CN209806155U - Low-insertion-loss high-frequency high-heat-conductivity substrate and printed circuit board - Google Patents
Low-insertion-loss high-frequency high-heat-conductivity substrate and printed circuit board Download PDFInfo
- Publication number
- CN209806155U CN209806155U CN201920101966.2U CN201920101966U CN209806155U CN 209806155 U CN209806155 U CN 209806155U CN 201920101966 U CN201920101966 U CN 201920101966U CN 209806155 U CN209806155 U CN 209806155U
- Authority
- CN
- China
- Prior art keywords
- layer
- heat
- low
- conductive adhesive
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Laminated Bodies (AREA)
Abstract
the utility model provides a low insertion loss high-frequency high-heat-conduction substrate and printed circuit board, heat conduction substrate top-down includes in proper order that the following each layer that combines together: the low-profile copper foil layer comprises a first low-profile copper foil layer, a thin film resistor layer, a first resin layer, a first heat conduction bonding sheet or a heat conduction adhesive film layer, a third heat conduction bonding sheet layer, a second heat conduction bonding sheet or a heat conduction adhesive film layer, a second resin layer and a second low-profile copper foil layer. The heat-conducting substrate has higher heat conductivity and peel strength; the heat conducting substrate has lower dielectric constant and dielectric loss, lower insertion loss and higher integration level, and the reliability of the heat conducting substrate is improved; the circuit board can be used as a circuit board to be applied to electronic products.
Description
Technical Field
The utility model belongs to the technical field of electronic material, a low insertion loss high frequency high heat conduction base plate and printed circuit board are related to.
Background
With the continuous development of Printed Circuit Boards (PCBs) towards high density and multilayering, the space for carrying and installing components on the PCBs is greatly reduced, the power requirements of the electronic products of the whole machine on the power components are higher and higher, and more heat accumulation is inevitably generated due to small space and high power. On the other hand, with the rapid development of modern communication technology, the working frequency of electronic equipment is higher and higher, and the heat productivity is larger and larger. In summary, the integration of a large number of powerful functions into smaller components drives the printed board to become more dense, and the development of high-frequency or high-speed digitization of signal transmission drives the operating temperature of the printed board to rise sharply. If the accumulated heat cannot be discharged in time, the working temperature of the equipment is increased, and the electrical performance of components is reduced and even damaged, so that the service life and the reliability of the equipment are seriously damaged. A large number of tests and statistical data show that the reliability of electronic components (after the optimal working temperature is increased by 2 ℃) is reduced by 10%, and the service life of the electronic components (after the optimal working temperature is increased by 50 ℃) is only 1/6 with the temperature being increased by 25 ℃, so that the working temperature of the printed board becomes the most important factor influencing the reliability and the service life.
The demand for improving the circuit integration level and the power density of the PCB is increasing day by day, and the importance of the thermal management of the high frequency printed circuit board is more prominent. It is well known that the thermal conductivity of a material is critical to reduce the temperature rise. The heat of the high frequency circuit board is essentially closely related to the losses on the circuit board. For example, a copper foil with a rough surface has a larger loss than a copper foil with a smooth surface. Another material parameter that affects loss is the dissipation factor of the printed wiring board dielectric layer material, with lower dissipation factors and lower dielectric losses, the printed wiring board will also generate less heat. In addition, a printed circuit board material with a lower dielectric constant will also generate less loss and less heat than a material with a higher dielectric constant. Generally, the choice of circuit board materials with good properties, such as high thermal conductivity, low dissipation factor, smooth copper foil surface, and low dielectric constant, not only helps to design high performance printed circuit boards, but also improves thermal management.
Passive components (linear and non-linear resistors, capacitors, coils, fuses) are an essential component of every electronic device and occupy a large amount of the surface area of the printed board. At the same time, however, the automatic electrical mounting of small-sized passive components (such as 0402 and 0201) is difficult, and the quality of the solder joints is difficult to guarantee. The multilayer board embedded passive element technology can overcome the problems and can be widely applied to the manufacture of high-end products (such as mobile phones). As components become smaller, manufacturers and assemblers face many challenges in the manufacture, assembly, inspection, operation, and cost control of such printed boards. Because the number of welding spots is reduced, the embedded passive element is more reliable. Meanwhile, the embedded element increases the line density and improves the electrical performance and functions of the electronic equipment. While embedded passive components have many advantages, there are still some problems, including fracture delamination and stability problems with various embedded components. Since the embedded component usually requires a multi-layer stack design, the CTE mismatch of different materials will generate large thermal stress. Unlike discrete components, a defective embedded component cannot be replaced, which means that even a small component with a problem will cause the entire circuit board to be scrapped. Therefore, maintaining the elements stable and reliable for long periods of time is a concern for manufacturers to employ this technique.
