CN209672638U - A kind of heat pipe energy-saving heat exchanging type semiconductor refrigerating plant - Google Patents
A kind of heat pipe energy-saving heat exchanging type semiconductor refrigerating plant Download PDFInfo
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- CN209672638U CN209672638U CN201920417095.5U CN201920417095U CN209672638U CN 209672638 U CN209672638 U CN 209672638U CN 201920417095 U CN201920417095 U CN 201920417095U CN 209672638 U CN209672638 U CN 209672638U
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Abstract
The utility model embodiment discloses a kind of heat pipe energy-saving heat exchanging type semiconductor refrigerating plant, including semiconductor chip, the outside of semiconductor chip is provided with thermal insulation board, the top surface of thermal insulation board is provided with mounting groove, semiconductor chip it is upper, it is provided with cold effect surface and fuel factor face separately below, the outside of cold effect surface is provided with cold plate, cold plate is fixedly connected by bolt with thermal insulation board, the bottom surface both side of thermal insulation board is provided with the through-hole be connected with mounting groove, the two sides of the bottom in fuel factor face are provided with heat-conducting plate, the bottom end of heat-conducting plate is respectively connected with the heat pipe across corresponding through-hole, the bottom of heat pipe is in the shape of a spiral, the top of two heat pipes is connected by connecting tube, the bottom end of two heat pipes is connected separately with cooling water inlet pipe and cooling water outlet tube, the device radiation effect is more preferable, so as to improve the refrigeration effect and refrigerating efficiency of device , while can be adjusted from refrigeration effect of the outside to device, so that the using effect of device is more preferable, use is more flexible.
Description
Technical field
The utility model embodiment is related to energy-saving semiconductor refrigeration technology field, and in particular to a kind of heat pipe energy-saving heat exchange type
Semiconductor cooling device.
Background technique
With the fast development of semiconductor material, thermoelectric cooler just gradually moves towards engineering practice from laboratory, national defence,
The fields such as industry, agricultural, medical treatment and daily life are applied, big to the air-conditioning that can make nuclear submarine, small cold to that can be used to
But the probe of pyroscan, therefore thermoelectric cooler is usually called semiconductor cooler again
Thermoelectric cooling is the material with thermoelectric energy transfer characteristic, has refrigerating function when passing through direct current, due to
Semiconductor material has optimal thermoelectric energy conversion performance characteristic, so thermoelectric cooling is called semiconductor refrigerating by people.Half
Conductor refrigeration is to build on Seebeck effect, Peltier effect, Thomson effect, Joule effect, Fourier Effect totally five kinds of heat
New refrigeration technologies on the basis of electrical effect.Wherein, three kinds of Seebeck effect, paltie effect and Thomson effect effects show electricity
It is directly reversible for mutually converting with thermal energy, and in addition two kinds of effects are the irreversible effects of heat.
Existing heat exchanging type semiconductor refrigerating plant generally includes semiconductor chip, and the two sides of semiconductor chip are respectively cold
Effect surface and fuel factor face, and thermal insulation layer is provided between cold effect surface and fuel factor face, fuel factor face is connected with heat pipe, cold effect
It answers face to be connected with cooling piece, when semiconductor chip is powered, is just able to achieve heat exchange type refrigeration.
But existing heat exchanging type semiconductor refrigerating plant has the following deficiencies:
(1) existing heat exchanging type semiconductor refrigerating plant heat dissipation effect and bad, not only influences refrigeration effect, but also reduce system
Cold efficiency, and heat directly distributes, and causes the waste of the energy；
(2) existing heat exchanging type semiconductor refrigerating plant is difficult to be adjusted refrigeration effect from outside, is unfavorable for device
Flexible use.
Utility model content
For this purpose, the utility model embodiment provides a kind of heat pipe energy-saving heat exchanging type semiconductor refrigerating plant, which dissipates
Thermal effect is more preferable, so as to improve the refrigeration effect and refrigerating efficiency of device, and the heat recovery and utilization that can will be distributed, has
Conducive to energy conservation and environmental protection, meanwhile, it is capable to be adjusted from refrigeration effect of the outside to device, so that the using effect of device is more preferable,
Using more flexible, it can effectively solve problems of the prior art.
To achieve the goals above, the utility model embodiment provides the following technical solutions: a kind of heat pipe energy-saving heat exchange type
Semiconductor cooling device, including semiconductor chip, the outside of the semiconductor chip are provided with thermal insulation board, and the top surface of thermal insulation board
It is provided with mounting groove, the semiconductor chip is fixed in mounting groove by mounting rack, the top surface setting of the semiconductor chip
There is cold effect surface, and the bottom surface of semiconductor chip is provided with fuel factor face, the outside of the cold effect surface is provided with cold plate, and
Cold plate is fixedly connected by bolt with thermal insulation board；
The bottom surface both side of the thermal insulation board is provided with the through-hole be connected with mounting groove, the two sides of the bottom in the fuel factor face
It is provided with heat-conducting plate, and the bottom end of heat-conducting plate is respectively connected with the heat pipe across corresponding through-hole, the bottom of the heat pipe is in spiral shell
Revolve shape, and the top of two heat pipes by connecting tube be connected, the bottom end of two heat pipes be connected separately with cooling water inlet pipe with
Cooling water outlet tube.
Further, the bottom end two sides of the thermal insulation board are provided with fixed frame corresponding with heat pipe, and on fixed frame
It is fixedly installed with blower.
Further, the outside of the heat pipe is arranged with several radiator shutters, and the surface of radiator shutter is respectively provided with
There are several heat bulges.
Further, the top surface of the cold plate is provided with several parallel T-slots, and the outside of T-slot is respectively provided with
There is cold conductive sheet, the bottom end of the cold conductive sheet is provided with and the matched T-type metal block of T-slot.
Further, the thermal insulation board is internally provided with thermo insulating filling material.
Further, the outer cover of the mounting rack is equipped with annular heat cushion.
The utility model embodiment has the advantages that
(1) heat dissipation effect of the utility model is more preferable, so as to improve the refrigeration effect and refrigerating efficiency of device, and energy
Enough heat recovery and utilizations that will be distributed, are beneficial to energy conservation environmental protection；
(2) the utility model can be adjusted from refrigeration effect of the outside to device, so that the using effect of device is more
Good, use is more flexible.
Detailed description of the invention
It, below will be to reality in order to illustrate more clearly of the embodiments of the present invention or technical solution in the prior art
It applies mode or attached drawing needed to be used in the description of the prior art is briefly described.It should be evident that attached in being described below
Figure is only exemplary, for those of ordinary skill in the art, without creative efforts, can be with
It is extended according to the attached drawing of offer and obtains other implementation attached drawings.
Structure depicted in this specification, ratio, size etc., only to cooperate the revealed content of specification, for
Those skilled in the art understands and reads, and is not intended to limit the utility model enforceable qualifications, therefore does not have technology
On essential meaning, the modification of any structure, the change of proportionate relationship or the adjustment of size are not influencing the utility model institute energy
Under the effect of generation and the purpose that can reach, it should all still fall in the revealed technology contents of the utility model and obtain the model that can cover
In enclosing.
Fig. 1 is the whole vertical section structural schematic diagram of the utility model.
In figure:
1- semiconductor chip；2- thermal insulation board；3- mounting groove；4- mounting rack；The cold effect surface of 5-；6- fuel factor face；7- refrigeration
Plate；8- bolt；9- through-hole；10- heat-conducting plate；11- heat pipe；12- connecting tube；13- cooling water inlet pipe；14- cooling water outlet tube；15-
Fixed frame；16- blower；17- radiator shutter；18- heat bulge；19-T type groove；The cold conductive sheet of 20-；21-T type metal block；
22- thermo insulating filling material；23- annular heat cushion.
Specific embodiment
The embodiments of the present invention is illustrated by particular specific embodiment below, those skilled in the art can be by this
Content disclosed by specification understands other advantages and effect of the utility model easily, it is clear that described embodiment is
The utility model a part of the embodiment, instead of all the embodiments.Based on the embodiments of the present invention, this field is common
Technical staff's every other embodiment obtained without making creative work belongs to the utility model protection
Range.
As shown in Figure 1, the utility model provides a kind of heat pipe energy-saving heat exchanging type semiconductor refrigerating plant, including semiconductor
Chip 1, semiconductor chip 1 are the tools of a heat transmitting, when one piece of N-type semiconductor material and one piece of p-type semiconductor material connection
Heat transfer will be generated when having electric current to pass through in the thermocouple pair formed, between both ends, heat will be transferred to separately from one end
One end, so that generating the temperature difference forms hot and cold side, but since there are resistance for semiconductor itself, it will when electric current passes through semiconductor
Heat is generated, to will affect hot transmitting, and the heat between two pole plates can also pass through air and semiconductor material itself
A balance will be reached when hot and cold side reaches certain temperature difference, and the amount of both heat transmitting is equal by carrying out reverse heat transmitting
Point, just reverse heat transmitting are cancelled out each other, and the temperature of hot and cold side would not continue to change at this time, in order to reach lower temperature
Degree can take the modes such as heat dissipation to reduce the temperature in hot end to realize.
The outside of semiconductor chip 1 is provided with thermal insulation board 2, and thermal insulation board 2 is made of heat-barrier material, for completely cutting off semiconductor core
The transmitting of heat between 1 hot and cold side of piece is conducive to the refrigeration of device, and thermal insulation board 2 is internally provided with thermo insulating filling material 22, leads to
Setting thermo insulating filling material 22 is crossed, can be improved the heat insulation of thermal insulation board 2.
The top surface of thermal insulation board 2 is provided with mounting groove 3, and semiconductor chip 1 is fixed in mounting groove 3 by mounting rack 4, is passed through
Mounting rack 4, can facilitate the installation and removal of semiconductor chip 1, and the outer cover of mounting rack 4 is equipped with annular heat cushion 23, leads to
Setting annular heat cushion 23 is crossed, not only will not influence the installation of semiconductor chip 1, but also can be avoided heat from mounting groove more than 3 half
It is transmitted in the gap of conductor chip 1.
The top surface of semiconductor chip 1 is provided with cold effect surface 5, and the bottom surface of semiconductor chip 1 is provided with fuel factor face 6,
Cold effect surface 5 and fuel factor face 6 respectively correspond the hot and cold side of semiconductor chip 1, and the outside of cold effect surface 5 is provided with cold plate 7,
And cold plate 7 is fixedly connected by bolt 8 with thermal insulation board 2, after semiconductor chip 1 is mounted in mounting groove 3, can be passed through
Cold plate 7 is fixed in the cold effect surface 5 of semiconductor chip 1 by bolt 8.
The top surface of cold plate 7 is provided with several parallel T-slots 19, and the outside of T-slot 19 is provided with cold conduction
Piece 20, the bottom end of cold conductive sheet 20 be provided with the matched T-type metal block 21 of T-slot 19, device in actual use, can
According to use demand, to select the cold conductive sheet 20 of different number, cold conductive sheet 20 and T-type metal block 21 be heating conduction compared with
Good metal material is made, and is capable of increasing cold end and extraneous contact area, to improve the refrigeration effect of device, and passes through choosing
With the cold conductive sheet 20 of different number, the refrigeration effect of device can be made to be adjusted, pass through setting T-slot 19 and T-type metal
Sliding block 21 can facilitate the disassembly and installation of cold conductive sheet 20.
The bottom surface both side of thermal insulation board 2 is provided with the through-hole 9 be connected with mounting groove 3, and the two sides of the bottom in fuel factor face 6 are all provided with
It is equipped with heat-conducting plate 10, and the bottom end of heat-conducting plate 10 is respectively connected with the heat pipe 11 across corresponding through-hole 9, heat pipe 11 is hollow, and heat pipe
11 and heat-conducting plate 10 be made of the material of good heat dispersion performance, in the shape of a spiral, the outside of heat pipe 11 is equal for the bottom of heat pipe 11
Several radiator shutters 17 are arranged with, and the surface of radiator shutter 17 is provided with several heat bulges 18, by by heat pipe
11 are set as helical form, and radiator shutter 17 and heat bulge 18 is arranged, and are capable of increasing hot end and extraneous contact area, thus
Improve heat dissipation effect.
The top of two heat pipes 11 is connected by connecting tube 12, and the bottom end of two heat pipes 11 is connected separately with cooling water inlet pipe
13 and cooling water outlet tube 14, cooling water inlet pipe 13 and cooling water outlet tube 14 are connect with the pump housing, by heat pipe 11 and connecting tube 12
It is inside passed through cooling water, can be improved the radiating rate of heat pipe 11, meanwhile, cooling water can be made to heat up, avoid heat waste, favorably
In energy saving.
The bottom end two sides of thermal insulation board 2 are provided with fixed frame 15 corresponding with heat pipe 11, and fixed peace on fixed frame 15
It is capable of increasing the flowing velocity of air near heat pipe 11, to improve dissipating for heat pipe 11 by installing blower 16 equipped with blower 16
Thermal effect.
A variety of radiating rates can be arranged by intelligent control, to change refrigeration effect, will pump in heat dissipation for the device
Body, blower 16 are connect with control mechanism, when device refrigeration, carry out heat dissipation only with spiral helicine heat pipe 11 as the first heat dissipation
Mode, by control blower 16 work, accelerate air flowing be second of radiating mode, by control the pump housing, make cooling water from
It is flowed through in heat pipe 11 for the third radiating mode, the pump housing and blower 16 work at the same time, and are the 4th kind of radiating mode, in this way
Mode can be adjusted from refrigeration effect of the outside to device, so that the using effect of device is more preferable, use is more flexible, together
When, the heat dissipation effect of device can be made more preferable, to improve the refrigeration effect and refrigerating efficiency of device.
Although above having made detailed description to the utility model with generality explanation and specific embodiment,
On the basis of the utility model, it can be made some modifications or improvements, this is apparent to those skilled in the art
's.Therefore, these modifications or improvements on the basis of without departing from the spirit of the present invention, belong to the utility model and want
Seek the range of protection.
Claims (6)
1. a kind of heat pipe energy-saving heat exchanging type semiconductor refrigerating plant, including semiconductor chip (1), it is characterised in that: described partly to lead
The outside of body chip (1) is provided with thermal insulation board (2), and the top surface of thermal insulation board (2) is provided with mounting groove (3), the semiconductor core
Piece (1) is fixed in mounting groove (3) by mounting rack (4), and the top surface of the semiconductor chip (1) is provided with cold effect surface (5),
And the bottom surface of semiconductor chip (1) is provided with fuel factor face (6), the outside of the cold effect surface (5) is provided with cold plate (7),
And cold plate (7) is fixedly connected by bolt (8) with thermal insulation board (2)；
The bottom surface both side of the thermal insulation board (2) is provided with the through-hole (9) with mounting groove (3) conducting, the fuel factor face (6)
Two sides of the bottom are provided with heat-conducting plate (10), and the bottom end of heat-conducting plate (10) is respectively connected with the heat pipe across corresponding through-hole (9)
(11), the bottom of the heat pipe (11) in the shape of a spiral, and the top of two heat pipes (11) by connecting tube (12) be connected, two
The bottom end of the heat pipe (11) is connected separately with cooling water inlet pipe (13) and cooling water outlet tube (14).
2. a kind of heat pipe energy-saving heat exchanging type semiconductor refrigerating plant according to claim 1, it is characterised in that: described heat-insulated
The bottom end two sides of plate (2) are provided with fixed frame (15) corresponding with heat pipe (11), and are fixedly installed on fixed frame (15)
Blower (16).
3. a kind of heat pipe energy-saving heat exchanging type semiconductor refrigerating plant according to claim 1, it is characterised in that: the heat pipe
(11) outside is arranged with several radiator shutters (17), and to be provided with several heat dissipations convex on the surface of radiator shutter (17)
It rises (18).
4. a kind of heat pipe energy-saving heat exchanging type semiconductor refrigerating plant according to claim 1, it is characterised in that: the refrigeration
The top surface of plate (7) is provided with several parallel T-slots (19), and the outside of T-slot (19) is provided with cold conductive sheet (20),
The bottom end of the cold conductive sheet (20) is provided with and T-slot (19) matched T-type metal block (21).
5. a kind of heat pipe energy-saving heat exchanging type semiconductor refrigerating plant according to claim 1, it is characterised in that: described heat-insulated
Plate (2) is internally provided with thermo insulating filling material (22).
6. a kind of heat pipe energy-saving heat exchanging type semiconductor refrigerating plant according to claim 1, it is characterised in that: the installation
The outer cover of frame (4) is equipped with annular heat cushion (23).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920417095.5U CN209672638U (en) | 2019-03-29 | 2019-03-29 | A kind of heat pipe energy-saving heat exchanging type semiconductor refrigerating plant |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920417095.5U CN209672638U (en) | 2019-03-29 | 2019-03-29 | A kind of heat pipe energy-saving heat exchanging type semiconductor refrigerating plant |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209672638U true CN209672638U (en) | 2019-11-22 |
Family
ID=68573158
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920417095.5U Active CN209672638U (en) | 2019-03-29 | 2019-03-29 | A kind of heat pipe energy-saving heat exchanging type semiconductor refrigerating plant |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209672638U (en) |
-
2019
- 2019-03-29 CN CN201920417095.5U patent/CN209672638U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 230000, floor 2, building A3, Zhongan chuanggu science and Technology Park, high tech Zone, Hefei, Anhui Province Patentee after: Anhui Zhongke Xinyuan Semiconductor Technology Co.,Ltd. Address before: 226000 East Road No. 3, Chengnan Street Telecom, Rugao City, Nantong City, Jiangsu Province Patentee before: JIANGSU ZHONGKE XINYUAN SEMICONDUCTOR TECHNOLOGY Co.,Ltd. |
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| CP03 | Change of name, title or address |