CN209873398U - Semiconductor heat exchange assembly and clothes drying equipment - Google Patents
Semiconductor heat exchange assembly and clothes drying equipment Download PDFInfo
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- CN209873398U CN209873398U CN201822115803.8U CN201822115803U CN209873398U CN 209873398 U CN209873398 U CN 209873398U CN 201822115803 U CN201822115803 U CN 201822115803U CN 209873398 U CN209873398 U CN 209873398U
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Abstract
The utility model discloses a semiconductor heat exchange assemblies and clothing equipment of drying. The semiconductor heat exchange assembly comprises a semiconductor refrigeration piece, a laminar flow heat exchanger and a driving mechanism, wherein the laminar flow heat exchanger comprises a first heat exchange part for exchanging cold energy at a cold end of the semiconductor refrigeration piece, the laminar flow heat exchanger comprises a second heat exchange part for exchanging heat at a hot end of the semiconductor refrigeration piece, the first heat exchange part and the second heat exchange part respectively comprise a plurality of layers of circular blades, and the driving mechanism is used for driving the laminar flow heat exchanger to rotate; and air inlet areas are formed between the through holes of the multiple layers of circular blades, and air outlet areas are formed between the adjacent two layers of circular blades. The whole volume of clothes drying equipment is reduced, and the running noise is reduced so as to improve the user experience.
Description
Technical Field
The utility model relates to a refrigeration plant especially relates to a semiconductor heat exchange assemblies and clothing equipment of drying.
Background
At present, clothes drying cabinets in the prior art usually adopt a heat pump drying mode or an electric heating drying mode to realize clothes drying. However, the user experience is poor due to the fact that the noise of the compressor and the fan is large when the heat pump operates, and the defects that the power consumption is large and the noise of the fan is large exist when the electric heating mode is adopted. With the development of semiconductor refrigeration technology, the technology of realizing the function of a clothes drying cabinet by adopting the semiconductor refrigeration technology is gradually popularized, and Chinese patent No. 201210008372 discloses a novel clothes dryer, which realizes the function of drying clothes by adopting a semiconductor refrigeration piece to match with a condenser and an evaporator in an air duct, and meanwhile, a fan is arranged in the air duct to realize the circulating flow of air flow. In the practical use process, the condenser, the evaporator and the fan need to occupy larger space, and meanwhile, the noise in the operation process of the fan is still larger. How to design a compact structure is small and the running noise is low is with the clothes drying equipment who improves user experience nature the utility model aims to solve the technical problem.
SUMMERY OF THE UTILITY MODEL
The utility model provides a semiconductor heat exchange assemblies and clothing equipment of drying realizes dwindling the whole volume of clothing equipment of drying to reduce the running noise in order to improve user experience nature.
In order to achieve the technical purpose, the utility model adopts the following technical scheme:
a semiconductor heat exchange assembly comprises semiconductor refrigeration pieces, a laminar flow heat exchanger and a driving mechanism, wherein the laminar flow heat exchanger comprises a first heat exchange part used for exchanging cold energy at a cold end of each semiconductor refrigeration piece, the laminar flow heat exchanger comprises a second heat exchange part used for exchanging heat of a hot end of each semiconductor refrigeration piece, the first heat exchange part and the second heat exchange part respectively comprise a plurality of layers of circular ring blades, and the driving mechanism is used for driving the laminar flow heat exchanger to rotate; and air inlet areas are formed between the through holes of the multiple layers of circular blades, and air outlet areas are formed between the adjacent two layers of circular blades.
Furthermore, the cold end of the semiconductor refrigeration piece is connected with a first heat pipe, the first heat pipe is connected with the annular blade of the first heat exchanging part, the hot end of the semiconductor refrigeration piece is connected with a second heat pipe, and the second heat pipe is connected with the annular blade of the second heat exchanging part.
Furthermore, the first heat pipe and the second heat pipe respectively comprise an arc-shaped pipe part and a plurality of straight pipe parts which are connected together, the straight pipe parts penetrate through the corresponding plurality of layers of the annular blades, and the arc-shaped pipe part is connected with the semiconductor refrigerating sheet.
Further, the first heat pipe and the second heat pipe are arranged in an insulating mode and fixed together.
