CN219349453U - Heat dissipation mechanism of data processing server - Google Patents

Abstract

The utility model relates to the technical field of server heat dissipation mechanisms, in particular to a data processing server heat dissipation mechanism which reduces the space occupation of the heat dissipation mechanism in a case, improves the drying effect in the case and improves the heat dissipation and cooling effect of air on a server; the cooling device comprises a cooling box and a machine case, wherein the machine case is arranged at the top end of the cooling box, the front end of the machine case is provided with a taking and placing opening, and a sealing door is arranged at the taking and placing opening; still include heat conduction case, the heat-conducting plate, first cover body, first tuber pipe, the second tuber pipe, dehydrating unit and circulating fan, the electrical components of server installs inside the quick-witted case, the heat conduction case passes through the support mounting inside the cooler bin, be provided with the coolant liquid in the cooler bin, the heat-conducting case soaks inside the coolant liquid, multiunit heat-conducting plate is the staggered installation in position respectively on the heat conduction case inside wall, first cover body intercommunication sets up on the quick-witted case top, first tuber pipe input passes the inside intercommunication setting of cooler bin at the heat-conducting case left end, first tuber pipe output and first cover body intercommunication.

Description

Heat dissipation mechanism of data processing server

Technical Field

The present utility model relates to the field of server heat dissipation mechanisms, and in particular, to a heat dissipation mechanism for a data processing server.

Background

The server is a supercomputer, the background serving as a website is used for carrying out data processing on the front end, the server is served, the electric appliance part of the server is required to be subjected to heat dissipation and cooling processing in the operation process of the server, the server main body is installed at the top center of the base in the prior art CN202022745969.5, a first power mechanism is installed at the top of the base close to the left side of the server main body, a filtering mechanism … … is installed at the top of the base close to the left side edge of the base, the water outlet of the first water pump is fixedly communicated with the left end of the second connecting pipe through a flange plate, but the mechanism finds out in use, the mechanism leads to larger space occupation of the condenser pipe in the main body shell by arranging the condenser pipe in the main body shell, reduces the convenience of overhauling and maintaining the server, condensate water is easy to be generated on the surface of the condenser pipe, and the server is not beneficial to drying and using.

Disclosure of Invention

In order to solve the technical problems, the utility model provides the data processing server heat dissipation mechanism which reduces the space occupation of the heat dissipation mechanism in the case, improves the drying effect in the case and improves the heat dissipation and cooling effects of air on the server.

The utility model relates to a heat dissipation mechanism of a data processing server, which comprises a cooling box and a case, wherein the case is arranged at the top end of the cooling box, the front end of the case is provided with a taking and placing opening, and a sealing door is arranged at the taking and placing opening; the cooling device comprises a cooling box, a plurality of groups of heat-conducting plates, a first cover body, a first air pipe, a second air pipe, a dehumidifying device and a circulating fan, wherein electric components of the server are arranged in a machine case, the heat-conducting box is arranged in the cooling box through a bracket, cooling liquid is arranged in the cooling box, the heat-conducting box is immersed in the cooling liquid, the plurality of groups of heat-conducting plates are respectively arranged on the inner side wall of the heat-conducting box in a staggered mode, the first cover body is communicated with the top end of the machine case, the first air pipe input end passes through the cooling box and is communicated with the left end of the heat-conducting box, the first air pipe output end is communicated with the first cover body, the second air pipe input end is communicated with the lower part of the machine case, the second air pipe output end is communicated with the circulating fan through the dehumidifying device, and the circulating fan output end passes through the cooling box and is communicated with the right end of the heat-conducting box; firstly, the electric appliance components of the server are installed in a case, then a closed door is closed, a circulating fan is opened to exhaust air from the lower part of the case through a second air pipe, so that air in the case is conveyed to the inside of a heat conducting case through the circulating fan, the air entering the heat conducting case flows from right to left through the diversion of a plurality of groups of heat conducting plates, the cooling liquid in the cooling case cools the heat conducting case in the air flowing process, the heat conducting case cools the heat conducting plates in the plurality of groups through heat conduction, so that the heat conducting case and the heat conducting plates cool the flowing air jointly, the cooled air flows back into the case through a first air pipe and a first cover body, the heat of the server in the case is dissipated and cooled, the space occupation of a heat dissipating mechanism in the case is reduced, the drying effect in the case is improved through dehumidification treatment of a dehumidification device when the air conveyed by the second air pipe enters the circulating fan, the air cooling effect is improved through the diversion conveying of the plurality of groups of heat conducting plates, and the heat dissipation effect of the air is improved.

Preferably, the dehumidifying device comprises a shell, a sealing cover, a storage box, moisture absorption particles, a plurality of groups of bolts and a handle, wherein the shell is arranged on the outer side wall of the case, the right end of the shell is provided with an opening, the left end of the shell is communicated with the output end of the second air pipe, the bottom end of the shell is communicated with the input end of the circulating fan, the sealing cover is fixedly arranged at the opening of the right end of the shell through the plurality of groups of bolts, the right end of the storage box is connected with the left side wall of the sealing cover, a plurality of groups of ventilation holes are formed in the storage box, the moisture absorption particles are arranged in the storage box, and the handle is arranged at the right end of the sealing cover; the circulating fan input is through the casing to inhaling in the second tuber pipe, make the second tuber pipe carry the air of quick-witted incasement to inside the casing, the multiunit bleeder vent that the air that gets into in the casing passed the bin is inside entering the bin, afterwards through the moisture absorption granule with the air dehumidification processing, make the air after the dehumidification carry through circulating fan circulation, thereby improve the air drying effect that gets into quick-witted incasement, reduce the condition that the server of quick-witted incasement was wet damaged, through rotatory dismantlement with multiunit bolt, thereby be convenient for pull sealed lid right through snatching the handle, the convenience that the bin was taken out is improved, the convenience of operation is changed to the improvement moisture absorption granule.

Preferably, the semiconductor refrigerator further comprises a semiconductor refrigeration plate, heat conducting pipes, fins and fans, wherein the semiconductor refrigeration plate is arranged on the outer side wall of the cooling box, a plurality of groups of heat conducting pipes are arranged on the refrigeration end of the semiconductor refrigeration plate, the plurality of groups of heat conducting pipes are respectively immersed in cooling liquid in the cooling box, the fins are arranged on the heat dissipation end of the semiconductor refrigeration plate, and the fans are arranged on the side of the heat dissipation end of the semiconductor refrigeration plate through mounting frames; the semiconductor refrigeration plate is opened to cool the plurality of groups of heat conduction pipes, so that the plurality of groups of heat conduction pipes cool the cooling liquid in the cooling box, the cooling effect of the cooling liquid on air is improved, the heat dissipation efficiency of the heat dissipation mechanism on the server is improved, and the heat dissipation effect of the heat dissipation end of the semiconductor refrigeration plate is improved by arranging the fins and the fans.

Preferably, the intelligent control system further comprises a pressure sensor, a controller and an electric control valve, wherein the pressure sensor is communicated and arranged in the case, the controller is arranged on the outer side wall of the case, the pressure sensor is electrically connected with the controller, the electric control valve is communicated and arranged on the outer side wall of the case, and the electric control valve is electrically connected with the controller; the pressure sensor detects the pressure in the case, the pressure sensor transmits detection data to the controller, and when a large pressure difference occurs between the pressure in the case and the outdoor pressure, the controller controls the electric control valve to be opened, so that the pressure in the case is balanced with the outdoor pressure, and the condition that the server is damaged due to the pressure in the case is avoided.

Preferably, the cooling device also comprises a pump body and a liquid pipe, wherein the pump body is communicated with the bottom end of the cooling box, the liquid pipe is communicated with the output end of the pump body, and the output end of the liquid pipe is communicated with the upper part of the cooling box; and the pump body is opened to extract the cooling liquid in the cooling box, the extracted cooling liquid is returned to the cooling box through the liquid pipe, the effect of circulating the cooling liquid up and down in the cooling box is improved, and the heating uniformity of the cooling liquid is improved.

Preferably, the air conditioner further comprises a second cover body, wherein the second cover body is arranged at the bottom of the inner side wall of the machine case, the top end of the second cover body is communicated with the interior of the machine case, and the lower part of the second cover body is communicated with the input end of the second air pipe; through setting up the second cover body, improve the balanced effect of air flow in the quick-witted incasement, improve the cold air and to the radiating effect of server.

Preferably, the device further comprises a grid, wherein the grid is arranged at the top end of the second cover body; through setting up the grid, improve the space utilization of quick-witted incasement, improve the convenience of server installation in quick-witted incasement.

Compared with the prior art, the utility model has the beneficial effects that: firstly, the electric appliance components of the server are installed in a case, then a closed door is closed, a circulating fan is opened to exhaust air from the lower part of the case through a second air pipe, so that air in the case is conveyed to the inside of a heat conducting case through the circulating fan, the air entering the heat conducting case flows from right to left through the diversion of a plurality of groups of heat conducting plates, the cooling liquid in the cooling case cools the heat conducting case in the air flowing process, the heat conducting case cools the heat conducting plates in the plurality of groups through heat conduction, so that the heat conducting case and the heat conducting plates cool the flowing air jointly, the cooled air flows back into the case through a first air pipe and a first cover body, the heat of the server in the case is dissipated and cooled, the space occupation of a heat dissipating mechanism in the case is reduced, the drying effect in the case is improved through dehumidification treatment of a dehumidification device when the air conveyed by the second air pipe enters the circulating fan, the air cooling effect is improved through the diversion conveying of the plurality of groups of heat conducting plates, and the heat dissipation effect of the air is improved.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a schematic view of a partial structure of a connection of a sealing cover with a storage box or the like;

FIG. 3 is a schematic view of a partial structure of a connection of a heat conduction box with a heat conduction plate or the like;

FIG. 4 is a schematic illustration of a partial axial structure of the housing and seal cover;

the reference numerals in the drawings: 1. a cooling box; 2. a chassis; 3. a heat conduction box; 4. a heat conductive plate; 5. a first cover; 6. a first air duct; 7. a second air duct; 8. a circulating fan; 9. a housing; 10. sealing cover; 11. a storage tank; 12. moisture-absorbing particles; 13. a bolt; 14. a handle; 15. a semiconductor refrigeration plate; 16. a heat conduction pipe; 17. a fin; 18. a fan; 19. a pressure sensor; 20. a controller; 21. an electric control valve; 22. a pump body; 23. a liquid pipe; 24. a second cover; 25. and (5) a grille.

Detailed Description

In order that the utility model may be readily understood, a more complete description of the utility model will be rendered by reference to the appended drawings. This utility model may be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

The machine case 2 is arranged at the top end of the cooling box 1, the front end of the machine case 2 is provided with a taking and placing opening, a sealing door is arranged at the taking and placing opening, an electric component of the server is arranged inside the machine case 2, the heat conducting box 3 is arranged inside the cooling box 1 through a bracket, cooling liquid is arranged in the cooling box 1, the heat conducting box 3 is immersed inside the cooling liquid, a plurality of groups of heat conducting plates 4 are respectively arranged on the inner side wall of the heat conducting box 3 in a staggered mode, a first cover body 5 is communicated at the top end of the machine case 2, the input end of a first air pipe 6 passes through the cooling box 1 and is communicated at the left end of the heat conducting box 3, the output end of the first air pipe 6 is communicated with the first cover body 5, the input end of a second air pipe 7 is communicated at the lower part of the machine case 2, the output end of a circulating fan 8 passes through the cooling box 1 and is communicated at the right end of the heat conducting box 3, a shell 9 is arranged on the outer side wall of the machine case 2, an opening is arranged at the right end of the shell 9, the bottom end of the shell 9 is communicated with the input end of the circulating fan 8, the sealing cover 10 is fixedly arranged at the opening of the right end of the shell 9 through a plurality of groups of bolts 13, the right end of the storage tank 11 is connected with the left side wall of the sealing cover 10, a plurality of groups of air holes are arranged on the storage tank 11, moisture absorption particles 12 are arranged in the storage tank 11, a handle 14 is arranged at the right end of the sealing cover 10, a semiconductor refrigeration plate 15 is arranged on the outer side wall of the cooling tank 1, a plurality of groups of heat conduction pipes 16 are all arranged on the refrigeration end of the semiconductor refrigeration plate 15, the heat conduction pipes 16 are respectively immersed in cooling liquid in the cooling tank 1, fins 17 are arranged on the heat dissipation end of the semiconductor refrigeration plate 15, a fan 18 is arranged at the side of the heat dissipation end of the semiconductor refrigeration plate 15 through a mounting frame, a pressure sensor 19 is arranged in the machine case 2 in a communicating manner, a controller 20 is arranged on the outer side wall of the machine case 2, the pressure sensor 19 is electrically connected with the controller 20, the electric control valve 21 is communicated and arranged on the outer side wall of the case 2, the electric control valve 21 is electrically connected with the controller 20, the pump body 22 is communicated and arranged at the bottom end of the cooling box 1, the liquid pipe 23 is communicated and arranged at the output end of the pump body 22, the output end of the liquid pipe 23 is communicated and internally arranged at the upper part of the cooling box 1, the second cover 24 is arranged at the bottom of the inner side wall of the case 2, the top end of the second cover 24 is communicated with the inside of the case 2, the lower part of the second cover 24 is communicated with the input end of the second air pipe 7, and the grille 25 is arranged at the top end of the second cover 24; firstly, the electric components of the server are installed inside a case 2, then a closed door is closed, a circulating fan 8 is opened to exhaust air to the lower part in the case 2 through a second air pipe 7, air in the case 2 is conveyed to the inside of a heat conducting box 3 through the circulating fan 8, air entering the inside of the heat conducting box 3 flows from right to left through the diversion of a plurality of groups of heat conducting plates 4, cooling liquid in a cooling box 1 cools the heat conducting box 3 in the air flowing process, the heat conducting box 3 cools the plurality of groups of heat conducting plates 4 through heat conduction, so that the heat conducting box 3 and the heat conducting plates 4 cool the flowing air jointly, then the cooled air flows back into the case 2 through a first air pipe 6 and a first cover body 5, so that the server in the case 2 dissipates heat, the air is conveyed through the plurality of groups of heat conducting plates 4 to the air diversion, the effect of the air is improved, the effect of the heat dissipation of the air on the server is further improved, the input end of the circulating fan 8 flows into the inside the second air pipe 7 through a shell 9, the air in the inside of the second air pipe 7 is conveyed into the shell 9, the air entering the inside of the shell 9 passes through a plurality of groups of air storage boxes 11, the air absorption holes 12 in the storage boxes 11 enter the air storage boxes, and the air is dehumidified through the air circulation box 2, the effect of the air is reduced, and the air is then the air is absorbed through the air is processed through the air circulation device 2, and the air absorption effect is reduced, and the case is damaged after the air is subjected to the drying effect is reduced, and the drying the air is subjected to the drying condition is damaged.

As shown in fig. 1 to 4, in the heat dissipation mechanism of a data processing server according to the present utility model, when the heat dissipation mechanism works, firstly, electrical components of the server are installed in a chassis 2, then a closed door is closed, a circulating fan 8 is opened to exhaust air from the lower portion in the chassis 2 through a second air pipe 7, air in the chassis 2 is conveyed to the inside of a heat conducting box 3 through the circulating fan 8, air entering the heat conducting box 3 flows from right to left through diversion of a plurality of groups of heat conducting plates 4, in the air flowing process, a cooling liquid in the cooling box 1 cools the heat conducting box 3 through heat conduction, the heat conducting box 3 cools the plurality of groups of heat conducting plates 4 through heat conduction, so that the heat conducting box 3 and the heat conducting plates 4 cool the flowing air together, then the cooled air flows back into the chassis 2 through a first air pipe 6 and a first cover 5, so that the server in the chassis 2 is cooled, the input end of the circulating fan 8 conveys the air in the chassis 2 to the inside of the casing 9 through the second air pipe 7 through the casing 9, the air entering the casing 9 flows from right to left through diversion of a plurality of groups of heat conducting plates 4, the cooling liquid in the cooling box 3 through a plurality of groups of ventilation holes of storage boxes 11, and then the cooling liquid is cooled through a plurality of groups of heat conducting plates 16 through a plurality of groups of heat conducting pipes 12, and the heat conducting pipes 16 are cooled through the heat conducting plates 16 after the cooling liquid is cooled by circulating air, and the cooling liquid is cooled by a plurality of groups of heat conducting pipes 16 is cooled by the heat conducting pipes 16.

The main functions realized by the utility model are as follows: the circulation fan 8 is opened to exhaust air to the lower part in the case 2 through the second air pipe 7, so that air in the case 2 is conveyed to the inside of the heat conducting box 3 through the circulation fan 8, air entering the heat conducting box 3 flows from right to left through the diversion of the plurality of groups of heat conducting plates 4, cooling liquid in the cooling box 1 cools down the heat conducting box 3 in the air flowing process, the heat conducting box 3 cools down the plurality of groups of heat conducting plates 4 through heat conduction, so that the heat conducting box 3 and the heat conducting plates 4 cool down the flowing air together, and then the cooled air flows back into the case 2 through the first air pipe 6 and the first cover body 5, so that the space occupation of a heat dissipation mechanism in the case 2 is reduced, and the air conveyed by the second air pipe 7 enters the circulation fan 8 and is dehumidified through the dehumidification device, so that the drying effect in the case 2 is improved.

The data processing server heat dissipation mechanism has the advantages that the installation mode, the connection mode or the setting mode of the heat dissipation mechanism are common mechanical modes, and the heat dissipation mechanism can be implemented as long as the beneficial effects of the heat dissipation mechanism can be achieved; the circulating fan 8, the moisture absorption particles 12, the semiconductor refrigeration plate 15, the fan 18, the pressure sensor 19, the controller 20, the electric control valve 21 and the pump body 22 of the heat dissipation mechanism of the data processing server are purchased in the market, and the circulating fan, the moisture absorption particles 12, the semiconductor refrigeration plate, the fan, the pressure sensor 19, the controller 20, the electric control valve 21 and the pump body 22 are installed and operated according to the attached using instructions by those skilled in the art without creative labor of those skilled in the art.

All technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

The foregoing is merely a preferred embodiment of the present utility model, and it should be noted that it will be apparent to those skilled in the art that modifications and variations can be made without departing from the technical principles of the present utility model, and these modifications and variations should also be regarded as the scope of the utility model.

Claims (7)

1. The heat dissipation mechanism of the data processing server comprises a cooling box (1) and a machine case (2), wherein the machine case (2) is arranged at the top end of the cooling box (1), the front end of the machine case (2) is provided with a taking and placing opening, and a sealing door is arranged at the taking and placing opening; the cooling device is characterized by further comprising a heat conducting box (3), a heat conducting plate (4), a first cover body (5), a first air pipe (6), a second air pipe (7), a dehumidifying device and a circulating fan (8), wherein an electric component of the server is arranged inside the case (2), the heat conducting box (3) is arranged inside the cooling box (1) through a bracket, cooling liquid is arranged in the cooling box (1), the heat conducting box (3) is immersed into the cooling liquid, the heat conducting plates (4) are respectively arranged on the inner side walls of the heat conducting box (3) in a position staggered mode, the first cover body (5) is communicated with the top end of the case (2), the input end of the first air pipe (6) is communicated with the left end of the heat conducting box (3) in a penetrating mode, the output end of the first air pipe (6) is communicated with the first cover body (5), the input end of the second air pipe (7) is communicated with the lower portion of the case (2), the output end of the second air pipe (7) is communicated with the circulating fan (8) through the dehumidifying device, and the output end of the circulating fan (8) is communicated with the right end of the cooling box (1) in a communicating mode.

2. The heat dissipation mechanism of a data processing server according to claim 1, wherein the dehumidifying device comprises a housing (9), a sealing cover (10), a storage box (11), hygroscopic particles (12), a plurality of groups of bolts (13) and a handle (14), wherein the housing (9) is mounted on the outer side wall of the chassis (2), an opening is formed in the right end of the housing (9), the left end of the housing (9) is communicated with the output end of the second air pipe (7), the bottom end of the housing (9) is communicated with the input end of the circulating fan (8), the sealing cover (10) is fixedly mounted at the opening of the right end of the housing (9) through the plurality of groups of bolts (13), the right end of the storage box (11) is connected with the left side wall of the sealing cover (10), a plurality of groups of ventilation holes are formed in the storage box (11), the hygroscopic particles (12) are arranged inside the storage box (11), and the handle (14) is mounted at the right end of the sealing cover (10).

3. A data processing server heat dissipation mechanism as claimed in claim 1, further comprising a semiconductor refrigeration plate (15), heat conduction pipes (16), fins (17) and fans (18), wherein the semiconductor refrigeration plate (15) is mounted on the outer side wall of the cooling box (1), the plurality of groups of heat conduction pipes (16) are mounted on the refrigerating ends of the semiconductor refrigeration plate (15), and the plurality of groups of heat conduction pipes (16) are immersed in the cooling liquid in the cooling box (1) respectively, the fins (17) are mounted on the heat dissipation ends of the semiconductor refrigeration plate (15), and the fans (18) are arranged on the side of the heat dissipation ends of the semiconductor refrigeration plate (15) through mounting frames.

4. A data processing server heat dissipation mechanism as defined in claim 1, further comprising a pressure sensor (19), a controller (20) and an electrically controlled valve (21), wherein the pressure sensor (19) is disposed in the chassis (2) in a communication manner, the controller (20) is mounted on an outer side wall of the chassis (2), the pressure sensor (19) is electrically connected to the controller (20), the electrically controlled valve (21) is disposed on the outer side wall of the chassis (2) in a communication manner, and the electrically controlled valve (21) is electrically connected to the controller (20).

5. A data processing server heat dissipation mechanism as claimed in claim 1, further comprising a pump body (22) and a liquid pipe (23), wherein the pump body (22) is arranged at the bottom end of the cooling tank (1) in a communicating manner, the liquid pipe (23) is arranged at the output end of the pump body (22) in a communicating manner, and the output end of the liquid pipe (23) is arranged at the upper part of the cooling tank (1) in a communicating manner.

6. A heat dissipation mechanism for a data processing server as recited in claim 1, further comprising a second cover (24), wherein the second cover (24) is mounted at the bottom of the inner side wall of the chassis (2), the top end of the second cover (24) is communicated with the interior of the chassis (2), and the lower part of the second cover (24) is communicated with the input end of the second air duct (7).

7. A data processing server heat dissipating mechanism according to claim 6, further comprising a grille (25), the grille (25) being mounted on top of the second housing (24).

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