CN209930739U - Waterproof assembly structure of circuit board - Google Patents
Waterproof assembly structure of circuit board Download PDFInfo
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- CN209930739U CN209930739U CN201920228731.XU CN201920228731U CN209930739U CN 209930739 U CN209930739 U CN 209930739U CN 201920228731 U CN201920228731 U CN 201920228731U CN 209930739 U CN209930739 U CN 209930739U
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- circuit board
- bottom shell
- assembly structure
- power line
- groove
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Abstract
The utility model relates to a circuit board waterproof assembly structure and a circuit board sealing method, wherein the circuit board waterproof assembly structure comprises a bottom shell fixed with a circuit board and an upper cover matched with the bottom shell and tightly covered; the circuit board is positioned inside the bottom shell; the lower surface of the upper cover extends downwards to form an enclosure which corresponds to the circuit board and extends into the inner space of the bottom shell; the horizontal height of the lower end part of the enclosure is not higher than that of the circuit board; the circuit board is provided with a power line for connecting with an external power supply; the waterproof assembly structure of the circuit board also comprises a plugging piece which is sleeved on the power line and prevents glue in the bottom shell from leaking to the outside; the side edge of the bottom shell is provided with an alignment through groove which is communicated with the inner space of the bottom shell and corresponds to the plugging piece; the design has the advantages of small glue injection amount, economy, environmental protection, good applicability and the like.
Description
Technical Field
The utility model relates to a circuit board technical field, more specifically say, relate to a waterproof assembly structure of circuit board.
Background
A circuit board is an important electronic component on which a number of electronic components are carried. In order to ensure that the circuit board always has good working performance, as shown in fig. 9, a large amount of glue is often poured into the bottom case 11 to wrap the circuit board 10 with the glue, so as to create a sealed environment, and prevent external moisture from entering the circuit board and further affecting sensitive circuits and electronic components. However, in such a waterproof manner, the amount of glue used is large, and the application range is not wide enough, for example, the waterproof manner is not suitable for a circuit board (such as a circuit board with electronic components such as an indicator light, a communication circuit, an antenna, a microwave induction circuit, an infrared induction head, and the like) which cannot be filled with glue. Therefore, there is still a need for further improvement of the assembling mechanism to solve the above-mentioned disadvantages.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the present invention is to provide a waterproof assembly structure for circuit board and a circuit board sealing method for the above-mentioned defects of the prior art.
The utility model provides a technical scheme that its technical problem adopted is:
on one hand, a waterproof assembly structure of a circuit board is constructed, and comprises a bottom shell fixed with the circuit board and an upper cover matched with the bottom shell and tightly covered; the circuit board is positioned inside the bottom shell; an enclosure which corresponds to the circuit board and extends into the inner space of the bottom shell extends downwards from the lower surface of the upper cover; the horizontal height of the lower end part of the enclosure is not higher than that of the circuit board; the circuit board is provided with a power line for connecting with an external power supply; the waterproof assembly structure of the circuit board further comprises a plugging piece which is sleeved on the power line and prevents glue in the bottom shell from leaking to the outside; and the side edge of the bottom shell is provided with a contraposition through groove which is communicated with the inner space of the bottom shell and corresponds to the leaking stoppage piece.
Preferably, a supporting column for supporting the circuit board extends upwards from the inner bottom surface of the bottom shell; the supporting column is fixed with the circuit board; the lower end of the enclosure is lower than the circuit board.
Preferably, the leakage blocking piece is a power line tail card; the power line tail clamp is provided with a wire passing through hole corresponding to the power line; the power line tail clamp is sequentially provided with a U-shaped first limiting groove and a second limiting groove corresponding to the side edge of the bottom shell along the penetrating direction of the power line; the second limiting groove is positioned on the lower surface of the power line tail card; and a supporting plate used for supporting the power line tail card and corresponding to the second limiting groove extends upwards from the inner bottom surface of the bottom shell.
