CN209914226U

CN209914226U - Chip taking device

Info

Publication number: CN209914226U
Application number: CN201822149913.6U
Authority: CN
Inventors: 宋学祁; 李翔; 许志超
Original assignee: Hongfu Precision Industry (Shenzhen) Co Ltd
Current assignee: Fulian Yuzhan Technology Shenzhen Co Ltd
Priority date: 2018-12-20
Filing date: 2018-12-20
Publication date: 2020-01-07
Anticipated expiration: 2028-12-20

Abstract

The utility model provides a get core piece device for move and get unqualified chip on the circuit board, get core piece device including bearing and driving the feed mechanism that the circuit board removed, hot melt mechanism and feeding mechanism, hot melt mechanism includes support frame and hot melt spare, the hot melt spare sets up and can follow the support frame motion with the feed mechanism interval, with distance between adjustment and the feed mechanism, the hot melt spare is used for sending the ray and assembles the fixed material with hot melt rigid coupling chip and circuit board on the chip, feeding mechanism is used for moving the chip after the hot melt on the circuit board. The utility model discloses the utilization can make the chip be convenient for separate from the circuit board under the condition of not destroying the circuit board with the heat gather into the fixed material of the hot melt rigid coupling chip of punctiform and circuit board, and utilizes the extracting mechanism to absorb the chip, has improved the efficiency and the yield of operation.

Description

Chip taking device

Technical Field

The utility model relates to a circuit board processing technology field, especially a get core piece device.

Background

During the production of circuit boards, the chips are typically secured to the circuit board by a securing material, such as solder or glue. When the chip on the circuit board is detected to be defective, the defective chip needs to be removed, the current method for removing the chip is to manually heat the chip by using a hot air gun and then clamp the chip by using tweezers, but the heating temperature and time are difficult to control, the circuit board and the good chips around the defective chip can be damaged when the heating time is long, and the manual operation intensity is high, the efficiency is low and the qualified rate is unstable.

SUMMERY OF THE UTILITY MODEL

In view of the above, it is desirable to provide a coring sheet device that solves the problems of low efficiency and unstable yield of coring sheet operation.

The utility model provides a get core piece device for move and get unqualified chip on circuit board, bear and drive including ability the feeding mechanism that the circuit board removed, it still includes hot melt mechanism and feeding mechanism to get the chip device, hot melt mechanism includes support frame and hot melt spare, the hot melt spare with the feeding mechanism interval sets up and can follow the support frame motion, in order to adjust with distance between the feeding mechanism, the hot melt spare be used for sending the ray and assemble in with the hot melt rigid coupling on the chip with the fixed material of circuit board, feeding mechanism is used for moving and gets on the circuit board behind the hot melt the chip.

Further, the thermal melting member is an infrared semiconductor laser for emitting infrared rays and forming a dot-shaped or linear region on the chip.

Further, hot melt mechanism still includes and is used for adjusting hot melt spare with the regulating part of the distance between the feed mechanism, the regulating part includes lead screw, regulating wheel, screw nut and slider, the regulating wheel with lead screw connection locates on the support frame, screw nut with lead screw thread fit, the slider is fixed in on the screw nut, hot melt spare is located on the slider, rotate the regulating wheel enables the lead screw rotates, so that screw nut takes the slider motion.

Furthermore, the adjusting part further comprises a guide rod and a guide block, the guide rod is arranged on the support frame and is positioned on one side of the screw rod, the guide block is sleeved on the guide rod and can slide along the guide rod, and the sliding part is connected with the guide block to move along the guide rod so as to drive the hot melting part to move relative to the feeding mechanism.

Furthermore, the feeding mechanism comprises a first driving part, a first guide part and a material bearing part, the first guide part is positioned on one side of the supporting frame, and the material bearing part is arranged on the first guide part and can move along the first guide part under the driving of the first driving part.

Furthermore, the material taking mechanism comprises a suction nozzle and a suction nozzle driving part, the suction nozzle is used for sucking the chip on the circuit board, and the suction nozzle driving part is used for driving the suction nozzle to move.

