JPH01278755A - Lead frame and resin-sealed semiconductor device using the same - Google Patents

Lead frame and resin-sealed semiconductor device using the same

Info

Publication number
JPH01278755A
JPH01278755A JP63109450A JP10945088A JPH01278755A JP H01278755 A JPH01278755 A JP H01278755A JP 63109450 A JP63109450 A JP 63109450A JP 10945088 A JP10945088 A JP 10945088A JP H01278755 A JPH01278755 A JP H01278755A
Authority
JP
Japan
Prior art keywords
groove parts
supporting part
resin
sealing resin
substrate supporting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63109450A
Inventor
Koji Nose
Original Assignee
Matsushita Electron Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electron Corp filed Critical Matsushita Electron Corp
Priority to JP63109450A priority Critical patent/JPH01278755A/en
Publication of JPH01278755A publication Critical patent/JPH01278755A/en
Application status is Pending legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Abstract

PURPOSE: To prevent a peeling from generating between a sealing resin and a substrate supporting part by a method wherein groove parts of a pattern of a meanderlingly crawled form are formed in the rear of the substrate supporting part.
CONSTITUTION: A lead frame, on which a semiconductor chip of a large area is mounted, is set in a metal mold and when a sealing resin 7 is poured in this metal mold, the resin 7 flows in groove parts 3 formed in the rear of a substrate supporting part 2. At this time, as the configurations of the groove parts 3 are a pattern of a meanderlingly crawled form, no gas is caught in the groove parts 3 at the time of encapsulation of the sealing resin. The resin 7 flowed in these groove parts 3 is engaged with the groove parts 3 of the supporting part 2 to prevent the groove parts 3 and the supporting part 2 from slipping from each other and a centralization of a shearing stress, which is generated at the time of heat shrinkage, is dispersed. Thereby, the crack of the place of the sealing resin for sealing a semiconductor device and the peeling of the sealing resin from the substrate supporting part are prevented.
COPYRIGHT: (C)1989,JPO&Japio
JP63109450A 1988-05-02 1988-05-02 Lead frame and resin-sealed semiconductor device using the same Pending JPH01278755A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63109450A JPH01278755A (en) 1988-05-02 1988-05-02 Lead frame and resin-sealed semiconductor device using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63109450A JPH01278755A (en) 1988-05-02 1988-05-02 Lead frame and resin-sealed semiconductor device using the same

Publications (1)

Publication Number Publication Date
JPH01278755A true JPH01278755A (en) 1989-11-09

Family

ID=14510546

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63109450A Pending JPH01278755A (en) 1988-05-02 1988-05-02 Lead frame and resin-sealed semiconductor device using the same

Country Status (1)

Country Link
JP (1) JPH01278755A (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5659952A (en) * 1994-09-20 1997-08-26 Tessera, Inc. Method of fabricating compliant interface for semiconductor chip
US5776796A (en) * 1994-05-19 1998-07-07 Tessera, Inc. Method of encapsulating a semiconductor package
US5915170A (en) * 1994-09-20 1999-06-22 Tessera, Inc. Multiple part compliant interface for packaging of a semiconductor chip and method therefor
US6046076A (en) * 1994-12-29 2000-04-04 Tessera, Inc. Vacuum dispense method for dispensing an encapsulant and machine therefor
US6169328B1 (en) 1994-09-20 2001-01-02 Tessera, Inc Semiconductor chip assembly
US6214640B1 (en) 1999-02-10 2001-04-10 Tessera, Inc. Method of manufacturing a plurality of semiconductor packages
US6232152B1 (en) 1994-05-19 2001-05-15 Tessera, Inc. Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures
US6303985B1 (en) * 1998-11-12 2001-10-16 Micron Technology, Inc. Semiconductor lead frame and package with stiffened mounting paddle
US6359335B1 (en) 1994-05-19 2002-03-19 Tessera, Inc. Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures
US6686015B2 (en) 1996-12-13 2004-02-03 Tessera, Inc. Transferable resilient element for packaging of a semiconductor chip and method therefor
US6870272B2 (en) 1994-09-20 2005-03-22 Tessera, Inc. Methods of making microelectronic assemblies including compliant interfaces
US7112879B2 (en) 1995-10-31 2006-09-26 Tessera, Inc. Microelectronic assemblies having compliant layers
US7215010B2 (en) * 2000-03-03 2007-05-08 Infineon Technologies Ag Device for packing electronic components using injection molding technology
US7665101B2 (en) * 2005-06-20 2010-02-16 Sanyo Electric Co., Ltd. Optical pickup apparatus

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6359335B1 (en) 1994-05-19 2002-03-19 Tessera, Inc. Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures
US5776796A (en) * 1994-05-19 1998-07-07 Tessera, Inc. Method of encapsulating a semiconductor package
US6232152B1 (en) 1994-05-19 2001-05-15 Tessera, Inc. Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures
US6870272B2 (en) 1994-09-20 2005-03-22 Tessera, Inc. Methods of making microelectronic assemblies including compliant interfaces
US6723584B2 (en) 1994-09-20 2004-04-20 Tessera, Inc. Methods of making microelectronic assemblies including compliant interfaces
US6133639A (en) * 1994-09-20 2000-10-17 Tessera, Inc. Compliant interface for semiconductor chip and method therefor
US6169328B1 (en) 1994-09-20 2001-01-02 Tessera, Inc Semiconductor chip assembly
US6525429B1 (en) 1994-09-20 2003-02-25 Tessera, Inc. Methods of making microelectronic assemblies including compliant interfaces
US5915170A (en) * 1994-09-20 1999-06-22 Tessera, Inc. Multiple part compliant interface for packaging of a semiconductor chip and method therefor
US6521480B1 (en) 1994-09-20 2003-02-18 Tessera, Inc. Method for making a semiconductor chip package
US5659952A (en) * 1994-09-20 1997-08-26 Tessera, Inc. Method of fabricating compliant interface for semiconductor chip
US6126428A (en) * 1994-12-29 2000-10-03 Tessera, Inc. Vacuum dispense apparatus for dispensing an encapsulant
US6046076A (en) * 1994-12-29 2000-04-04 Tessera, Inc. Vacuum dispense method for dispensing an encapsulant and machine therefor
US7112879B2 (en) 1995-10-31 2006-09-26 Tessera, Inc. Microelectronic assemblies having compliant layers
US6686015B2 (en) 1996-12-13 2004-02-03 Tessera, Inc. Transferable resilient element for packaging of a semiconductor chip and method therefor
US6303985B1 (en) * 1998-11-12 2001-10-16 Micron Technology, Inc. Semiconductor lead frame and package with stiffened mounting paddle
US6214640B1 (en) 1999-02-10 2001-04-10 Tessera, Inc. Method of manufacturing a plurality of semiconductor packages
US7215010B2 (en) * 2000-03-03 2007-05-08 Infineon Technologies Ag Device for packing electronic components using injection molding technology
US7665101B2 (en) * 2005-06-20 2010-02-16 Sanyo Electric Co., Ltd. Optical pickup apparatus
US7934226B2 (en) 2005-06-20 2011-04-26 Sanyo Electric Co., Ltd. Optical pickup apparatus

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