CN209811949U - Active control shearing action and temperature induced gradient thickening polishing processing device - Google Patents

Active control shearing action and temperature induced gradient thickening polishing processing device Download PDF

Info

Publication number
CN209811949U
CN209811949U CN201920412295.1U CN201920412295U CN209811949U CN 209811949 U CN209811949 U CN 209811949U CN 201920412295 U CN201920412295 U CN 201920412295U CN 209811949 U CN209811949 U CN 209811949U
Authority
CN
China
Prior art keywords
polishing
temperature
polishing solution
solution tank
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201920412295.1U
Other languages
Chinese (zh)
Inventor
李敏
宋方增
董婷
杨晓莹
刘明辉
黄振荣
唐成
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hunan University of Science and Technology
Original Assignee
Hunan University of Science and Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hunan University of Science and Technology filed Critical Hunan University of Science and Technology
Priority to CN201920412295.1U priority Critical patent/CN209811949U/en
Application granted granted Critical
Publication of CN209811949U publication Critical patent/CN209811949U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)

Abstract

An active control shearing action and temperature induced gradient thickening polishing processing device comprises a workpiece clamp, a polishing disc, a polishing pad, a polishing liquid pool, a main shaft, a polishing liquid box, a temperature sensor, a temperature changing rod and a water pump, wherein the polishing disc is arranged on the main shaft, and the polishing pad is arranged on the polishing disc; the workpiece clamp is arranged above the polishing disc, and a workpiece is clamped on the workpiece clamp; the polishing solution tank is arranged at the lower left of the polishing solution tank, the polishing solution tank is arranged below the polishing disc, the liquid conveying pipe is connected with the polishing solution tank and the polishing solution tank, the water pump is arranged in the polishing solution tank, and the water pump is connected with the liquid conveying pipe; the temperature sensor is arranged in the workpiece clamp, and a contact head of the temperature sensor is contacted with polishing liquid in a polishing area of the workpiece; the temperature change rod is arranged in the workpiece clamp; the polishing solution box is internally filled with polishing solution with a temperature-induced gradient thickening effect. The utility model provides an initiative control shearing temperature induced gradient thickening polishing processingequipment that polishing efficiency is higher, polishing process controllability and flexibility are good.