The concept of embedded passive components has emerged within the wiring board industry many years ago. At the end of the last 60 th century, the embedded capacitor is manufactured through the first test; in the early 70 s of the last century, NiP and NiCr layers were used to fabricate embedded thin-layer resistors; many other materials for making embedded passive components have been developed so far. In addition, in the late 90 s of the last century, CTS, 3M, Oak Mitsui, Sanmina-SCI and others began to develop embedded passive components and materials. Currently, embedded thin film resistors and materials have been developed more and more mature, representing companies with DuPont electronics, Ohmega, TiCer, Sheldahl, W.L. CORE & ASSOCIATE, and Georgia technical research institute. By this century, asian regions have also begun the study of this technology. At present, the application range of the embedded technology is still very small, and the embedded technology is mostly used in the fields of electronic products such as military, aviation, aerospace and the like. Nevertheless, the demand for the technology is increasing for highly developed but inexpensive consumer electronics products, such as mobile phones, notebook computers, network devices, etc., and the technology of embedded passive components is thus receiving a great deal of attention and is once again the focus, which is considered to be the next key technology for the development of printed boards.
Previous studies have focused on a single material, either a thin film resistor alone or a polymeric thick film resistor. Combining thin film and thick film resistor technologies, all available ranges of resistance values can be fabricated. When the resistance value range is small, the area can be greatly reduced by using the thin film resistor, and meanwhile, the accurate resistance value is obtained; with thick film resistors, large resistance values can be obtained with relatively large tolerances. Polymer Thick Film (PTF) resistors are typically made from polymer resistor pastes and are suitable for use on different printed board substrates. Typically, the resistor paste composition is a carbon (carbon black and graphite) and/or silver filler mixed with a polymeric resin (containing solvents and diluents, sometimes with the addition of insulating powder fillers to give it suitable rheological properties). The curing temperature of the PTF resistor paste on the printed board should not exceed 180 ℃, but some manufacturers may provide resistor pastes with curing temperatures up to 220 ℃. The sheet resistance range of the resistance paste and the resistance paste is far larger than that of a thin film resistance material, but the resistance tolerance is larger and the stability is limited. Oxide layers between the polymer and copper layer interface cause resistance variation and are more prone to delamination and cracking due to CTE mismatch.
In a thick-film and thin-film hybrid circuit, a passive separation element is formed on a substrate, which is a method for improving the integration level, and the method is also suitable for a printed board. The embedded resistor or capacitor is used to replace the separated resistor and capacitor elements, so that the density can be improved, compared with the common surface packaging element, the electrical performance of the high-speed and high-performance transmission printed board is also greatly improved, and the advantages are shown in the following aspects: (1) effectively improving the line density. Can replace a separate element, save the space of the board surface, is integrated with the printed board, and the position of the printed board is not limited by other elements, so that the weight of the printed board is reduced and the size is reduced. In some applications, the double-surface packaging can be changed into the single-surface packaging, so that the packaging burden is reduced. (2) The electrical performance is improved. The adoption of the thin film resistor greatly reduces the leading-in and leading-out lines related to the resistor element, is expected to match all signal lines, is very critical in high-frequency transmission, has extremely low inductance coefficient (less than nano-Henry), and also greatly reduces the surface electromagnetic interference (EMI). (3) The mechanical properties are improved. The film resistor is not affected by impact vibration like a resistor element with a lead or surface package; the assembly problem of the surface package resistor caused by moisture and dust is also avoided. (4) The reliability is improved. The number of welding spots is greatly reduced, and the long-term reliability is excellent through a plurality of application practices. (5) The cost is reduced. The use of thin film resistors reduces the amount of discrete resistors, reduces the amount of substrate material due to reduced size, and reduces rework effort, all of which contributes to cost reduction. In recent years, high-speed and high-performance electronic products have been increased rapidly to meet the requirements of high density and high-frequency and high-speed transmission, so that the surface packaging of the circuit board needs to be switched to the embedded component PCB. A key factor that is not affected by parasitic elements or noise and can transmit a large-capacity signal at high speed is resistance. The thermal stability of the embedded resistor during operation is a key factor for the success of the embedded resistor technology. The current generates heat when passing through the resistor and quickly diffuses from the printed board to the surrounding environment. Therefore, the heat generated needs to be quickly dissipated, which requires that the substrate has a heat conducting function, and that the substrate has low insertion loss and can generate less heat.
