CN109769364A - A kind of seal assembly and method for circuit board sealing - Google Patents
A kind of seal assembly and method for circuit board sealing Download PDFInfo
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- CN109769364A CN109769364A CN201910133539.7A CN201910133539A CN109769364A CN 109769364 A CN109769364 A CN 109769364A CN 201910133539 A CN201910133539 A CN 201910133539A CN 109769364 A CN109769364 A CN 109769364A
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- circuit board
- bottom case
- reserve tank
- slot
- shroud
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Abstract
The present invention relates to a kind of seal assemblies for circuit board sealing, cooperate the upper cover covered tightly including the bottom case fixed with circuit board, and with bottom case；Circuit board is located at the inside of bottom case；The lower surface of upper cover extends downwardly the first shroud that is corresponding with circuit board and protruding into bottom shell space；The level height of first shroud lower end is not higher than the level height of circuit board；Circuit board is connected with power supply line；The side of bottom case is provided with first and crosses line through slot；It is provided in the upper surface of bottom case and crosses the first overflowing liquid reserve tank that line through slot was connected to and stored the glue of its discharge with first；First overflowing liquid reserve tank is blind slot, and height where slot bottom crosses height where line through slot slot bottom lower than first；The partition by the partition of its inner space at preceding reserve tank and rear reserve tank is provided in first overflowing liquid reserve tank；Depth of the height of partition less than the first overflowing liquid reserve tank；This seal assembly has the advantages that small injecting glue amount, economic and environment-friendly, good leak-proof effect.
Description
Technical field
The present invention relates to circuit board technology fields, more specifically to a kind of seal assembly for circuit board sealing
And method.
Background technique
Circuit board is a kind of important electronic component, and there are many electronic components for carrying thereon.To guarantee circuit board always
There is good working performance, as shown in figure 9, Chang Huixiang bottom case 11 pours into a large amount of glue circuit board 10 is wrapped up by glue, from
And sealed environment is built, enter circuit board to avoid extraneous moisture and then shadow is caused to sensitive circuit and electronic component
It rings.However, such waterproof type, glue usage amount is big, and the scope of application is not extensive enough, for example, to can not encapsulating circuit board
(as having indicator light, communication, antenna is microwave induced, the circuit board of the first-class electronic component of infrared induction) is then not suitable for.Cause
This, still needs to that assemble mechanism is further improved, to solve above-mentioned deficiency.
Summary of the invention
The technical problem to be solved in the present invention is that in view of the above drawbacks of the prior art, providing a kind of for circuit board
The seal assembly of sealing and a kind of circuit board encapsulating method.
The technical solution adopted by the present invention to solve the technical problems is:
On the one hand, a kind of seal assembly for circuit board sealing is constructed, including the bottom case fixed with circuit board, and
Cooperate the upper cover covered tightly with the bottom case；The circuit board is located at the inside of the bottom case；Wherein, the following table of the upper cover towards
Under be extended with the first shroud that is corresponding with the circuit board and protruding into the bottom shell space；First shroud lower end
Level height is not higher than the level height of the circuit board；The circuit board is connected with the power supply for connecting with extraneous power supply
Line；The side of the bottom case is provided with first for being connected to its inner space and passing through for the power supply line and crosses line through slot；
Be provided in the upper surface of the bottom case with described first cross that line through slot be connected to and store the glue that it is discharged the
One overflowing liquid reserve tank；The first overflowing liquid reserve tank is blind slot, and height where slot bottom crosses line through slot lower than described first
Height where slot bottom；It is provided in the first overflowing liquid reserve tank and separates its inner space at preceding reserve tank and rear reserve tank
Partition；The preceding reserve tank is not connected to the rear reserve tank；The height of the partition is stored less than first overflowing liquid
The depth of slot.
Preferably, it is pierced by the direction that is pierced by of the bottom case along the power supply line, is provided in the upper surface of the bottom case
The first overflowing liquid reserve tank, and the second overflowing liquid storage immediately below line through slot and communicated therewith is crossed positioned at described first
Slot；The second overflowing liquid reserve tank is blind slot；The preceding reserve tank and it is described after reserve tank not with second overflowing liquid
Reserve tank connection.
Preferably, the first overflowing liquid reserve tank is inverted u-shaped；After described there are two reserve tank settings, and it is distributed in institute
State the second overflowing liquid reserve tank two sides.