Furthermore, the driving mechanism comprises a motor and a rotating disc, the motor is used for driving the rotating disc to rotate, and the laminar flow heat exchanger is installed on the rotating disc.
Further, the second heat exchanging part is fixed on the rotating disc.
Furthermore, the periphery of the semiconductor refrigeration piece is provided with a heat insulation gasket, the cold end of the semiconductor refrigeration piece is provided with a cold end heat conduction block, the hot end of the semiconductor refrigeration piece is provided with a hot end heat conduction block, the heat insulation gasket is clamped between the cold end heat conduction block and the hot end heat conduction block, the first heat pipe is connected with the cold end heat conduction block, and the second heat pipe is connected with the hot end heat conduction block.
Further, a wind shielding sleeve is arranged between the first heat exchange part and the second heat exchange part.
The utility model also provides a clothes drying device, which comprises a cabinet body, wherein a clothes drying cavity and an installation cavity are arranged in the cabinet body, the installation cavity is provided with a return air inlet and an air outlet which are communicated with the clothes drying cavity, and the clothes drying device also comprises the semiconductor heat exchange component, and the semiconductor heat exchange component is arranged in the installation cavity; air in the clothes drying cavity enters the mounting cavity through the air return opening, exchanges heat with the first heat exchange part in the semiconductor heat exchange assembly, is condensed and dried, and then enters the clothes drying cavity through the air outlet.
Compared with the prior art, the utility model discloses an advantage is with positive effect: the semiconductor heat exchange assembly realizes heat exchange of the cold end and the hot end of the semiconductor refrigeration sheet by utilizing the laminar flow heat exchanger, two heat exchange parts of the laminar flow heat exchanger are composed of a plurality of layers of circular ring blades, the driving mechanism drives the laminar flow heat exchanger to integrally rotate, the space between two adjacent circular ring blades is in the rotating process, air is driven to flow outwards under the action of centrifugal force and fluid viscosity, negative pressure is formed at the air inlet area of the multilayer circular blades, air sucked into the clothes drying cavity is condensed and dehumidified by the air inlet area of the first heat exchanging part, the dried air is conveyed into the clothes drying cavity again to flow circularly, so as to achieve the aim of drying clothes, the laminar flow heat exchanger plays the role of a fan on one hand and also plays the role of a heat exchanger on the other hand, the semiconductor heat exchange assembly is compact in overall structure and small in size, so that the overall size of the clothes drying equipment is reduced; and the multilayer annular blade rotates to realize laminar flow type wind circulation, and the running noise can be effectively reduced to improve the user experience.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
Fig. 1 is a schematic structural view of a semiconductor heat exchange assembly of the present invention;
fig. 2 is an exploded view of the semiconductor heat exchange assembly of the present invention;
fig. 3 is a first schematic diagram of airflow flowing of the semiconductor heat exchange assembly of the present invention;
fig. 4 is a second schematic diagram of the airflow flowing of the semiconductor heat exchange assembly of the present invention;
FIG. 5 is a schematic structural view of the clothes drying apparatus of the present invention;
FIG. 6 is a first assembly view of the semiconductor heat exchange assembly in the clothes drying apparatus of the present invention;
FIG. 7 is a second assembly view of the semiconductor heat exchange assembly in the clothes drying apparatus of the present invention;
fig. 8 is a third assembly diagram of the semiconductor heat exchange assembly in the clothes drying equipment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
As shown in fig. 1 to 4, the semiconductor heat exchange assembly of the embodiment includes a semiconductor refrigeration sheet 1, and further includes a laminar flow heat exchanger 2 and a driving mechanism 3, where the laminar flow heat exchanger 2 includes a first heat exchanging portion 21 for exchanging cold of a cold end of the semiconductor refrigeration sheet 1, the laminar flow heat exchanger 2 includes a second heat exchanging portion 22 for exchanging heat of a hot end of the semiconductor refrigeration sheet 1, the first heat exchanging portion 21 and the second heat exchanging portion 22 respectively include multiple layers of circular blades 20, and the driving mechanism 3 is configured to drive the laminar flow heat exchanger 2 to rotate; an air inlet area 201 is formed between the through holes of the multiple layers of circular blades 20, and an air outlet area 202 is formed between the adjacent two layers of circular blades 20.