Description

Active control shearing action and temperature induced gradient thickening polishing processing device
Technical Field
The utility model belongs to the technical field of the super precision finishing, specifically relate to an active control shearing action and temperature induction gradient thickening polishing processingequipment.
Background
Ultraprecise machining technology is an important component of modern science and technology and is widely applied in many fields. For example, processing of hard and brittle materials such as sapphire, single-crystal silicon, and various functional ceramics, and materials such as bearing elements; high precision, low damage, beautiful appearance and the like of various complex curved surfaces. By using ultra-precision machining techniques, workpiece surfaces with low surface roughness, low/no surface damage or subsurface damage can be obtained.
Polishing is one of ultra-precision machining, and refers to an ultra-precision machining process capable of reducing the surface roughness of a workpiece and improving the surface finish of the workpiece under the action of machinery, chemistry or electrochemistry. Shear thickening polishing is a novel polishing process proposed in recent years, and is a polishing process which utilizes non-Newtonian fluid with shear thickening effect as base liquid, wherein abrasive particles are added to prepare polishing liquid, a shear thickening flexible grinding tool is formed under the action of shear, and the surface of a workpiece is subjected to material removal under the action of speed and load. The workpiece subjected to shear thickening polishing has smaller surface roughness, causes small surface damage or subsurface damage, and has the characteristics of wide sources, low cost and the like. The viscosity of the shear thickening fluid increases as the temperature decreases.
A temperature sensor is a sensor that senses temperature and converts it into a usable output signal. The temperature sensor is the core part of the temperature measuring instrument and has a plurality of varieties. The measurement method can be divided into a contact type and a non-contact type, and the measurement method can be divided into a thermal resistor and a thermocouple according to the characteristics of sensor materials and electronic elements.
The invention discloses a Chinese invention patent (CN201810122104.8), and the patent name is: an efficient ultraprecise shearing thickening-chemical synergistic polishing device. The patent implementing equipment comprises a polishing tool, a polishing tool clamp, a polishing fixed movable disc, a dust cover and a polishing solution circulating device. The invention utilizes the synergy of active restriction of the liquid flow boundary, active control of the flow of the polishing liquid flow, shear thickening and green chemical action to improve the processing efficiency and precision and expand the processable material and surface shape. The polishing solution has the advantages that the polishing solution is wide in processable material, various in processing surface type and environment-friendly, the shear thickening effect is utilized, the polishing is flexible, the material removal certainty is improved, and the surface deterioration layer is few; the polishing process has the disadvantages that the viscosity of polishing solution in the polishing area of a workpiece cannot be directionally changed in the polishing process, so that the polishing process is lack of flexibility.
Granted chinese utility model patent (CN 201410436897.2), patent name: the ultraprecise processing device with the non-Newtonian fluid shear thickening and electrolysis composite effect comprises a polishing tool, a polishing tool clamp, a workpiece clamp and a polishing pool, wherein a conductive piece of the workpiece clamp is connected with a power supply anode, and a conductive piece of the polishing tool clamp is connected with a power supply cathode. Abrasive particles or micro-powder are added into the non-Newtonian fluid with the shear thickening effect to prepare polishing solution, and an electrolyte component is added, so that the polishing solution has both the electrolytic effect and the shear thickening effect. After the power supply is electrified, an electrochemical reaction is generated between the anode workpiece and the cathode polishing tool, the metal on the surface of the workpiece is dissolved by electrolysis, and then an oxide film which hinders the electrochemical reaction is formed on the surface of the workpiece. The oxide film on the bulge of the workpiece surface is firstly ground to expose fresh metal, and the electrochemical reaction can be continued at the bulge. The oxide film in the recess is not removed, the chemical reaction is hindered, and the metal is protected. Simultaneously because the peak effect of electric current, the protruding department electric field intensity is big, and is also strong to the corrosivity of metal, and the abrasive particle is stronger to the removal effect of work piece surface protruding department under the shear thickening effect, and the combined action influence in these several respects for work piece surface protruding department is got rid of rapidly, and surface roughness also reduces rapidly. The defect of the patent lies in that the adaptability to the surface shape of a machinable workpiece is poor, the problem of certainty of material removal cannot be solved, the certainty polishing and high surface shape precision of a workpiece material are difficult to realize, the range of the machinable material (with conductive performance) is limited, and the electrolyte belongs to a non-environment-friendly substance, has large influence on the environment and high environment-friendly treatment cost. However, since the polishing only relies on a single shear thickening effect to produce micro-cut formation material removal from the workpiece, there is still room for improvement in polishing efficiency.
Granted chinese invention patent (CN 201510366852.7), patent name: an ultra-precise polishing method for actively controlling the removal mechanism transformation of workpiece materials. According to the polishing method, a workpiece-polishing disk contact state adjusting mechanism is adopted in the polishing process, close contact polishing is adopted at the initial polishing time to guarantee the workpiece processing shape precision, then the contact state of the workpiece and the polishing disk is adjusted, and a non-contact polishing is adopted to remove a workpiece surface processing damage layer of the close contact polishing. The patent fails to change the concentration of the polishing liquid at the non-contact polishing removal stage, and the polishing efficiency at this stage is insufficient.
Disclosure of Invention
In order to overcome the polishing efficiency of having the polishing mode lower, the relatively poor not enough of polishing process controllability and flexibility, the utility model provides a polishing efficiency is higher, the polishing process controllability and the good active control shearing temperature induced gradient thickening polishing processingequipment of flexibility.
The utility model provides a technical scheme that its technical problem adopted is:
an active control shearing action and temperature induced gradient thickening polishing processing device comprises a workpiece clamp, a polishing disc, a polishing pad, a polishing liquid pool, a main shaft, a polishing liquid box, a temperature sensor, a temperature changing rod and a water pump, wherein the polishing disc is arranged on the main shaft, and the polishing pad is arranged on the polishing disc; the workpiece clamp is arranged above the polishing disc, and a workpiece is clamped on the workpiece clamp; the polishing solution tank is arranged at the lower left of the polishing solution tank, the polishing solution tank is arranged below the polishing disc, the liquid conveying pipe is connected with the polishing solution tank and the polishing solution tank, the water pump is arranged in the polishing solution tank, and the water pump is connected with the liquid conveying pipe; the temperature sensor is arranged in the workpiece clamp, and a contact head of the temperature sensor is contacted with polishing liquid in a polishing area of the workpiece; the temperature change rod is arranged in the workpiece clamp; the polishing solution box is internally filled with polishing solution with a temperature-induced gradient thickening effect.
Still further, the device also comprises a data receiver for wirelessly receiving the signal transmitted from the temperature sensor and being capable of wirelessly controlling the startup/shutdown of the temperature change rod; the temperature sensor has a data wireless transmission function and a built-in battery; the temperature-changing rod has a data wireless transmission function and a built-in battery characteristic; the temperature sensor and the temperature change rod are in communication connection with the data receiver.
The data receiver comprises a control module for monitoring the temperature of the polishing solution, starting the temperature change rod, and reducing the temperature of the polishing solution at intervals of time gradient to realize temperature-induced gradient thickening and polishing.
Furthermore, the polishing solution comprises the following components in percentage by weight: 8-25 wt% of polishing abrasive particles, 16-25 wt% of shear thickening base liquid, 35-55 wt% of water and 1-16 wt% of temperature-changing particles, wherein the polishing liquid can change temperature rapidly under the action of a cooling sheet in the processing process, so that active control of shear temperature induced gradient thickening polishing is realized.
The temperature-changing particles can be selected to be particles with a specific heat capacity value (the value can be smaller than that of water or a thickening phase), and the selected temperature-changing particles are required not to influence the thickening effect of the polishing solution.
The polishing solution tank is provided with a polishing solution circulating system, the polishing solution circulating system is composed of a liquid conveying pipe, a polishing solution tank, a water pump, a polishing solution tank and a polishing solution tank, the polishing solution in the polishing solution tank is conveyed into the workpiece clamp and the polishing pad through the liquid conveying pipe, and redundant polishing solution flows into the polishing solution tank and reaches the polishing solution tank through the liquid conveying pipe.
The shearing action is actively controlled in the rough polishing stage by actively controlling the shearing action and the temperature-induced gradient thickening polishing technology, so that the polishing efficiency is improved; in the fine polishing stage, gradient thickening is induced by temperature, and the workpiece with high surface quality and low/no surface damage or subsurface damage is obtained by gradually and slowly polishing layer by layer.
The active control shearing action and the temperature induced gradient thickening polishing, wherein the active control shearing action is realized by changing the load applied to the workpiece by the workpiece clamp or the rotating speed of the polishing disc or the rotating speed of the workpiece clamp; the temperature-induced gradient thickening is realized by changing the temperature of the polishing solution at intervals through a temperature-changing rod in a workpiece clamp and combining active shear rate control, so that the viscosity of the polishing solution can be changed at intervals, and the gradient thickening of the polishing solution is realized. In the rough polishing stage, the viscosity of the polishing solution on the polishing surface of the workpiece is increased due to the large shearing action, and the viscosity of the polishing solution is reduced due to the friction heat generated by the shearing action, so that the viscosity of the polishing solution is stable finally, and the workpiece is roughly polished at the viscosity; and in the fine polishing stage, the temperature of the polishing solution is rapidly changed by x ℃ by a temperature changing rod every t time, the viscosity of the polishing solution is increased, the polishing solution is polished for a period of time under the viscosity, and the polishing is circulated in such a way, so that the active control of shearing action and temperature-induced gradient thickening polishing are finally realized.
Compared with the prior art, the beneficial effects of the utility model are that:
