CN201248194Y - Ceramic-based copper foil covered board - Google Patents
Ceramic-based copper foil covered board Download PDFInfo
- Publication number
- CN201248194Y CN201248194Y CNU2008200396028U CN200820039602U CN201248194Y CN 201248194 Y CN201248194 Y CN 201248194Y CN U2008200396028 U CNU2008200396028 U CN U2008200396028U CN 200820039602 U CN200820039602 U CN 200820039602U CN 201248194 Y CN201248194 Y CN 201248194Y
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- CN
- China
- Prior art keywords
- layer
- copper
- copper foil
- plate
- ceramics base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Laminated Bodies (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The utility model relates to the technical field of the copper-clad plate, in particular to a porcelain-based copper-clad plate which is in a structure of such five layers as a copper foil layer, an insulating layer, a porcelain baseplate layer, an insulating layer and a copper foil layer arranged from top to bottom in sequence, and the porcelain baseplate layer can be replaced by a metal baseplate layer such as a pure-aluminum plate or a pure-copper plate. The utility model has the advantages of high vitrification transformation temperature and good radiating performance, realizes light weight, small size and thin appearance, and achieves the effect of integration of element devices and lead connection.
Description
Technical field
The utility model relates to the copper coated foil plate technical field, especially a kind of ceramics base copperclad laminates.
Background technology
Along with electronic product develops to light, thin, little, high density, multifunction, element packaging density and integrated level are more and more higher in the printed board, power is increasing, thermal diffusivity to printed circuit board base board requires more and more urgent, if the thermal diffusivity of substrate is bad, will cause on the printed circuit board components and parts overheated, thereby whole aircraft reliability is descended, high heat radiating metal PCB substrate thus has been born.
As everyone knows, a lot of double sided boards, multiple-plate density height, power are big, heat distribute comparatively difficulty, conventional copper-clad plates such as FR-4, CEM-3 are all the non-conductor of heat, heat is difficult for distributing.If the electronic equipment local pyrexia can not be got rid of, certainly will cause electronic devices and components to be in the condition of high temperature and lost efficacy.
Summary of the invention
The utility model provides a kind of ceramics base copperclad laminates, can not get rid of this technical problem to solve the electronic equipment local pyrexia.
The technical scheme that its technical problem that solves the utility model adopts is: a kind of ceramics base copperclad laminates, it has five-layer structure, is followed successively by copper foil layer, insulating barrier, ceramic substrate layer, insulating barrier and copper foil layer from top to bottom.
Further: copper foil layer thickness is 0.035～0.105mm, and thickness of insulating layer is 0.07～0.18mm.
For machining property and the mechanical strength that improves substrate, further: ceramic substrate layer can be replaced by the metal substrate layer of pure aluminum plate or fine copper plate.
Further: the metal substrate layer thickness is 0.5～4.0mm.
The utility model glass transition temperature height, perfect heat-dissipating has realized lightweight, miniaturization, slimming, is connected integrated with lead thereby reach component arrangement.
Description of drawings
Below in conjunction with drawings and Examples the utility model is further specified.
Fig. 1 is a structural representation of the present utility model.
1. ceramic substrate layers among the figure, 2 insulating barriers, 3.Copper Foil once.
Embodiment
A kind of ceramics base copperclad laminates as shown in Figure 1, it has five-layer structure, be followed successively by copper foil layer, insulating barrier, ceramic substrate layer, insulating barrier and copper foil layer from top to bottom, ceramic substrate layer wherein also can be metal substrate layer, and metal substrate is divided into two kinds of pure aluminum plate and fine copper plates.
The utility model is not halogen-containing, and anti-flammability reaches the UL94V-0 level; And have outstanding flexibility, thermal endurance, dimensional stability and outstanding mechanical performance and electrical property; And the utility model peel strength height, satisfy the RoHS command request, not leaded, mercury, cadmium, Cr VI, Polybrominated biphenyl, Poly Brominated Diphenyl Ethers etc.; Divide the branch that two-sided, single face and tabula rasa are arranged equally by structure.
The utility model also has following characteristics:
1, good thermal diffusivity: well-known, a lot of double sided boards, multiple-plate density height, power are big, heat distribute comparatively difficulty.Conventional copper coated foil plates such as FR-4, CEM-3.Be all the non-conductor of heat, heat is difficult for distributing.If the electronic equipment local pyrexia can not be got rid of, certainly will cause electronic devices and components to be in the condition of high temperature and lost efficacy, and the Metal Substrate copper-clad plate can address the above problem.
2, lower thermal expansivity: conventional printed circuit boards such as FR-4, CEM-3 are the species complexs that resin, reinforcing material and Copper Foil constitute.In x, the y direction of plate face, the thermal coefficient of expansion of printed circuit board is 13 * 10
-6～18 * 10
-6, then be 80 * 10 at the z of thickness of slab direction of principal axis
-6～90 * 10
-6/ ℃.The metallization hole wall of printed circuit board differs greatly at the axial thermal coefficient of expansion of z, and when standing the variation of high temperature low temperature, expanding with heat and contract with cold makes plated-through hole cracking, disconnection, have a strong impact on the reliability of equipment, and the thermal coefficient of expansion of aluminium is 16.8 * 10
-6/ ℃, can satisfy instructions for use can solve heat dissipation problem effectively, and the thermal expansion shrinkage problem of different materials in the printed board is alleviated, thereby has improved the durability and the reliability of complete machine electronic equipment.
3, good dimensional stability: Metal Substrate printed circuit board dimensional stability will significantly be better than pure insulating material.For example aluminium base printed board, the thermal coefficient of expansion of aluminium are 22.4 * 10
-6/ ℃, when temperature when 30 ℃ are heated to 140 ℃～150 ℃, its change in size only is 0.25%～0.3%.
4, good machining property: the rigid body material of Metal Substrate copper-clad plate is fine aluminium or fine copper, compares with copper-clad plates such as conventional FR-4, CEM-3, and the toughness of fine aluminium or fine copper will be far above the resinousness reinforcing material.
5, good insulating properties: in the Metal Substrate copper-clad plate is formed, circuit layer and substrate layer its maximum 6KV (the AC value between vertical) under the good situation of heat conduction, and conventional control circuit requirement low breakdown voltage is just can meet design requirement more than the 2KV.Therefore, the insulation property of Metal Substrate printed circuit board require far above conventional design.
6, good mechanical strength: conventional FR-4, the breaking strength of FR-4 is the highest in the copper-clad plates such as CEM-3 is: 450MPa (1.6mm is thick), and aluminium base breaking strength is 670MPa in the Metal Substrate copper-clad plate of same specification, the copper base be 870MPa.
Claims (5)
1. ceramics base copperclad laminates, it is characterized in that: described ceramics base copperclad laminates has five-layer structure, is followed successively by copper foil layer (3), insulating barrier (2), ceramic substrate layer (1), insulating barrier (2) and copper foil layer (3) from top to bottom.
2. a kind of ceramics base copperclad laminates according to claim 1 is characterized in that: described copper foil layer (3) thickness is 0.035～0.105mm.
3. a kind of ceramics base copperclad laminates according to claim 1 is characterized in that: described insulating barrier (2) thickness is 0.07～0.18mm.
4. a kind of ceramics base copperclad laminates according to claim 1 is characterized in that: described ceramic substrate layer (1) can be replaced by the metal substrate layer of pure aluminum plate or fine copper plate.
5. a kind of ceramics base copperclad laminates according to claim 4 is characterized in that: described metal substrate layer thickness is 0.5～4.0mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200396028U CN201248194Y (en) | 2008-09-01 | 2008-09-01 | Ceramic-based copper foil covered board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200396028U CN201248194Y (en) | 2008-09-01 | 2008-09-01 | Ceramic-based copper foil covered board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201248194Y true CN201248194Y (en) | 2009-05-27 |
Family
ID=40732021
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008200396028U Expired - Fee Related CN201248194Y (en) | 2008-09-01 | 2008-09-01 | Ceramic-based copper foil covered board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201248194Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101930963B (en) * | 2009-06-19 | 2012-03-21 | 赫克斯科技股份有限公司 | Segment difference type ceramic copper-clad plate unit and manufacturing method thereof |
| CN111556649A (en) * | 2020-05-15 | 2020-08-18 | 上海林众电子科技有限公司 | Insulated metal substrate and preparation method and application thereof |
-
2008
- 2008-09-01 CN CNU2008200396028U patent/CN201248194Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101930963B (en) * | 2009-06-19 | 2012-03-21 | 赫克斯科技股份有限公司 | Segment difference type ceramic copper-clad plate unit and manufacturing method thereof |
| CN111556649A (en) * | 2020-05-15 | 2020-08-18 | 上海林众电子科技有限公司 | Insulated metal substrate and preparation method and application thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090527 Termination date: 20130901 |