CN209824164U - Heat insulation base of pin joint head in flexible substrate circuit - Google Patents
Heat insulation base of pin joint head in flexible substrate circuit Download PDFInfo
- Publication number
- CN209824164U CN209824164U CN201920420184.5U CN201920420184U CN209824164U CN 209824164 U CN209824164 U CN 209824164U CN 201920420184 U CN201920420184 U CN 201920420184U CN 209824164 U CN209824164 U CN 209824164U
- Authority
- CN
- China
- Prior art keywords
- joint head
- head body
- joint
- flexible substrate
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to an interior pin joint technical field just discloses the thermal-insulated base of pin joint in the flexible substrate circuit, including the joint body, the top fixedly connected with upper fixed plate of joint body, the bottom fixedly connected with bottom plate of joint body. This thermal-insulated base of pin joint in flexible substrate circuit, be equipped with upper fixed plate and bottom plate through setting up joint body top and bottom, and upper fixed plate and bottom plate are inside all seted up spacing hole, can carry on spacingly at spacing hole department mounting screw, and just it is good to tear open the nature, the effect of being convenient for install and dismantle has been reached, four hollow groove have been seted up through joint body is inside, and the top and the bottom in hollow groove are equipped with first louvre and second louvre, be favorable to the joint body to cool off, can make this thermal-insulated base be convenient for dispel the heat and insulate against heat, thereby the effectual problem of having solved bonding tool and joint main part and being not convenient for dismantle change or installation.
Description
Technical Field
The utility model relates to an interior pin joint head technical field specifically is a heat-insulating base of pin joint head in flexible substrate circuit.
Background
The substrate is a basic material for manufacturing a PCB (printed circuit board), generally, the substrate is a copper clad laminate, a single-sided and double-sided printed circuit board is manufactured by selectively performing processing such as hole processing, chemical copper plating, electro-coppering, etching and the like on a substrate material to obtain a required circuit pattern, and the other type of multi-layer printed circuit board is manufactured by alternately laminating and bonding a conductive pattern layer and a prepreg together by taking an inner core thin copper clad laminate as a base.
The existing inner pin joint head refers to a joint point which is formed by welding and combining a substrate and pins or a joint which is formed by connecting two or more pins and the substrate by a welding method, after a heating rod is disassembled after the inner pin joint head is used, the ventilation rate of a ventilation hole is low, so that the joint head body is cooled slowly, and the welding head and the joint head body are inconvenient to disassemble, replace or install according to the use requirement, so that the heat insulation base of the inner pin joint head of the flexible substrate circuit is provided to solve the problems.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
The utility model provides a not enough to prior art, the utility model provides a heat-insulating base of pin joint in flexible substrate circuit possesses the heat dissipation of being convenient for and advantages such as installation dismantlement, has solved the problem that bonding tool and joint main part are not convenient for dismantle change or installation.
(II) technical scheme
For the purpose of realizing the aforesaid be convenient for heat dissipation and installation dismantlement, the utility model provides a following technical scheme: the heat insulation base for the pin joint in the flexible substrate circuit comprises a joint body, wherein an upper fixing plate is fixedly connected to the top of the joint body, a lower fixing plate is fixedly connected to the bottom of the joint body, limiting holes are formed in the upper fixing plate and the lower fixing plate, a limiting groove is formed in the front of the joint body, a hollow groove is formed in the joint body, a countersunk hole is formed in the front of the joint body and located in the outer portion of the hollow groove, a first heat dissipation hole is formed in the joint body and located at the top of the hollow groove, a second heat dissipation hole is formed in the joint body and located at the bottom of the hollow groove, a threaded hole is formed in the outer portion of the joint body, and a heat dissipation groove is formed in the back of the joint body.
Preferably, the shape of the joint head body is rectangular, the shapes and the sizes of the joint head body and the lower fixing plate are equal, and the number of the limiting holes in the joint head body and the lower fixing plate is two.
Preferably, the number of the limiting grooves is four and the limiting grooves are uniformly distributed at four right angles of the front surface of the joint head body.
Preferably, the number of the hollow grooves in the bonding head body is four, and the four hollow grooves divide the front surface of the bonding head body into a shape like a Chinese character 'tian'.
Preferably, the number of the counter bores is four, the inner diameters of the four counter bores are equal, and the four counter bores are uniformly distributed on the left side of the front face and the right side of the front face of the joint head body.
Preferably, a hollow heat dissipation hole is formed in the joint head body and between the first heat dissipation hole and the second heat dissipation hole, and the first heat dissipation hole, the second heat dissipation hole and the hollow heat dissipation hole are arranged in parallel.
Preferably, the number of the threaded holes at the outer part of the joint head body is four, and the threaded holes are uniformly distributed at the left side and the right side of the joint head body.
(III) advantageous effects
Compared with the prior art, the utility model provides a heat-insulating base of pin joint in flexible substrate circuit possesses following beneficial effect:
1. this thermal-insulated base of pin joint in flexible substrate circuit, top and bottom through setting up the joint body all are equipped with upper fixed plate and bottom plate, and spacing hole has all been seted up to upper fixed plate and bottom plate's inside, the accessible carries on spacingly at spacing hole department mounting screw, and just easy dismantlement nature is good, the effect of being convenient for install and dismantle has been reached, four well grooves have been seted up through the inside of joint body, and the top and the bottom of well groove are equipped with first louvre and second louvre respectively, be favorable to the joint body to cool off, can make this thermal-insulated base be convenient for dispel the heat and thermal-insulated.
2. This heat-insulating base of pin joint in flexible substrate circuit runs through four hollow grooves through first louvre, second louvre and cavity louvre, can effectively avoid the slow condition of cooling rate to appear in joint body and bonding tool, separates the front of joint body for the field font through four hollow grooves, and its bottom formula structure as an organic whole, can effectively strengthen this heat-insulating base's thermal diffusivity and heat-proof quality to effectual bonding tool of having solved is not convenient for dismantle the problem of changing or installing with the joint main part.
Drawings
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is a three-dimensional front view of the bond head body of the present invention;
fig. 3 is a three-dimensional back view of the joint head body of the present invention.
In the figure: 1 joint head body, 2 upper fixed plate, 3 bottom plate, 4 spacing holes, 5 spacing grooves, 6 hollow groove, 7 counter bores, 8 first louvre, 9 second louvre, 10 screw hole, 11 radiating groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, the heat insulation base for the pin joint in the flexible substrate circuit comprises a joint body 1, an upper fixing plate 2 is fixedly connected to the top of the joint body 1, a lower fixing plate 3 is fixedly connected to the bottom of the joint body 1, limiting holes 4 are formed in the upper fixing plate 2 and the lower fixing plate 3, the joint body 1 is rectangular, the joint body 1 and the lower fixing plate 3 have the same shape and size, the number of the limiting holes 4 in the joint body 1 and the lower fixing plate 3 is two, limiting grooves 5 are formed in the front surface of the joint body 1, the number of the limiting grooves 5 is four, the four limiting grooves are uniformly distributed at four right corners of the front surface of the joint body 1, hollow grooves 6 are formed in the joint body 1, the number of the hollow grooves 6 in the joint body 1 is four, and the four hollow grooves 6 divide the front surface of the joint body 1 into a shape like a Chinese character 'tian', the front of the joint head body 1 and the outer part of the hollow groove 6 are provided with countersunk holes 7, the number of the countersunk holes 7 is four, the inner diameters of the four countersunk holes 7 are equal, the four countersunk holes 7 are uniformly distributed on the left side of the front of the joint head body 1 and the right side of the front, the inner part of the joint head body 1 and the top of the hollow groove 6 are provided with first heat dissipation holes 8, the inner part of the joint head body 1 and the bottom of the hollow groove 6 are provided with second heat dissipation holes 9, the inner part of the joint head body 1 and the opposite sides of the first heat dissipation holes 8 and the second heat dissipation holes 9 are provided with hollow heat dissipation holes, the first heat dissipation holes 8, the second heat dissipation holes 9 and the hollow heat dissipation holes are arranged in parallel, the outer part of the joint head body 1 is provided with threaded holes 10, the number of the threaded holes 10 on the outer part of the joint head body 1, radiating groove 11 has been seted up at the back of joint body 1, this flexible substrate circuit inner pin joint heat insulation base, run through four hollow groove 6 through first louvre 8, second louvre 9 and hollow louvre, can effectively avoid joint body 1 and the bonding tool condition that cooling rate is slower to appear, separate the front of joint body 1 for field font through four hollow groove 6, and its bottom formula structure as an organic whole, can effectively strengthen this heat dissipation and the heat-proof quality of heat insulation base, thereby the effectual bonding tool of having solved is not convenient for dismantle the problem of changing or installing with the joint main part.
To sum up, this thermal-insulated base of pin joint in flexible substrate circuit, top and bottom through setting up joint body 1 all are equipped with upper fixed plate 2 and bottom plate 3, and spacing hole 4 has all been seted up to upper fixed plate 2 and bottom plate 3's inside, the accessible is spacing at spacing hole 4 department mounting screw, and just easy dismantlement nature is good, the effect of being convenient for install and dismantle has been reached, four cavity grooves 6 have been seted up through joint body 1's inside, and the top and the bottom of cavity groove 6 are equipped with first louvre 8 and second louvre 9 respectively, be favorable to joint body 1 to cool off, can make this thermal-insulated base be convenient for dispel the heat and thermal-insulated.
Moreover, the heat insulation base of the pin joint in the flexible substrate circuit is characterized in that the four hollow grooves 6 are penetrated through the first radiating holes 8, the second radiating holes 9 and the hollow radiating holes, the situation that the cooling rate of the joint body 1 and a welding head is slow can be effectively avoided, the front surface of the joint body 1 is separated into a shape like a Chinese character tian through the four hollow grooves 6, the bottom of the heat insulation base is of an integrated structure, the heat dissipation performance and the heat insulation performance of the heat insulation base can be effectively enhanced, and therefore the problem that the welding head and the joint body are not convenient to disassemble, replace or install is effectively solved.
It is to be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. Heat insulation base of pin joint in flexible substrate circuit, including joint body (1), its characterized in that: the top of the joint head body (1) is fixedly connected with an upper fixing plate (2), the bottom of the joint head body (1) is fixedly connected with a lower fixing plate (3), limiting holes (4) are formed in the upper fixing plate (2) and positioned in the lower fixing plate (3), a limiting groove (5) is formed in the front of the joint head body (1), a hollow groove (6) is formed in the joint head body (1), a countersunk hole (7) is formed in the front of the joint head body (1) and positioned outside the hollow groove (6), a first heat dissipation hole (8) is formed in the joint head body (1) and positioned at the top of the hollow groove (6), a second heat dissipation hole (9) is formed in the joint head body (1) and positioned at the bottom of the hollow groove (6), and a threaded hole (10) is formed in the outside of the joint head body (1), the back of the joint head body (1) is provided with a heat dissipation groove (11).
2. The thermally insulated base of the inner pin joint head of flexible substrate circuit as claimed in claim 1, wherein: the appearance of joint head body (1) is the rectangle, and the appearance and the size of joint head body (1) and bottom plate (3) are equal, and the spacing hole (4) inside joint head body (1) and bottom plate (3) are two in quantity.
3. The thermally insulated base of the inner pin joint head of flexible substrate circuit as claimed in claim 1, wherein: the number of the limiting grooves (5) is four, and the limiting grooves are uniformly distributed at four right angles on the front surface of the joint head body (1).
4. The thermally insulated base of the inner pin joint head of flexible substrate circuit as claimed in claim 1, wherein: the number of the hollow grooves (6) in the joint head body (1) is four, and the four hollow grooves (6) divide the front surface of the joint head body (1) into a shape like Chinese character 'tian'.
5. The thermally insulated base of the inner pin joint head of flexible substrate circuit as claimed in claim 1, wherein: the number of the counter bores (7) is four, the inner diameters of the four counter bores (7) are equal, and the four counter bores (7) are uniformly distributed on the left side of the front face and the right side of the front face of the joint head body (1).
6. The thermally insulated base of the inner pin joint head of flexible substrate circuit as claimed in claim 1, wherein: a hollow heat dissipation hole is formed in the joint head body (1) and between the opposite sides of the first heat dissipation hole (8) and the second heat dissipation hole (9), and the first heat dissipation hole (8), the second heat dissipation hole (9) and the hollow heat dissipation hole are arranged in parallel.
7. The thermally insulated base of the inner pin joint head of flexible substrate circuit as claimed in claim 1, wherein: the number of the threaded holes (10) in the outer portion of the joint head body (1) is four, and the threaded holes are evenly distributed on the left side and the right side of the joint head body (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920420184.5U CN209824164U (en) | 2019-03-30 | 2019-03-30 | Heat insulation base of pin joint head in flexible substrate circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920420184.5U CN209824164U (en) | 2019-03-30 | 2019-03-30 | Heat insulation base of pin joint head in flexible substrate circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209824164U true CN209824164U (en) | 2019-12-20 |
Family
ID=68877871
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920420184.5U Active CN209824164U (en) | 2019-03-30 | 2019-03-30 | Heat insulation base of pin joint head in flexible substrate circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209824164U (en) |
-
2019
- 2019-03-30 CN CN201920420184.5U patent/CN209824164U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101841974A (en) | High-thermal conductivity circuit board and method for producing same by using electroplating method | |
| CN207369400U (en) | A kind of ceramic embedded radiating circuit plate | |
| CN206879195U (en) | A kind of heat radiating type heat conducting circuit board | |
| CN103906344B (en) | Heat-conducting type double-sided PCB | |
| CN209824164U (en) | Heat insulation base of pin joint head in flexible substrate circuit | |
| CN205005345U (en) | Circuit board that epoxy and metal base combine | |
| CN215121297U (en) | Copper-clad plate with holes and of multilayer composite structure | |
| CN210042376U (en) | Novel drilling circuit board | |
| CN209882201U (en) | Double-sided multilayer PCB | |
| CN204593313U (en) | A kind of LED metal base printed circuit board heat abstractor | |
| CN203788546U (en) | Heat dissipating PCB | |
| CN206938106U (en) | A kind of copper-clad plate of high heat conduction | |
| CN210042368U (en) | High heat conduction circuit board | |
| CN207283902U (en) | One kind heat dissipation pcb board | |
| CN102427665B (en) | Manufacturing technology of three-dimensional double-face aluminium substrate | |
| CN206402530U (en) | A kind of low-power consumption type printed circuit board (PCB) | |
| CN213426709U (en) | PCB substrate for display screen | |
| CN111954368A (en) | Thermoelectric separation filling electroplated double-sided metal substrate and manufacturing method thereof | |
| CN212163812U (en) | High heat conduction multilayer printed circuit board | |
| CN106515133A (en) | Manufacturing method of double-sided aluminum-based copper-clad plate for LED lamps | |
| CN217445731U (en) | From heat dissipation base plate of taking temperature to detect structure | |
| CN210511597U (en) | High-heat-conductivity aluminum substrate | |
| CN217283522U (en) | Waterproof heat dissipation multilayer circuit board of convenient location | |
| CN220292247U (en) | Double-sided FPC board convenient to connect and separable | |
| CN214901441U (en) | Multilayer high density circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |