CN209822623U - Multi-chip stacked heat dissipation device - Google Patents

Abstract

The utility model relates to a chip heat dissipation technical field specifically is a heat abstractor of multicore piece heap, including the left socle, the lower extreme of left socle is through welding board fixed mounting on the circuit board, and the right-hand member face vertical welding of left socle has the three-layer diaphragm of linear distribution, leaves the mounting groove between two adjacent diaphragms from top to bottom, and beneficial effect is: the utility model has the advantages that the left and right supports are arranged, so that gaps are left between the mutually stacked chips, and the heat dissipation efficiency between the chips is improved; the chip is arranged on the heat dissipation plate, and the heat dissipation efficiency is improved by utilizing the plurality of heat dissipation strips at the lower end of the heat dissipation plate; through the cooperation that sets up rubber buffer and mounting panel for remain throughout between chip terminal and the contact closely laminating, realize the firm connection of stability of chip.

Description

Multi-chip stacked heat dissipation device

Technical Field

The utility model relates to a chip heat dissipation technical field specifically is a heat abstractor of multicore piece heap.

Background

The assembly method is to directly mount the bare integrated circuit chip on the multilayer high-density interconnection substrate, and the metal wires of the layers are connected by the via holes. This assembly allows the chips to be in close proximity to each other, which reduces problems of signal delay, cross-talk noise, inductive/capacitive coupling, etc. that may be generated in the interconnects and wiring.

When the mutual stack installation of multicore piece, because the chip is laminated each other from top to bottom, lead to inside heat gathering for the temperature risees, and the heat can not be in time lost, lead to the circuit to burn out or chip utility life reduces, because the temperature is higher, make the circuit board soldering melt, make the contact failure of chip and circuit board.

Therefore, the multi-chip stacked heat dissipation device is provided, and the problem of timely heat dissipation among chips is solved.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a heat abstractor of multicore piece heap to solve the problem that proposes in the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme:

a multi-chip stacked heat dissipation device comprises a left support, wherein the lower end of the left support is fixedly and vertically installed on a circuit board through a welding plate, three layers of transverse plates which are linearly distributed are vertically welded on the right end face of the left support, a mounting groove is reserved between two transverse plates which are adjacent from top to bottom, a chip is arranged in the mounting groove, a mounting plate is fixedly installed on the upper end face of each transverse plate, a rectangular frame is arranged in the middle of the upper end face of the mounting plate, welding feet which correspond to welding holes are arranged at the left end and the right end of the lower end face of the mounting plate, a heat dissipation plate is fixedly welded at the lower end of the rectangular frame, a chip is fixedly installed at the upper end of the heat dissipation plate, a pair of terminals which are symmetrical to each other are arranged at the left end face and the right end face of the chip, four welding rods, the upper end of the rubber cushion pad is fixedly bonded on the lower end face of the transverse plate, and the lower end of the rubber cushion pad is tightly attached to the upper end face of the chip.

Preferably, the fixed slot has been seted up to the upper end of diaphragm, the up end of fixed slot is provided with four welding holes of linear distribution, and the inside grafting in this welding hole has the leg, and the diaphragm passes through the cooperation fixed connection mounting panel of welding hole and leg, the other end fixed mounting of mounting panel is in the inside of right branch frame, be bilateral symmetry between right branch frame and the left socle and distribute.

Preferably, four jacks distributed in a circumferential array are arranged in the middle of the upper end face of the heat dissipation plate, welding rods are connected to the inner walls of the jacks, and the upper end face of the heat dissipation plate is fixedly connected with the chip through soldering between the jacks and the welding rods.

Preferably, contacts are arranged at the left end and the right end of the upper end face of the heat dissipation plate, and the contacts are electrically connected with terminals on the lower end face of the chip in a matched mode.

Preferably, a gap is reserved between the lower end face of the heat dissipation plate and the upper end face of the chip, a plurality of heat dissipation strips which are linearly distributed are arranged on the lower end face of the heat dissipation plate, and the upper ends of the heat dissipation strips are fixedly welded on the lower end face of the heat dissipation plate.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model has the advantages that the left and right supports are arranged, so that gaps are left between the mutually stacked chips, and the heat dissipation efficiency between the chips is improved;

2. the utility model discloses an install the chip on the heating panel, utilize a plurality of heat dissipation strips of heating panel lower extreme, and then improve the radiating efficiency;

3. the utility model discloses a set up the cooperation of rubber blotter and mounting panel for remain throughout between chip terminal and the contact and closely laminate, realize the firm connection of stability of chip.

Drawings

Fig. 1 is a front view of the present invention;

FIG. 2 is a schematic view of the mounting plate structure of the present invention;

FIG. 3 is a schematic diagram of the chip structure of the present invention;

fig. 4 is a schematic view of the three-dimensional structure of the left bracket of the present invention.

In the figure: 1 left socle, 2 diaphragm, 3 weld the board, 4 mounting grooves, 5 fixed slots, 6 welding holes, 7 rubber buffer, 8 mounting panels, 9 rectangle frames, 10 heating panels, 11 heat dissipation strip, 12 jacks, 13 contacts, 14 pins, 15 chips, 16 terminals, 17 welding rods, 18 right socle.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1 to 4, the present invention provides a technical solution:

the utility model provides a heat abstractor of multicore piece heap, including left socle 1, the lower extreme of left socle 1 is installed perpendicularly on the circuit board through welding 3 fixed weldings of board, the right-hand member face vertical welding of left socle 1 has linear distribution's three-layer diaphragm 2, leave mounting groove 4 between two adjacent diaphragms 2 from top to bottom, the inside of this mounting groove 4 is provided with chip 15, the up end fixed mounting of diaphragm 2 has mounting panel 8, fixed slot 5 has been seted up to the upper end of diaphragm 2, the up end of fixed slot 5 is provided with four welding holes 6 of linear distribution, the inside grafting of this welding hole 6 has leg 14, diaphragm 2 is through welding hole 6 and leg 14's cooperation fixed connection mounting panel 8.

The other end of the mounting plate 8 is fixedly mounted inside the right support 18, the right support 18 and the left support 1 are distributed in bilateral symmetry, a rectangular frame 9 is arranged in the middle of the upper end face of the mounting plate 8, welding feet 14 corresponding to the welding holes 6 are arranged at the left end and the right end of the lower end face of the mounting plate 8, and a heat dissipation plate 10 is fixedly welded at the lower end of the rectangular frame 9.

Four jacks 12 distributed in a circumferential array are arranged in the middle of the upper end face of the heat dissipation plate 10, welding rods 17 are connected with the inner walls of the jacks 12, the upper end face of the heat dissipation plate 10 is fixedly connected with a chip 15 through tin soldering between the jacks 12 and the welding rods 17, the upper end of the heat dissipation plate 10 is fixedly provided with the chip 15, a gap is reserved between the lower end face of the heat dissipation plate 10 and the upper end face of the chip 15, the lower end face of the heat dissipation plate 10 is provided with a plurality of heat dissipation strips 11 distributed linearly, the upper ends of the heat dissipation strips 11 are fixedly welded on the lower end face of the heat dissipation plate 10, the left end and the right end of the lower end face of the chip 15 are provided with a pair of terminals 16 which are symmetrical to each other, the left end and the right end of the upper end face of the heat dissipation plate 10 are provided with contacts 13, the contacts 13 are electrically connected with the terminals 16, the upper end of the rubber cushion pad 7 is fixedly bonded on the lower end face of the transverse plate 2, and the lower end of the rubber cushion pad 7 is tightly attached on the upper end face of the chip 15.

The working principle is as follows: firstly, a left bracket 1 and a right bracket 18 are fixedly connected on a circuit board through a welding plate 3, then a mounting plate 8 is fixedly arranged inside a fixing groove 5 through the matching of a welding pin 14 and a welding hole 6, then the soldering connection of a chip 15 is realized by utilizing the matching of a jack 12 and a welding rod 17, further the chip 15 is arranged on the upper end surface of a heat dissipation plate 10 inside a rectangular frame 9, the heat between the chips 15 is timely dissipated into the air by utilizing a heat dissipation strip 11 of the heat dissipation plate 10, the chip 15 is tightly pressed on the upper end of the heat dissipation plate 10 by utilizing the matching of a rubber buffer cushion 17 at the lower end of a transverse plate 2 and the heat dissipation plate 10, at the moment, a terminal 16 of the chip 15 is tightly connected with a contact 13 on the heat dissipation plate 10, the stable connection between the chip 15 and the circuit board is realized, meanwhile, the heat dissipation plate 10 is, thereby improving the heat dissipation effect.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (5)

1. The utility model provides a heat abstractor of multicore piece heap, includes left socle (1), its characterized in that: the lower extreme of left socle (1) is through welding board (3) fixed mounting on the circuit board, and the perpendicular welding of the right-hand member face of left socle (1) has three-layer diaphragm (2) of linear distribution, leaves mounting groove (4) between two adjacent diaphragms (2) from top to bottom, and the inside of this mounting groove (4) is provided with chip (15), the up end fixed mounting of diaphragm (2) has mounting panel (8), rectangle frame (9) has been seted up in the middle of the up end of mounting panel (8), and the lower extreme face left and right sides both ends of mounting panel (8) are provided with welding foot (14) corresponding with welding hole (6) position, the lower extreme fixed welding of rectangle frame (9) has heating panel (10), the upper end fixed mounting of heating panel (10) has chip (15), both ends are provided with a pair of terminal (16) of mutual symmetry about the lower extreme face, four welding rods (17) distributed in a circumferential array are arranged in the middle of the lower end face of the chip (15), a rubber cushion pad (7) is arranged between the upper end face of the chip (15) and the lower end face of the transverse plate (2), the upper end of the rubber cushion pad (7) is fixedly bonded on the lower end face of the transverse plate (2), and the lower end of the rubber cushion pad (7) is tightly attached to the upper end face of the chip (15).

2. The multi-chip stacked heat dissipation device of claim 1, wherein: fixed slot (5) have been seted up to the upper end of diaphragm (2), the up end of fixed slot (5) is provided with four welding hole (6) of linear distribution, and the inside grafting of this welding hole (6) has leg (14), and diaphragm (2) are through cooperation fixed connection mounting panel (8) of welding hole (6) and leg (14), the other end fixed mounting of mounting panel (8) is in the inside of right branch frame (18), right branch frame (18) are bilateral symmetry distribution with left socle (1).

3. The multi-chip stacked heat dissipation device of claim 1, wherein: four jacks (12) distributed in a circumferential array are arranged in the middle of the upper end face of the heat dissipation plate (10), welding rods (17) are connected to the inner walls of the jacks (12), and the upper end face of the heat dissipation plate (10) is fixedly connected with chips (15) through the jacks (12) and the welding rods (17).

4. The multi-chip stacked heat dissipation device of claim 1, wherein: contacts (13) are arranged at the left end and the right end of the upper end face of the heat dissipation plate (10), and the contacts (13) are matched and electrically connected with terminals (16) on the lower end face of the chip (15).

5. The multi-chip stacked heat dissipation device of claim 1, wherein: leave the clearance between the up end of the lower terminal surface of heating panel (10) and chip (15), and the lower terminal surface of heating panel (10) is provided with a plurality of radiating strip (11) of linear distribution, the fixed welding in the lower terminal surface of heating panel (10) in the upper end of radiating strip (11).