Preferably, the inner bottom surface of the bottom case upwardly extends the support column for being used to support the circuit board；The support
Column is fixed with the circuit board；The level height of first shroud lower end is lower than the level height of the circuit board.
Preferably, the second shroud of c-type is provided in the bottom case；Second shroud divides the inner space of the bottom case
It is divided into the injecting glue area of inside and the overflow area in outside；The support column and the circuit board are located in the injecting glue area；Described
One shroud protrudes into the injecting glue area；The level height of the upper end of second shroud is lower than where the bottom case upper surface
Level height.
Preferably, the described first line through slot excessively is connected to the upper surface of the bottom case；The upper cover is provided with and the electricity
Source line corresponding second crosses line through slot.
Preferably, the upper cover two sides are provided with buckle；The outer surface of the bottom case is provided with corresponding with the buckle
Card slot.
Preferably, the side of first shroud is provided with the evacuation groove for avoiding the power supply line；The bottom case is square
Shape, and four internal edges have upwardly extended stud；The stud is provided with the first screw hole for installing screw；Institute
It states upper cover and is provided with the second screw hole corresponding with first screw hole.
Preferably, the upper cover is made of transparent material or translucent material, and is provided with for being consolidated with external device
Surely the third screw hole connected.
On the other hand, a kind of circuit board encapsulating method is provided, based on the above-mentioned seal assembly for circuit board sealing,
Wherein, comprising:
Step 1: the assembly that line through slot completes power supply line and bottom case is crossed by first；
Step 2: circuit board is fixed in the bottom case；
Step 3: injecting glue in Xiang Suoshu bottom case, until the glue liquid level in the bottom case not less than the bottom case and
Level height when upper cover lid closes where the first shroud lower end；
Step 4: after the completion of injecting glue, lid closes lid and the bottom case, so far completes circuit board seal operation.
The beneficial effects of the present invention are: on the one hand, continue injecting glue until circuit board is fully immersed in glue with previous
In compare, the design has the advantage that injecting glue amount is small, economic and environment-friendly, specifically, the glue liquid level toward after bottom case injecting glue, in bottom case
It can continue to rise, the level height when glue liquid level is closed not less than bottom case and upper cover lid where the first shroud lower end
Afterwards, injecting glue can be stopped, after lid closes lid, the first shroud has covered circuit board, so that circuit board is just in the first shroud and glue
In the sealing space that water is collectively formed, sealing effect is good and injecting glue amount is small；On the other hand, due on injecting glue overall process circuit board
Electronic component will not all be covered by glue, therefore electronic component institute is impacted small, so that the design is suitable for all types of
Circuit board, applicability are good；In another aspect, glue still can be from this since power supply line and first are crossed between line through slot there are gap
The outside overflow in gap can be stored the glue of outside overflow by the way that the first overflowing liquid reserve tank is arranged, good leak-proof effect,
Further, before the glue of overflow flows into after reserve tank under the blocking of partition realization buffer deceleration, and preceding reserve tank store it is full
Glue can just cross reserve tank after partition flows into afterwards, therefore compared with the reservoir of not set partition, the first overflow of the design
The leak preventing effect of liquid reserve tank is more preferable.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, below in conjunction with attached drawing and reality
Applying example, the invention will be further described, and the accompanying drawings in the following description is only section Example of the invention, for this field
For those of ordinary skill, without creative efforts, it can also be obtained according to these attached drawings other accompanying drawings:
Fig. 1 is a kind of structural schematic diagram of seal assembly for circuit board sealing of present pre-ferred embodiments；
Fig. 2 is a kind of explosive view of seal assembly for circuit board sealing of present pre-ferred embodiments；
Fig. 3 is a kind of internal structure chart (dotted line of seal assembly for circuit board sealing of present pre-ferred embodiments
Part refers to glue)；
Fig. 4 is the structural representation of upper cover in a kind of seal assembly for circuit board sealing of present pre-ferred embodiments
Figure；
Fig. 5 is the top view of bottom case in a kind of seal assembly for circuit board sealing of present pre-ferred embodiments；
Fig. 6 is existing liquid storage process schematic；
Fig. 7 is a kind of liquid storage process schematic of seal assembly for circuit board sealing of present pre-ferred embodiments；
Fig. 8 is a kind of implementation flow chart of circuit board encapsulating method of present pre-ferred embodiments；
Fig. 9 is existing seal assembly.
Specific embodiment
In order to keep the purposes, technical schemes and advantages of the embodiment of the present invention clearer, implement below in conjunction with the present invention
Technical solution in example carries out clear, complete description, it is clear that and described embodiment is section Example of the invention, and
It is not all of embodiment.Based on the embodiment of the present invention, those of ordinary skill in the art are not before making the creative labor
Every other embodiment obtained is put, protection scope of the present invention is belonged to.
A kind of seal assembly for circuit board sealing of present pre-ferred embodiments is as shown in Figure 1, simultaneously extremely refering to Fig. 2
Fig. 9；Cooperate the upper cover 12 covered tightly including the bottom case 11 fixed with circuit board 10, and with bottom case 11；Circuit board 10 is located at bottom case
11 inside；The lower surface of upper cover 12 extends downwardly the first shroud that is corresponding with circuit board 10 and protruding into 11 inner space of bottom case
13；The level height of first shroud, 13 lower end is not higher than the level height of circuit board 10；Circuit board 10 be connected with for it is outer
The power supply line 14 of boundary's power supply connection；The side of bottom case 11 is provided with and is connected to the first mistake that power supply source line 14 passes through with its inner space
Line through slot 180；
It is provided with to cross line through slot 180 with first and be connected to and store the first of the glue that it is discharged in the upper surface of bottom case 11 and overflow
Flow liquid reserve tank 181；First overflowing liquid reserve tank 181 is blind slot, and height crosses 180 slot bottom of line through slot lower than first where slot bottom
Place height；It is provided in first overflowing liquid reserve tank 181 and separates its inner space at preceding reserve tank 182 and rear reserve tank
183 partition 15；Preceding reserve tank 182 is not connected to rear reserve tank 183；The height of partition 15 is less than the first overflowing liquid reserve tank
181 depth, on the one hand, compared with continuing injecting glue until circuit board 10 is fully immersed in glue in the past, the design has
Small, the economic and environment-friendly advantage of injecting glue amount, specifically, the glue liquid level in bottom case 11 can continue to rise toward after 11 injecting glue of bottom case, when
After level height when glue liquid level is closed not less than bottom case 11 and the lid of upper cover 12 where first shroud, 13 lower end, Ji Keting
Only injecting glue, after lid closes lid 12, the first shroud 13 has covered circuit board 10, so that circuit board 10 is just in the first shroud 13 and glue
In the sealing space that water is collectively formed, sealing effect is good and injecting glue amount is small；On the other hand, due on injecting glue overall process circuit board 10
Electronic component will not all be covered by glue, therefore electronic component institute it is impacted small so that the design be suitable for it is all types of
Circuit board, applicability is good；In another aspect, glue is still since there are gaps between power supply line 14 and the first mistake line through slot 180
The glue of outside overflow can be stored, be prevented by the way that the first overflowing liquid reserve tank 181 is arranged from the outside overflow in the gap
It is good to leak effect, further, before the glue of overflow flows into after reserve tank 182 under the blocking of partition 15 realization buffer deceleration, and
And the preceding full rear glue of the storage of reserve tank 182 can just cross reserve tank 183 after partition 15 flows into, therefore the liquid storage with not set partition 15
Slot (as shown in Figure 6) is compared, and the liquid storage amount of the first overflowing liquid reserve tank 181 (as shown in Figure 7) of the design is bigger, leak preventing effect
More preferably.
As shown in Figure 2 and Figure 5, it is pierced by the direction that is pierced by of bottom case 11 along power supply line 14, is arranged in the upper surface of bottom case 11
There is the first overflowing liquid reserve tank 181, and crosses the second overflowing liquid storage immediately below line through slot 180 and communicated therewith positioned at first
Slot 184, most overflowing liquid, which can drip, to be dropped into the first overflowing liquid reserve tank 181, but still has fraction can be along power supply
Line 14 continues toward outward leakage, therefore the second overflowing liquid reserve tank 184 is arranged to accept overflowing liquid in rear end, further enhances leakproof
Effect；Second overflowing liquid reserve tank 184 is blind slot；Preceding reserve tank 182 and rear reserve tank 183 not with the second overflowing liquid reserve tank
184 connection so that each reserve tank liquid storage work be it is independent, will not interfere with each other, so that user is according to the storage of each reserve tank
Liquid situation adjusts subsequent injecting glue speed and injecting glue amount.