Therefore, it is necessary to develop a low insertion loss, high frequency and high thermal conductivity substrate.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a low insertion loss high frequency heat conduction base plate and printed circuit board, heat conduction base plate has higher thermal conductivity, peel strength and integrated level, and possesses lower dielectric constant, dielectric loss and insertion loss, can satisfy high frequency high heat conduction electronic circuit base plate to the requirement of comprehensive properties such as low dielectric constant, low dielectric loss, low insertion loss, high thermal conductivity, high reliability, can regard as the circuit board to use in the electronic product.
in order to achieve the purpose of the utility model, the utility model adopts the following technical proposal:
An object of the utility model is to provide a low insertion loss high frequency heat conduction base plate, top-down includes in proper order that the combination is together following each layer:
a first low-profile copper foil layer having a roughness Rz of not more than 5 μm;
A thin film resistance layer;
A first resin layer having a thickness of 2 to 20 μm;
The first heat-conducting bonding sheet or the heat-conducting film layer has the dielectric constant lower than 3.8, the dielectric loss less than 0.0040 and the heat conductivity of 0.5-1.5W/mK;
A third thermally conductive adhesive layer having a dielectric constant of less than 3.8, a dielectric loss of less than 0.0040, and a thermal conductivity of 1.0-3.0W/mK;
The second heat-conducting bonding sheet or the heat-conducting film layer has the dielectric constant lower than 3.8, the dielectric loss less than 0.0040 and the heat conductivity of 0.5-1.5W/mK;
a second resin layer having a thickness of 2 to 20 μm;
And a second low-profile copper foil layer having a roughness Rz of 5 [ mu ] m or less.
The low-insertion-loss high-frequency heat-conducting substrate has the heat conductivity larger than 1.20W/mK, has the insertion loss lower than-0.25 dB/5inch (2GHz) and lower than-0.51 dB/5inch (5GHz), and can meet the use requirement of the high-frequency substrate; the insertion loss is low, and the heat generated by the high-frequency substrate can be further reduced; the thin film resistance layer is added in the substrate, so that the prepared heat-conducting substrate has higher integration level and can further improve the reliability of the heat-conducting substrate.
In the present invention, the roughness Rz of the first low-profile copper foil layer is 5 μm or less, for example, 0.1 μm, 0.5 μm, 1 μm, 1.5 μm, 2 μm, 2.5 μm, 3 μm, 3.5 μm, 4 μm, 4.5 μm, 5 μm, or the like.
In the present invention, the roughness Rz of the second low-profile copper foil layer is 5 μm or less, for example, 0.1 μm, 0.5 μm, 1 μm, 1.5 μm, 2 μm, 2.5 μm, 3 μm, 3.5 μm, 4 μm, 4.5 μm, 5 μm, or the like.
Preferably, the first and second low-profile copper foil layers are low-profile copper foil layers having the same roughness.
in the utility model, the first low-profile copper foil layer and the second low-profile copper foil layer are adopted to reduce the insertion loss of the heat-conducting substrate, and the lower the roughness of the copper foil is, the lower the insertion loss of the high-frequency high-heat-conducting substrate with low insertion loss is; when the roughness of the first low-profile copper foil layer and the second low-profile copper foil layer is higher, the insertion loss of the low-insertion-loss high-frequency high-heat-conductivity substrate is higher, and the service life of the heat-conductivity substrate is influenced.
In the present invention, the thickness of the thin film resistance layer is 0.1 to 1.0 μm, for example, 0.1 μm, 0.2 μm, 0.3 μm, 0.4 μm, 0.5 μm, 0.6 μm, 0.7 μm, 0.8 μm, 0.9 μm, 1.0 μm, or the like.
the utility model discloses in, the thin film resistance layer is in order to improve the integrated level of heat conduction base plate, buries the base plate with the resistance is built-in, finally improves heat conduction base plate's reliability.
In the present invention, the thickness of the first resin layer is 2 to 20 μm, for example, 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, 11 μm, 12 μm, 13 μm, 14 μm, 15 μm, 16 μm, 17 μm, 18 μm, 19 μm, 20 μm, or the like.
In the present invention, the thickness of the second resin layer is 2 to 20 μm, for example, 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, 11 μm, 12 μm, 13 μm, 14 μm, 15 μm, 16 μm, 17 μm, 18 μm, 19 μm, 20 μm, or the like.
Preferably, the second resin layer and the first resin layer have the same thickness.
the utility model discloses in, first resin layer and second resin layer are in order to improve the peel strength of base plate dielectric layer and copper foil, because the roughness of copper foil is than low, and the cohesion with the dielectric layer is than low, need coat the one deck resin layer on the copper foil and improve peel strength; the thickness of the resin layer selected by the utility model is 2-20 μm, and the prepared substrate has better peeling strength; when the thickness of the resin layer is less than 2 μm, the prepared substrate cannot achieve the purpose of improving the peeling strength; when the thickness of the resin layer is more than 20 μm, the dielectric properties of the substrate may be affected because the dielectric constant of the resin layer is relatively low, and if the resin layer is relatively thick, the dielectric constant of the substrate may be significantly reduced; in addition, the thermal conductivity of the resin layer is also relatively low, and if the resin layer is relatively thick, the thermal conductivity of the substrate is also reduced.
The utility model discloses in, first heat conduction glue film layer and second heat conduction glue film layer are the heat conduction glue film layer that does not contain the fine cloth of glass, first heat conduction glue film layer and second heat conduction glue film layer can be by one or many heat conduction glued membrane constitute.
The utility model discloses in, first heat conduction bonding lamellar with second heat conduction bonding lamellar is high frequency heat conduction bonding lamellar, first heat conduction bonding lamellar with second heat conduction bonding lamellar can be by one or many heat conduction bonding pieces constitute.
in the present invention, the dielectric constant of the first heat-conducting bonding sheet or the heat-conducting adhesive film layer is lower than 3.8(10GHz, SPDR), for example, the dielectric constant may be 3.0, 3.2, 3.5, 3.8, etc.; the dielectric loss is less than 0.0040(10GHz, SPDR), for example, the dielectric loss may be 0.0012, 0.0015, 0.0018, 0.0020, 0.0022, 0.0025, 0.0028, 0.0030, 0.0032, 0.0035, 0.0038, 0.0039, and the like.
The thermal conductivity of the first thermal conductive adhesive sheet or the thermal conductive adhesive film layer is 0.5-1.5W/mK, such as 0.5W/mK, 0.6W/mK, 0.7W/mK, 0.8W/mK, 0.9W/mK, 1.0W/mK, 1.1W/mK, 1.2W/mK, 1.3W/mK, 1.4W/mK, 1.5W/mK, and the like.
in the present invention, the dielectric constant of the second thermally conductive adhesive sheet or the thermally conductive adhesive film layer is lower than 3.8(10GHz, SPDR), for example, the dielectric constant may be 3.0, 3.2, 3.5, 3.8, etc., the dielectric loss is less than 0.0040(10GHz, SPDR), for example, the dielectric loss may be 0.0012, 0.0015, 0.0018, 0.0020, 0.0022, 0.0025, 0.0028, 0.0030, 0.0032, 0.0035, 0.0038, 0.0039, etc.
The thermal conductivity of the second thermal conductive adhesive sheet or the thermal conductive adhesive film layer is 0.5-1.5W/mK, such as 0.5W/mK, 0.6W/mK, 0.7W/mK, 0.8W/mK, 0.9W/mK, 1.0W/mK, 1.1W/mK, 1.2W/mK, 1.3W/mK, 1.4W/mK, 1.5W/mK, and the like.
Preferably, the second heat-conducting bonding sheet or the heat-conducting adhesive film layer and the first heat-conducting bonding sheet or the heat-conducting adhesive film layer are heat-conducting adhesive film layers with the same heat conductivity.
preferably, the first heat-conducting bonding sheet or the heat-conducting adhesive film layer and the second heat-conducting bonding sheet or the heat-conducting adhesive film layer are the same heat-conducting bonding sheet or the same heat-conducting adhesive film layer.
In the present invention, the third thermally conductive adhesive sheet layer may have a dielectric constant lower than 3.8(10GHz, SPDR), for example, a dielectric constant of 3.0, 3.2, 3.5, 3.8, etc., a dielectric loss of less than 0.0040(10GHz, SPDR), for example, a dielectric loss of 0.0012, 0.0015, 0.0018, 0.0020, 0.0022, 0.0025, 0.0028, 0.0030, 0.0032, 0.0035, 0.0038, 0.0039, etc., and may be composed of one or more thermally conductive adhesive sheets.
In the present invention, the thermal conductivity of the third thermally conductive adhesive layer is 1.0 to 3.0W/mK, such as 1.0W/mK, 1.2W/mK, 1.5W/mK, 1.7W/mK, 2.0W/mK, 2.2W/mK, 2.5W/mK, 2.7W/mK, 3.0W/mK, and the like.
The heat conductivity of the third heat-conducting bonding layer in the utility model is 1.0-3.0W/mK, which can increase the heat conductivity of the substrate; when the thermal conductivity of the third thermal conductive adhesive sheet layer is less than 1.0W/mK, the thermal conductivity of the substrate is affected.
