CN111640841A - LED packaging structure - Google Patents
LED packaging structure Download PDFInfo
- Publication number
- CN111640841A CN111640841A CN202010555891.2A CN202010555891A CN111640841A CN 111640841 A CN111640841 A CN 111640841A CN 202010555891 A CN202010555891 A CN 202010555891A CN 111640841 A CN111640841 A CN 111640841A
- Authority
- CN
- China
- Prior art keywords
- glue
- gold thread
- insulator
- support
- led chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 13
- 239000003292 glue Substances 0.000 claims abstract description 42
- 241000218202 Coptis Species 0.000 claims abstract description 26
- 235000002991 Coptis groenlandica Nutrition 0.000 claims abstract description 26
- 239000012212 insulator Substances 0.000 claims abstract description 21
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 10
- 238000003466 welding Methods 0.000 claims abstract description 6
- 239000000758 substrate Substances 0.000 claims description 19
- 230000001174 ascending effect Effects 0.000 claims description 3
- 239000012780 transparent material Substances 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract description 3
- 239000000084 colloidal system Substances 0.000 description 4
- 230000008602 contraction Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229920006335 epoxy glue Polymers 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The utility model provides a LED packaging structure, includes the support, just adorns the glue of LED chip and encapsulation LED chip on the support, and the support includes two electrodes and establishes the insulator between two electrodes, and the insulator is protruding and form the bellying that is close to the gold thread to one side of the gold thread of LED chip, and the bellying makes the gold thread below fill out the deformation space of glue volume and glue and all reduces and then reduce the internal stress and the deformation that glue received expend with heat and contract with cold and produce. Adopt above-mentioned technical scheme, design into the bellied form that makes progress with the insulator for the gold thread below is filled out the deformation space of glue volume and glue and is all reduced and then reduce glue and receive the internal stress and the deformation that expend with heat and contract with cold and produce, and then can effectively avoid the gold thread to break from the electrode welding department under the effect of internal stress. In addition, the bonding area of the glue and the support is increased, the bonding force of the internal structure of the glue body after the packaging glue is cured is improved, and the risks of glue body peeling, gold wire breaking and the like in the subsequent use process are reduced.
Description
Technical Field
The invention relates to the technical field of LED packaging, in particular to an LED packaging structure.
Background
The existing LED packaging SMD component has the following problems:
(1) when a reliability experiment is conventionally performed, due to the fact that the stress of the material (silicon resin and epoxy glue) glue of the packaging glue is different, the inner strain of the glue in the bowl cup is changed due to expansion with heat and contraction with cold in a cold and hot impact experiment. The functional area of the LED bracket is a bowl cup with a plane structure, glue is instantly lifted when heated to expand and contract, and a gold thread at the positive electrode of an internal LED chip is broken after the internal stress of the glue is increased.
(2) After the packaging glue is cured, the bonding force between the glue and the bracket is not enough, and the packaging glue is easy to peel.
Therefore, improvements are needed.
Disclosure of Invention
The invention aims to provide an LED packaging structure, which has the advantage that a gold wire is not easy to be broken in the subsequent drying process or the using process. In order to achieve the purpose, the invention adopts the following technical scheme:
the utility model provides a LED packaging structure, includes the support, just adorns LED chip and encapsulation on the support the glue of LED chip, the support includes two electrodes and establishes the insulator between two electrodes, the insulator is protruding and form the bellying that is close to the gold thread to one side of the gold thread of LED chip, the bellying makes the gold thread below fill out the deformation space of gluey volume and glue and all reduces and then reduce the internal stress and the deformation that glue produced by expend with heat and contract with cold.
Further, the protruding part is made of a transparent material.
Furthermore, the gold thread includes ascending section and descending section, the end and the electrode welding of descending section, the bellying is established in the below of gold thread descending section.
Further, the top of the convex part is arranged downwards and slantwise towards the side of the tail end of the descending section.
Further, the insulator and the boss are integrally formed.
Further, the support comprises a carrier and an enclosing body arranged on the periphery of the carrier, the carrier and the enclosing body form a groove for accommodating the LED chip, and the glue is filled in the groove.
Furthermore, the carrier comprises a substrate, an insulator arranged at the top of the substrate and a protruding part arranged at the top of the insulator, the two electrodes are respectively arranged at two sides of the substrate, each electrode comprises a first electrode plate arranged on the upper surface of the substrate, a second electrode plate arranged on the side surface of the substrate and a third electrode plate arranged on the bottom surface of the substrate, and the first electrode plate, the second electrode plate and the third electrode plate are integrally bent and formed.
Furthermore, the two electrodes are respectively a positive electrode and a negative electrode, the tail ends of gold wires close to the protruding portions are welded on the positive electrode, and the LED chips are mounted on the negative electrode.
Adopt above-mentioned technical scheme, design into the bellied form that makes progress with the insulator for the gold thread below is filled out the deformation space of glue volume and glue and is all reduced and then reduce glue and receive the internal stress and the deformation that expend with heat and contract with cold and produce, and then can effectively avoid the gold thread to break from the electrode welding department under the effect of internal stress.
Secondly, because the insulator has adopted the bellied structure that makes progress, consequently increased the bonding area of glue and support, encapsulation glue solidification back colloid inner structure cohesion promotes, reduces risks such as follow-up in the use colloid peels off, gold thread break.
Drawings
FIG. 1 is a schematic structural diagram of the present invention.
Detailed Description
As shown in fig. 1, an LED package structure includes a support 1, an LED chip 2 mounted on the support 1, and a glue 3 encapsulating the LED chip 2.
The support 1 comprises a carrier, two electrodes 7 and an enclosing body 4 arranged around the carrier, the carrier and the enclosing body 4 form a groove for accommodating the LED chip 2, and the glue 3 is filled in the groove. Specifically, the carrier comprises a substrate 5 and an insulator 6 arranged on the top of the substrate 5, the insulator 6 protrudes towards one side of a gold wire 12 of the LED chip 2 and forms a protruding portion 13 close to the gold wire 12, the substrate 5, the insulator 6 and the protruding portion 13 are integrally formed, the two electrodes 7 are respectively a positive electrode and a negative electrode, the two electrodes 7 are respectively arranged on two sides of the substrate 5, the electrodes 7 comprise a first electrode piece 9 arranged on the upper surface of the substrate 5, a second electrode piece 10 arranged on the side surface of the substrate 5 and a third electrode piece 11 arranged on the bottom surface of the substrate 5, the first electrode piece 9, the second electrode piece 10 and the third electrode piece 11 are integrally bent and formed, and the insulator 6 is arranged between the two first electrode pieces 9.
In this embodiment, the LED chip 2 is mounted on the cathode, one gold wire 12 of the LED is connected to the cathode, the other gold wire 12 bypasses the protruding portion 13 and is connected to the anode, and the protruding portion 13 is close to the gold wire 12, so that the glue filling amount below the gold wire 12 and the deformation space of the glue 3 are reduced, and the internal stress and deformation of the glue 3 caused by thermal expansion and contraction are reduced. Specifically, gold thread 12 includes ascending section 14 and descending section 15, and the end and the electrode 7 welding of descending section 15, boss 13 establish in the below of gold thread 12 descending section 15, and the top of boss 13 is downward and the terminal one side slope setting of descending section 15, and the incline direction of boss 13 is unanimous with the trend of gold thread 12, increases the support nature to top gold thread 12.
Preferably, the protruding portion 13 is made of a transparent material, so as to prevent the protruding portion 13 from blocking the transmission of light.
Adopt above-mentioned technical scheme, design into the bellied form that makes progress with insulator 6 for the volume of filling glue and the deformation space of glue 3 all reduce and then reduce glue 3 internal stress and the deformation that produces with expend with heat and contract with cold below gold thread 12, and then can effectively avoid gold thread 12 to break from electrode 7 welding department under the effect of internal stress.
Secondly, because insulator 6 has adopted the bellied structure that makes progress, consequently increased the bonding area of glue 3 with support 1, encapsulation glue 3 solidification back colloid inner structure cohesion promotes, reduces the risk such as follow-up use in-process colloid peels off, gold thread 12 breaks.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications, combinations and variations may be made by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.
Claims (8)
1. The utility model provides a LED packaging structure, includes the support, just adorns the LED chip on the support and encapsulates the glue of LED chip, the support includes two electrodes and establishes the insulator between two electrodes which characterized in that: the insulator is protruding and form the bellying that is close to the gold thread to one side of the gold thread of LED chip, the bellying makes the gold thread below fill out the deformation space of gluey volume and glue and all reduces and then reduce glue and receive the internal stress and the deformation that expend with heat and contract with cold and produce.
2. The LED package structure of claim 1, wherein: the protruding part is made of a transparent material.
3. The LED package structure of claim 1, wherein: the gold thread includes ascending section and descending segment, the end and the electrode welding of descending segment, the bellying is established in the below of gold thread descending segment.
4. The LED package structure of claim 3, wherein: the top of the convex part is arranged downwards and slantwise towards one side of the tail end of the descending section.
5. The LED package structure of claim 1, wherein: the insulator and the boss are integrally formed.
6. The LED package structure of claim 1, wherein: the support comprises a carrier and an enclosing body arranged on the periphery of the carrier, the carrier and the enclosing body form a groove for accommodating the LED chip, and the glue is filled in the groove.
7. The LED package structure of claim 1, wherein: the carrier comprises a substrate, an insulator arranged at the top of the substrate and a protruding part arranged at the top of the insulator, the two electrodes are respectively arranged at two sides of the substrate, the electrodes comprise a first electrode plate arranged on the upper surface of the substrate, a second electrode plate arranged on the side surface of the substrate and a third electrode plate arranged on the bottom surface of the substrate, and the first electrode plate, the second electrode plate and the third electrode plate are integrally bent and formed.
8. The LED package structure of claim 1, wherein: the two electrodes are respectively a positive electrode and a negative electrode, the tail end of the gold wire close to the protruding part is welded on the positive electrode, and the LED chip is installed on the negative electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010555891.2A CN111640841A (en) | 2020-06-17 | 2020-06-17 | LED packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010555891.2A CN111640841A (en) | 2020-06-17 | 2020-06-17 | LED packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111640841A true CN111640841A (en) | 2020-09-08 |
Family
ID=72332579
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010555891.2A Pending CN111640841A (en) | 2020-06-17 | 2020-06-17 | LED packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111640841A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112563399A (en) * | 2020-12-11 | 2021-03-26 | 南通莱士达光电科技有限公司 | Novel LED lamp |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201555172U (en) * | 2009-09-14 | 2010-08-18 | 四川九洲光电科技有限公司 | LED bracket |
| CN102709441A (en) * | 2012-05-24 | 2012-10-03 | 重庆四联光电科技有限公司 | LED (light-emitting diode) packaging structure |
| US20150069428A1 (en) * | 2011-08-18 | 2015-03-12 | Lg Display Co., Ltd. | Light emitting diode package |
| CN206422093U (en) * | 2016-11-25 | 2017-08-18 | 佛山市国星光电股份有限公司 | A kind of high LED support of reliability, LED component and LED display |
-
2020
- 2020-06-17 CN CN202010555891.2A patent/CN111640841A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201555172U (en) * | 2009-09-14 | 2010-08-18 | 四川九洲光电科技有限公司 | LED bracket |
| US20150069428A1 (en) * | 2011-08-18 | 2015-03-12 | Lg Display Co., Ltd. | Light emitting diode package |
| CN102709441A (en) * | 2012-05-24 | 2012-10-03 | 重庆四联光电科技有限公司 | LED (light-emitting diode) packaging structure |
| CN206422093U (en) * | 2016-11-25 | 2017-08-18 | 佛山市国星光电股份有限公司 | A kind of high LED support of reliability, LED component and LED display |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112563399A (en) * | 2020-12-11 | 2021-03-26 | 南通莱士达光电科技有限公司 | Novel LED lamp |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200908 |