Further, the material taking mechanism further comprises a moving and carrying part and a sliding frame, the moving and carrying part is arranged on one side, away from the hot melting mechanism, of the first guide part, the sliding frame is arranged on the moving and carrying part and can be driven by the moving and carrying part to one side of the material bearing part, and the suction nozzle driving part are arranged on one side, close to the first guide part, of the sliding frame.

Furthermore, the transfer part comprises a second driving part, a second guiding part, a third driving part and a third guiding part, the second guiding part is arranged on one side, away from the hot melting mechanism, of the first guiding part, the third guiding part is connected to the second guiding part and can move along the second guiding part under the driving of the second driving part, and the sliding frame is arranged on the third guiding part and can move along the third guiding part under the driving of the third driving part.

Furthermore, the chip taking device further comprises a waste material box, wherein the waste material box is arranged on one side of the feeding mechanism and used for recovering the chips taken down by the taking mechanism.

Furthermore, the chip taking device also comprises a control mechanism for controlling the time and the temperature of the hot melting piece for hot melting the chip.

Compared with the prior art, the utility model discloses the utilization can make the chip be convenient for separate from the circuit board under the condition of not destroying the circuit board with the heat gather into the fixed material of the hot melt rigid coupling chip of punctiform and circuit board, and utilizes the extracting mechanism to absorb the chip, has improved the efficiency and the yield of operation.

Drawings

Fig. 1 is a schematic perspective view of a coring sheet device according to an embodiment of the present invention.

Fig. 2 is a partial perspective view of the coring blade device provided in fig. 1.

Description of the main elements

The following detailed description of the invention will be further described in conjunction with the above-identified drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

It will be understood that when an element or component is referred to as being "connected" to another element or component, it can be directly connected to the other element or component or intervening elements or components may also be present. When an element or component is referred to as being "disposed on" another element or component, it can be directly on the other element or component or intervening elements or components may also be present.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1 and 2, an embodiment of the present invention provides a coring apparatus 100 for removing an unqualified chip 210 on a circuit board 200, wherein the chip 210 is generally fixed on the circuit board 200 by a fixing material, such as solder and glue. The coring blade device 100 includes a base plate 10, a feeding mechanism 20, a heat-staking mechanism 30, and a take-out mechanism 40. The feeding mechanism 20, the hot melting mechanism 30 and the material taking mechanism 40 are all installed on one side of the bottom plate 10, and the hot melting mechanism 30 and the material taking mechanism 40 are respectively located on two sides of the feeding mechanism 20.

The feeding mechanism 20 includes a first driving member 21, a first guiding member 22 and a material receiving member 23. The first guide 22 is fixed to the base plate 10. The material receiving member 23 is provided on the first guide member 22, and is used to fix the circuit board 200 provided with the chip 210. The first driving member 21 is used for driving the material-bearing member 23 to move along the first guiding member 22.

The thermal melting mechanism 30 includes a support frame 31 and a thermal melting element 32. The supporting frame 31 is fixed on the base plate 10 and located at one side of the first guide 22. The thermal melting member 32 is disposed on the supporting frame 31 and spaced apart from the material supporting member 23 for emitting high-energy radiation to converge on the chip 210, so that the fixing material is melted from a solid state to a liquid state, so as to separate the chip 210 from the circuit board 200. In the embodiment, the thermal fuse 32 is an infrared semiconductor laser, and the thermal fuse has a thermal fusing temperature of 217 ℃ or higher, so as to emit infrared rays and form a dot-shaped or linear high-energy region on the chip 210, thereby facilitating the separation of the chip 210 to be removed from the circuit board 200 without damaging the circuit board 200 and the chip 210 around the chip 210 to be removed.

Preferably, the fuse mechanism 30 further includes an adjusting member 33 for adjusting a distance of the fuse 32 with respect to the material receiving member 23. The adjusting member 33 includes a screw 331, an adjusting wheel 332, a screw nut (not shown), a guide rod 333, a guide block 334, and a sliding member 335. The adjusting wheel 332 is connected with the lead screw 331 and is arranged on the support frame 31. The lead screw nut is screw-engaged with the lead screw 331. The guide rod 333 is disposed on the support frame 31 and located at one side of the lead screw 331, and extends perpendicular to the base plate 10. The guide block 334 is sleeved on the guide rod 333 and can slide along the guide rod 333. The guide block 334 is integrally formed with the lead screw nut. The sliding member 335 is fixed to the lead screw nut and the guide block 334, and the hot melt member 32 is provided on the sliding member 335. The adjustment wheel 332 is rotated to rotate the lead screw 331 so that the lead screw nut and the guide block 334 carry the sliding member 335 along the guide rod 333, and the sliding member 335 carries the thermal melting member 32 along the supporting frame 31 and moves relative to the first guide member 22.

