CN209929340U

CN209929340U - Die bonding structure with glue grabbing function

Info

Publication number: CN209929340U
Application number: CN201921235383.5U
Authority: CN
Inventors: 唐加良
Original assignee: Yancheng Dongshan Precision Manufacturing Co Ltd
Current assignee: Yancheng Dongshan Precision Manufacturing Co Ltd
Priority date: 2019-08-01
Filing date: 2019-08-01
Publication date: 2020-01-10
Anticipated expiration: 2029-08-01

Abstract

The utility model provides a gu brilliant structure with grab gluey function, including metal support, the plastics base, wafer and solid brilliant silver glue, the plastics base includes base under plastics upper base and the plastics, base bottom portion under plastics is wrapped up in to metal support bottom, metal support top is worn to establish and fixed connection is between base under plastics upper base and the plastics, the metal support top is provided with the metal pad, enclose between plastics upper base and the metal pad and establish and be formed with the rim of a cup structure, set up the ditch that is used for separating into the metal pad into a plurality of pad units's undercut on the metal pad, set up the gluey groove of grabbing of undercut on arbitrary pad unit, the wafer is through solid brilliant silver glue fixed connection on the metal pad and its upper surface in the metal pad is formed with solid brilliant region, it is located solid brilliant regional below of grabbing, solid brilliant silver glue flows into and grabs gluey inslot. The utility model discloses this solid brilliant structure has increased the associativity of solid brilliant silver glue and metal support, prevents solid brilliant silver glue and breaks away from with metal support, has improved product property ability.

Description

Die bonding structure with glue grabbing function

Technical Field

The utility model relates to a photoelectronic device technical field, concretely relates to solid brilliant structure with grab gluey function.

Background

With the development of electronic technology, the application range of LEDs is widened. Because the LED lamp has a simple structure, the die bonding process becomes an important factor for the quality of the LED lamp, and how to improve the success rate of die bonding is a problem to be continuously solved. Die bonding is also known as DieBond or die attach. Die bonding is a process of bonding a wafer to a designated area of a support through die bonding adhesive (generally conductive adhesive or insulating adhesive for an LED), forming a thermal or electrical path, and providing conditions for subsequent wire bonding.

The existing solid crystal silver adhesive is bonded in a solid crystal area on a metal bracket, and as the silver powder in the solid crystal silver adhesive has higher content, the baked adhesive has fewer components; when the material is combined with a metal support, two different metal substances cause different thermal expansion coefficients, so that the solid crystal silver colloid is easy to separate from the bottom of the metal support in the use process to cause failure, and meanwhile, the solid crystal silver colloid has large combination stress and poor combination property with the metal support in the application process, and is easy to cause the separation of the solid crystal silver colloid after the material absorbs moisture, thereby seriously affecting the reliability and the service life of the product.

Therefore, aiming at the defect that the existing die bond silver adhesive is easy to come unstuck, the die bond structure with the adhesive grabbing function is required to be provided, the connecting and combining force of the die bond silver adhesive and the metal bracket is improved in the die bond structure, the die bond silver adhesive is prevented from being separated from the metal bracket, and the quality risks of lamp death and the like caused by the separation of the die bond silver adhesive are reduced.

Disclosure of Invention

In view of this, the utility model aims at providing a solid brilliant structure with grab gluey function, this solid brilliant structure has increased the associativity of solid brilliant silver glue and metal support, prevents that solid brilliant silver glue and metal support break away from, has improved product property ability.

In order to achieve the above purpose, the utility model adopts the technical scheme that: the die comprises a metal support, a plastic base, a wafer and die bonding silver adhesive, wherein the plastic base comprises a plastic upper base and a plastic lower base integrally formed with the plastic upper base, the bottom of the metal support is wrapped at the bottom of the plastic lower base, the top of the metal support is penetrated and fixedly connected between the plastic upper base and the plastic lower base, a metal pad is arranged at the top of the metal support, a cup opening structure is formed between the plastic upper base and the metal pad in an enclosing manner, a water channel which is used for dividing the metal pad into a plurality of pad units and is sunken downwards is arranged on the metal pad unit, a die bonding groove which is sunken downwards is arranged on any pad unit, the wafer is fixedly connected on the metal pad through the die bonding silver adhesive, a die bonding area is formed on the upper surface of the metal pad, and the die bonding groove is positioned below the die bonding area, the die bonding silver adhesive flows into the adhesive grabbing groove.

Preferably, the glue grasping groove is in any shape.

Preferably, the glue grasping groove is in a cross shape, a triangular shape, a rice shape or a circular shape.

Preferably, the plastic upper base and the plastic lower base are both made of polyphthalamide material.

