 extends upward from the inner bottom surface of the bottom case 11; the supporting column 16 is fixed with the circuit board 10; the horizontal height of the lower end part of the enclosure 13 is lower than that of the circuit board 10, the circuit board 10 is lifted, and meanwhile, the lower end part of the enclosure 13 extends downwards into the glue liquid level, so that the circuit board 10 cannot be contaminated by the glue, and the negative influence of glue injection on the working performance of the circuit board 10 is reduced.
As shown in fig. 1, 3 and 4, the circuit board 10 is connected with a plurality of groups of power lines 14, and different design requirements of products can be met by adding the power line tail card 15; a plurality of mounting through grooves 180 corresponding to the power lines 14 one to one are formed on the side edge of the bottom case 11; each overflow liquid storage tank 181 is not communicated with each other, so that the storage operations of the overflow liquid storage tanks are independently performed, the storage operations cannot interfere with each other, the product quality of the bottom case can be judged according to the overflow amount of different positions, and if one overflow amount is obviously smaller, the product itself may be damaged and other leakage points exist.
As shown in fig. 3 and 6, two sets of power supply lines 14 are connected to the circuit board 10; the lower surface of the upper cover 12 is provided with two aligning blocks 17; the alignment block 17 corresponds to the sub-storage tank a182 and extends into the inner space thereof, so that the positioning work of the upper cover 12 and the bottom case 11 can be completed quickly, and the improvement of the installation efficiency is facilitated.
As shown in fig. 3 and 6, the side of the enclosure 13 is provided with an avoidance groove 184 for avoiding the power cord 14; a plurality of reinforcing support blocks 18 extend downward from the lower surface of the upper cover 12; the reinforcing support blocks 18 are fixed with the side surfaces of the enclosure 13, and the glue can shrink in the curing process, so that certain pulling force is generated on the enclosure 13, and the rigidity of the enclosure 13 is enhanced by arranging the reinforcing support blocks 18.
As shown in fig. 4, the bottom case 11 is rectangular, and studs 19 extend upwards from four corners of the inside; the stud 19 is provided with a first screw hole for mounting a screw, so that the mounting is convenient and fast, and the connection is stable; the upper cover 12 is made of transparent materials or light-transmitting materials, and is provided with a second screw hole corresponding to the first screw hole, so that the condition that the enclosure 13 is immersed in glue can be observed through the upper cover 12 before the upper cover 12 is finally determined to be covered, and the glue injection amount can be adjusted in time.
As shown in fig. 2 and 4, the supporting column 16 is frustum-shaped, and has better supporting effect compared with a cylinder; the wide end of the supporting column 16 is fixed to the bottom case 11, and the narrow end is fixed to the circuit board 10.
As shown in fig. 3 and 4, the circuit board 10 is provided with third screw holes for mounting screws; the narrow end of the supporting column 16 is provided with a fourth screw hole corresponding to the third screw hole, so that the installation is convenient and the connection is stable.
As shown in fig. 4 and 5, the overflow liquid storage tank 181 is U-shaped, and the sub-storage tank a182 is connected to both ends of the sub-storage tank B183, so that a larger gap is provided for the user to observe the overflow amount.
The utility model discloses a circuit board sealing method of preferred embodiment, as shown in fig. 7, based on foretell circuit board seal structure, include:
step S101: and the assembly of the tail clamp and the bottom shell of the power line is completed through the installation through groove.
Step S102: the circuit board is fixed in the bottom shell.
Step S103: and injecting glue into the bottom shell until the liquid level height of the glue in the bottom shell is not lower than the horizontal height of the lower end part of the enclosure when the bottom shell and the upper cover are covered.
Step S104: and after the glue injection is finished, the upper cover and the bottom shell are covered, so that the circuit board sealing work is finished.
It will be understood that modifications and variations can be made by persons skilled in the art in light of the above teachings and all such modifications and variations are considered to be within the scope of the invention as defined by the following claims.