Preferably, both ends of the supporting plate are fixed with inverted-L-shaped overflow baffles; the overflow baffle comprises a transverse plate body fixed with the supporting plate and a longitudinal plate body of which two ends are connected with the transverse plate body and the side wall of the bottom shell; the supporting plate and the two overflow baffles divide the inner space of the bottom shell into a glue injection groove and an overflow liquid storage groove for storing glue discharged from the glue injection groove; the supporting column is positioned in the glue injection groove; the enclosure extends into the glue injection groove.
Preferably, the bottom shell is rectangular, and studs extend upwards from four corners inside the bottom shell; the stud is positioned in the glue injection groove and is provided with a first threaded hole for mounting a screw; the upper cover is made of transparent materials or light-transmitting materials and is provided with a second threaded hole corresponding to the first threaded hole.
Preferably, the power line tail clamp is provided with a sealing groove which is positioned right above the second limiting groove; and a sealing pressing plate which corresponds to the sealing groove and is matched with the supporting plate to clamp the power line tail clamp extends downwards from the lower surface of the upper cover.
Preferably, an avoiding groove for avoiding the power line is formed in the side edge of the enclosure; a plurality of reinforcing support blocks extend downwards from the lower surface of the upper cover; the reinforcing support blocks are fixed to the side surfaces of the enclosure.
Preferably, the supporting columns are arranged on both sides of the circuit board; the support column comprises a column body used for bearing the circuit board and a buckle fixed at the upper end of the column body and used for fixing the circuit board.
Preferably, the circuit board is provided with a third threaded hole for mounting a screw; and a fourth threaded hole corresponding to the third threaded hole is formed in the upper end of the supporting column.
On the other hand, a circuit board sealing method is provided, based on the above waterproof assembly structure for a circuit board, wherein the method comprises the following steps:
the method comprises the following steps: sleeving a leakage stopping piece on a power line, and completing the assembly of the leakage stopping piece and a bottom shell through a positioning through groove;
step two: fixing a circuit board in the bottom shell;
step three: injecting glue into the bottom shell until the liquid level height of the glue in the bottom shell is not lower than the horizontal height of the lower end part of the enclosure when the bottom shell and the upper cover are closed;
step four: and after the glue injection is finished, covering the upper cover and the bottom shell, so as to finish the circuit board sealing work.
The beneficial effects of the utility model reside in that: on one hand, compared with the prior art that glue is continuously injected until the circuit board is completely soaked in the glue, the design has the advantages of small glue injection amount and economy and environmental protection, specifically, after glue is injected into the bottom shell, the glue liquid level in the bottom shell can continuously rise, when the glue liquid level is not lower than the horizontal height of the lower end part of the enclosure when the bottom shell and the upper cover are closed, the glue injection can be stopped, and after the upper cover is closed, the enclosure covers the circuit board, so that the circuit board is positioned in a sealing space formed by the enclosure and the glue together, the sealing effect is good, the glue injection amount is small, meanwhile, by arranging the leakage blocking piece, unnecessary waste and pollution caused by the outward overflow of the glue are avoided, and the glue injection amount is further reduced; on the other hand, because electronic components on the circuit board can not be covered by glue in the whole glue injection process, the influence on the electronic components is small, so that the design is suitable for various types of circuit boards, and the applicability is good.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the present invention will be further described below with reference to the accompanying drawings and embodiments, wherein the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained without inventive work according to the drawings:
fig. 1 is an exploded view of a waterproof assembly structure of a circuit board according to a preferred embodiment of the present invention;
fig. 2 is an exploded view of a waterproof assembly structure of a circuit board according to a preferred embodiment of the present invention;
fig. 3 is a cross-sectional view of a waterproof assembly structure of a circuit board according to a preferred embodiment of the present invention (the dotted line indicates glue);
fig. 4 is a schematic structural diagram of an upper cover in a waterproof assembly structure of a circuit board according to a preferred embodiment of the present invention;
FIG. 5 is an enlarged view taken at A in FIG. 1;
FIG. 6 is an enlarged view at B in FIG. 2;
FIG. 7 is an enlarged view at C in FIG. 2;
fig. 8 is a schematic flow chart illustrating a circuit board sealing method according to a preferred embodiment of the present invention;
fig. 9 is a conventional waterproof assembly structure of a circuit board.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, a clear and complete description will be given below with reference to the technical solutions of the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
Fig. 1 shows a circuit board waterproof assembly structure according to a preferred embodiment of the present invention, and fig. 2 to 9 are also shown; comprises a bottom shell 11 fixed with the circuit board 10 and an upper cover 12 tightly matched with the bottom shell 11; the circuit board 10 is located inside the bottom case 11; an enclosure 13 corresponding to the circuit board 10 and extending into the inner space of the bottom case 11 extends downwards from the lower surface of the upper cover 12; the lower end of the enclosure 13 has a level not higher than that of the circuit board 10; the circuit board 10 is provided with a power line 14 for connection with an external power supply; the waterproof assembly structure of the circuit board further comprises a plugging piece 15 which is sleeved on the power line 14 and prevents glue in the bottom shell 11 from leaking to the outside; the side edge of the bottom shell 11 is provided with the alignment through groove 180 which is communicated with the inner space of the bottom shell 11 and corresponds to the plugging member 15, on one hand, compared with the prior art that glue is continuously injected until the circuit board 10 is completely soaked in the glue, the design has the advantages of small glue injection amount, economy and environmental protection, specifically, after the glue is injected to the bottom shell 11, the glue injection can be stopped after the glue level in the bottom shell 11 is continuously raised, when the glue level is not lower than the horizontal height of the lower end part of the enclosure 13 when the bottom shell 11 and the upper cover 12 are covered, and after the upper cover 12 is covered, the enclosure 13 covers the circuit board 10, so that the circuit board 10 is positioned in a sealing space formed by the enclosure 13 and the glue together, the sealing effect is good, the glue injection amount is small, meanwhile, by arranging the plugging member 15, unnecessary waste and pollution caused by glue overflowing outwards are avoided, and the glue injection amount; on the other hand, since the electronic components on the circuit board 10 are not covered by the glue in the whole glue injection process, the influence on the electronic components is small, so that the design is suitable for various types of circuit boards, and the applicability is good.
As shown in fig. 2, 3 and 5, a support column 16 for supporting the circuit board 10 extends upward from the inner bottom surface of the bottom case 11; the supporting column 16 is fixed with the circuit board 10; the horizontal height of the lower end part of the enclosure 13 is lower than that of the circuit board 10, the circuit board 10 is lifted, and meanwhile, the lower end part of the enclosure 13 extends downwards into the glue liquid level, so that the circuit board 10 cannot be contaminated by the glue, and the negative influence of glue injection on the working performance of the circuit board is reduced.
As shown in fig. 1 to 3, and fig. 6, the leakage blocking member 15 is a power cord tail clip; the power line tail card is provided with a wire passing through hole corresponding to the power line 14; along the penetrating direction of the power cord 14, the power cord tail clip is sequentially provided with a U-shaped first limiting groove 181 corresponding to the side edge of the bottom shell 11 and a second limiting groove 182; the second limit groove 182 is positioned on the lower surface of the power line tail card; the inner bottom surface of the bottom shell 11 extends upwards to form a supporting plate 17 which is used for supporting the power line tail clamp and corresponds to the second limiting groove 182, the front end and the rear end of the power line tail clamp are correspondingly supported and limited, in the glue injection process, the power line tail clamp cannot move, and a good leaking stoppage effect is guaranteed.
As shown in fig. 7, an inverted L-shaped overflow baffle 18 is fixed to both ends of the support plate 17; the overflow baffle 18 comprises a transverse plate body 19 fixed with the support plate 17, and a longitudinal plate body 110 with two ends connected with the transverse plate body 19 and the side wall of the bottom shell 11; the support plate 17 and the two overflow baffles 18 divide the inner space of the bottom shell 11 into a glue injection groove 183 and an overflow liquid storage groove 184 for storing glue discharged from the glue injection groove 183, and because a gap exists between the power line tail clamp and the support plate 17, the glue still overflows outwards from the gap, and the glue overflowing outwards can be stored by arranging the overflow liquid storage groove 184, so that the leakage-proof effect is good, and meanwhile, the structure is simple and the cost is low; the supporting column 16 is positioned in the glue injection groove 183; the enclosure 13 extends into the glue injection groove 183.
As shown in fig. 2, the bottom case 11 is rectangular, and studs 111 extend upwards from four corners of the inside; the stud 111 is positioned in the glue injection groove 183 and is provided with a first threaded hole for mounting a screw, so that the mounting is convenient and fast, and the connection is stable; the upper cover 12 is made of transparent materials or light-transmitting materials, and is provided with a second threaded hole corresponding to the first threaded hole, and before the upper cover 12 is finally determined to be covered, the condition that the enclosure 13 is immersed in glue can be observed through the upper cover 12, and glue injection quantity can be adjusted in time.
As shown in fig. 3, the power line tail card is provided with a sealing groove 185 located right above the second limit groove 182; the lower surface of the upper cover 12 extends downwards to form a sealing pressing plate 112 corresponding to the sealing groove 185 and cooperating with the supporting plate 17 to clamp the power line tail clip, thereby further enhancing the sealing effect and reducing the overflow of glue.
As shown in fig. 1 and 4, the side of the enclosure 13 is provided with an avoidance groove 186 for avoiding the power cord 14; a plurality of reinforcing support blocks 113 extend downward from the lower surface of the upper cover 12; the reinforcing support blocks 113 are fixed to the side surfaces of the enclosure 13, and the enclosure 13 can shrink in the glue curing process, so that certain pulling force is generated on the enclosure 13, and the rigidity of the enclosure 13 is enhanced by the reinforcing support blocks 113.
As shown in fig. 7, support posts 16 are provided on both sides of the circuit board 10; the support post 16 includes a post 114 for receiving the circuit board 10 and a latch 115 secured to an upper end of the post for securing the circuit board 10, which is easy to assemble and low cost.
As shown in fig. 2, the circuit board 10 is provided with first screw holes for mounting screws; the upper end of the supporting column 16 is provided with a second screw hole corresponding to the first screw hole, so that the connection is stable and the cost is low.
The utility model discloses a circuit board sealing method of preferred embodiment, based on the waterproof assembly structure of foretell circuit board, as shown in figure 8, include:
step S101: the plugging piece is sleeved on a power line, and the assembly of the plugging piece and the bottom shell is completed through the alignment through groove.
Step S102: the circuit board is fixed in the bottom shell.
Step S103: and injecting glue into the bottom shell until the liquid level height of the glue in the bottom shell is not lower than the horizontal height of the lower end part of the enclosure when the bottom shell and the upper cover are covered.
Step S104: and after the glue injection is finished, the upper cover and the bottom shell are covered, so that the circuit board sealing work is finished.
It will be understood that modifications and variations can be made by persons skilled in the art in light of the above teachings and all such modifications and variations are considered to be within the scope of the invention as defined by the following claims.
Claims (9)
1. A waterproof assembly structure of a circuit board comprises a bottom shell fixed with the circuit board and an upper cover matched and tightly covered with the bottom shell; the circuit board is positioned inside the bottom shell; the lower surface of the upper cover extends downwards to form an enclosure which corresponds to the circuit board and extends into the inner space of the bottom shell; the horizontal height of the lower end part of the enclosure is not higher than that of the circuit board; the circuit board is provided with a power line for connecting with an external power supply; the waterproof assembly structure of the circuit board further comprises a plugging piece which is sleeved on the power line and prevents glue in the bottom shell from leaking to the outside; and the side edge of the bottom shell is provided with a contraposition through groove which is communicated with the inner space of the bottom shell and corresponds to the leaking stoppage piece.
2. The waterproof mounting structure for circuit board according to claim 1, wherein a support column for supporting said circuit board extends upward from the inner bottom surface of said bottom case; the supporting column is fixed with the circuit board; the lower end of the enclosure is lower than the circuit board.
