CN217283522U - Waterproof heat dissipation multilayer circuit board of convenient location - Google Patents
Waterproof heat dissipation multilayer circuit board of convenient location Download PDFInfo
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- CN217283522U CN217283522U CN202220206631.9U CN202220206631U CN217283522U CN 217283522 U CN217283522 U CN 217283522U CN 202220206631 U CN202220206631 U CN 202220206631U CN 217283522 U CN217283522 U CN 217283522U
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- circuit board
- heat dissipation
- board body
- multilayer circuit
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Abstract
The utility model relates to a multilayer circuit board technical field just discloses a waterproof heat dissipation multilayer circuit board of convenient location, including circuit board body, positioning mechanism and waterproof layer, waterproof layer fixed connection is in the upper surface of circuit board body, positioning mechanism sets up in the left side of circuit board body, positioning mechanism includes first fixed plate and mounting groove, the right wall at first fixed plate is seted up to the mounting groove. This waterproof heat dissipation multilayer circuit board of convenient location, edge through at the circuit board sets up positioning mechanism, when needs fix a position the circuit board, its first locating piece can reciprocate along first fixed plate, adjust the position of first locating piece, make the preformed hole on the installed part can align with the locating hole, the screw of being convenient for fixes a position the circuit board, the practicality of multilayer circuit board has been improved, the setting of its heat-conducting plate can conveniently be with the heat transfer of production on the circuit board body to the fin simultaneously, make things convenient for the circuit board to dispel the heat fast.
Description
Technical Field
The utility model relates to a multilayer circuit board technical field specifically is a waterproof heat dissipation multilayer circuit board of convenient location.
Background
A circuit board is a conductive pattern, generally called a printed circuit, formed by a printed circuit, a printed element or a combination of both, formed on an insulating material according to a predetermined design. And a conductive pattern on the insulating substrate that provides electrical connection between the components is called a printed wiring. The finished board of the printed circuit or printed circuit is then referred to as a printed circuit board, also known as a printed circuit board or printed circuit board. Circuit boards can be classified into the following categories according to function: the circuit board comprises a single-sided circuit board, a double-sided circuit board, a multi-layer circuit board, an aluminum-based circuit board, an impedance circuit board, an FPC (flexible printed circuit) and the like, wherein the circuit board is prepared from the following raw materials: the glass fiber, CEM-1, CEM3, FR4 and the like, which can be seen in daily life, for example, the core of the fireproof cloth and the fireproof felt is the glass fiber, the glass fiber is easily combined with resin, the glass fiber cloth with compact structure and high strength is immersed in the resin and hardened to obtain the PCB substrate which is insulated and not easy to bend, if the PCB is broken, the edge is whitish and layered, and the material is proved to be resin glass fiber.
At present, the installation positioning holes of the existing multilayer circuit board are all four corners fixedly arranged on the circuit board, so that the positioning and the fixing of the circuit board are limited, the four corners of the circuit board can only be positioned by screws, and when the preformed hole of the installation part is deviated from the positioning holes on the circuit board, the positioning of the circuit board is difficult.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a waterproof heat dissipation multilayer circuit board of convenient location to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a waterproof heat dissipation multilayer circuit board of convenient location, includes circuit board body, positioning mechanism and waterproof layer, waterproof layer fixed connection is in the upper surface of circuit board body, positioning mechanism sets up in the left side of circuit board body.
Positioning mechanism includes first fixed plate and mounting groove, the right wall of first fixed plate is seted up to the mounting groove, spacing spout has been seted up to the left wall of first fixed plate, the inside sliding connection of spacing spout has the slider, the left wall fixedly connected with connecting block of slider, the first locating piece of left wall fixedly connected with of connecting block.
Preferably, the upper surface of the first positioning block is provided with a positioning hole, the front end of the left wall of the first fixing plate is fixedly connected with the first fixing block, and the positioning hole is arranged to facilitate the screw to penetrate through the first positioning block to position and fix the circuit board.
Preferably, the left end of the circuit board body is fixedly mounted in the mounting groove, the right wall of the circuit board body is fixedly mounted with a second fixing plate, and the second fixing plate is arranged to conveniently position and fix the right side of the circuit board body.
Preferably, a second fixing block is fixedly connected to the front end of the right wall of the second fixing plate, a second positioning block is arranged on the right side of the second fixing plate, and the second fixing block and the second positioning block are arranged to facilitate positioning and fixing of the circuit board body by screws.
Preferably, the bottom fixed mounting of circuit board body has the heat-conducting plate, the bottom fixed mounting of heat-conducting plate has the fin, and on the heat transfer of production can conveniently be gone up the circuit board body to the fin, make things convenient for the circuit board to dispel the heat fast in its heat-conducting plate's setting.
Preferably, the upper surface of the first fixing block is provided with a through hole, and the through hole is convenient for the screw to position and fix the first fixing block.
Preferably, the bottom of circuit board body is provided with sealed glue, sealed glue sets up in the edge of heat-conducting plate, and sealed setting up of its sealed glue can play sealed effect.
Compared with the prior art, the utility model provides a waterproof heat dissipation multilayer circuit board of convenient location. The method has the following beneficial effects:
this waterproof heat dissipation multilayer circuit board of convenient location, edge through at the circuit board sets up positioning mechanism, when needs fix a position the circuit board, its first locating piece can reciprocate along first fixed plate, adjust the position of first locating piece, make the preformed hole on the installed part can align with the locating hole, the screw of being convenient for fixes a position the circuit board, the practicality of multilayer circuit board has been improved, the setting of its heat-conducting plate can conveniently be with the heat transfer of production on the circuit board body to the fin simultaneously, make things convenient for the circuit board to dispel the heat fast.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic front view of the present invention;
FIG. 2 is a schematic view of the bottom cross-sectional structure of the present invention;
FIG. 3 is a schematic view of the bottom cross-sectional structure of the first fixing plate of the present invention;
fig. 4 is a schematic side view of the first fixing plate of the present invention.
In the figure: 1. a circuit board body; 2. a positioning mechanism; 201. a first fixing plate; 202. mounting grooves; 203. a first positioning block; 204. positioning holes; 205. connecting blocks; 206. a slider; 207. a limiting chute; 3. a waterproof layer; 4. a heat conducting plate; 5. a heat sink; 6. sealing glue; 7. a first fixed block; 8. a second fixing plate; 9. a second fixed block; 10. and a second positioning block.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
Referring to fig. 1-4, the present invention provides a technical solution: the utility model provides a waterproof heat dissipation multilayer circuit board of convenient location, includes circuit board body 1, positioning mechanism 2 and waterproof layer 3, 3 fixed connection in the upper surface of circuit board body 1 of waterproof layer, and positioning mechanism 2 sets up in the left side of circuit board body 1.
The upper surface of the first positioning block 203 is provided with a positioning hole 204, the front end of the left wall of the first fixing plate 201 is fixedly connected with a first fixing block 7, the positioning hole 204 is arranged to facilitate the positioning and fixing of the circuit board by a screw penetrating through the first positioning block 203, the left end of the circuit board body 1 is fixedly arranged inside the mounting groove 202, the right wall of the circuit board body 1 is fixedly provided with a second fixing plate 8, the second fixing plate 8 is arranged to facilitate the positioning and fixing of the right side of the circuit board body 1, the front end of the right wall of the second fixing plate 8 is fixedly connected with a second fixing block 9, the right side of the second fixing plate 8 is provided with a second positioning block 10, the arrangement of the second fixing block 9 and the second positioning block 10 is convenient for the positioning and fixing of the circuit board body 1 by a screw, the bottom of the circuit board body 1 is fixedly provided with a heat conducting plate 4, and the bottom of the heat conducting plate 4 is fixedly provided with a radiating fin 5, the heat conducting plate 4 is arranged to conveniently transfer the heat produced on the circuit board body 1 to the radiating fins 5, so that the circuit board can conveniently and quickly radiate, the upper surface of the first fixing block 7 is provided with a through hole, the through hole is arranged to conveniently position and fix the first fixing block 7 by a screw, the bottom of the circuit board body 1 is provided with the sealant 6, the sealant 6 is arranged at the edge of the heat conducting plate 4, the sealant 6 can play a sealing role, the positioning mechanism 2 is arranged at the edge of the circuit board, when the circuit board needs to be positioned, the first positioning block 203 can move up and down along the first fixing plate 201, the position of the first positioning block 203 is adjusted, so that the reserved hole on the mounting piece can be aligned with the positioning hole 204, the screw can conveniently position and fix the circuit board, the practicability of the multilayer circuit board is improved, and the heat produced on the circuit board body 1 can be conveniently transferred to the radiating fins 5 by the arrangement of the heat conducting plate 4, the circuit board can be conveniently and rapidly cooled.
In the actual operation process, when this device uses, set up positioning mechanism 2 through the edge at the circuit board, when needs fix a position the circuit board, its first locating piece 203 can reciprocate along first fixed plate 201, adjust the position of first locating piece 203, make the preformed hole on the installed part can align with locating hole 204, the screw of being convenient for fixes a position the circuit board, the practicality of multilayer circuit board has been improved, simultaneously its heat-conducting plate 4 set up can conveniently with circuit board body 1 on the heat transfer to fin 5, make things convenient for the circuit board to dispel the heat fast.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. The term "comprising", without further limitation, means that the element so defined is not excluded from the group consisting of additional identical elements in the process, method, article, or apparatus that comprises the element.
Claims (7)
1. The utility model provides a waterproof heat dissipation multilayer circuit board of convenient location, includes circuit board body (1), positioning mechanism (2) and waterproof layer (3), its characterized in that: the waterproof layer (3) is fixedly connected to the upper surface of the circuit board body (1), and the positioning mechanism (2) is arranged on the left side of the circuit board body (1);
positioning mechanism (2) include first fixed plate (201) and mounting groove (202), the right wall of first fixed plate (201) is seted up in mounting groove (202), spacing spout (207) have been seted up to the left wall of first fixed plate (201), the inside sliding connection of spacing spout (207) has slider (206), the left wall fixedly connected with connecting block (205) of slider (206), the first locating block (203) of the left wall fixedly connected with of connecting block (205).
2. The waterproof heat dissipation multilayer circuit board of claim 1, characterized in that: the surface of the first positioning block (203) is provided with a positioning hole (204), and the front end of the left wall of the first fixing plate (201) is fixedly connected with a first fixing block (7).
3. The waterproof heat dissipation multilayer circuit board of claim 1, characterized in that: the left end fixed mounting of circuit board body (1) is in the inside of mounting groove (202), the right wall fixed mounting of circuit board body (1) has second fixed plate (8).
4. The waterproof heat dissipation multilayer circuit board of convenient location of claim 3, characterized in that: the front end of the right wall of the second fixing plate (8) is fixedly connected with a second fixing block (9), and a second positioning block (10) is arranged on the right side of the second fixing plate (8).
5. The waterproof heat dissipation multilayer circuit board of convenient location of claim 1, characterized in that: the bottom fixed mounting of circuit board body (1) has heat-conducting plate (4), the bottom fixed mounting of heat-conducting plate (4) has fin (5).
6. The waterproof heat dissipation multilayer circuit board of claim 2, characterized in that: the upper surface of the first fixing block (7) is provided with a through hole.
7. The waterproof heat dissipation multilayer circuit board of claim 1, characterized in that: the bottom of circuit board body (1) is provided with sealed glue (6), sealed glue (6) set up in the edge of heat-conducting plate (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220206631.9U CN217283522U (en) | 2022-01-25 | 2022-01-25 | Waterproof heat dissipation multilayer circuit board of convenient location |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220206631.9U CN217283522U (en) | 2022-01-25 | 2022-01-25 | Waterproof heat dissipation multilayer circuit board of convenient location |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217283522U true CN217283522U (en) | 2022-08-23 |
Family
ID=82902334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220206631.9U Active CN217283522U (en) | 2022-01-25 | 2022-01-25 | Waterproof heat dissipation multilayer circuit board of convenient location |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217283522U (en) |
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2022
- 2022-01-25 CN CN202220206631.9U patent/CN217283522U/en active Active
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