Claims (9)
1. A circuit board sealing structure comprises a bottom shell fixed with a circuit board and an upper cover matched and tightly covered with the bottom shell; the circuit board is positioned inside the bottom shell; the lower surface of the upper cover extends downwards to form an enclosure which corresponds to the circuit board and extends into the inner space of the bottom shell; the horizontal height of the lower end part of the enclosure is not higher than that of the circuit board; the circuit board is provided with a power line for connecting with an external power supply; a power line tail clip is sleeved on the power line; the side edge of the bottom shell is provided with an installation through groove which is communicated with the inner space of the bottom shell and corresponds to the power line tail card; an overflow liquid storage tank for storing the glue discharged from the mounting through groove is arranged in the upper surface of the bottom shell; the overflow liquid storage tank is a blind tank; the overflow liquid storage tank comprises a longitudinal sub storage tank A extending downwards from the upper surface of the bottom shell and a sub storage tank B communicated with the side wall of the sub storage tank A and extending towards the installation through groove; the sub storage tank B is positioned below the installation through tank and communicated with the bottom of the installation through tank.
2. The circuit board sealing structure according to claim 1, wherein a support column for supporting the circuit board extends upward from an inner bottom surface of the bottom case; the supporting column is fixed with the circuit board; the lower end of the enclosure is lower than the circuit board.
3. The circuit board sealing structure according to claim 2, wherein a plurality of sets of the power supply lines are connected to the circuit board; a plurality of installation through grooves corresponding to the power lines one to one are formed in the side edge of the bottom shell; the overflow liquid storage tanks are not communicated with each other.
4. The circuit board sealing structure according to claim 3, wherein two sets of the power supply lines are connected to the circuit board; the lower surface of the upper cover is provided with two aligning blocks; the alignment block corresponds to the sub storage tank A and extends into the inner space of the sub storage tank A.
5. The circuit board sealing structure according to claim 4, wherein an avoidance groove that avoids the power supply line is provided on a side edge of the enclosure; a plurality of reinforcing support blocks extend downwards from the lower surface of the upper cover; the reinforcing support blocks are fixed to the side surfaces of the enclosure.
6. The circuit board sealing structure according to claim 4, wherein the bottom case is rectangular, and studs extend upward from four corners of the inside; the stud is provided with a first screw hole for mounting a screw; the upper cover is made of transparent materials or light-transmitting materials and is provided with second screw holes corresponding to the first screw holes.
7. The circuit board sealing structure according to claim 4, wherein the support column is a frustum; the wide end of the supporting column is fixed with the bottom shell, and the narrow end of the supporting column is fixed with the circuit board.
8. The circuit board sealing structure according to claim 7, wherein said circuit board is provided with third screw holes for mounting screws; and a fourth screw hole corresponding to the third screw hole is formed in the narrow end of the supporting column.
9. The circuit board sealing structure according to claim 3, wherein the overflow liquid storage tank is U-shaped, and both ends of the sub storage tank B are communicated with the sub storage tank a.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920225069.2U CN209930738U (en) | 2019-02-22 | 2019-02-22 | Circuit board sealing structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920225069.2U CN209930738U (en) | 2019-02-22 | 2019-02-22 | Circuit board sealing structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209930738U true CN209930738U (en) | 2020-01-10 |
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ID=69068381
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920225069.2U Withdrawn - After Issue CN209930738U (en) | 2019-02-22 | 2019-02-22 | Circuit board sealing structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209930738U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109757054A (en) * | 2019-02-22 | 2019-05-14 | 深圳源创智能照明有限公司 | A kind of circuit board sealing structure and circuit board encapsulating method |
-
2019
- 2019-02-22 CN CN201920225069.2U patent/CN209930738U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109757054A (en) * | 2019-02-22 | 2019-05-14 | 深圳源创智能照明有限公司 | A kind of circuit board sealing structure and circuit board encapsulating method |
| CN109757054B (en) * | 2019-02-22 | 2023-05-30 | 深圳源码智能照明有限公司 | Circuit board sealing structure and circuit board sealing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210219 Address after: 518000 Wutong street, Baoan District, Shenzhen, Guangdong, China. The 5 floor of 13A building, Taihua Indus Industrial Park Patentee after: Shenzhen Yuanyuan Intelligent Lighting Co.,Ltd. Address before: 518000 13A, 6-7F, Taihua Wutong Industrial Park, Baoan District Xixiang street, Shenzhen, Guangdong Patentee before: SOCREAT ELECTRONICS TECHNOLOGY Ltd. |
|
| TR01 | Transfer of patent right | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20200110 Effective date of abandoning: 20230530 |
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| AV01 | Patent right actively abandoned |
Granted publication date: 20200110 Effective date of abandoning: 20230530 |
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| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |