CN209929278U - Silicon wafer flower basket - Google Patents
Silicon wafer flower basket Download PDFInfo
- Publication number
- CN209929278U CN209929278U CN201921131908.0U CN201921131908U CN209929278U CN 209929278 U CN209929278 U CN 209929278U CN 201921131908 U CN201921131908 U CN 201921131908U CN 209929278 U CN209929278 U CN 209929278U
- Authority
- CN
- China
- Prior art keywords
- silicon wafer
- silicon chip
- internal partition
- clamping
- placing
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 82
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 81
- 239000010703 silicon Substances 0.000 title claims abstract description 81
- 238000005192 partition Methods 0.000 claims abstract description 48
- 230000005661 hydrophobic surface Effects 0.000 claims abstract description 8
- 239000004033 plastic Substances 0.000 claims description 3
- 229920003023 plastic Polymers 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 5
- 238000001035 drying Methods 0.000 abstract description 3
- 239000003292 glue Substances 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 42
- 239000002184 metal Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 239000002131 composite material Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 229920001600 hydrophobic polymer Polymers 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000002121 nanofiber Substances 0.000 description 1
- 231100000956 nontoxicity Toxicity 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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Abstract
The utility model discloses a silicon chip basket of flowers, it belongs to solar cell technical field, include: an outer frame body provided with a placing space in which a silicon wafer can be placed; the internal partition plates are arranged in the placing space in parallel and at intervals, a silicon wafer placing position is formed between every two adjacent internal partition plates, and the surfaces of the internal partition plates are hydrophobic surfaces. The utility model provides a silicon chip basket of flowers through set up a plurality of inside baffles in the space of placing of silicon chip, forms the position of placing of a slice silicon chip between two adjacent inside baffles, and adjacent silicon chip can not take place direct contact, thoroughly solves the bonding problem of silicon chip, and the surface of inside baffle is the hydrophobicity surface, and its surface can not adhere to there is the drop of water, can avoid the silicon chip to glue drying and the silicon chip surface quality that influences the silicon chip on the back on the inside baffle.
Description
Technical Field
The utility model relates to a solar cell technical field especially relates to a silicon chip basket of flowers.
Background
Solar energy is increasingly used as the cleanest renewable resource. Solar cells use solar energy to generate electricity. Silicon solar cells are one of the solar cells, and most of the commercialized solar cells are currently made of silicon wafers based on the advantages of non-toxicity, low price and large reserves in the earth's crust.
With the continuous development of solar silicon wafer battery technology, the size of the silicon wafer is more diversified, and the thickness of the silicon wafer is smaller. When an extremely thin silicon wafer is placed in a basket for cleaning, two adjacent silicon wafers are easily adsorbed together under the action of the tension of water attached to the surfaces of the silicon wafers, so that the silicon wafers are stuck, and the adsorbed silicon wafers cannot be quickly dried when the silicon wafers are dried; the silicon wafers adsorbed together are easy to be polluted, so that the silicon wafers have higher loss rate, and the production cost is increased.
Therefore, a silicon wafer basket is needed to solve the above problems.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a silicon chip basket of flowers to solve the technical problem who takes place the bonding die easily when placing the silicon chip and wasing in the basket of flowers that exist among the prior art.
As the conception, the utility model adopts the technical proposal that:
a silicon wafer basket, comprising:
an outer frame body provided with a placing space in which a silicon wafer can be placed;
the internal partition plates are arranged in the placing space in parallel at intervals, a piece of placing space for the silicon wafer is formed between every two adjacent internal partition plates, and the surface of each internal partition plate is a hydrophobic surface.
Wherein the outer frame body includes:
the two end parts are arranged in parallel and at intervals;
the two ends of the side part are respectively connected with one end part, and the two side parts which are parallel and arranged at intervals are arranged between the two end parts;
the internal partition is connected to the side portion.
Wherein the distance between the two side portions is adjustable.
Wherein the end portion comprises a first part and a second part which are sleeved, one side portion is connected with the first part, the other side portion is connected with the second part, and the sleeved length of the first part and the second part is adjustable to adjust the distance between the two side portions.
Wherein the first part and the second part are slidably sleeved and locked through a locking piece.
The side part is provided with a clamping groove for installing the internal partition plate, and the internal partition plate can be clamped in the clamping groove.