3. The waterproof assembly structure of circuit board according to claim 2, wherein the leakage blocking member is a power cord tail clip; the power line tail clamp is provided with a wire passing through hole corresponding to the power line; the power line tail clamp is sequentially provided with a U-shaped first limiting groove and a second limiting groove corresponding to the side edge of the bottom shell along the penetrating direction of the power line; the second limiting groove is positioned on the lower surface of the power line tail card; and a supporting plate used for supporting the power line tail card and corresponding to the second limiting groove extends upwards from the inner bottom surface of the bottom shell.
4. The waterproof assembly structure of circuit board according to claim 3, wherein an inverted-L-shaped overflow baffle is fixed to each of both ends of the support plate; the overflow baffle comprises a transverse plate body fixed with the supporting plate and a longitudinal plate body of which two ends are connected with the transverse plate body and the side wall of the bottom shell; the supporting plate and the two overflow baffles divide the inner space of the bottom shell into a glue injection groove and an overflow liquid storage groove for storing glue discharged from the glue injection groove; the supporting column is positioned in the glue injection groove; the enclosure extends into the glue injection groove.
5. The waterproof assembly structure of circuit board according to claim 4, wherein the bottom case is rectangular, and studs extend upwards from four corners of the inside of the bottom case; the stud is positioned in the glue injection groove and is provided with a first threaded hole for mounting a screw; the upper cover is made of transparent materials or light-transmitting materials and is provided with a second threaded hole corresponding to the first threaded hole.
6. The waterproof assembly structure of a circuit board according to claim 3, wherein the power cord tail clip is provided with a sealing groove located directly above the second limiting groove; and a sealing pressing plate which corresponds to the sealing groove and is matched with the supporting plate to clamp the power line tail clamp extends downwards from the lower surface of the upper cover.
7. The waterproof assembly structure of a circuit board according to claim 3, wherein an avoidance groove for avoiding the power supply line is provided at a side of the enclosure; a plurality of reinforcing support blocks extend downwards from the lower surface of the upper cover; the reinforcing support blocks are fixed to the side surfaces of the enclosure.
8. The waterproof assembly structure of a circuit board according to claim 3, wherein the support column is provided on both sides of the circuit board; the support column comprises a column body used for bearing the circuit board and a buckle fixed at the upper end of the column body and used for fixing the circuit board.
9. The waterproof assembly structure of circuit board according to claim 3, wherein the circuit board is provided with third screw holes for mounting screws; and a fourth threaded hole corresponding to the third threaded hole is formed in the upper end of the supporting column.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920228731.XU CN209930739U (en) | 2019-02-22 | 2019-02-22 | Waterproof assembly structure of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920228731.XU CN209930739U (en) | 2019-02-22 | 2019-02-22 | Waterproof assembly structure of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209930739U true CN209930739U (en) | 2020-01-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920228731.XU Withdrawn - After Issue CN209930739U (en) | 2019-02-22 | 2019-02-22 | Waterproof assembly structure of circuit board |
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| Country | Link |
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| CN (1) | CN209930739U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109803514A (en) * | 2019-02-22 | 2019-05-24 | 深圳源创智能照明有限公司 | A kind of circuit board waterproof assembling structure and method |
-
2019
- 2019-02-22 CN CN201920228731.XU patent/CN209930739U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109803514A (en) * | 2019-02-22 | 2019-05-24 | 深圳源创智能照明有限公司 | A kind of circuit board waterproof assembling structure and method |
| CN109803514B (en) * | 2019-02-22 | 2023-10-20 | 深圳源码智能照明有限公司 | Waterproof assembly structure and method for circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210205 Address after: 518000 Wutong street, Baoan District, Shenzhen, Guangdong, China. The 5 floor of 13A building, Taihua Indus Industrial Park Patentee after: Shenzhen Yuanyuan Intelligent Lighting Co.,Ltd. Address before: 518000 13A, 6-7F, Taihua Wutong Industrial Park, Baoan District Xixiang street, Shenzhen, Guangdong Patentee before: SOCREAT ELECTRONICS TECHNOLOGY Ltd. |
|
| TR01 | Transfer of patent right | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20200110 Effective date of abandoning: 20231020 |
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| AV01 | Patent right actively abandoned |
Granted publication date: 20200110 Effective date of abandoning: 20231020 |
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| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |