CN209675268U

CN209675268U - A kind of mold for preventing chip from falling

Info

Publication number: CN209675268U
Application number: CN201920005985.5U
Authority: CN
Inventors: 吉祥
Original assignee: Hitech Semiconductor Wuxi Co Ltd
Current assignee: Hitech Semiconductor Wuxi Co Ltd
Priority date: 2019-01-02
Filing date: 2019-01-02
Publication date: 2019-11-22
Anticipated expiration: 2029-01-02

Abstract

The purpose of this utility model is to provide a kind of molds for preventing chip from falling, and avoid defective products that from can not detecting, and flow to client；Including upper fixture, lower fixture, substrate, chip；The chip setting is on the substrate；The upper fixture and the lower fixture cooperate, and the chip is fixed on the substrate；The beneficial effects of the utility model are that can solve chip by using dedicated fixture and fall, it is possible to reduce the frequency of personnel inspection reduces the probability that quality risk occurs, improves product reliability.

Description

A kind of mold for preventing chip from falling

Technical field

The utility model relates to semiconductor integrated circuit package molds, more particularly to a kind of mould for preventing chip from falling Tool.

Background technique

Semiconductor assembly and test enterprise is empty frequent occurrence in Flip Chip Bonding (chip face-down bonding) engineering Weldering causes chip to fall off, and causes the problem of chip leakage occurs for Molding (plastic packaging) engineering, certain domestic Sino-Korean joint envelope surveys work During the actual job of factory the moon occur rejection number be 16, while bringing unfavorable condition to production, also bring due to The case where chip to fall off crushes other chips under Belt-type tools again.It can not be detected due to bad after plastic packaging in the case of volume production, It wanders in the presence of by bad to the risk of client.

Chinese utility model patent is disclosed, publication number: CN202462789U, patent name: high-accuracy high speed storing core Piece integrated circuit packaging mould, the applying date: 20120210, it discloses high-accuracy high speed storing chip integrated circuit package moulds Tool, including upper die and lower die, it is characterised in that the upper mold mainly has: upper mold swaging die block；Upper mold sprue central plate；On Mould fine positioning fixed block；Upper mold fine positioning fixing lock；Upper moulding/demoulding material pushing needle；Upper mold diaphragm capsule；Upper mold liftout needle plate；Upper mold liftout Needle plate driving plate；Upper mold pressure-bearing column；Upper mold driving plate unloads stock column；Upper mold limited block；Upper mold discharging spring；Upper mold discharging spring limit Position column and limited block；The lower die mainly has: lower die swaging die block；Lower die material feeding plate；Lower die fine positioning fixed block；Lower die essence Position fixing lock；Lower die fine positioning needle；Lower moulding/demoulding material pushing needle；Lower die diaphragm capsule；Lower die liftout needle plate；The driving of lower die liftout needle plate Plate；Lower die pressure-bearing column；Lower die driving plate unloads stock column；Lower die limited block；Lower die discharging spring；Lower die discharging spring retainer column and limit Position block；Filling barrel, this mould structure is reasonable, and precisely, high production efficiency has wide range of applications for encapsulation.

Utility model content

The purpose of this utility model is to provide a kind of molds for preventing chip from falling, and avoid defective products that from can not detecting, and Flow to client.

The utility model provides a kind of mold for preventing chip from falling, including upper fixture 1, lower fixture 2, substrate 3, chip 4；

The chip 4 is arranged on the substrate 3；The upper fixture 1 cooperates with the lower fixture 2, by the chip 4 It is fixed on the substrate 3.

Preferably, the upper fixture 1 is also symmetrical arranged there are two square through hole.

Preferably, the both ends of the upper fixture 1 respectively also extend downwardly out a protrusion；The protrusion and the lower fixture 2 Form the space of chip 4 described in cutting ferrule.

Preferably, the upper fixture 1 further includes a central sill；The central sill is arranged between two square through holes； The central sill is extended downwardly to be contradicted with the substrate 3.

Preferably, the lower fixture 2 is not less than the upper fixture 1.

Preferably, it is two groups that the chip 4, which is divided to,；Chip 4 described in every group is corresponding with two square through holes respectively.

Preferred in the present embodiment, chip 4 described in two groups is evenly distributed with the corresponding lower section substrate 3 of the square through hole respectively On.

The beneficial effects of the utility model are that can solve chip by using dedicated fixture and fall, it is possible to reduce people The frequency that member checks reduces the probability that quality risk occurs, and improves product reliability.

Detailed description of the invention

Fig. 1 is the utility model top view；

Fig. 2 is the utility model side view；

In figure,

1. upper fixture；2. lower fixture；3. substrate；4. chip.

Specific embodiment

With reference to the accompanying drawing to this it is practical be described in detail, the description of this part be only it is exemplary and explanatory, do not answer There is any restriction effect to the protection scope of the utility model.

Preferred in the present embodiment, the upper fixture 1 is also arranged symmetrically, and there are two square through holes.

Preferred in the present embodiment, the both ends of the upper fixture 1 respectively also extend downwardly out a protrusion；The protrusion and institute State the space that lower fixture 2 forms chip 4 described in cutting ferrule.

Preferred in the present embodiment, the upper fixture 1 further includes a central sill；The central sill setting is described rectangular at two Between through-hole；The central sill is extended downwardly to be contradicted with the substrate 3.

Preferred in the present embodiment, the lower fixture 2 is not less than the upper fixture 1.

Preferred in the present embodiment, it is two groups that the chip 4, which is divided to,；Chip 4 described in every group is described rectangular logical with two respectively Hole is corresponding.

The utility model is used for the dedicated fixture of Flip Chip Bonding, after all chips 4 complete attachment operation, Upper fixture 1 customized is covered into substrate 3, substrate 3 carries out weld job with upper fixture 1 and lower fixture 2 together, and chip 4 is due to quilt Upper fixture 1 and lower fixture 2 are fixed and can not be fallen off, and will not occur that warped phenomenon occurs after substrate 3 is heated.

It should be noted that term " center ", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outside" etc. The orientation or positional relationship of instruction is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of description the utility model It is described with simplifying, rather than the device or element of indication or suggestion meaning must have a particular orientation, with specific orientation structure It makes and operates, therefore should not be understood as limiting the present invention.In addition, term " first ", " second ", " third " are only used for Purpose is described, relative importance is not understood to indicate or imply.

Above-described the utility model embodiment, does not constitute the restriction to scope of protection of the utility model.It is any Modifications, equivalent substitutions and improvements made within spirit of the present utility model and principle etc., should be included in the utility model Claims within.

Claims

1. a kind of mold for preventing chip from falling, including upper fixture (1), lower fixture (2), substrate (3), chip (4)；

It is characterized in that,

The chip (4) is arranged on the substrate (3)；The upper fixture (1) and the lower fixture (2) cooperate, by the core Piece (4) is fixed on the substrate (3).

2. a kind of mold for preventing chip from falling according to claim 1, which is characterized in that the upper fixture (1) is also right Claiming setting, there are two square through holes.

3. a kind of mold for preventing chip from falling according to claim 2, which is characterized in that the two of the upper fixture (1) End respectively also extends downwardly out a protrusion；The protrusion forms the space of chip (4) described in cutting ferrule with the lower fixture (2).

4. a kind of mold for preventing chip from falling according to claim 3, which is characterized in that the upper fixture (1) is also wrapped Include a central sill；The central sill is arranged between two square through holes；The central sill is extended downwardly to be supported with the substrate (3) Touching.

5. a kind of mold for preventing chip from falling according to claim 4, which is characterized in that the lower fixture (2) is not small In the upper fixture (1).

6. a kind of mold for preventing chip from falling according to claim 5, which is characterized in that the chip (4) is divided into two Group；Chip described in every group (4) is corresponding with two square through holes respectively.

7. a kind of mold for preventing chip from falling according to claim 6, which is characterized in that chip described in two groups (4) point It Jun Bu not be on the corresponding lower section substrate (3) of the square through hole.