As shown in figure 5, the first overflowing liquid reserve tank 181 is inverted u-shaped；Afterwards there are two the settings of reserve tank 183, and it is distributed in the
Two overflowing liquid reserve tanks, 184 two sides, so that the first overflowing liquid reserve tank 181 has bigger liquid storage capacity.
As shown in Figures 2 and 3, the inner bottom surface of bottom case 11 upwardly extends the support column 16 for being used to support circuit board 10；Branch
Dagger 16 and circuit board 10 are fixed；The level height of first shroud, 13 lower end is lower than the level height of circuit board, by will be electric
Road plate 10 is raised, while 13 lower end downlink of the first shroud protrudes into glue liquid level, so that circuit board 10 will not be infected with by glue,
Injecting glue is reduced to negative effect caused by 10 working performance of circuit board.
As shown in Figures 2 and 3, the second shroud of c-type 17 is provided in bottom case 11；Second shroud 17 is empty by the inside of bottom case 11
Between be separated into inside injecting glue area 185 and outside overflow area 186, taken up space to reduce injecting glue area 185, both will not be to close
Envelope effect impacts, and can be reduced injecting glue amount, reduces cost；Support column 16 and circuit board 10 are located in injecting glue area 185；First
Shroud 13 protrudes into injecting glue area 185；The level height of the upper end of second shroud 17 is lower than the level where 11 upper surface of bottom case
Highly, when injecting glue area 185 store it is full after glue can cross the second shroud 17 inflow overflow area 186, without direct past outward leakage,
Good leak-proof effect.
As shown in Figure 2 and Figure 4, the first line through slot 180 excessively is connected to the upper surface of bottom case 11；Upper cover 12 is provided with and power supply
Line 14 corresponding second crosses line through slot 187.
As shown in Figure 1, Figure 4 and Figure 5,12 two sides of upper cover are provided with buckle 18；The outer surface of bottom case 11 is provided with and blocks
18 corresponding card slots 188 are detained, by the cooperation of buckle 18 and card slot 188, the assembly of upper cover 12 and bottom case 11 can be rapidly completed
Work, at the same it is stable connection, at low cost.
As shown in Figure 4 and Figure 5, the side of the first shroud 13 is provided with the evacuation groove 189 of evacuation power supply line 14；Bottom case 11
Four edges for rectangle, and inside have upwardly extended stud 19；Stud 19 is provided with the first spiral shell for installing screw
Hole；Upper cover 12 is provided with the second screw hole corresponding with the first screw hole, is easily installed and stable connection.
As shown in Fig. 2, upper cover 12 is made of transparent material or translucent material, and it is provided with for being consolidated with external device
Surely the third screw hole 1810 connected can pass through upper cover 12 and observe the leaching of the first shroud 13 before final determining lid closes lid 12
The case where entering glue is in time adjusted injecting glue amount.
A kind of circuit board encapsulating method of present pre-ferred embodiments, based on the above-mentioned sealing group for circuit board sealing
Part, as shown in Figure 8, comprising:
Step S101: the assembly that line through slot completes power supply line and bottom case is crossed by first.
Step S102: circuit board is fixed in bottom case.
Step S103: the injecting glue into bottom case, until when the glue liquid level in bottom case is closed not less than bottom case and upper cover lid
Level height where first shroud lower end.
Step S104: after the completion of injecting glue, lid closes lid and bottom shell, so far completes circuit board seal operation.
It should be understood that for those of ordinary skills, it can be modified or changed according to the above description,
And all these modifications and variations should all belong to the protection domain of appended claims of the present invention.
Claims (10)
1. a kind of seal assembly for circuit board sealing cooperates including the bottom case fixed with circuit board, and with the bottom case
The upper cover covered tightly；The circuit board is located at the inside of the bottom case；It is characterized in that, the lower surface of the upper cover has extended downwardly
The first shroud that is corresponding with the circuit board and protruding into the bottom shell space；The level height of first shroud lower end
Not higher than the level height of the circuit board；The circuit board is connected with the power supply line for connecting with extraneous power supply；The bottom
The side of shell is provided with first for being connected to its inner space and passing through for the power supply line and crosses line through slot；
It is provided with to cross line through slot with described first and be connected to and store the first of the glue that it is discharged in the upper surface of the bottom case and overflow
Flow liquid reserve tank；The first overflowing liquid reserve tank is blind slot, and height where slot bottom crosses line through slot slot bottom lower than described first
Place height；Be provided in the first overflowing liquid reserve tank by its inner space partition at preceding reserve tank and rear reserve tank every
Plate；The preceding reserve tank is not connected to the rear reserve tank；The height of the partition is less than the first overflowing liquid reserve tank
Depth.
2. the seal assembly according to claim 1 for circuit board sealing, which is characterized in that worn along the power supply line
The bottom case is pierced by direction out, the first overflowing liquid reserve tank is provided in the upper surface of the bottom case, and be located at institute
It states first and crosses the second overflowing liquid reserve tank immediately below line through slot and communicated therewith；The second overflowing liquid reserve tank is blind slot；
The preceding reserve tank and the rear reserve tank are not connected to the second overflowing liquid reserve tank.
3. the seal assembly according to claim 2 for circuit board sealing, which is characterized in that the first overflowing liquid storage
It is inverted u-shaped to deposit slot；After described there are two reserve tank settings, and it is distributed in the second overflowing liquid reserve tank two sides.
4. the seal assembly according to claim 1 for circuit board sealing, which is characterized in that the inner bottom surface of the bottom case
Upwardly extend the support column for being used to support the circuit board；The support column is fixed with the circuit board；First shroud
The level height of lower end is lower than the level height of the circuit board.
5. the seal assembly according to claim 4 for circuit board sealing, which is characterized in that be provided in the bottom case
The second shroud of c-type；The inner space of the bottom case is separated into the injecting glue area of inside and the overflow area in outside by second shroud；
The support column and the circuit board are located in the injecting glue area；First shroud protrudes into the injecting glue area；Described second
The level height of the upper end of shroud is lower than the level height where the bottom case upper surface.
6. the seal assembly according to claim 1 for circuit board sealing, which is characterized in that described first crosses line through slot
It is connected to the upper surface of the bottom case；The upper cover is provided with corresponding with the power supply line second and crosses line through slot.
7. the seal assembly according to claim 1 for circuit board sealing, which is characterized in that the upper cover two sides are all provided with
It is equipped with buckle；The outer surface of the bottom case is provided with card slot corresponding with the buckle.
8. the seal assembly according to claim 1 for circuit board sealing, which is characterized in that the side of first shroud
While being provided with the evacuation groove for avoiding the power supply line；The bottom case is rectangle, and four internal edges upwardly extend
There is stud；The stud is provided with the first screw hole for installing screw；The upper cover is provided with corresponding with first screw hole
The second screw hole.
9. the seal assembly according to claim 1 for circuit board sealing, which is characterized in that the upper cover is by transparent material
Material or translucent material are made, and are provided with the third screw hole for being fixedly connected with external device.
10. a kind of circuit board encapsulating method, based on any seal assembly for circuit board sealing of claim 1-9,
It is characterised by comprising:
Step 1: the assembly that line through slot completes power supply line and bottom case is crossed by first；
Step 2: circuit board is fixed in the bottom case；
Step 3: injecting glue in Xiang Suoshu bottom case, until the glue liquid level in the bottom case is not less than the bottom case and upper cover
Level height when lid closes where the first shroud lower end；
Step 4: after the completion of injecting glue, lid closes lid and the bottom case, so far completes circuit board seal operation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910133539.7A CN109769364B (en) | 2019-02-22 | 2019-02-22 | Sealing assembly and method for sealing circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910133539.7A CN109769364B (en) | 2019-02-22 | 2019-02-22 | Sealing assembly and method for sealing circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109769364A true CN109769364A (en) | 2019-05-17 |
| CN109769364B CN109769364B (en) | 2023-05-30 |
Family
ID=66456311
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910133539.7A Active CN109769364B (en) | 2019-02-22 | 2019-02-22 | Sealing assembly and method for sealing circuit board |
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| Country | Link |
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| CN (1) | CN109769364B (en) |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201037019Y (en) * | 2007-05-09 | 2008-03-19 | 天津市松正电子有限公司 | Sealed type controller housing structure |
| CN101578008A (en) * | 2008-05-07 | 2009-11-11 | 本田技研工业株式会社 | Protective structure for a circuit board and method for fabricating the same |
| CN201435885Y (en) * | 2009-06-03 | 2010-03-31 | 天津市松正电动科技有限公司 | Electric motorcar controller |
| CN201571263U (en) * | 2009-11-03 | 2010-09-01 | 天津市松正电动科技有限公司 | Casing structure of waterproof controller |
| CN102984905A (en) * | 2012-12-04 | 2013-03-20 | 茂硕电源科技股份有限公司 | LED sealing power supply and sealing method thereof |
| CN203038948U (en) * | 2012-11-13 | 2013-07-03 | 海南英利新能源有限公司 | Solar cell junction box |
| DE102015200549A1 (en) * | 2015-01-15 | 2016-07-21 | Zf Friedrichshafen Ag | Circuit device and method for monitoring a circuit device |
| CN106257652A (en) * | 2015-06-16 | 2016-12-28 | 台达电子企业管理（上海）有限公司 | Package module |
| CN207115893U (en) * | 2017-03-10 | 2018-03-16 | 福建省爱民光电科技有限公司 | One kind sealing waterproof display screen external member |
| CN207382746U (en) * | 2017-09-20 | 2018-05-18 | 辽宁民生智能仪表有限公司 | A kind of electronic module waterproof sealing box with external lead wire and replaceable battery |
| CN108575068A (en) * | 2017-03-13 | 2018-09-25 | 宁德时代新能源科技股份有限公司 | battery control unit encapsulating structure and encapsulating method |
| CN208186276U (en) * | 2018-05-31 | 2018-12-04 | 深圳实现创新科技有限公司 | A kind of daylight lamp circuit plate encapsulating structure |
| CN209930719U (en) * | 2019-02-22 | 2020-01-10 | 深圳源创智能照明有限公司 | Sealing assembly for sealing circuit board |
-
2019
- 2019-02-22 CN CN201910133539.7A patent/CN109769364B/en active Active
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201037019Y (en) * | 2007-05-09 | 2008-03-19 | 天津市松正电子有限公司 | Sealed type controller housing structure |
| CN101578008A (en) * | 2008-05-07 | 2009-11-11 | 本田技研工业株式会社 | Protective structure for a circuit board and method for fabricating the same |
| CN201435885Y (en) * | 2009-06-03 | 2010-03-31 | 天津市松正电动科技有限公司 | Electric motorcar controller |
| CN201571263U (en) * | 2009-11-03 | 2010-09-01 | 天津市松正电动科技有限公司 | Casing structure of waterproof controller |
| CN203038948U (en) * | 2012-11-13 | 2013-07-03 | 海南英利新能源有限公司 | Solar cell junction box |
| CN102984905A (en) * | 2012-12-04 | 2013-03-20 | 茂硕电源科技股份有限公司 | LED sealing power supply and sealing method thereof |
| DE102015200549A1 (en) * | 2015-01-15 | 2016-07-21 | Zf Friedrichshafen Ag | Circuit device and method for monitoring a circuit device |
| CN106257652A (en) * | 2015-06-16 | 2016-12-28 | 台达电子企业管理（上海）有限公司 | Package module |
| CN207115893U (en) * | 2017-03-10 | 2018-03-16 | 福建省爱民光电科技有限公司 | One kind sealing waterproof display screen external member |
| CN108575068A (en) * | 2017-03-13 | 2018-09-25 | 宁德时代新能源科技股份有限公司 | battery control unit encapsulating structure and encapsulating method |
| CN207382746U (en) * | 2017-09-20 | 2018-05-18 | 辽宁民生智能仪表有限公司 | A kind of electronic module waterproof sealing box with external lead wire and replaceable battery |
| CN208186276U (en) * | 2018-05-31 | 2018-12-04 | 深圳实现创新科技有限公司 | A kind of daylight lamp circuit plate encapsulating structure |
| CN209930719U (en) * | 2019-02-22 | 2020-01-10 | 深圳源创智能照明有限公司 | Sealing assembly for sealing circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109769364B (en) | 2023-05-30 |
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Effective date of registration: 20210207 Address after: 518000 Wutong street, Baoan District, Shenzhen, Guangdong, China. The 5 floor of 13A building, Taihua Indus Industrial Park Applicant after: Shenzhen Yuanyuan Intelligent Lighting Co.,Ltd. Address before: 518000 13A, 6-7F, Taihua Wutong Industrial Park, Baoan District Xixiang street, Shenzhen, Guangdong Applicant before: SOCREAT ELECTRONICS TECHNOLOGY Ltd. |
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