The clamping groove is formed in the side portion, a plurality of protruding groups are arranged on the side portion at intervals, each protruding group comprises two clamping protrusions, and a gap is formed between the clamping protrusions to form the clamping groove.
The clamping protrusion is arranged along the circumferential direction of the side part to form a clamping groove extending along the circumferential direction of the side part.
The inner partition board is in an I shape and comprises a partition body and clamping strips arranged at two ends of the partition body, and the end head parts of the clamping strips can be clamped in the clamping grooves.
Wherein, the material of inside baffle is plastics.
The utility model provides a silicon chip basket of flowers through set up a plurality of inside baffles in the space of placing of silicon chip, forms the position of placing of a slice silicon chip between two adjacent inside baffles, and direct contact can not take place for adjacent silicon chip to thoroughly solve the bonding problem of silicon chip, and the surface of inside baffle is the hydrophobicity surface, and its surface can not adhere to there is the drop of water, can avoid the silicon chip to glue drying and the silicon chip surface quality that influences the silicon chip on the back to inside baffle.
Drawings
FIG. 1 is a top view of a silicon wafer basket according to an embodiment of the present invention;
fig. 2 is a top view of an outer frame provided by an embodiment of the present invention;
FIG. 3 is an enlarged view at A in FIG. 1;
fig. 4 is a front view of an internal partition according to an embodiment of the present invention.
In the figure:
1. an outer frame; 11. an end portion; 12. a side portion; 121. clamping the bulges;
2. an internal partition; 21. a separator; 22. and (6) clamping the strip.
Detailed Description
In order to make the technical problem solved by the present invention, the technical solution adopted by the present invention and the technical effect achieved by the present invention clearer, the technical solution of the present invention will be further explained by combining the drawings and by means of the specific implementation manner. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some but not all of the elements related to the present invention are shown in the drawings.
When placing in the basket of flowers and wasing in order to thoroughly solve the silicon chip, very easily adsorb together, take place the bonding problem because of the tension of the surface-attached drop of water between the two adjacent silicon chips, this embodiment provides a silicon chip basket of flowers.
Referring to fig. 1 and 2, the silicon wafer basket includes an outer frame 1 and an inner partition 2.
The outer frame body 1 is provided with a placing space for placing a silicon wafer; in the space is placed to a plurality of inside baffle 2 parallel and interval locate, form the position of placing of a slice silicon chip between two adjacent inside baffle 2, the surface of inside baffle 2 is the hydrophobicity surface. Due to the arrangement of the internal partition plate 2, two adjacent silicon wafers cannot be in direct contact, so that the wafer sticking phenomenon of the silicon wafers is avoided; the surface of the internal partition plate 2 is set to be a hydrophobic surface, so that the phenomenon that the silicon wafer is adhered to the internal partition plate 2 after water drops are attached to the internal partition plate 2 to influence the drying of the silicon wafer and the surface quality of the silicon wafer can be avoided.
In order to make the surface of the inner partition 2 a hydrophobic surface, optionally, the material of the inner partition 2 is plastic, such as teflon; of course, in other embodiments, the surface of the internal separator 2 may be a very hydrophobic surface, and specifically, the internal separator 2 may include a metal substrate, the surface of the metal substrate is treated to form a very hydrophobic surface, for example, the metal substrate is anodized to form a ceramic layer of a composite structure of a microstructure and a nanofiber structure on the surface of the metal substrate, and a hydrophobic polymer substance is applied on the composite structure to form a polymer layer having the same surface shape as the composite structure, so that the surface of the metal substrate forms the very hydrophobic surface.
Further, the outer frame 1 includes an end portion 11 and a side portion 12. Specifically, the outer frame 1 includes end portions 11 at both ends and side portions 12 at both sides. The two end parts 11 are arranged in parallel and at intervals; two ends of the side part 12 are respectively connected with one end part 11, two parallel side parts 12 are arranged between the two end parts 11 at intervals, and the internal clapboard 2 is connected with the side part 12. Optionally, the side 12 is connected perpendicular to the end 11.
Further, the external frame 1 further comprises a bearing part which is located below the whole external frame 1, and when the silicon wafer is placed in the placing space, the bearing part located below can bear the silicon wafer, so that the silicon wafer is prevented from sliding down from the internal of the external frame. Specifically, the receiving portion may be rod-shaped, parallel to the side portion 12 and connected at both ends to the end portion 11, or parallel to the end portion 11 and connected at both ends to the side portion; of course, the receiving portion may be plate-shaped and have a through hole. As long as the bearing part can bear the silicon wafer, the silicon wafer is prevented from sliding from the outer frame body, and the shape of the silicon wafer is not limited too much.