The material taking mechanism 40 includes a transfer member 41, a carriage 42, a suction nozzle 43, and a suction nozzle driving member 44. The transfer member 41 is provided on a side of the first guide 22 away from the heat fusing mechanism 30. The sliding rack 42 is disposed on the transfer member 41 and can be driven by the transfer member 41 to a position directly above the material receiving member 23. The suction nozzle 43 and the suction nozzle driving unit 44 are disposed on a side of the carriage 42 close to the first guiding unit 22, and the suction nozzle driving unit 44 can drive the suction nozzle 43 to suck the melted chip 210 on the circuit board 200 on the material supporting unit 23.

Specifically, the transfer member 41 includes a second driver 411, a second guide 412, a third driver 413, and a third guide 414. The second guide 412 is disposed on a side of the first guide 22 away from the heat-fusing mechanism 30, and is parallel to the first guide 22. The third guide 414 is vertically connected to the second guide 412 and can move along the second guide 412 by the second driving member 411. The sliding frame 42 is disposed on the third guiding member 414 and can move along the third guiding member 414 under the driving of the third driving member 413, so as to drive the suction nozzle 43 and the suction nozzle driving member 44 to move in the extending direction of the third guiding member 414.

Preferably, the coring blade device 100 also includes a waste magazine 50. The waste bin 50 may be disposed on one side of the first guide 22 for recovering the chips 210 removed by the material extracting mechanism 40.

Specifically, the coring blade device 100 also includes a control mechanism (not shown) for controlling the time and temperature at which the hot melt 32 melts the securing material of the chip 210. The hot melting time and temperature can be set according to actual conditions, for example, a non-plated chip soldered on a circuit board by soldering tin needs to be hot melted at the hot melting temperature of 217 ℃ for 15 seconds; the glass-coated chip soldered to the circuit board by solder is generally heat-melted at a heat-melting temperature of 217 ℃ for 20 seconds.

In operation, the first driving member 21 drives the material supporting member 23 carrying the circuit board 200 to move to a position right below the thermal melting member 32 along the first guiding member 22, the thermal melting member 32 performs thermal melting on the chip 210 on the circuit board 200 on the material supporting member 23, the second driving member 411 drives the third guiding member 414 to move to a position corresponding to the material supporting member 23 along the second guiding member 412, the third driving member 413 drives the carriage 42 to a position above the material supporting member 23, the suction nozzle driving member 44 drives the suction nozzle 43 to suck the chip 210 on the circuit board 200 on the material supporting member 23, the second driving member 411 drives the third guiding member 414 to move to a position corresponding to the waste material box 50 along the second guiding member 412, and the suction force of the suction nozzle 43 is turned off to make the chip 210 fall into the waste material box 50.

In the present embodiment, the coring blade device 100 includes the base plate 10, but is not limited thereto, and it is understood that in other embodiments, the feeding mechanism 20, the heat-melting mechanism 30 and the material-taking mechanism 40 may be respectively disposed on a workbench.

In the present embodiment, the adjusting member 33 includes a screw 331, an adjusting wheel 332 and a screw nut, and the adjusting wheel 332 is rotated to rotate the screw 331 so that the screw nut carries the sliding member 335 to move along the guiding rod 333, it is understood that in other embodiments, the screw 331, the adjusting wheel 332 and the screw nut may have other driving structures, such as a linear cylinder, as long as the sliding member 335 carries the thermal melting member 32 to move along the guiding rod 333.

In this embodiment, the adjusting member 33 includes a guiding rod 333 and a guiding block 334, the guiding block 334 is sleeved on the guiding rod 333 and can slide along the guiding rod 333, and the sliding member 335 is disposed on the integrally formed screw nut and guiding block 334 to move along the guiding rod 333, it is understood that in other embodiments, the guiding rod 333 and guiding block 334 may be omitted, and the sliding member 335 is disposed on the screw nut to move along the screw 331.

Compared with the prior art, the utility model discloses the utilization can make chip 210 be convenient for separate from circuit board 200 under the condition of not destroying circuit board 200 with the heat gather into the fixed material of the 32 hot melt rigid coupling chips 210 of punctiform and circuit board 200 of heat, and utilize extracting mechanism 40 to absorb chip 210, improved the efficiency and the yield of operation.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned. Furthermore, it is obvious that the word "comprising" does not exclude other elements or steps, and the singular does not exclude the plural.

Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention and not for limiting, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.

Claims

1. The utility model provides a get core piece device for move the chip on getting the circuit board, include and be used for bearing and drive the feeding mechanism that the circuit board removed, its characterized in that: get chip device and still include hot melt mechanism and feeding mechanism, hot melt mechanism includes support frame and hot melt spare, the hot melt spare with feeding mechanism interval sets up and can follow the support frame motion, with the adjustment with distance between the feeding mechanism, the hot melt spare be used for sending the ray and assemble in on the chip, with the hot melt rigid coupling the chip with the fixed material of circuit board, feeding mechanism locates one side is in order to move and gets the last hot melt of circuit board after the chip.

2. The coring sheet device of claim 1, wherein: the hot melting piece is an infrared semiconductor laser and is used for emitting infrared rays and converging the infrared rays on the chip to form a dot-shaped or linear area.

3. The coring sheet device of claim 1, wherein: the hot melting mechanism further comprises an adjusting piece for adjusting the distance between the hot melting piece and the feeding mechanism, the adjusting piece comprises a lead screw, an adjusting wheel, a lead screw nut and a sliding piece, the adjusting wheel is connected with the lead screw and arranged on the supporting frame, the lead screw nut is in threaded fit with the lead screw, the sliding piece is fixed on the lead screw nut, the hot melting piece is arranged on the sliding piece, the adjusting wheel is rotated to enable the lead screw to rotate, and the lead screw nut is driven by the sliding piece to move.

4. The coring sheet device of claim 3, wherein: the adjusting part further comprises a guide rod and a guide block, the guide rod is arranged on the support frame and located on one side of the lead screw, the guide block is sleeved on the guide rod and can slide along the guide rod, and the sliding part is connected with the guide block to move along the guide rod so as to drive the hot melting part to move relative to the feeding mechanism.

5. The coring sheet device of claim 1, wherein: the feeding mechanism comprises a first driving piece, a first guide piece and a material bearing piece, the first guide piece is located on one side of the supporting frame, and the material bearing piece is arranged on the first guide piece and can move along the first guide piece under the driving of the first driving piece.

6. The coring sheet device of claim 5, wherein: the material taking mechanism comprises a suction nozzle and a suction nozzle driving piece, the suction nozzle is used for sucking the chips after hot melting on the circuit board, and the suction nozzle driving piece is used for driving the suction nozzle to move.

7. The coring sheet device of claim 6, wherein: the material taking mechanism further comprises a moving and carrying part and a sliding frame, the moving and carrying part is arranged on one side, away from the hot melting mechanism, of the first guide part, the sliding frame is arranged on the moving and carrying part and can be driven by the moving and carrying part to one side of the material bearing part, and the suction nozzle driving part are arranged on one side, close to the sliding frame, of the first guide part.

8. The coring sheet device of claim 7, wherein: the transfer part comprises a second driving part, a second guiding part, a third driving part and a third guiding part, the second guiding part is arranged on one side, away from the hot melting mechanism, of the first guiding part, the third guiding part is connected to the second guiding part and can move along the second guiding part under the driving of the second driving part, and the sliding frame is arranged on the third guiding part and can move along the third guiding part under the driving of the third driving part.

9. The coring sheet device of claim 1, wherein: the chip taking device further comprises a waste material box, wherein the waste material box is arranged on one side of the feeding mechanism and used for recycling the chips taken down by the taking mechanism.

10. The coring sheet device of claim 1, wherein: the chip taking device further comprises a control mechanism used for controlling the time and the temperature of the hot melting piece for hot melting the fixing material of the chip.