Preferably, four bending feet are arranged at the bottom of the metal support, and the metal support is wrapped at the bottom of the plastic lower base through the four bending feet.

Preferably, the bottom surface of the plastic lower base is provided with a groove corresponding to the four bent legs, and the bent legs are wrapped in the groove.

Preferably, a step surface is arranged on the periphery of a top corner of the upper part of the plastic upper base.

Compared with the prior art, the solid crystal glue structure with the glue grabbing function provided by the utility model has the advantages that the solid crystal glue structure is provided with the glue grabbing grooves, so that the solid crystal silver glue flows into the glue grabbing grooves with different shapes of structures, and the bonding property of the solid crystal silver glue and the metal bracket is enhanced; when the lamp is affected by moisture absorption stress, the die bonding silver colloid and the metal bracket can be firmly combined without causing die bonding silver colloid to be separated, and the performance of the product is ensured without causing bad dead lamp.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic perspective view of a die bonding structure with a glue grasping function provided by the present invention;

fig. 2 is another schematic perspective view of a die bonding structure with a glue grasping function according to the present invention;

fig. 3 is a top view of the die bonding structure with the glue grasping function provided by the present invention.

Reference numerals and component parts description referred to in the drawings:

1. a metal bracket; 11. a metal pad; 111. a ditch; 112. a glue grabbing groove; 12. bending the feet; 2. a plastic base; 21. a plastic upper base; 211. a step surface; 22. a plastic lower base; 221. a groove; 3. a wafer; 4. and (5) solidifying the crystal silver glue.

Detailed Description

The technical solution of the present invention will be described clearly and completely through the following detailed description. It is to be understood that the embodiments described are only some embodiments of the invention, and not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

Referring to fig. 1 to 3, a die bonding structure with a glue grasping function includes a metal bracket 1, a plastic base 2, a wafer 3 and a die bonding silver glue 4, wherein the metal bracket 1 may be made of an iron material or a copper material. The die bond silver paste 4 is mainly used for connecting the wafer 3 to the top of the metal support 1, and the die bond silver paste 4 has conductivity. The plastic base 2 comprises a plastic upper base 21 and a plastic lower base 22, wherein the plastic upper base 21 and the plastic lower base 22 are integrally formed, and the plastic upper base 21 is located above the plastic lower base 22. The bottom of the metal support 1 is wrapped at the bottom of the plastic lower base 22, the top of the metal support 1 is positioned between the plastic upper base 21 and the plastic lower base 22, and the metal support 1 can be integrally formed with the plastic upper base 21 and the plastic lower base 22. The top surface of the metal support 1 is provided with a metal bonding pad 11, a cup opening structure is formed between the plastic upper base 21 and the metal bonding pad 11 in an enclosing manner, and the wafer 3 is installed in the cup opening structure and is installed on the metal support 1 through the crystal-fixing silver adhesive 4. The metal pad 11 is provided with a ditch 111 which is sunken downwards, the ditch 111 has different distribution forms on the metal pad 11 according to different product structure designs, wherein the ditch 111 is used for dividing the metal pad 11 into different pad units, so that the pad units are prevented from being conducted, and a blocking effect is achieved.

Any one of the pad units is provided with a downward-recessed glue catching groove 112, the rotary selection of the pad unit can be set according to the actual situation, wherein the glue catching groove 112 has a certain depth. The wafer 3 is mounted on the metal pad 1 through the die bonding silver paste 4, and the mounting position of the wafer on the metal pad 1 is a die bonding area, wherein the die bonding area is located at the upper part of the paste catching groove 112. The solid crystal silver glue 4 is dispensed on the glue grasping groove 112, and a part of the solid crystal silver glue 4 is dispensed on the metal bracket 1; the other part of the die bond silver colloid 4 directly flows into the colloid grasping groove 112 below the die bond area, so that the colloid grasping groove 112 holds more die bond silver colloid 4, meanwhile, the die bond silver colloid 4 is fixedly connected with the colloid grasping groove 112, the connectivity of the die bond silver colloid 4 which does not flow into the colloid grasping groove 112 and flows into the colloid grasping groove 112 is increased, the contact area of the die bond silver colloid 4 and the colloid grasping groove 112 on the metal pad 11 is increased, the binding property of the die bond silver colloid 4 and the metal support 1 is further enhanced, the die bond silver colloid 4 is more firmly combined with the metal pad 11, and the binding force of the die bond silver colloid 4 and the metal support 1 is effectively improved. When the LED lamp is applied, the die bond silver colloid 4 cannot be separated from the metal bracket 1, so that quality risks such as lamp death and the like caused by separation of the die bond silver colloid 4 are prevented; meanwhile, when the solid crystal silver colloid is influenced by moisture absorption stress, the solid crystal silver colloid 4 and the metal support 1 can be firmly combined without causing silver colloid separation, and the product performance is ensured without causing bad dead lamp.

Polyphthalamide (PPA for short) can be injected at the ditch 111, and the die bond silver paste 4 can be dispensed on the PPA at the ditch 111, but the die bond silver paste 4 is not conducted with the metal pad 11. The crystal-bonded silver paste 4 contains epoxy resin inside, has similar characteristics with PPA plastic material, and relatively reduces the stress existing between the PPA plastic material and the PPA plastic material after baking and combination.

Specifically, the shape of the glue grasping groove 112 may be any shape, and the position thereof may be any position, for example, the glue grasping groove 112 is disposed below the wafer 3, that is, the wafer 3 is connected to the glue grasping groove 112 through the die bonding silver paste 4, as long as the glue grasping groove 112 is below the die bonding area. The glue catching groove 112 is provided to avoid the installation of the ditch 111 as much as possible. The adhesive catching groove 112 may be formed in any shape on the metal pad 11 by punching.

Specifically, the glue catching groove 112 may be cross-shaped, triangular, rice-shaped, or circular, and the specific position thereof may be set according to the actual situation, wherein the cross-shaped, triangular, rice-shaped, or circular glue catching groove 112 can increase the contact area with the die attach silver paste 4.

Specifically, the plastic upper base 21 and the plastic lower base 22 are made of polyphthalamide material. The polyphthalamide has good tensile strength, high hardness and good physical, thermal and electrical properties, and the quality and the service time of the solid crystal structure are improved.

The bottom of the metal support 1 is provided with four bending feet 12. The four bending feet 12 are all arranged in a bending mode, the bending angle of the four bending feet is approximately ninety degrees, and the four bending feet face the bottom of the plastic lower base 22. Wherein, two bending feet 12 are symmetrically arranged. The metal bracket 1 is wrapped at the bottom of the plastic lower base 22 through four bending feet 12.

Specifically, a groove 221 is formed in the bottom surface of the plastic lower base 22, wherein the shape of the groove 221 is the same as that of the bending leg 12, and the bending leg 12 is placed in the corresponding groove 221, so that the plastic lower base 22 is wrapped by the metal support 1.

A step surface 211 is arranged on the periphery of a vertex angle at the upper part of the plastic upper base 21, and the step surface 211 facilitates the installation of the die bonding structure on an external part and facilitates the assembly.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. The utility model provides a gu brilliant structure with grab gluey function, includes metal support (1), plastic base (2), wafer (3) and solid brilliant silver colloid (4), plastic base (2) including plastics upper base (21) and with base (22) under plastics upper base (21) integrated into one piece's the plastics, metal support (1) bottom parcel in base (22) bottom under the plastics, metal support (1) top is worn to establish and fixed connection in plastics upper base (21) with between base (22) under the plastics, its characterized in that: metal support (1) top is provided with metal pad (11), plastics upper base (21) with enclose between metal pad (11) and establish and be formed with the rim of a cup structure, offer on metal pad (11) be used for with metal pad (11) are separated into undercut ditch (111) of a plurality of pad units, arbitrary offer undercut on the pad unit and grab gluey groove (112), wafer (3) pass through gu brilliant silver glue (4) fixed connection in on metal pad (11) and its in metal pad (11) upper surface is formed with solid crystalline substance region, it is located to grab gluey groove (112) gu brilliant regional below, gu brilliant silver glue (4) flow in grab gluey inslot (112).

2. The die bonding structure with the glue grabbing function as claimed in claim 1, wherein: the glue grabbing groove (112) is in any shape.

3. The die bonding structure with the glue grabbing function as claimed in claim 2, wherein: the glue grabbing groove (112) is in a cross shape, a triangular shape, a rice shape or a circular shape.

4. The die bonding structure with the function of catching glue according to any one of claims 1 to 3, characterized in that: the plastic upper base (21) and the plastic lower base (22) are both made of polyphthalamide materials.

5. The die bonding structure with the function of catching glue according to any one of claims 1 to 3, characterized in that: the bottom of the metal support (1) is provided with four bending feet (12), and the metal support (1) is wrapped at the bottom of the plastic lower base (22) through the four bending feet (12).

6. The die bonding structure with the glue grabbing function as claimed in claim 5, wherein: the plastic lower base (22) is provided with a groove (221) corresponding to the four bent legs (12) on the bottom surface, and the bent legs (12) are wrapped in the groove (221).

7. The die bonding structure with the function of catching glue according to any one of claims 1 to 3, characterized in that: a step surface (211) is arranged on the periphery of a vertex angle at the upper part of the plastic upper base (21).