Specifically, the cross-section of the end portion 11 and the side portion 12 may be square or circular, and may be designed by a designer according to the needs without being limited thereto.
When the silicon wafers are cleaned, the silicon wafers of each specification and size need to be manufactured into flower baskets corresponding to the sizes of the silicon wafers. Once the size of the silicon wafer is upgraded and changed, the flower basket manufactured in the prior art cannot adapt to the upgraded silicon wafer, so that waste is easily caused, and the production cost is increased. In order to adapt the same silicon wafer basket to silicon wafers of different sizes, the distance between the two side portions 12 is adjustable in this embodiment.
In particular, in the present embodiment, in order to achieve the adjustment of the distance between the two side portions 12, the end portion 11 comprises a first part and a second part which are sleeved, one side portion 12 is connected with the first part, and the other side portion 12 is connected with the second part. The socket length of the first and second members is adjustable to adjust the distance between the two side portions 12. Optionally, the first part and the second part are slidably sleeved and locked by the locking part; the locking piece penetrates through the locking hole and can abut against the first part to lock the first part and the second part; of course, in other embodiments, the second member may be sleeved in the first member, the first member is provided with a locking hole, and the locking member passes through the locking hole and abuts against the second member to lock the first member and the second member. Specifically, the locking hole is a threaded hole, and the locking piece is selected to be a bolt.
Of course, in other embodiments, the end portion 11 may include at least three sleeved components, such as a first component, a second component, and a third component, the first component and the third component are sleeved on two ends of the second component respectively, the sleeved length of the first component and the second component is adjustable, the sleeved length of the third component and the second component is also adjustable, one side portion 12 is connected with the first component, and the other side portion 12 is connected with the third component, and the arrangement is such that the adjustment range is larger.
When the cross-section of the end portion 11 is circular, the first and second parts may also be screwed to enable adjustment of the distance between the two side portions 12. When the first member and the second member are screwed, the side portion 12 and the end portion 11 need to be detachably connected, for example, an installation groove capable of installing the side portion 12 is formed on the end portion 11.
When adjusting the distance between the two sides 12, it is necessary to remove the internal partition 2. In order to conveniently dismantle the internal partition board 2, in the embodiment, the side portion 12 is provided with a clamping groove for installing the internal partition board 2, the internal partition board 2 can be clamped in the clamping groove, and when the internal partition board 2 needs to be removed, the internal partition board 2 is pulled out from the clamping groove.
Referring to fig. 3, specifically, a plurality of protrusion sets are spaced apart from each other on the side portion 12, each protrusion set includes two clamping protrusions 121, and a gap is formed between the two clamping protrusions 121 to form a clamping groove. Alternatively, the shape of the catching protrusion 121 is a rectangular parallelepiped, a cube, a sphere, or an ellipsoid. The clamping protrusion 121 can be integrally formed with the side portion 12, or can be adhered to the surface of the side portion 12; the clamping protrusion 121 can be stuck on one surface of the side part 12, and can also be stuck around the circumference of the side part 12; specifically, in the present embodiment, the latching protrusion 121 is disposed along the circumferential direction of the side portion 12 to form a latching groove extending along the circumferential direction of the side portion 12, and the orientation of the latching protrusion 121 on the side portion 12 does not need to be selected when the side portion 12 is installed.
When the distance between the two side portions 12 needs to be adjusted, the internal partition 2 of the corresponding specification can be selected according to the distance between the two side portions 12.
Of course, it is also possible to design the internal partition 2 in a structure that allows the length of the internal partition 2 itself to be adjusted according to the distance between the two sides 12. Referring to fig. 4, optionally, the internal partition board 2 is "i" shaped, and includes a partition body 21 and clamping strips 22 disposed at two ends of the partition body 21, and the end heads of the clamping strips 22 can be clamped in the clamping grooves. The length of the clamping strip 22 is the same as the distance between the two side portions 12. After the structure of the outer frame body 1 is fixed, the inner partition board 2 is pushed into the clamping groove from top to bottom. After the silicon wafers are placed, the separating body 21 is just positioned between the two adjacent silicon wafers, so that the silicon wafers are prevented from being stuck. The internal partition board 2 is designed to be I-shaped, so that the material is saved, and the disassembly and the assembly are convenient. Further, the clip strip 22 is designed to be of a length-adjustable structure; alternatively, the ends of the clamping strip 22 are provided with a multi-sleeved telescopic structure, so that the length of the internal partition 2 can be adjusted to adapt to the distance between the two side parts 12.