Specifically, the cold and hot end of the semiconductor refrigeration piece 1 in the semiconductor heat exchange assembly of the present embodiment exchanges heat through the laminar flow heat exchanger 2, wherein two heat exchange portions in the laminar flow heat exchanger 2 are respectively composed of multiple layers of circular blades 20, in the rotation process of the laminar flow heat exchanger 2 driven by the driving mechanism 3, the circular blades 20 rotate along with the same, air between two adjacent layers of circular blades 20 flows to the outer side of the circular blades 20 under the action of centrifugal force by utilizing fluid viscosity, so that the air inlet area 201 formed at the through hole of the circular blades 20 generates negative pressure, and the flow of the air is realized. Wherein, the flowing air flow formed by the rotation of the multiple layers of annular blades 20 in the first heat exchanging part 21 will realize the heat exchanging treatment of the cold end of the semiconductor refrigerating sheet 1, and the flowing air flow formed by the rotation of the multiple layers of annular blades 20 in the second heat exchanging part 22 will realize the heat exchanging treatment of the hot end of the semiconductor refrigerating sheet 1. The annular blades 20 can play a role of a fan on one hand and can also play a role of heat exchange of the semiconductor refrigeration sheet 1 on the other hand, so that the whole volume of the semiconductor heat exchange assembly is smaller; meanwhile, laminar flow type wind circulation is realized by the rotation of the annular blades 20, and the running noise can be effectively reduced to improve the user experience. In addition, the driving mechanism 3 may include a motor 31 and a rotating disc 32, the motor 31 is used for driving the rotating disc 32 to rotate, and the laminar flow heat exchanger 2 is mounted on the rotating disc 32; in order to make the first heat exchanging portion 21 better condense and dry the air, the laminar flow heat exchanger 2 is fixed on the rotating disc 32 through the second heat exchanging portion 22, and the first heat exchanging portion 21 can avoid the rotating disc 32 from shielding to have better ventilation efficiency, so as to improve the efficiency of condensing and drying.
Further, in order to improve the heat exchange efficiency and enable the cold and hot ends of the semiconductor refrigeration piece 1 to exchange heat quickly and efficiently, the cold end of the semiconductor refrigeration piece 1 is connected with a first heat pipe 11, the first heat pipe 11 is connected with the annular blade 20 of the first heat exchanging part 21, the hot end of the semiconductor refrigeration piece 1 is connected with a second heat pipe 12, and the second heat pipe 12 is connected with the annular blade 20 of the second heat exchanging part 22. Specifically, the cold end and the hot end of the semiconductor chilling plate 1 respectively pass through the heat pipe and the corresponding annular blade 20 of the heat exchanging portion, the heat pipe can conduct heat rapidly and dissipate heat rapidly by using the annular blade 20, preferably, the first heat pipe 11 and the second heat pipe 12 respectively comprise an arc-shaped pipe portion 101 and a plurality of straight pipe portions 102 which are connected together, the straight pipe portions 102 penetrate through the corresponding plurality of layers of the annular blades 20, the arc-shaped pipe portion 101 is connected with the semiconductor chilling plate 1, specifically, the first heat pipe 11 and the second heat pipe 12 are both composed of the arc-shaped pipe portion 101 and the plurality of straight pipe portions 102, taking the assembly of the first heat pipe 11 and the first heat exchanging portion 21 as an example, the arc-shaped pipe portion 101 in the first heat pipe 11 is provided with the plurality of straight pipe portions 102, each straight pipe portion 102 penetrates through the plurality of layers of the annular blades 20 of the first heat exchanging portion 21, and each layer of the cold end of the semiconductor chilling plate 1 can be rapidly transferred to the annular blade 20, the annular blades 20 can serve as heat dissipation fins to exchange heat with the cold end of the semiconductor refrigeration piece 1 quickly and efficiently in the rotating process besides driving air to flow. In addition, for the first heat exchanging portion 21 and the second heat exchanging portion 22, the first heat exchanging portion 21 and the second heat exchanging portion 22 may be fixedly connected together by a connection column or a connection frame, preferably, the first heat pipe 11 and the second heat pipe 12 are arranged in a heat insulating manner and are fixed together, specifically, the first heat pipe 11 and the second heat pipe 12 are fixedly connected, so that the first heat exchanging portion 21 and the second heat exchanging portion 22 are connected together by the first heat pipe 11 and the second heat pipe 12, and the heat pipes are used for connecting the two heat exchanging portions besides heat transfer, which is more beneficial to simplifying the structure and reducing the size.