(1) the utility model discloses utilized active control shearing action and temperature induction gradient thickening technique, not only improved the polishing efficiency to the work piece, obtained surface quality height, low roughness's work piece, still improved the controllability of polishing process, flexibility, increased polishing process's variety.
(2) The utility model discloses utilized non-Newtonian fluidic shear thickening effect, made this polishing be flexible polishing, can the work piece to low/no surface damage or sub-surface damage.
Drawings
Fig. 1 is a schematic diagram of actively controlling shearing action and temperature induced gradient thickening and polishing, and comprises a workpiece 1, a temperature sensor 2, polishing liquid 3, a temperature changing rod 4, a polishing pad 5, a workpiece clamp 6, a liquid conveying pipe 7, a water pump 8, a polishing liquid box 9, a main shaft 10, a polishing liquid pool 11 and a polishing disc 12.
Detailed Description
The present invention will be further described with reference to the accompanying drawings.
Referring to fig. 1, the active control shearing action and temperature induced gradient thickening and polishing processing device comprises a workpiece clamp 6, a polishing disc 12, a polishing pad 5, a polishing solution pool 11, a main shaft 10, a polishing solution tank 9, a temperature sensor 2, a temperature changing rod 4 and a water pump 8, wherein the polishing disc 12 is installed on the main shaft 10, the polishing pad 5 is installed on the polishing disc 12, and the polishing solution pool 11 is installed below the polishing disc 12; the workpiece fixture 6 is arranged above the polishing disc 12, and the workpiece 1 is clamped on the workpiece fixture 6; the polishing solution box 9 is arranged at the lower left of the polishing solution pool 11, the liquid conveying pipe 7 is connected with the polishing solution pool 11 and the polishing solution box 9, the water pump 8 is arranged in the polishing solution box 9, and the water pump 8 is connected with the liquid conveying pipe 7; the temperature sensor 2 is arranged in the workpiece clamp 6, and a contact head of the temperature sensor is contacted with polishing liquid in a polishing area of the workpiece 1; the temperature change rod 4 is arranged in the workpiece fixture, and the polishing solution box 9 is filled with polishing solution with temperature-induced gradient thickening effect.
The device also comprises a data receiver for wirelessly receiving the signal transmitted from the temperature sensor 2 and being capable of wirelessly controlling the startup/shutdown of the temperature change rod 4; the temperature sensor 2 has a data wireless transmission function and a built-in battery; the temperature-changing rod 4 has a data wireless transmission function and a built-in battery characteristic; the temperature sensor 2 and the temperature change rod 4 are in communication connection with the data receiver.
The data receiver comprises a control module for monitoring the temperature of the polishing solution, starting the temperature change rod, and reducing the temperature of the polishing solution at intervals of time gradient to realize temperature-induced gradient thickening and polishing.
Furthermore, the polishing solution comprises the following components in percentage by weight: 8-25 wt% of polishing abrasive particles, 16-25 wt% of shear thickening base liquid, 35-55 wt% of water and 1-16 wt% of temperature-changing particles, wherein the polishing liquid can change temperature rapidly under the action of a cooling sheet in the processing process, so that active control of shear temperature induced gradient thickening polishing is realized.
In this embodiment, the polishing solution may include the following components in parts by weight:
8 wt.% polishing abrasive particles, 25 wt.% shear thickening base solution, 55 wt.% water, 12 wt.% temperature changing particles;
or the following steps: 20 wt.% polishing abrasive particles, 16 wt.% shear thickening base solution, 50 wt.% water, 14 wt.% temperature changing particles;
or the following steps: 25 wt.% polishing abrasive particles, 24 wt.% shear thickening base solution, 35 wt.% water, 16 wt.% temperature changing particles;
or else: 24 wt.% polishing abrasive particles, 23 wt.% shear thickening base solution, 52 wt.% water, and 1 wt.% temperature changing particles.
The temperature-changing particles can be selected to be particles with a specific heat capacity value (the value can be smaller than that of water or a thickening phase), and the selected temperature-changing particles are required not to influence the thickening effect of the polishing solution.
The liquid conveying pipe 7, the polishing liquid pool 11, the polishing liquid box 9 and the water pump 8 form a polishing liquid circulating system, polishing liquid in the polishing liquid box 9 is input into the workpiece clamp and the polishing pad 5 through the liquid conveying pipe through the water pump 8, and redundant polishing liquid flows into the polishing liquid pool 11 and reaches the polishing liquid box 9 through the liquid conveying pipe.
As shown in figure 1, the utility model is used for when processing work pieces such as bearing steel, carbide, cermet, optical glass and difficult processing hard and brittle material, including following step:
1) selecting a workpiece clamp 6;
2) clamping the workpiece 1 on a workpiece clamp 6;
3) preparing a polishing solution 3 with a temperature-induced gradient thickening effect, and placing the polishing solution 3 in a polishing solution box 9;
4) starting the main shaft 10 and the water pump 8, inputting the polishing solution 3 onto the polishing disc 12, and enabling the polishing solution 3 to move relatively on the polishing disc 12 to form a polishing solution circulating system;
5) roughly polishing the workpiece 1 under the action of large shearing;
6) and (3) monitoring the temperature T ℃ of the polishing solution 3 by using the temperature sensor 2, starting the temperature change rod 4, and reducing the temperature of the polishing solution 3 at intervals of time gradient, namely increasing the viscosity of the polishing solution 3 at intervals of time to cause the gradient thickening of the polishing solution 3, thereby realizing temperature-induced gradient thickening polishing.

Claims (4)

1. The utility model provides an active control shearing action and temperature induction gradient thickening polishing processingequipment which characterized in that: the device comprises a workpiece clamp, a polishing disc, a polishing pad, a polishing solution pool, a main shaft, a polishing solution box, a temperature sensor, a temperature changing rod and a water pump, wherein the polishing disc is arranged on the main shaft, and the polishing pad is arranged on the polishing disc; the workpiece clamp is arranged above the polishing disc, and a workpiece is clamped on the workpiece clamp; the polishing solution tank is arranged at the lower left of the polishing solution tank, the polishing solution tank is arranged below the polishing disc, the liquid conveying pipe is connected with the polishing solution tank and the polishing solution tank, the water pump is arranged in the polishing solution tank, and the water pump is connected with the liquid conveying pipe; the temperature sensor is arranged in the workpiece clamp, and a contact head of the temperature sensor is contacted with polishing liquid in a polishing area of the workpiece; the temperature-changing rod is arranged in the workpiece clamp, and the polishing solution box is filled with polishing solution with a temperature-induced gradient thickening effect.
2. The actively controlled shear and temperature induced gradient thickening and polishing apparatus as claimed in claim 1, wherein: the device also comprises a data receiver for wirelessly receiving the signal transmitted from the temperature sensor and being capable of wirelessly controlling the startup/shutdown of the temperature change rod; the temperature sensor has a data wireless transmission function and a built-in battery; the temperature-changing rod has a data wireless transmission function and a built-in battery characteristic; the temperature sensor and the temperature change rod are in communication connection with the data receiver.
3. The actively controlled shear and temperature induced gradient thickening and polishing apparatus as claimed in claim 2, wherein: the data receiver comprises a control module for monitoring the temperature of the polishing solution, starting the temperature change rod, and reducing the temperature of the polishing solution at intervals of time gradient to realize temperature-induced gradient thickening and polishing.
4. The apparatus according to any of claims 1 to 3, wherein the shear action and temperature induced gradient thickening and polishing apparatus comprises: the polishing solution tank is provided with a polishing solution circulating system, the polishing solution circulating system is composed of a liquid conveying pipe, a polishing solution tank, a water pump, a polishing solution tank and a polishing solution tank, the polishing solution in the polishing solution tank is conveyed into the workpiece clamp and the polishing pad through the liquid conveying pipe, and redundant polishing solution flows into the polishing solution tank and reaches the polishing solution tank through the liquid conveying pipe.
CN201920412295.1U 2019-03-29 2019-03-29 Active control shearing action and temperature induced gradient thickening polishing processing device Active CN209811949U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920412295.1U CN209811949U (en) 2019-03-29 2019-03-29 Active control shearing action and temperature induced gradient thickening polishing processing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920412295.1U CN209811949U (en) 2019-03-29 2019-03-29 Active control shearing action and temperature induced gradient thickening polishing processing device

Publications (1)

Publication Number Publication Date
CN209811949U true CN209811949U (en) 2019-12-20

Family

ID=68877750

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201920412295.1U Active CN209811949U (en) 2019-03-29 2019-03-29 Active control shearing action and temperature induced gradient thickening polishing processing device

Country Status (1)

Country Link
CN (1) CN209811949U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109822428A (en) * 2019-03-29 2019-05-31 湖南科技大学 Active control shear action and temperature-induced gradient thicken polishing processing device
CN112454157A (en) * 2020-09-29 2021-03-09 湖南科技大学 Controllable discontinuous shear thickening and polishing method and device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109822428A (en) * 2019-03-29 2019-05-31 湖南科技大学 Active control shear action and temperature-induced gradient thicken polishing processing device
CN109822428B (en) * 2019-03-29 2024-05-14 湖南科技大学 Active control shearing action and temperature induction gradient thickening polishing processing device
CN112454157A (en) * 2020-09-29 2021-03-09 湖南科技大学 Controllable discontinuous shear thickening and polishing method and device

Similar Documents

Publication Publication Date Title
CN103395002B (en) A kind of electric discharge machining in gas dressing of bulky diamond emery wheel repaiies neat method
CN1929955B (en) Insulated pad conditioner and method of using same
CN202684651U (en) Cluster magneto-rheological - chemo mechanical composite polishing device
CN209811949U (en) Active control shearing action and temperature induced gradient thickening polishing processing device
CN108555698A (en) A kind of efficient ultraprecise shear thickening-chemical cooperated polishing method
CN105313234B (en) A kind of processing method of twin polishing sapphire wafer
CN104742002A (en) Intelligent grinding device for short chip removing and cooling by means of pulse electric smelting
CN109822401A (en) Active control shear action and temperature-induced gradient thicken polishing method
CN109877657B (en) Electrochemical thickening and polishing method
Doi et al. Advances in CMP polishing technologies
CN110774118B (en) Grinding method of large-size single crystal diamond
CN108098536A (en) A kind of efficient ultraprecise shear thickening-chemical cooperated burnishing device
CN103213038A (en) Inner-circle ultrasonic electrolytic in-process dressing (ELID) composite grinding experimental device
CN110328607B (en) Chemical polishing method for germanium plane mirror by utilizing electric field effect to enhance pH value of processing area
CN103341822B (en) Based on surfacing method and the equipment thereof of two electrolysis
Sreejith et al. Recent advances in machining of silicon wafers for semiconductor applications
CN204584931U (en) A kind of Intelligent grinding turning device of short pulse electric smelting chip removal cooling
Lee et al. A study on the analysis of grinding mechanism and development of dressing system by using optimum in-process electrolytic dressing
Ma et al. Electrolytic in-process dressing grinding of ceramic balls
CN109822428B (en) Active control shearing action and temperature induction gradient thickening polishing processing device
CN105127881A (en) Bearing disc for wafer double-face grinding and polishing machine, grinding and polishing machine of wafers and grinding and polishing method for wafers
CN203426554U (en) Shaft part polishing device
CN109877656B (en) Electrochemical thickening burnishing device
CN210878099U (en) Hydration processing burnishing device is assisted based on laser
CN103419121B (en) A kind of magnetic suspension burnishing device based on monitoring temperature

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant