CN209861258U

CN209861258U - Module circuit

Info

Publication number: CN209861258U
Application number: CN201920295784.3U
Authority: CN
Inventors: 邓坤; 蒋峰; 陈仪恒; 陈治勇; 彭正; 王鹏; 张生德
Original assignee: Yao Shuo Information Technology Co Ltd Of Beijing Zhongke
Current assignee: Yao Shuo Information Technology Co Ltd Of Beijing Zhongke
Priority date: 2019-03-08
Filing date: 2019-03-08
Publication date: 2019-12-27
Anticipated expiration: 2029-03-08

Abstract

The technical scheme of the utility model a module circuit is provided, include: a PCB board; the PCB comprises a PCB and a plurality of electronic components, wherein the PCB is provided with a first surface and a second surface, the first surface is provided with a plurality of electronic components, the plurality of electronic components are provided with grounding contacts, the grounding contacts penetrate through the first surface, the PCB extends to the second surface in a protruding mode, and the metal heat conduction module is connected with at least two grounding contacts of the electronic components. The utility model discloses an increase metal heat conduction module, on conducting the heat total that produces among the module circuit to the ground contact as far as possible, on further high thermal conductivity through metal heat conduction module concentrates the metal module with the heat of dispersion on the ground contact on the circuit board, the rethread metal module is derived the heat with casing in close contact with's mode. The utility model discloses a module circuit, it is efficient at during operation heat conduction, and simple structure, easily industrial production.

Description

Module circuit

Technical Field

The utility model relates to a module circuit, especially a module circuit of sealed high-power consumption.

Background

In a sealed module circuit with high power consumption, many and scattered electronic components are provided. The heat that electronic components and parts gived off when working can disperse on the PCB board, and this heat lasts the accumulation in airtight space, can produce the great influence to sensitive key components and parts such as microprocessor among the module circuit, can lead to using the equipment of this module circuit to work for a long time or even can not normally work when serious, because the volume of module circuit is less, and is in encapsulated situation, so this kind of heat attached to on the PCB board influences greatly but is difficult for deriving. One existing solution is to conduct the heat away by bringing the heat sink into direct contact with the main heat generating device housing or heat generating face. However, in the case of a large number of and dispersed heat generating devices, the structural design of this method is very complicated, and heat dissipation is not thorough.

In addition, the experiment shows that the heat generating points of the integrated circuit are concentrated on the grounding contact points, and the grounding contact points in the circuit are communicated. Accordingly, it is desirable to provide an improved modular circuit.

Disclosure of Invention

The utility model aims at providing a high and simple structure's of radiating efficiency module circuit.

In order to achieve the above object, the present invention provides a module circuit, including: a PCB board; the PCB comprises a PCB and a plurality of electronic components, wherein the PCB is provided with a first surface and a second surface, the first surface is provided with a plurality of electronic components, the plurality of electronic components are provided with grounding contacts, the grounding contacts penetrate through the first surface, the PCB extends to the second surface in a protruding mode, and the metal heat conduction module is connected with at least two grounding contacts of the electronic components.

Furthermore, the second surface of the PCB board is a flat surface.

Furthermore, the metal heat conduction module comprises a pin, and the pin is connected with the grounding contact in a welding mode.

Furthermore, the module circuit further comprises a heat conducting pad and a shell, and the metal heat conducting module is further provided with a heat conducting surface which is connected with the shell through the heat conducting pad.

Further, the PCB board is a two-layer board or a multilayer board.

The utility model discloses following beneficial effect has: the utility model discloses an increase metal heat conduction module, on conducting the heat total that produces among the module circuit to the ground contact as far as possible, on further high thermal conductivity through metal heat conduction module concentrates the metal module with the heat of dispersion on the ground contact on the circuit board, the rethread metal module is derived the heat with casing in close contact with's mode. The utility model discloses a module circuit, it is efficient at during operation heat conduction, and simple structure, easily industrial production.

Drawings

Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention.

Fig. 1 is a schematic perspective view of a metal heat conduction module in the present invention.

Fig. 2 is a schematic diagram of the module circuit observed from the first side.

Fig. 3 is a schematic diagram of the module circuit observed from the first side.

Detailed Description

The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only to illustrate and explain the present invention, and not to limit the present invention.

Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

It will be understood by those within the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

As shown in fig. 1, fig. 1 is a schematic perspective view of a metal heat conduction module in the present invention. The design of the metal heat conduction module mainly considers the factors of two aspects of materials and structures.

Table 1 shows the thermal conductivity and reference prices for the same period for several technical materials for industrial use. According to the heat conduction demand of product design, combine the consideration of product cost control, the utility model discloses the module circuit chooses the copper product for use as the heat conduction material of metal module. As shown in table 1, among several metal materials used for industrial purposes, copper has a high thermal conductivity and is economical, and in addition, copper can be welded to completely meet design requirements, and is an ideal material for designing a heat dissipation system.

TABLE 1 Metal thermal conductivity and reference price

Name of Material	Coefficient of thermal conductivity	Reference price
			Silver (Ag)	420W/m.K	3464 kg/kg
Copper (Cu)	401W/m.K	49150 Yuan/ton
			Gold (gold)	318W/m.K	273.12 yuan/g
Aluminium	237W/m.K	13750 yuan/ton
			Platinum gold	70W/m.K	202 yuan/g
Iron	60W/m.K	3460 yuan/ton
			Steel	60W/m.K	4280 yuan/ton

With continued reference to fig. 1, fig. 1(a) - (c) are respectively three-dimensional views of the metal conductive module of the present invention at different angles. The specific shape and size of the metal conductive module 1 are determined according to the solder joint of the PCB design, the heat capacity and the placement space of the metal conductive module 1. Further, referring to fig. 1(a), the metal conductive module 1 includes a pin 11, the pin 11 is a solder pin, and the contact points of the pin 11 are all on the complete copper clad and close to the ground contact of the main heat dissipation device. Referring to fig. 1(c), the surface opposite to the pin 11 is a heat conducting surface 12 of the metal conductive module 1, and the operation mode of the metal conductive module 1 will be described in detail later.

Referring to fig. 2 and fig. 3, wherein, fig. 2 is a schematic diagram of the module circuit observed from the first side, and fig. 3 is a schematic diagram of the module circuit observed from the first side. The utility model discloses a module circuit includes PCB board 2, sets up a plurality of electronic components (31,32,33,34,35,36,37,38,39,40) and the metal heat conduction module 1 in the first face of PCB board 2. Wherein, a plurality of electronic components (31,32,33,34,35,36,37,38,39,40) are provided with a grounding contact, and the grounding contact penetrates through the PCB board 2 from the first surface and protrudes to the second surface. The metal heat conduction module 1 is connected with at least two of a plurality of electronic components (31,32,33,34,35,36,37,38,39,40) in a grounding contact manner. In the present embodiment, the pin 11 of the metal heat conduction module 1 is connected to the ground contact by soldering, so as to ensure a stable heat conduction structure. Because the arrangement of a plurality of electronic components (31,32,33,34,35,36,37,38,39,40) is dispersed and the shapes are different in height, if a mode that all heat dissipation devices are respectively contacted with the shell for heat dissipation is adopted, the design of the shell is very complicated, the design of a PCB (printed circuit board) is limited, and the heat dissipation is not complete. The sensitive component microprocessor 35 is located in the middle of the PCB board, and if the heat dissipation is not ideal, the operation of the whole module circuit will be greatly affected. The utility model discloses in, metal heat conduction module 1 concentrates on each electronic components's dispersion heat, only can derive the heat quantity through metal heat conduction module 1's heat-conducting surface 12.

Furthermore, the module circuit further comprises a heat conducting pad and a housing (not shown), and the heat conducting surface 12 is connected with the housing through the heat conducting pad 12, so that the maximum amount of heat can be led out. The utility model discloses in, casing and PCB design are all greatly simplified, and heat conduction efficiency is high.

Continuing to refer to fig. 2, the utility model discloses in, the cooling surface 12 of metal heat conduction module 1 is in same plane with other electronic components (41,42,43), and module circuit point scattered that generates heat has been solved to this design, and PCBA board both sides all need radiating problem. The utility model discloses concentrate on metal heat conduction module 1 the dispersion heat, and heat-conducting surface 11 and other electronic components (41,42,43) heating surface are in the homonymy, have greatly simplified the design of casing.

Continuing to refer to fig. 3, the utility model discloses in, electronic components (36,37,38,39) concentrate relatively, and metal heat conduction module 1 locating position is close above-mentioned electronic components (36,37,38,39), and this kind of design that shortens heat conduction path as far as possible has improved cooling system's heat conduction efficiency, has eliminated the possibility that thermal shock damaged sensitive component spare, has greatly improved the operational reliability of equipment.

The utility model discloses in, the second face of PCB board 2 is for leveling the surface. When the PCB 2 is a two-layer board, the ground plane should be blocked, and the heat conduction path between each ground point and the ground plane should be smooth. When the PCB board 2 is a multi-layer board, the ground plane remains intact without routing. The welding holes of the metal heat conduction module 1 are required to be arranged at the positions with the most complete grounding surface and the largest area. Therefore, the heat scattered on the electronic component can be conducted to the grounding point completely, the heat of the grounding point can be efficiently conducted to the metal module, and finally the heat is concentrated.

In practice, welding is a very important step. In the design, the metal module and other heating modules are on the same horizontal plane, and in the manufacturing process, it is very important that the welding installation of the metal module and each heat dissipation module is as horizontal as possible, and the installation error should be within an allowable range.

The utility model discloses a module circuit has been used on the unmanned aerial vehicle system. Before the module circuit is not installed, the temperature in the cavity of the equipment reaches 80 ℃ within 10 minutes, and the equipment stops working. After the module circuit is applied, the temperature in the cavity is balanced at 50 ℃ within 1 hour of full-load work of the equipment, and the equipment can continuously and stably work.

The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.

Claims

1. A modular circuit, comprising:

a PCB board;

set up and be in a plurality of electronic components of the first face of PCB board, be equipped with ground contact on a plurality of electronic components, ground contact follows first face passes PCB board and projection to second face, its characterized in that:

and the metal heat conduction module is connected with the grounding contacts of at least two electronic components in the plurality of electronic components.

2. A modular circuit as claimed in claim 1, wherein: the metal heat conduction module comprises a pin, and the pin is connected with the grounding contact in a welding mode.

3. A modular circuit as claimed in claim 1, wherein: the module circuit further comprises a heat conducting pad and a shell, the metal heat conducting module is further provided with a heat conducting surface, and the heat conducting surface is connected with the shell through the heat conducting pad.

4. A modular circuit as claimed in claim 1, wherein: the second surface of the PCB is a flat surface.

5. A modular circuit as claimed in claim 1, wherein: the PCB board is a two-layer board or a multilayer board.