Furthermore, a heat insulation gasket (not shown) is arranged on the periphery of the semiconductor refrigeration sheet 1, a cold end heat conduction block 13 is arranged at the cold end of the semiconductor refrigeration sheet 1, a hot end heat conduction block 14 is arranged at the hot end of the semiconductor refrigeration sheet 1, the heat insulation gasket is clamped between the cold end heat conduction block 13 and the hot end heat conduction block 14, the first heat pipe 11 is connected with the cold end heat conduction block 13, and the second heat pipe 12 is connected with the hot end heat conduction block 14. Specifically, 1 cold junction of semiconductor refrigeration piece and hot junction are passed heat through the heat conduction piece to drinking, and the heat conduction piece can be better be connected with the heat pipe to improve heat transfer efficiency. Preferably, in order to make the overall structure more compact, the semiconductor cooling fins 1 are disposed between the first heat exchanging part 21 and the second heat exchanging part 22, and as shown in fig. 3, in regard to the manner of circulating air of the first heat exchanging part 21 and the second heat exchanging part 22, the air intake regions 201 of the first heat exchanging part 21 and the second heat exchanging part 22 are communicated with each other, such that external air enters the laminar heat exchanger 2 through the air intake regions 201 of the first heat exchanging part 21, a part of the air is condensed and dried to form dry air output after exchanging heat with the annular blades 20 of the first heat exchanging part 21, and the rest of the air is output after exchanging heat with the annular blades 20 of the second heat exchanging part 22, and in order to reduce air leakage from the gap region between the first heat exchanging part 21 and the second heat exchanging part 22, a wind shielding sleeve (not shown) is further disposed between the first heat exchanging part 21 and the second heat exchanging part 22, the wind is shielded by the wind shielding sleeve, and the wind shielding sleeve also functions to connect the first heat exchanging portion 21 and the second heat exchanging portion 22. Similarly, as shown in fig. 4, the cold-end heat conduction block 13 and the hot-end heat conduction block 14 are both disc-shaped structures, the cold-end heat conduction block 13 and the hot-end heat conduction block 14 separate the air inlet area 201 of the first heat exchanging part 21 from the air inlet area 201 of the second heat exchanging part 22, so that external air respectively and independently enters from the air inlet area 201 of the first heat exchanging part 21 and the air inlet area 201 of the second heat exchanging part 22, and simultaneously, is respectively and independently output from the air outlet area 202 of the first heat exchanging part 21 and the air outlet area 202 of the second heat exchanging part 22.
The utility model also provides a clothes drying device, as shown in fig. 1-5, clothes drying device includes cabinet 4, be provided with dry clothing cavity 41 and installation cavity 42 in cabinet 4, installation cavity 42 is provided with return air inlet 401 and air outlet 402 that communicate dry clothing cavity 41, still includes the semiconductor heat exchange assembly in the above-mentioned embodiment, the semiconductor heat exchange assembly sets up in installation cavity 42; the air in the drying cavity 41 enters the installation cavity 42 through the air return port 401, exchanges heat with the first heat exchanging part 21 in the semiconductor heat exchanging assembly, is condensed and dried, and then enters the drying cavity 41 through the air outlet 402.
Specifically, the semiconductor heat exchange assembly is installed in the installation cavity 42, in the clothes drying process, the driving mechanism 3 drives the laminar flow heat exchanger 2 to rotate, meanwhile, the semiconductor refrigeration piece 1 is electrified, air in the clothes drying cavity 41 is sucked into the installation cavity 42 and enters the first heat exchange portion 21 to be condensed and dried, the dried air flows back into the clothes drying cavity 41 again, and the clothes drying process is carried out on the clothes in the clothes drying cavity 41 in a reciprocating mode. The specific control method of the clothes drying equipment comprises a clothes drying mode, in the clothes drying mode, after the semiconductor refrigeration piece 1 is electrified, the driving mechanism 3 drives the laminar flow heat exchanger 2 to rotate, air between two adjacent circular blades 20 flows outwards under the action of fluid viscosity and centrifugal force to generate negative pressure in an air inlet area formed by the circular blades 20, under the action of the negative pressure, the air in the clothes drying cavity 41 enters the air inlet area 201 of the first heat exchanging part 21 through the air return port 401 and is condensed and dried by cold energy released by the cold end of the semiconductor refrigeration piece 1, and then the dried air enters the clothes drying cavity 41 from the air outlet 402.
Based on the above technical solution, optionally, the semiconductor heat exchange assemblies are arranged longitudinally and transversely according to different arrangement modes of the semiconductor heat exchange assemblies in the installation cavity 42, and corresponding designs are provided for related structures in different arrangement modes, which is specifically described as follows.
As shown in fig. 6, when the semiconductor heat exchange assembly is arranged longitudinally, the first heat exchange portion 21 and the second heat exchange portion 22 are arranged vertically, a partition 421 arranged transversely is provided in the mounting cavity 42, the mounting cavity 42 is divided into an upper cavity and a lower cavity by the partition 421, a mounting hole is formed in the partition 421, the laminar flow heat exchanger 2 penetrates through the mounting hole, the first heat exchange portion 21 is located in the upper cavity, and the second heat exchange portion 22 is located in the lower cavity; the upper cavity is provided with an air return port 401 and an air outlet 402 which are communicated with the clothes drying cavity 41. Specifically, the first heat exchanging part 21 is arranged in the upper cavity, air in the drying cavity 41 is sucked into the upper cavity through the air return opening 401 and enters the first heat exchanging part 21, and is conveyed back into the drying cavity 41 from the air outlet 402 after being condensed and dried, wherein the air return opening 401 is arranged in the middle of the top plate of the upper cavity, and the air return opening 401 is arranged opposite to the air inlet area 201 of the first heat exchanging part 21; the air outlets 402 are respectively arranged on two sides of the top plate of the upper cavity. The second heat exchanging part 22 in the lower cavity is used for dissipating heat released by the hot end of the semiconductor chilling plate 1, wherein the air inlet modes of the air inlet area 201 in the second heat exchanging part 22 are divided into two modes. In a first mode, as shown in fig. 3, an air intake region of the first heat exchanging portion 21 and an air intake region of the second heat exchanging portion 22 are communicated with each other; the two side walls of the lower cavity are provided with hot end air outlets 403, a part of air entering the mounting cavity 42 from the clothes drying cavity 41 flows back to the clothes drying cavity 41 after being condensed and dried by the first heat exchanging part 21, the other part of air enters the second heat exchanging part 22 for heat exchange, generated hot air is discharged from the hot end air outlets 403, and the clothes drying cavity 41 can supplement air through gaps of door seams. In a second mode, as shown in fig. 4, the cold-end heat conduction block 13 and the hot-end heat conduction block 14 are located in the mounting hole to effectively separate the upper cavity from the lower cavity, a second connection air duct (not labeled) for introducing and conveying external air to an air inlet area of the second heat exchanging portion 22 is arranged in the lower cavity, hot-end air outlets 403 are arranged on two side walls of the lower cavity, and after the external air enters the lower cavity from the second connection air duct and exchanges heat with the second heat exchanging portion 22, the hot air is output from the hot-end air outlets 403. Preferably, a water retaining ring 422 is arranged on the partition 421 at the periphery of the mounting hole, a drain hole (not shown) is further arranged on the partition 421, the drain hole is connected with a drain pipe (not shown), specifically, during the condensation and drying process of the annular blade 20 of the first heat exchanging portion 21, condensed water formed on the surface of the annular blade 20 is thrown onto the side wall of the upper cavity, and finally the condensed water is collected and discharged from the drain hole, and the water retaining ring 422 can ensure that the condensed water cannot flow into the lower cavity from the mounting hole. The partition 421 is provided with a water collecting tank (not shown) at a position connected with the side wall of the upper cavity, two adjacent water collecting tanks are communicated with each other, the drain hole is arranged in one of the water collecting tanks, and specifically, the condensed water flowing down from the side wall of the upper cavity is collected to the drain hole through the water collecting tank.
As shown in fig. 7, when the semiconductor heat exchange assembly is arranged horizontally, the first heat exchange portion 21 and the second heat exchange portion 22 are arranged side by side from left to right, a partition 421 arranged longitudinally is arranged in the mounting cavity 42, the partition 421 divides the mounting cavity into a first cavity and a second cavity arranged from left to right, a mounting hole is opened on the partition 421, the laminar flow heat exchanger 2 is arranged horizontally and penetrates through the mounting hole, the first heat exchange portion 21 is located in the first cavity, and the second heat exchange portion 22 is located in the second cavity; the first cavity is provided with an air return port 401 and an air outlet 402 which are communicated with the clothes drying cavity 41. Specifically, the first heat exchanging portion 21 is located in the first cavity, air in the drying cavity 41 is sucked into the first cavity through the air return port 401 and enters the first heat exchanging portion 21, and is conveyed back into the drying cavity 41 from the air outlet 402 after condensation and drying, wherein a first connecting air duct (not shown) is disposed between the air return port 401 and the air inlet area 201 of the first heat exchanging portion 21, specifically, the air in the drying cavity 41 enters the first cavity through the air return port 401 and flows along the first connecting air duct, so that humid air can effectively enter the first heat exchanging portion 21 for condensation and drying to meet the air inlet requirement of the horizontal arrangement of the laminar flow heat exchanger 2, and condensed water formed on the surface of the circular ring blade 20 in the first heat exchanging portion 21 is thrown to the front and rear side walls and the upper and lower portions of the upper cavity, and a water pan 423 is disposed below the first heat exchanging portion 21 in the first cavity, the water pan 423 can collect condensed water at the bottom of the first cavity, preferably, the front side and the rear side of the water pan 423 are connected with the front side wall and the rear side wall of the first cavity, so that the condensed water flowing down from the front side wall and the rear side wall can effectively flow into the water pan 423. In addition, the air intake method for the air intake region 201 in the second heat exchanging portion 22 is also divided into two types. In a first mode, as shown in fig. 3, the air inlet area of the first heat exchanging portion 21 and the air inlet area of the second heat exchanging portion 22 are communicated with each other, and the top of the second cavity is further provided with a hot end air outlet 403 communicated with the drying cavity 41, so that air entering the installation cavity 42 from the drying cavity 41 flows back to the drying cavity 41 through the air outlet 402 after a part of air passes through the first heat exchanging portion 21 for condensation and drying, and flows back to the drying cavity 41 through the hot end air outlet 403 after another part of air enters the second heat exchanging portion 22 for heat exchange, and the generated hot air can also flow back to the drying cavity 41 through the hot end air outlet 403, so that the temperature of clothes in the drying cavity 41 can be raised, and the temperature of the clothes in the drying cabinet is not too low after the clothes are dried, thereby improving the user experience. In a second mode, as shown in fig. 4 and 8, the semiconductor chilling plate 1 is disposed between the first heat exchanging part 21 and the second heat exchanging part 22, the cold-side heat conduction block 13 and the hot-side heat conduction block 14 are located in the mounting hole to effectively separate the first cavity from the second cavity, an air inlet 404 for introducing and conveying the outside air to an air inlet area of the second heat exchanging part is arranged in the second cavity, the front and rear side walls of the lower cavity are provided with hot end air outlets (not shown), specifically, the air inlet area 201 of the second heat exchanging part 22 is arranged opposite to the air inlet 404, outside air is sucked into the second cavity and enters the air inlet area 201 for heat exchange, the air after heat exchange is output from the hot end air outlets, a second connecting air duct (not shown) may be disposed between the air inlet 404 and the air inlet area 201 of the second heat exchanging portion 22.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention.
Claims (9)
1. The semiconductor heat exchange assembly comprises semiconductor refrigeration pieces, and is characterized by further comprising a laminar flow heat exchanger and a driving mechanism, wherein the laminar flow heat exchanger comprises a first heat exchange part used for exchanging cold of a cold end of each semiconductor refrigeration piece in a heat exchange manner, the laminar flow heat exchanger comprises a second heat exchange part used for exchanging heat of a hot end of each semiconductor refrigeration piece in a heat exchange manner, the first heat exchange part and the second heat exchange part respectively comprise a plurality of layers of annular blades, and the driving mechanism is used for driving the laminar flow heat exchanger to rotate; and air inlet areas are formed between the through holes of the multiple layers of circular blades, and air outlet areas are formed between the adjacent two layers of circular blades.
2. The semiconductor heat exchange assembly according to claim 1, wherein a first heat pipe is connected to the cold end of the semiconductor refrigeration piece, the first heat pipe is connected to the annular blade of the first heat exchange portion, a second heat pipe is connected to the hot end of the semiconductor refrigeration piece, and the second heat pipe is connected to the annular blade of the second heat exchange portion.
3. The semiconductor heat exchange assembly according to claim 2, wherein the first heat pipe and the second heat pipe respectively comprise an arc-shaped pipe portion and a plurality of straight pipe portions, the arc-shaped pipe portion and the straight pipe portions are connected together, the straight pipe portions penetrate through the corresponding plurality of layers of annular blades, and the arc-shaped pipe portions are connected with the semiconductor chilling plates.
4. The semiconductor heat exchange assembly of claim 3, wherein the first heat pipe and the second heat pipe are thermally isolated and secured together.
5. The semiconductor heat exchange assembly of claim 1, wherein the drive mechanism comprises a motor and a rotating disk, the motor is used for driving the rotating disk to rotate, and the laminar flow heat exchanger is mounted on the rotating disk.
6. The semiconductor heat exchange assembly of claim 5, wherein the second heat exchange portion is fixed to the rotating disk.
7. The semiconductor heat exchange assembly according to claim 2, wherein a heat insulating gasket is arranged on the periphery of the semiconductor refrigeration sheet, a cold-end heat conducting block is arranged at the cold end of the semiconductor refrigeration sheet, a hot-end heat conducting block is arranged at the hot end of the semiconductor refrigeration sheet, the heat insulating gasket is sandwiched between the cold-end heat conducting block and the hot-end heat conducting block, the first heat pipe is connected with the cold-end heat conducting block, and the second heat pipe is connected with the hot-end heat conducting block.
8. The semiconductor heat exchange assembly of claim 1, wherein a wind shielding sleeve is further disposed between the first heat exchange portion and the second heat exchange portion.
9. A clothes drying device comprises a cabinet body, wherein a clothes drying cavity and a mounting cavity are arranged in the cabinet body, and the mounting cavity is provided with an air return opening and an air outlet which are communicated with the clothes drying cavity; air in the clothes drying cavity enters the mounting cavity through the air return opening, exchanges heat with the first heat exchange part in the semiconductor heat exchange assembly, is condensed and dried, and then enters the clothes drying cavity through the air outlet.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822115803.8U CN209873398U (en) | 2018-12-17 | 2018-12-17 | Semiconductor heat exchange assembly and clothes drying equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822115803.8U CN209873398U (en) | 2018-12-17 | 2018-12-17 | Semiconductor heat exchange assembly and clothes drying equipment |
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| CN209873398U true CN209873398U (en) | 2019-12-31 |
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| CN201822115803.8U Active CN209873398U (en) | 2018-12-17 | 2018-12-17 | Semiconductor heat exchange assembly and clothes drying equipment |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111735924A (en) * | 2020-07-13 | 2020-10-02 | 上海安杰环保科技股份有限公司 | Measuring instrument for measuring chemical oxygen demand |
| CN113175708A (en) * | 2021-04-16 | 2021-07-27 | 西安交通大学 | Indoor air and outdoor fresh air purifying device capable of preventing haze, diminishing inflammation and preventing epidemic |
-
2018
- 2018-12-17 CN CN201822115803.8U patent/CN209873398U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111735924A (en) * | 2020-07-13 | 2020-10-02 | 上海安杰环保科技股份有限公司 | Measuring instrument for measuring chemical oxygen demand |
| CN113175708A (en) * | 2021-04-16 | 2021-07-27 | 西安交通大学 | Indoor air and outdoor fresh air purifying device capable of preventing haze, diminishing inflammation and preventing epidemic |
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