Preferably, the third thermally conductive adhesive sheet layer is a thermally conductive adhesive sheet layer having a thermal conductivity higher than that of the first thermally conductive adhesive sheet or the thermally conductive adhesive film layer and the second thermally conductive adhesive sheet or the thermally conductive adhesive film layer.
The utility model discloses in, the preparation method of heat conduction base plate is as follows:
(1) Depositing the thin film resistive layer on a first low profile copper foil layer; the first resin layer is coated on the thin film resistance layer; the second resin layer is coated on the second low profile copper foil layer.
(2) Laminating a first low-profile copper foil layer, a thin film resistance layer, a first resin layer, a first heat-conducting bonding sheet or a heat-conducting adhesive film layer, a third heat-conducting bonding sheet layer, a second heat-conducting bonding sheet or a heat-conducting adhesive film layer, a second resin layer and a second low-profile copper foil layer from top to bottom in sequence, and curing at a curing temperature of 150-2(e.g., 25 kg/cm)2、30kg/cm2、35kg/cm2、40kg/cm2、50kg/cm2、60kg/cm2Or 70kg/cm2)。
A second object of the present invention is to provide a printed circuit board, which includes a heat conductive substrate according to the first object.
In the utility model, the low-profile copper foil, the thin film resistance layer, the resin layer, the heat-conducting bonding sheet and the heat-conducting adhesive film can be prepared by the existing materials according to the existing preparation method; the heat-conducting bonding sheet or the heat-conducting adhesive film layer with the heat conductivity of 0.5-1.5W/mK and the third heat-conducting bonding sheet layer with the heat conductivity of 1.0-3.0W/mK can also be prepared from the existing materials according to the existing preparation method. Exemplary methods of preparation of the layers are as follows:
The first or second heat-conducting adhesive film layer is a heat-conducting adhesive film layer which is formed by coating resin adhesive liquid on a release film or release paper and drying a solvent to obtain uncured, semi-cured or completely cured heat-conducting adhesive film layer; the first, second or third heat conducting bonding sheet layer in the utility model is a bonding sheet layer which is obtained by impregnating a reinforcing material (such as glass fiber cloth, glass fiber paper and the like) with resin glue solution and drying a solvent and is not solidified, semi-solidified or completely solidified; the utility model provides a first or second resin layer is for coating the resin glue solution on the thin film resistance layer or obtain on the low profile copper foil layer.
The utility model provides a resin glue solution that uses in first resin layer, first heat conduction bonding sheet or heat conduction glue film layer, third heat conduction bonding sheet layer, second heat conduction bonding sheet or heat conduction glue film layer and the second resin layer can select known resin composition formula to dissolve in organic solvent and make as required dielectric constant, dielectric loss, coefficient of heat conductivity, for example resin composition contains resin, initiator, filler, fire retardant, viscosity control agent, other auxiliaries etc..
The resin is selected from one or a mixture of at least two of polyphenylene oxide resin, polybutadiene copolymer resin and elastomer block copolymer with unsaturated double bonds;
The polyphenylene ether resin with unsaturated double bonds is one or a mixture of at least two of polyphenylene ether resin with acryloyl groups at the two terminal modified groups, polyphenylene ether resin with styrene groups at the two terminal modified groups and polyphenylene ether resin with vinyl groups at the two terminal modified groups;
the polybutadiene resin is one or a mixture of at least two of 1, 2-polybutadiene resin, maleic anhydride modified polybutadiene resin, acrylate modified polybutadiene resin, epoxy modified polybutadiene resin, amine modified polybutadiene resin, carboxyl-terminated modified polybutadiene resin and hydroxyl-terminated modified polybutadiene resin;
The polybutadiene copolymer resin is selected from one or a mixture of at least two of polybutadiene-styrene copolymer resin, polybutadiene-styrene-divinylbenzene graft copolymer resin, maleic anhydride modified styrene-butadiene copolymer resin and acrylate modified styrene-butadiene copolymer resin;
The elastomer block copolymer is selected from one or a mixture of at least two of styrene-butadiene diblock copolymer, styrene-butadiene-styrene triblock copolymer, styrene- (ethylene-butylene) -styrene triblock copolymer, styrene-isoprene diblock copolymer, styrene-isoprene-styrene triblock copolymer, styrene- (ethylene-propylene) -styrene triblock copolymer and styrene- (ethylene-butylene) diblock copolymer.
the filler is selected from one or a mixture of at least two of boron nitride, aluminum nitride, silicon carbide, silicon dioxide, titanium dioxide, aluminum oxide, magnesium oxide, zinc oxide, barium titanate, strontium titanate, magnesium titanate, calcium titanate, potassium titanate, barium strontium titanate, lead titanate, glass powder, magnesium hydroxide, mica powder, talcum powder, hydrotalcite, mullite, boehmite, kaolin, montmorillonite, calcium silicate or calcium carbonate;
The initiator is one of organic peroxide free radical initiator and carbon-based free radical initiator or the mixture of at least two of the organic peroxide free radical initiator and the carbon-based free radical initiator.
The organic solvent is selected from one or a mixture of at least two of aromatic hydrocarbon solvents such as toluene, xylene and mesitylene.
the utility model discloses in the application of heat conduction base plate in the electronic product as the circuit board.
heat conduction base plate can satisfy high heat conduction electronic circuit base plate of high frequency to the requirement of comprehensive properties such as low dielectric constant, low dielectric loss, low insertion loss, high thermal conductivity, high reliability, can regard as the circuit board to use in electronic articles for use.
Compared with the prior art, the utility model discloses following beneficial effect has:
the low-insertion-loss high-frequency high-heat-conductivity substrate has higher heat conductivity (more than 1.20W/mK) and peel strength (more than 0.70N/mm); the dielectric constant (less than 3.80(10GHz, SPDR)) and the dielectric loss (less than 0.0040(10GHz, SPDR)) are relatively low, so that the use requirement of the high-frequency substrate is met; the insertion loss is lower (the 2GHz insertion loss is lower than-0.25 dB/5inch, and the 5GHz insertion loss is lower than-0.51 dB/5inch), and the heat generated by the substrate can be further reduced; the integrated level is higher, and the reliability of the substrate can be further improved; the requirements of the high-frequency high-heat-conductivity electronic circuit substrate on the comprehensive performances of low dielectric constant, low dielectric loss, low insertion loss, high heat conductivity, high reliability and the like are met, and the high-frequency high-heat-conductivity electronic circuit substrate can be used as a circuit board in electronic products.
Drawings
Fig. 1 is the embodiment of the utility model provides an in the embodiment of the high heat conduction base plate of low insertion loss high frequency's schematic structure diagram, wherein: 1 is a first low profile copper foil layer; 2 is a thin film resistance layer; 3 is a first resin layer; 4 is a first heat-conducting bonding sheet or a heat-conducting adhesive film layer; 5 is a third high-frequency high-thermal-conductivity bonding sheet layer; 6 is a second heat-conducting bonding sheet or a heat-conducting adhesive film layer; 7 is a second resin layer; and 8 is a second low profile copper foil layer.
Detailed Description
The technical solution of the present invention will be further explained by the following embodiments. It should be understood by those skilled in the art that the described embodiments are merely provided to assist in understanding the present invention and should not be construed as specifically limiting the present invention.
Examples 1 to 5
in embodiments 1 to 5, a low-insertion-loss high-frequency high-thermal-conductivity substrate is provided, and a schematic structural diagram is shown in fig. 1, where the low-insertion-loss high-frequency high-thermal-conductivity substrate includes, from top to bottom, the following layers combined together in sequence: the low-profile copper foil comprises a first low-profile copper foil layer 1, a thin film resistor layer 2, a first resin layer 3, a first heat-conducting bonding sheet or heat-conducting adhesive film layer 4, a third high-frequency high-heat-conducting bonding sheet layer 5, a second heat-conducting bonding sheet or heat-conducting adhesive film layer 6, a second resin layer 7 and a second low-profile copper foil layer 8.
the preparation method of the low-insertion-loss high-frequency heat conduction substrate comprises the following steps:
(1) According to the dielectric constant, the dielectric loss and the thermal conductivity coefficient required by the embodiment, a known resin composition formula is selected to obtain the required first resin layer, the first thermal conductive bonding sheet or the thermal conductive adhesive film layer, the third thermal conductive bonding sheet layer, the second thermal conductive bonding sheet or the thermal conductive adhesive film layer and the second resin layer.
(2) Depositing the thin film resistive layer 2 on a first low profile copper foil layer 1; the first resin layer 3 is coated on the thin film resistance layer 2; the second resin layer 7 is coated on the second low profile copper foil layer 8.
(3) laminating a first low-profile copper foil layer, a thin film resistor layer, a first resin layer, a first heat-conducting bonding sheet or a heat-conducting adhesive film layer, a third heat-conducting bonding sheet layer, a second heat-conducting bonding sheet or a heat-conducting adhesive film layer, a second resin layer and a second low-profile copper foil layer from top to bottom in sequence, and curing in a press to obtain a laminated board, wherein the curing temperature is 150-300 ℃, and the curing pressure is 25-70kg/cm2。
table 1 is the embodiment of the present invention provides the structure setting and test results of the low insertion loss high frequency high thermal conductivity substrate:
TABLE 1
From table 1, low insertion loss high-frequency high-thermal-conductivity substrate has higher thermal conductivity, peel strength and integration level, and possesses lower dielectric constant, dielectric loss and insertion loss.
Comparative examples 1 to 12
the heat conductive substrates of comparative examples 1 to 9 are different from those of examples 1 to 5in the structural arrangement of the respective layers as shown in tables 2 and 3, and the heat conductive substrates of comparative examples 10 to 12 are different from those of examples 1 to 5in the structural arrangement as shown in table 3, and the performance test results of the substrates of comparative examples 1 to 12 are shown in tables 2 and 3.
TABLE 2
TABLE 3
The performance test methods for the substrates in the above examples and comparative examples are as follows:
(a) Peel Strength (PS): the peel strength of the panels was tested according to the "post thermal stress" experimental conditions in IPC-TM-6502.4.8.
(b) Dielectric constant (Dk) and dielectric loss (Df): the dielectric constant Dk and dielectric loss Df of the board were measured by SPDR method at a frequency of 10 GHz.
(c)2GHz insertion loss and 5GHz insertion loss: the measurement was carried out according to the method defined by 2.5.5.12A in IPCTM-650.
(d) Thermal conductivity: and testing by adopting a thermal conductivity tester according to an ASTMD5470 method.
from a comparison of the data in tables 1,2 and 3, it can be seen that:
Comparative example 1 the first resin layer 3 and the second resin layer 7 coated on the low-profile copper foil were thicker than those of example 1, the dielectric constant of the conductive substrate was lowered, and the thermal conductivity of the substrate was lower.
Comparative example 2 compared to example 2, the roughness of the first and second low-profile copper foil layers 1 and 8 was higher, and the 2GHz insertion loss and the 5GHz insertion loss of the substrate were both higher.
In comparative example 3, the thermal conductivity of the third high-frequency high-thermal-conductivity adhesive sheet layer 5 is lower than that of example 3, and the thermal conductivity of the substrate is lower.
In comparative example 4, the substrate peel strength was lower when the thicknesses of the first resin layer 3 and the second resin layer 7 were lower than in example 4.
comparative example 5 the thermal conductivity of the first and second thermally conductive adhesive sheets or adhesive film layers 4 and 6 is lower than that of example 3, and the thermal conductivity of the substrate is lower.
In comparative example 6, compared to example 1, when the dielectric constants of the first heat conductive adhesive sheet or the heat conductive adhesive film layer 4 and the second heat conductive adhesive sheet or the heat conductive adhesive film layer 6 are higher, the dielectric constant of the substrate is higher.
In comparative example 7, the dielectric loss of the first and second heat conductive adhesive sheets or adhesive film layers 4 and 6 is higher than that of example 1, and the dielectric loss of the substrate is higher.
In comparative example 8, the dielectric constant of the third high-frequency high-thermal-conductivity adhesive sheet layer 5 is higher than that of example 3, and the dielectric constant of the substrate is higher.
In comparative example 9, the dielectric loss of the third high-frequency high-thermal-conductivity adhesive sheet layer 5 is higher than that of example 3, and the dielectric loss of the substrate is higher.
comparative example 10 the thermal conductivity of the substrate was lower without the third high frequency high thermal conductive adhesive sheet layer 5 compared to example 3.
comparative example 11 the substrate did not include the first and second thermally conductive adhesive sheets or adhesive films 4 and 6, and the peel strength of the substrate was low compared to example 3.
In comparative example 12, the substrate did not include the first resin layer 3 and the second resin layer 7, and the peel strength of the substrate was low as compared with example 3.
The applicant states that the above description is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and those skilled in the art should understand that any changes or substitutions easily conceivable by those skilled in the art within the technical scope of the present invention are within the protection scope and the disclosure scope of the present invention.
Claims (8)
1. the utility model provides a low insertion loss high frequency heat conduction base plate which characterized in that, low insertion loss high frequency heat conduction base plate top-down includes the following each layer that combines together in proper order:
A first low-profile copper foil layer having a roughness Rz of not more than 5 μm;
a thin film resistance layer;
A first resin layer having a thickness of 2 to 20 μm;
The first heat-conducting bonding sheet or the heat-conducting film layer has the dielectric constant lower than 3.8, the dielectric loss less than 0.0040 and the heat conductivity of 0.5-1.5W/mK;
A third thermally conductive adhesive layer having a dielectric constant of less than 3.8, a dielectric loss of less than 0.0040, and a thermal conductivity of 1.0-3.0W/mK;
The second heat-conducting bonding sheet or the heat-conducting film layer has the dielectric constant lower than 3.8, the dielectric loss less than 0.0040 and the heat conductivity of 0.5-1.5W/mK;
a second resin layer having a thickness of 2 to 20 μm;
And a second low-profile copper foil layer having a roughness Rz of 5 [ mu ] m or less.
2. The substrate of claim 1, wherein the first and second low-profile copper foil layers are low-profile copper foil layers having the same roughness.
3. The substrate of claim 1, wherein the thin film resistive layer has a thickness of 0.1-1.0 μm.
4. The low insertion loss, high frequency thermal conductive substrate according to claim 1, wherein the first resin layer and the second resin layer have the same thickness.
5. The low-insertion-loss high-frequency thermal conductive substrate according to claim 1, wherein the third thermal conductive adhesive sheet layer is a thermal conductive adhesive sheet layer having a thermal conductivity higher than that of the first and second thermal conductive adhesive sheets or adhesive film layers.
6. The substrate of claim 1, wherein the second thermally conductive adhesive sheet or the thermally conductive adhesive film layer and the first thermally conductive adhesive sheet or the thermally conductive adhesive film layer are thermally conductive adhesive film layers having the same thermal conductivity.
7. The substrate of claim 1, wherein the first thermally conductive adhesive sheet or the thermally conductive adhesive film layer and the second thermally conductive adhesive sheet or the thermally conductive adhesive film layer are the same thermally conductive adhesive sheet or the thermally conductive adhesive film layer.
8. A printed circuit board comprising the low insertion loss, high frequency thermally conductive substrate of any one of claims 1-7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920101966.2U CN209806155U (en) | 2019-01-21 | 2019-01-21 | Low-insertion-loss high-frequency high-heat-conductivity substrate and printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920101966.2U CN209806155U (en) | 2019-01-21 | 2019-01-21 | Low-insertion-loss high-frequency high-heat-conductivity substrate and printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209806155U true CN209806155U (en) | 2019-12-17 |
Family
ID=68820588
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920101966.2U Active CN209806155U (en) | 2019-01-21 | 2019-01-21 | Low-insertion-loss high-frequency high-heat-conductivity substrate and printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209806155U (en) |
-
2019
- 2019-01-21 CN CN201920101966.2U patent/CN209806155U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN113227245B (en) | Resin composition, metal laminate using same, printed circuit board, and method for producing metal laminate | |
| CN112679936B (en) | Thermosetting resin composition, resin glue solution containing thermosetting resin composition, prepreg, laminated board, copper-clad plate and printed circuit board | |
| TWI765306B (en) | Flexible printed circuits having high electromagnetic shielding property and preparing methods thereof | |
| CN102285168A (en) | Buried capacitance material and manufacturing method thereof | |
| US8935851B2 (en) | Method for manufacturing a circuit board | |
| KR20200061452A (en) | Resin composition, manufacturing method the same, prepreg including the same, laminated plate including the same, metal foil coated with resin including the same | |
| CN115139589B (en) | High-heat-conductivity copper-clad plate and preparation method thereof | |
| JP7124890B2 (en) | Thermosetting resin compositions for semiconductor packages, prepregs and metal foil laminates | |
| KR20180074110A (en) | Metal laminate and method for preparing the same | |
| CN109688697B (en) | Low-insertion-loss high-frequency high-heat-conductivity substrate and application thereof | |
| CN111642068A (en) | RCC substrate and multi-layer laminated flexible board | |
| CN209806155U (en) | Low-insertion-loss high-frequency high-heat-conductivity substrate and printed circuit board | |
| WO2023109440A1 (en) | Copper-clad laminate and preparation method therefor | |
| WO2020151052A1 (en) | Low insertion loss high-frequency heat conducting substrate and application therefor | |
| TW201944861A (en) | Multilayer flexible printed circuits and method for preparing the same | |
| TWI710312B (en) | High-frequency covering film with electromagnetic shielding function and preparing methods thereof | |
| CN209627821U (en) | A kind of filter with low insertion loss high frequency heat-conducting substrate and printed circuit board | |
| CN209627817U (en) | A kind of filter with low insertion loss high frequency high thermal conductive substrate and printed circuit board | |
| JP2003086950A (en) | Printed wiring board | |
| US5066691A (en) | Adhesive composition for metal-clad laminates | |
| CN201248194Y (en) | Ceramic-based copper foil covered board | |
| WO2012151738A1 (en) | Embedded capacitance material and forming method thereof | |
| CN118283910A (en) | Copper-clad plate capable of rapidly radiating heat | |
| TWI799128B (en) | Metal clad substrate | |
| TWI755974B (en) | Magnetic dielectric resin composition, prepreg and copper clad laminate comprising the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |