CN213702101U - Laser soldering mechanism - Google Patents
Laser soldering mechanism Download PDFInfo
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- CN213702101U CN213702101U CN202022344995.7U CN202022344995U CN213702101U CN 213702101 U CN213702101 U CN 213702101U CN 202022344995 U CN202022344995 U CN 202022344995U CN 213702101 U CN213702101 U CN 213702101U
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Abstract
The utility model discloses a laser soldering tin mechanism, it includes: the module fixing plate, the Z-axis linear module, the laser soldering tin assembly and the camera module are arranged on the module fixing plate; the Z-axis straight line module is arranged on the module fixing plate, the laser soldering tin assembly is arranged on the Z-axis straight line module, the camera module is arranged on the Z-axis straight line module on one side of the laser soldering tin assembly, and the Z-axis straight line module drives the laser soldering tin assembly and the camera module to move in a Z-axis direction in a reciprocating mode. The utility model discloses laser soldering tin mechanism soldering tin position is accurate, product terminal soldering cup surface does not have the solder to remain and not damaged surface gold plating layer, can not harm other positions of product yet, can ensure product processing quality, adopts automation equipment to replace manual operation, can improve product yield and production efficiency.
Description
Technical Field
The utility model relates to an electronic product's soldering tin processing technology field especially indicates a laser soldering tin mechanism of laser soldering tin equipment.
Background
In the installation process of electronic products, a soldering tin process is needed for welding, and also electronic products need to remove the surface gold plating layer of the products by using a soldering tin and tin suction process, for example, a welding type connector, the inner surface of a welding cup of a terminal is provided with the gold plating layer, the surface gold plating layer needs to be removed before welding with a lead, the main steps are soldering tin and tin suction, the soldering tin is melted in an empty welding cup of the terminal by using the soldering tin process, the gold plating layer on the surface of the welding cup is melted in the soldering tin, the soldering tin in the empty welding cup is melted again by using the tin suction process and is sucked out and cleaned by using a tin suction tool, so that the gold plating layer on the inner surface of the welding cup is removed, and then the lead is welded. The gold plating layer on the inner surface of the welding cup is removed mainly for preventing the welding tin and the gold plating layer on the welding cup from fusing to form 'gold brittleness', so that the hardness of the welding spot is reduced, and the welding spot is seriously broken. At present, the gold plating layer on the inner surface of a terminal welding cup of a welding connector is removed, manual soldering iron welding and suction welding are mainly adopted for removing, the welding cup of the terminal is small and deep, manual operation is difficult, time and labor are wasted, the requirement on the operation technical level of workers is high, the yield is low, and the production efficiency is low.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to overcome prior art's is not enough, provide a laser soldering tin mechanism that can improve product soldering tin quality and soldering tin efficiency.
In order to achieve the above purpose, the solution of the present invention is:
a laser tin soldering mechanism comprises a module fixing plate, a Z-axis linear module, a laser tin soldering assembly and a camera module; the Z-axis straight line module is arranged on the module fixing plate, the laser soldering tin assembly is arranged on the Z-axis straight line module, the camera module is arranged on the Z-axis straight line module on one side of the laser soldering tin assembly, and the Z-axis straight line module drives the laser soldering tin assembly and the camera module to move in a Z-axis direction in a reciprocating mode.
Further, the laser soldering component comprises a component fixing plate, a laser head, a wire feeding mechanism, a tin wire rack, a tin wire guide pipe, a tin outlet adjusting rack, a tin outlet nozzle and a tin wire; wire feeding mechanism includes sending a ware and drive and send a ware operation to send a motor, the subassembly fixed plate is fixed on the slip table of Z axle sharp module, the laser head passes through the laser head fixed plate and sets up on the subassembly fixed plate, the output of laser head is down, lower extreme one side of subassembly fixed plate is provided with out tin adjustment frame, go out the tin mouth setting on going out tin adjustment frame and its bottom towards the laser head below, the bottom of going out the tin pipe is connected to the head of tin mouth, go out the top of tin pipe and connect and send a ware, the tin frame sets up the input at a ware of sending, the tin silk book has been put to its cover, the tin silk on the tin silk book is connected to out the tin mouth from the tin silk pipe behind a ware of sending, wire feeding mechanism sends tin silk to laser head below automatically.
Further, the wire feeding motor is a stepping motor or a servo motor.
Further, the camera module comprises a camera fixing plate, a camera, a lens and a light source; the camera fixing plate is fixed on the Z-axis linear module, the camera is fixed on the camera fixing plate, the lens is connected below the camera, and the light source is arranged below the camera and provides light source for the camera.
Further, the Z-axis linear module is a screw rod type linear module or a synchronous belt type linear module.
After the scheme is adopted, the utility model discloses laser soldering tin mechanism has following beneficial effect:
1. by adopting the laser soldering tin process, the laser spot can reach the micron level and can be adjusted in size, the processing control is easy, the precision is far higher than that of the traditional soldering iron process, the soldering iron can adapt to welding spots of various products, the processing adaptability of workpieces is stronger, and the risk of laser insufficient soldering is small; laser non-contact welding does not cause mechanical damage to products; the tiny laser beam replaces a soldering bit, and the processing is easy when other interferents exist on the surface of a workpiece; the laser only heats the part irradiated by the light spot, the local temperature rises quickly, the local heating is realized, and the heat affected zone is small; before soldering tin, adopt laser to preheat the processing position, promote the soldering tin effect, after soldering tin, tin silk pumpback back, laser heating postpones, can improve the soldering tin wire drawing badly.
2. The Z-axis linear module of the laser soldering mechanism can adopt a precise linear module, the moving precision can reach +/-0.01 mm, and the precision of a soldering position can be ensured;
3. the wire feeding motor of the tin feeding mechanism can adopt a stepping motor or a servo motor to drive the tin feeder to automatically feed tin wires, accurately control the tin spitting amount of the tin feeding mechanism, ensure the consistent amount of the tin entering the terminal welding cup every time through the control of the tin soldering time, and avoid the pollution of the outer surface of the terminal welding cup and the poor gold plating removal caused by excessive soldering solution overflowing the outer surface of the terminal welding cup;
4. the tin soldering position is positioned by adopting a camera vision, other required mechanisms are accurately controlled to reach the designated position by an industrial control computer, and each terminal of the product can further adopt a method of positioning and tin soldering operation at the same time so as to ensure the accuracy of the tin soldering position of each terminal soldering cup of the product;
5. the utility model discloses laser soldering mechanism soldering tin position is accurate, product terminal soldering cup surface has no solder to remain and not damaged surface gold plating layer, also can not harm other positions of product, can ensure product processing quality, adopts automation equipment to replace manual operation, can improve product yield and production efficiency; the utility model discloses laser soldering tin mechanism not only can be used to the welding of connector product, still can be used to the welding of other electronic product, circuit board such as PCB for example.
Drawings
Fig. 1 is a perspective view of the present invention in use.
Fig. 2 is a front side view of the usage state of the present invention.
Fig. 3 is a top view of the usage state of the present invention.
Fig. 4 is a left side view of the usage state of the present invention.
Fig. 5 is a perspective view of the laser soldering mechanism of the present invention.
Fig. 6 is a front side view of the laser soldering mechanism of the present invention.
Fig. 7 is a right side view of the laser soldering mechanism of the present invention.
Fig. 8 is a perspective view of the working example of the laser soldering mechanism and the positioning and rotating mechanism according to the present invention.
Fig. 9 is an enlarged view of a portion a of fig. 8.
Fig. 10 is a perspective view of the laser soldering assembly according to the present invention.
Fig. 11 is a front side view of the laser soldering assembly of the present invention.
Detailed Description
In order to further explain the technical solution of the present invention, the present invention is explained in detail by the following embodiments.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "secured" are to be construed broadly and can, for example, be connected or detachably connected or integrated; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above should not be understood to necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples described in this specification can be combined and combined by one skilled in the art.
As shown in fig. 1 to fig. 4, for using the laser soldering device of the laser soldering mechanism of the present invention, it includes a frame 10, an XY axis moving module 20, the present invention discloses a laser soldering mechanism 30 and a positioning and rotating mechanism 40.
The top surface of the frame 10 forms a table 11, and an XY-axis moving module 20 is provided on the table 11.
As shown in fig. 5 to 9, the laser soldering mechanism 30 includes a module fixing plate 31, a Z-axis linear module 32, a laser soldering component 33 and a camera module 34; the module fixing plate 31 is arranged on the XY-axis moving module 20, the Z-axis linear module 32 is fixed on the module fixing plate 31, and the XY-axis moving module drives the Z-axis linear module to reciprocate in the XY-axis direction; the laser soldering component 33 is arranged on the Z-axis linear module 32, the camera module 34 is arranged on the Z-axis linear module 32 on one side of the laser soldering component 33, and the Z-axis linear module 32 drives the laser soldering component 33 and the camera module 34 to reciprocate in the Z-axis direction. The Z-axis linear module 32 can be a screw-type linear module or a synchronous belt-type linear module.
As shown in fig. 10 and 11, the laser soldering assembly 33 includes a assembly fixing plate 331, a laser head fixing plate 332, a laser head 333, a wire feeder 334, a tin wire rack 335, a tin wire guide tube 336, a tin outlet adjusting rack 337, a tin outlet 338, and a tin wire 339; wherein the wire feeding mechanism 334 comprises a wire feeder 3341 and a wire feeding motor 3342 for driving the wire feeder to operate, the component fixing plate 331 is fixed on a sliding table of the Z-axis linear module, the laser fixing plate 332 is fixed on the component fixing plate 331, the laser head 333 is arranged on the laser fixing plate 332 with its output end facing downwards, one side of the lower end of the component fixing plate 331 is provided with a tin outlet adjusting frame 337, the tin outlet nozzle 338 is arranged on the tin outlet adjusting frame 337 with its bottom end facing downwards, the tin outlet position of the tin outlet nozzle 338 can be adjusted by the tin outlet adjusting frame 337, the head of the tin outlet nozzle 338 is connected with the bottom end of the tin outlet guide pipe 336, the top end of the tin outlet guide pipe 336 is connected with the wire feeder 3341, the wire feeding motor 3342 can adopt a stepping motor or a servo motor to drive the tin feeder 3341 to automatically deliver and recover tin wires, the tin wires are arranged on the tin wire feeder 335, tin wire reels are sleeved with tin wire rolls, the tin wires 339 on the tin wire reels are wound on the tin wire feeder 33336 through the wire feeder 33, the wire feeder 334 automatically feeds a tin wire 339 to the bottom machining area of the laser head 333.
As shown in fig. 5 to 7, the camera module 34 includes a camera fixing plate 341, a camera 342, a lens 343, and a light source 344; the camera fixing plate 341 is fixed on the Z-axis linear module 32, the Z-axis linear module 32 drives the camera fixing plate 341 to reciprocate in the Z-axis direction, the camera 342 is fixed on the camera fixing plate 341, the lens 343 is connected below the camera 342, and the light source 344 is arranged below the camera 342 to provide light for the camera 342.
The utility model discloses laser soldering tin equipment's operation process and theory of operation are:
please refer to fig. 1, fig. 8, and fig. 9 in combination with other drawings, when in use, the product 100 is placed on the product positioning block 411 of the positioning and rotating mechanism 40 and pressed tightly;
the XY-axis moving module 20 drives the camera module 34 of the laser soldering mechanism 30 to move to a position above one terminal 101 of one row of terminals of the product 100, and the Z-axis linear module 32 of the laser soldering mechanism 30 drives the camera module 34 to a position suitable for height visual identification and positioning of the terminal 101;
the XY-axis moving module 20 acts to drive the laser soldering component 33 of the laser soldering mechanism 30 to be above the terminal 101, and the Z-axis linear module 32 of the laser soldering mechanism 30 drives the laser soldering component 33 to be at a proper height;
the laser head 333 of the laser soldering component 33 starts to emit a laser beam 3331 to the terminal 101 to preheat the terminal;
a wire feeder 334 of the laser soldering assembly 33 discharges a fixed amount of solder wire 339, and the solder wire is melted into a soldering cup of the terminal 101 in cooperation with the laser 3331;
the wire feeder 334 quantitatively withdraws the tin wire 339;
the laser head 333 turns off the laser, and the Z-axis linear module 32 drives the laser soldering tin assembly 33 to lift;
repeating the steps until the terminals 101 of one row of terminals of the product 100 are processed;
the positioning and rotating mechanism drives the product 100 to rotate to a proper position;
and starting to process each terminal 101 of the next row of terminals of the product 100 until all the terminals 101 of the product 100 are processed, and taking out the product.
After the scheme is adopted, the utility model discloses laser soldering tin mechanism has following beneficial effect:
by adopting the laser soldering tin process, the laser spot can reach the micron level and can be adjusted in size, the processing control is easy, the precision is far higher than that of the traditional soldering iron process, the soldering iron can adapt to welding spots of various products, the processing adaptability of workpieces is stronger, and the risk of laser insufficient soldering is small; laser non-contact welding does not cause mechanical damage to products; the tiny laser beam replaces a soldering bit, and the processing is easy when other interferents exist on the surface of a workpiece; the laser only heats the part irradiated by the light spot, the local temperature rises quickly, the local heating is realized, and the heat affected zone is small; before tin soldering, the processing part is preheated by laser, so that the tin soldering effect is improved, and after tin soldering and tin wire drawing back, laser heating is delayed, so that poor tin soldering wire drawing can be improved;
the Z-axis linear module of the laser soldering mechanism can adopt a precise linear module, the moving precision can reach +/-0.01 mm, and the precision of a soldering position can be ensured;
the wire feeding motor of the tin feeding mechanism can adopt a stepping motor or a servo motor to drive the tin feeder to automatically feed tin wires, accurately control the tin spitting amount of the tin feeding mechanism, ensure the consistent amount of the tin entering the terminal welding cup every time through the control of the tin soldering time, and avoid the pollution of the outer surface of the terminal welding cup and the poor gold plating removal caused by excessive soldering solution overflowing the outer surface of the terminal welding cup;
the tin soldering position is positioned by adopting a camera vision, other required mechanisms are accurately controlled to reach the designated position by an industrial control computer, and each terminal of the product can further adopt a method of positioning and tin soldering operation at the same time so as to ensure the accuracy of the tin soldering position of each terminal soldering cup of the product;
the utility model discloses laser soldering mechanism soldering tin position is accurate, product terminal soldering cup surface has no solder to remain and not damaged surface gold plating layer, also can not harm other positions of product, can ensure product processing quality, adopts automation equipment to replace manual operation, can improve product yield and production efficiency; the utility model discloses laser soldering tin mechanism not only can be used to the welding of connector product, still can be used to the welding of other electronic product, circuit board such as PCB for example.
The above embodiments and drawings are not intended to limit the form and style of the present invention, and any suitable changes or modifications made by those skilled in the art should not be construed as departing from the scope of the present invention.
Claims (5)
1. A laser soldering mechanism, comprising: the module fixing plate, the Z-axis linear module, the laser soldering tin assembly and the camera module are arranged on the module fixing plate; the Z-axis straight line module is arranged on the module fixing plate, the laser soldering tin assembly is arranged on the Z-axis straight line module, the camera module is arranged on the Z-axis straight line module on one side of the laser soldering tin assembly, and the Z-axis straight line module drives the laser soldering tin assembly and the camera module to move in a Z-axis direction in a reciprocating mode.
2. A laser soldering mechanism according to claim 1, wherein: the laser soldering tin assembly comprises an assembly fixing plate, a laser head, a wire feeding mechanism, a tin wire rack, a tin wire guide pipe, a tin outlet adjusting rack, a tin outlet nozzle and a tin wire; wire feeding mechanism includes sending a ware and drive and send a ware operation to send a motor, the subassembly fixed plate is fixed on the slip table of Z axle sharp module, the laser head passes through the laser head fixed plate and sets up on the subassembly fixed plate, the output of laser head is down, lower extreme one side of subassembly fixed plate is provided with out tin adjustment frame, go out the tin mouth setting on going out tin adjustment frame and its bottom towards the laser head below, the bottom of going out the tin pipe is connected to the head of tin mouth, go out the top of tin pipe and connect and send a ware, the tin frame sets up the input at a ware of sending, the tin silk book has been put to its cover, the tin silk on the tin silk book is connected to out the tin mouth from the tin silk pipe behind a ware of sending, wire feeding mechanism sends tin silk to laser head below automatically.
3. A laser soldering mechanism according to claim 2, wherein: the wire feeding motor is a stepping motor or a servo motor.
4. A laser soldering mechanism according to claim 1, wherein: the camera module comprises a camera fixing plate, a camera, a lens and a light source; the camera fixing plate is fixed on the Z-axis linear module, the camera is fixed on the camera fixing plate, the lens is connected below the camera, and the light source is arranged below the camera and provides light source for the camera.
5. A laser soldering mechanism according to any one of claims 1 to 4, wherein: the Z-axis linear module is a screw rod type linear module or a synchronous belt type linear module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022344995.7U CN213702101U (en) | 2020-10-20 | 2020-10-20 | Laser soldering mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022344995.7U CN213702101U (en) | 2020-10-20 | 2020-10-20 | Laser soldering mechanism |
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|---|---|
| CN213702101U true CN213702101U (en) | 2021-07-16 |
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| CN202022344995.7U Active CN213702101U (en) | 2020-10-20 | 2020-10-20 | Laser soldering mechanism |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114871527A (en) * | 2022-05-13 | 2022-08-09 | 深圳市嘉鸿宝科技有限公司 | Tin wire rotating module of laser tin soldering machine |
| CN115519204A (en) * | 2022-11-23 | 2022-12-27 | 广东国玉科技股份有限公司 | Laser soldering equipment |
-
2020
- 2020-10-20 CN CN202022344995.7U patent/CN213702101U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114871527A (en) * | 2022-05-13 | 2022-08-09 | 深圳市嘉鸿宝科技有限公司 | Tin wire rotating module of laser tin soldering machine |
| CN115519204A (en) * | 2022-11-23 | 2022-12-27 | 广东国玉科技股份有限公司 | Laser soldering equipment |
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