Of course, in other embodiments, the internal partition 2 may be rectangular, and is not limited to this.
The above embodiments have been described only the basic principles and features of the present invention, and the present invention is not limited by the above embodiments, and is not departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (10)
1. A silicon wafer basket, comprising:
an outer frame (1) provided with a placement space in which a silicon wafer can be placed;
the silicon wafer placing device comprises internal partition plates (2), wherein the internal partition plates (2) are arranged in the placing space in parallel at intervals, a silicon wafer placing position is formed between every two adjacent internal partition plates (2), and the surfaces of the internal partition plates (2) are hydrophobic surfaces.
2. Silicon wafer basket according to claim 1, characterized in that the outer frame (1) comprises:
end portions (11), the two end portions (11) being arranged in parallel and at intervals;
the two ends of the side part (12) are respectively connected with one end part (11), and the two side parts (12) which are parallel and arranged at intervals are arranged between the two end parts (11);
the inner partition (2) is connected to the side (12).
3. Silicon wafer basket according to claim 2, characterized in that the distance between the two side portions (12) is adjustable.
4. Silicon wafer basket according to claim 3, characterized in that said end portion (11) comprises a first and a second nested part, one of said side portions (12) being connected to said first part and the other of said side portions (12) being connected to said second part, the nesting length of said first and second parts being adjustable to adjust the distance between the two side portions (12).
5. The silicon wafer basket of claim 4, wherein the first member and the second member are slidably received and secured by a retaining member.
6. The silicon wafer basket according to any one of claims 2 to 5, wherein the side portion (12) is provided with a slot for mounting the internal partition (2), and the internal partition (2) can be clamped in the slot.
7. The silicon wafer basket according to claim 6, wherein the side portion (12) is provided with a plurality of protrusion sets at intervals, each protrusion set comprises two clamping protrusions (121), and a gap is formed between the two clamping protrusions (121) to form the clamping groove.
8. The silicon wafer basket according to claim 7, wherein the clamping protrusions (121) are arranged along the circumference of the side portion (12) to form the clamping grooves extending along the circumference of the side portion (12).
9. The silicon wafer basket according to claim 7, wherein the inner partition (2) is I-shaped and comprises a partition (21) and clamping strips (22) arranged at two ends of the partition (21), and the end parts of the clamping strips (22) can be clamped in the clamping grooves.
10. The silicon wafer basket according to any one of claims 1 to 5, wherein the inner partition (2) is made of plastic.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921131908.0U CN209929278U (en) | 2019-07-18 | 2019-07-18 | Silicon wafer flower basket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921131908.0U CN209929278U (en) | 2019-07-18 | 2019-07-18 | Silicon wafer flower basket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209929278U true CN209929278U (en) | 2020-01-10 |
Family
ID=69093893
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921131908.0U Expired - Fee Related CN209929278U (en) | 2019-07-18 | 2019-07-18 | Silicon wafer flower basket |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209929278U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116581063A (en) * | 2023-05-29 | 2023-08-11 | 宁夏中欣晶圆半导体科技有限公司 | Silicon wafer etching tool and silicon wafer etching method |
-
2019
- 2019-07-18 CN CN201921131908.0U patent/CN209929278U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116581063A (en) * | 2023-05-29 | 2023-08-11 | 宁夏中欣晶圆半导体科技有限公司 | Silicon wafer etching tool and silicon wafer etching method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: No. 199, deer mountain road, Suzhou high tech Zone, Jiangsu Province Patentee after: CSI CELLS Co.,Ltd. Patentee after: ARTES PHOTOVOLTAIC POWER (LUOYANG) Co.,Ltd. Patentee after: Atlas sunshine Power Group Co.,Ltd. Address before: No. 199, deer mountain road, Suzhou high tech Zone, Jiangsu Province Patentee before: CSI Cells Co.,Ltd. Patentee before: ARTES PHOTOVOLTAIC POWER (LUOYANG) Co.,Ltd. Patentee before: CSI SOLAR POWER GROUP Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200110 Termination date: 20210718 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |