CN209672280U - Encapsulating LED module - Google Patents
Encapsulating LED module Download PDFInfo
- Publication number
- CN209672280U CN209672280U CN201920805692.5U CN201920805692U CN209672280U CN 209672280 U CN209672280 U CN 209672280U CN 201920805692 U CN201920805692 U CN 201920805692U CN 209672280 U CN209672280 U CN 209672280U
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- Prior art keywords
- lens
- substrate
- radiator
- led module
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000000758 substrate Substances 0.000 claims abstract description 82
- 239000000565 sealant Substances 0.000 claims abstract description 23
- 239000005357 flat glass Substances 0.000 claims description 19
- 229920000297 Rayon Polymers 0.000 claims description 8
- 239000003292 glue Substances 0.000 claims description 8
- 239000004519 grease Substances 0.000 claims description 6
- 229920001296 polysiloxane Polymers 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 239000004411 aluminium Substances 0.000 claims description 3
- 238000004512 die casting Methods 0.000 claims description 2
- 239000007787 solid Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 15
- 238000005286 illumination Methods 0.000 abstract description 2
- 238000007789 sealing Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- 230000032683 aging Effects 0.000 description 8
- 239000000084 colloidal system Substances 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 230000007812 deficiency Effects 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 238000003032 molecular docking Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 241001465382 Physalis alkekengi Species 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 238000004020 luminiscence type Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- 206010037660 Pyrexia Diseases 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000010422 painting Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 238000009738 saturating Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000003556 assay Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007596 consolidation process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model belongs to technical field of LED illumination, and in particular to a kind of encapsulating LED module comprising lens, LED light source, cover board, substrate and radiator, LED light source are fixed in substrate front side；Lens cap applies toughness glue-line on LED light source at least on the outer edge at the lens back side, and lens are bonded with substrate and are clinged；The back side of radiator is equipped with a circle and protrudes from the waterproof edge of spreader surface, and the substrate for being fixed with lens is fixedly mounted in the space being surrounded by by the waterproof edge, the filling with sealant, lens and substrate are completely enclosed within this space in the space；Corresponding lens are equipped with microlens window on the cover board, and cover board is covered on lens and fixed from top, and lens are pierced by from microlens window.LED module described in the utility model has good waterproofness, leakproofness and thermal diffusivity, while manufacturing convenience, high production efficiency.
Description
Technical field
The utility model relates to a kind of encapsulating LED modules, belong to technical field of LED illumination.
Background technique
The fixed form of lens is mostly that more than ten of screw is fixed in existing LED module on the market, on the one hand, technique is numerous
Trivial, manual operation load is big, and production efficiency is low, and on the other hand, the face being in contact with substrate by radiator is plane, therefore substrate peripheral
It is unobstructed, and the pressure that screw squeezes rubber mat is unequal, therefore, between substrate and radiator can there is gap, makes in this way
The sealed waterproof effect of LED module out is unsatisfactory, with the growth of time and the influence of outdoor adverse circumstances, screw worked itself loose
Water suction situation is generated after the raw gap of movable property and cushion rubber aging, directly affects quality and the service life of product.
Except above-mentioned points, presently commercially available LED module is all to use connecting plate PC lens, but limited by material, existing company
Light transmittance, temperature tolerance, the corrosion resistance of plate PC lens be all undesirable and easy to aging, yellow, and the whole light of lamps and lanterns is made to decline seriously.
Utility model content
Technical problem to be solved by the utility model is: overcoming deficiency in the prior art, it is scattered to provide a kind of sealing waterproof
Good in thermal property and manufacturing convenience, the encapsulating LED module of high production efficiency.
Encapsulating LED module described in the utility model, including lens, LED light source, cover board, substrate and radiator, LED light
Source is fixed in substrate front side；Lens cap applies toughness glue-line on LED light source at least on the outer edge at the lens back side,
Lens are bonded with substrate and are clinged；The back side (i.e. on the face of radiator and substrate face) of radiator is equipped with a circle and protrudes from heat dissipation
The substrate for being fixed with lens is fixedly mounted in the space being surrounded by by the waterproof edge, described by the waterproof edge on device surface
It is filling with sealant in space, lens and substrate are completely enclosed within this space；Corresponding lens are equipped with microlens window on the cover board,
Cover board is covered on lens and is fixed from top, and lens are pierced by from microlens window.
In LED module described in the utility model, because being equipped with the waterproof edge that a circle is increased at the radiator back side, make on radiator
Being in contact with substrate one side is no longer plane, but has a circle waterproof edge to encase substrate and lens, forms waterproof construction, plays good
Good water blocking effect, therefore waterproof performance is preferable；Meanwhile the utility model first makes the outer edge and base of lens using sticky glue-line
Plate fitting clings, it is ensured that lens outer edge is docked with the sealing of substrate (without folding gap i.e. at the docking of the two), such energy
The influence expanded with heat and contract with cold by lens interior air brought by LED light source fever or cooling to sealant is enough avoided, filling is also passed through
Enter sealant, each internal part is all sealed in the space being surrounded by by waterproof edge, is integrally formed with radiator, realizes
Secondary seal further strengthens bonding, enhances the waterproofness and leakproofness of LED module.Meanwhile lens outer edge and substrate it
Between seal docking, moreover it is possible to effectively prevent sealant in subsequent process for filling colloid to penetrate into lens interior cavity, guarantee lens light efficiency
And product is beautiful.
The utility model changes the structure of traditional LED module, compared to mechanical bond rubber sealing on the market lens with
And for part is with the lens of a small amount of colloid adhesive seal, the utility model in addition to good waterproofness and leakproofness,
Traditional handicraft can also be effectively prevent to use the aging phenomenon of cushion rubber, while overcoming tradition to make to be screwed brought pressure
Power and the non-uniform technological deficiency of tightness.
The preferred connecting plate glass lens of lens in LED module described in the utility model.So-called connecting plate glass lens is will to count
A glass lens design ultimately forms integral structure on certain plate.By using connecting plate glass lens, light transmittance can be made to be up to
92%, so that temperature tolerance is reached -50 DEG C~+550 DEG C, while having both corrosion-resistant, salt resistance alkali, surface electrostatic dust suction phenomenon less than connecting plate
PC lens, without the advantages such as aging or aetiolation, so as to preferably improve lamp luminescence efficiency, prolonging service lives of lamps.It is real
Border can be designed to multiple groups connecting plate glass lens when applying according to the gauge size of LED module.
In the utility model, it is evenly coated with heat-conducting silicone grease on the face that substrate is contacted with radiator, it can by heat-conducting silicone grease
Guarantee that there is good heat-conductive characteristic between LED light source and radiator.
For the ease of assembling, substrate positioning column can be equipped on the radiator back side, substrate positioning column is located at by waterproof edge
In the space being surrounded by, first positioning hole is arranged in counterpart substrate positioning column on substrate.When installation base plate, by first on substrate
Location hole is aligned with the substrate positioning column on the radiator back side, substrate steadily can be put into the radiator back side along substrate positioning column
It is easy to operate in the space be surrounded by by waterproof edge.Similarly, lens positioning column can also be equipped on the radiator back side, thoroughly
Mirror positioning column also is located in the space being surrounded by by waterproof edge, and second location hole is arranged in corresponding lens positioning column on lens, is led to
The installation of lens can be convenient for by crossing lens positioning column and second location hole.
Preferably, the back side (i.e. on the face of cover board and lens face) of cover board by the waterproof edge of viscose glue and radiator or
It is filled in sealant of the waterproof edge in space to be bonded as one, realizes and fix.
Preferably, the front of radiator is equipped with waterproof connector, and corresponding waterproof connector is equipped with through-hole, waterproof on a heat sink
Positive and negative anodes wiring on connector pass through the through-hole of radiator after, be respectively welded on the positive and negative anodes of substrate.
The preparation process of encapsulating LED module described in the utility model specifically includes the following steps:
1. LED light source to be mounted in substrate front side and weld；The radiator back side is surface-treated, it will be thermally conductive
Silicone grease painting is uniformly applied to substrate back, substrate is placed in the space that waterproof edge on radiator is surrounded by, and use fastener
Substrate is fixed on a heat sink；One is smeared along edge at the back side of lens and encloses sticky glue-line, by lens cap in corresponding LED light
On source, and lens are bonded with substrate and are clinged；
2. in the space being surrounded by radiator back side waterproof edge uniformly, layering pour into sealant, until substrate with
And the lens back side is completely enclosed in space described in the radiator back side rear stopping；
3. taking a cover board with microlens window, a circle viscose glue is smeared along the track of sealant, finally by cover board from top
It covers on lens, the back side of cover board is bonded as one by viscose glue and sealant, obtains LED module.
After completing, after the viscose glue solidification after be smeared between cover board and sealant, moves to waterproof aging workshop and examined
It tests, after the assay was approved, stores keeping can be taken in.
Preferably, mould group is placed in 60 DEG C~80 DEG C of environment, solidifies sealant quickly, it is to be solidified to taking after 80%
Out, it is placed on station after cooling, then carries out step and 3. operate.
In summary, the utility model solves light decay and waterproof of LED module lamps and lanterns etc. from material, structure, technique
This low problem of grade also greatly reduces the fixed process of screw machine, reduces manual operation, reduce production cost, mention
High production efficiency, makes product more meet automated production demand.
Possessed beneficial effect is the utility model compared with prior art:
1, LED module described in the utility model is equipped with the waterproof edge that a circle is increased at the radiator back side, plays good gear
Water effect, waterproof performance are good；
2, the utility model enhances the waterproofness and leakproofness of LED module using secondary seal, while also ensuring good
Good heat dissipation performance；
3, the lens of a small amount of colloid adhesive seal are used compared to the lens of mechanical bond rubber sealing on the market and part
For, the utility model is in addition to good waterproofness and leakproofness, additionally it is possible to traditional handicraft be effectively prevent to use cushion rubber
Aging phenomenon, at the same overcome tradition make to be screwed brought by pressure and the non-uniform technological deficiency of tightness, simultaneously
The fixed process of screw machine is greatly reduced, reduces manual operation, reduces production cost, improve production efficiency, make
Product more meets automated production demand；
4, lens use connecting plate glass lens, can be improved lamp luminescence efficiency, prolonging service lives of lamps.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of LED module；
Fig. 2 is the sectional view of LED module；
Fig. 3 is the partial enlarged view at the position I in Fig. 2；
Fig. 4 is the partial enlarged view at the position II in Fig. 2.
In figure: 1, cover board；2, microlens window；3, connecting plate glass lens；4, fastening screw；5, LED light source；6, substrate；7,
First positioning hole；8, waterproof edge；9, radiator；10, substrate positioning column；11, waterproof connector；12, lens positioning column；13, through-hole；
14, groove；15, heat-conducting silicone grease；16, sealant；17, sticky glue-line；18, viscose glue.
Specific embodiment
The embodiments of the present invention are described further with reference to the accompanying drawing:
As shown in figures 1-4, encapsulating LED module described in the utility model includes lens, LED light source 5, cover board 1,6 and of substrate
Radiator 9, LED light source 5 are fixed on 6 front of substrate；Lens cap is on LED light source 5, and at least in the outer edge at the lens back side
Upper painting toughness glue-line 17, lens are bonded with substrate 6 and are clinged；The back side (the i.e. face of radiator 9 and 6 face of substrate of radiator 9
On) it is equipped with the waterproof edge 8 that a circle protrudes from 9 surface of radiator；Thermal conductive silicon is evenly coated on the face that substrate 6 is contacted with radiator 9
Rouge 15 is passed through the substrate 6 for being fixed with lens with guaranteeing to have good heat-conductive characteristic between LED light source 5 and radiator 9
Fastening screw 4 is fixedly mounted in the space being surrounded by by the waterproof edge 8, in the space filling with sealant 16, will be saturating
Mirror and substrate 6 are completely enclosed within this space；Corresponding lens are equipped with microlens window 2 on cover board 1, and cover board 1 is covered from top saturating
On mirror and fixed, lens are pierced by from microlens window 2；The front of radiator 9 is equipped with waterproof connector 11, corresponding waterproof connector 11
Through-hole 13 is equipped on radiator 9, the positive and negative anodes wiring on waterproof connector 11 pass through the through-hole 13 of radiator 9 after, be respectively welded
On the positive and negative anodes of substrate 6.Substrate 6 in the present embodiment uses aluminum substrate；Radiator 9 uses die casting aluminium radiator；Lens are adopted
With connecting plate glass lens 3 (design of several glass lens is ultimately formed integral structure on certain plate), connecting plate glass lens 3
2 groups are devised, the LED light source 5 in connecting plate glass lens 3 on each lens unit and substrate 6 corresponds.
For the ease of assembling, the present embodiment is equipped with substrate positioning column 10 on 9 back side of radiator, and substrate positioning column 10 is located at
In the space be surrounded by by waterproof edge 8, counterpart substrate positioning column 10 is arranged first positioning hole 7 on substrate 6, when installation base plate 6,
First positioning hole 7 on substrate 6 is aligned with the substrate positioning column 10 on 9 back side of radiator, substrate 6 can be positioned along substrate
Column 10 is steadily put into the space that 9 back side of radiator is surrounded by by waterproof edge 8, easy to operate.Meanwhile at 9 back side of radiator
It is equipped with lens positioning column 12, lens positioning column 12 also is located in the space being surrounded by by waterproof edge 8, corresponding lens positioning column 12
Second location hole is set on lens, and lens positioning column 12 is located in waterproof edge 8 in the present embodiment, it should be noted that this reality
It applies in example and accommodation has been carried out to the structure type of second location hole, second location hole is no longer through-hole 13, but is designed along longitudinal direction
Groove 14 in lens periphery is oriented to lens positioning column 12 by groove 14, in order to installation (certainly, the In of lens
When actual production, by lens positioning column 12 design 9 back side of radiator on, simultaneously second location hole be designed as through-hole 13 be also can
Capable).
The preparation process of above-mentioned encapsulating LED module, specifically includes the following steps:
1. LED light source 5 is mounted on 6 front of substrate by chip mounter, and welded by solder reflow device；
Heat-conducting silicone grease 15 is applied and is uniformly applied to 6 back side of substrate, makes have good heat transfer between light source and radiator 9
Performance, the substrate positioning column 10 by substrate 6 along 9 back side of radiator are steadily put down, and are located at substrate 6 in waterproof edge 8 on radiator 9
In the space being surrounded by, and substrate 6 is fixed on radiator 9 with fastening screw 4；
Waterproof connector 11 is fixed on to the front of radiator 9, by the positive and negative anodes wiring of waterproof connector 11 leading to from radiator 9
It is passed through in hole 13, and positive and negative anodes wiring is soldered to respectively on the positive and negative anodes of substrate 6；
One is smeared along edge at the back side of connecting plate glass lens 3 and encloses sticky glue-line 17, by connecting plate glass lens 3 along radiator
The lens positioning column 12 at 9 back sides is steadily put down, and covers on connecting plate glass lens 3 on LED light source 5, and by connecting plate glass lens 3 with
The fitting of substrate 6 clings；
2. uniform in the space being surrounded by 9 back side waterproof edge 8 of radiator, layering pour into 16 (this implementation of sealant
Sealant 16 in example is using the LT-6510W epoxy electron pouring sealant by the carefree industrial materials Co., Ltd production in Shenzhen, tool
Have the features such as cohesive force is strong, good airproof performance, consolidation time is short), until substrate 6 and 3 back side of connecting plate glass lens are completely enclosed
In the space described in 9 back side of radiator, in order to ensure the fastness that connecting plate glass lens 3 is bonded, the present embodiment is straight in encapsulating
The periphery of connecting plate glass lens 3 is completely covered to sealant, is stopped later；
3. mould group is placed in 60 DEG C~80 DEG C of environment, solidify sealant 16 quickly, it is to be solidified to taking out after 80%,
It is placed on station until cooling；
4. taking a cover board 1 with microlens window 2, a circle viscose glue 18 is smeared along the track of sealant 16, finally by cover board 1
It is covered on connecting plate glass lens 3 from top, the back side of cover board 1 is bonded as one by viscose glue 18 with sealant 16, and LED mould is obtained
Group.
LED module described in the present embodiment changes the structure of traditional LED module, has the advantage that
1, because using connecting plate glass lens 3, so that light transmittance is up to 92%, so that temperature tolerance is reached -50 DEG C~+550 DEG C, simultaneously
Have both corrosion-resistant, salt resistance alkali, surface electrostatic dust suction phenomenon less than connecting plate PC lens, without the advantages such as aging or aetiolation, thus
Lamp luminescence efficiency, prolonging service lives of lamps can preferably be improved；
2, because being equipped with the waterproof edge 8 that a circle is increased at 9 back side of radiator, make to contact one side no longer with substrate 6 on radiator 9
It is plane, but has a circle waterproof edge 8 to encase substrate 6 and lens, forms waterproof construction, play the role of good water blocking, because
This waterproof performance is preferable；
It is first bonded the outer edge of lens with substrate 6 using sticky glue-line 17 to cling, it is ensured that lens outer edge and substrate 6
Sealing docking (without folding gap i.e. at the docking of the two), can be avoided in this way because brought by the fever of LED light source 5 or cooling
Lens interior air expands with heat and contract with cold to externalities (preferably increasing the description to relative influence), close by pouring into later
Each internal part is all sealed in the space being surrounded by by waterproof edge 8, is integrally formed with radiator 9 by sealing 16, realizes
Secondary seal further strengthens bonding, enhances the waterproofness and leakproofness of LED module；
Meanwhile sealing is docked between lens outer edge and substrate 6, moreover it is possible to the sealant effectivelying prevent in subsequent process for filling colloid
16 penetrate into lens interior cavity, guarantee that lens light efficiency and product are beautiful.
3, the lens of a small amount of colloid adhesive seal are used compared to the lens of mechanical bond rubber sealing on the market and part
For, the utility model is in addition to good waterproofness and leakproofness, additionally it is possible to guarantee good heat dissipation performance, while can be with
Effectively prevent traditional handicraft to use the aging phenomenon of cushion rubber, at the same overcome tradition make to be screwed brought by pressure and tight
The close non-uniform technological deficiency of property.
The utility model not only solved from material, structure, technique LED module lamps and lanterns light decay and waterproofing grade it is low this
One problem also greatly reduces the fixed process of screw machine, reduces manual operation, reduce production cost, improve life
Efficiency is produced, product is made more to meet automated production demand.
According in National Standard of the People's Republic of China " GB 7000.1-2005 ", the 9.2nd: preventing dust, solid different
The experiment that object and water immerse, detects above-mentioned LED module and reaches IP67 degree of protection, meets outdoor lamp using standard, especially
Sealing waterproof performance meets using standard.
Meanwhile the heat dissipation performance of above-mentioned LED module is tested, i.e. temperature rise is tested:
Test condition: LED light source power 30w, 29 DEG C of room temperature, the testing time 4 hours
Test result: 18 DEG C of temperature rise of front (lens face) of LED module, 20 DEG C of temperature rise of the back side (radiator face) meet family
Temperature rise is no more than 40 DEG C of standard when outer lamp uses.
By above-mentioned detection structure it is found that the utility model can still be protected under the premise of ensure that sealing waterproof performance
Demonstrate,prove good heat dissipation performance, it is ensured that integral LED mould group can be used normally in the service life of LED light source chip.
Claims (9)
1. a kind of encapsulating LED module, including lens, LED light source (5), cover board (1), substrate (6) and radiator (9), feature exists
In: LED light source (5) is fixed on substrate (6) front；Lens cap is on LED light source (5), and at least in the outside at the lens back side
Toughness glue-line (17) are applied on edge, lens are bonded with substrate (6) and are clinged；The back side of radiator (9) protrudes from scattered equipped with a circle
The substrate (6) for being fixed with lens is fixedly mounted on and to be surrounded by by the waterproof edge (8) by the waterproof edge (8) on hot device (9) surface
In space, the filling with sealant (16), lens and substrate (6) is completely enclosed within this space in the space；Corresponding lens
Microlens window (2) are equipped on cover board (1), cover board (1) is covered on lens and fixed from top, and lens are from microlens window (2)
It is pierced by.
2. encapsulating LED module according to claim 1, it is characterised in that: lens use connecting plate glass lens (3).
3. encapsulating LED module according to claim 1 or 2, it is characterised in that: the face that substrate (6) is contacted with radiator (9)
On be evenly coated with heat-conducting silicone grease (15).
4. encapsulating LED module according to claim 3, it is characterised in that: radiator (9) back side is equipped with substrate positioning column
(10), substrate positioning column (10) is located in the space being surrounded by by waterproof edge (8), and counterpart substrate positioning column (10) is in substrate (6)
Upper setting first positioning hole (7).
5. encapsulating LED module according to claim 3, it is characterised in that: radiator (9) back side is equipped with lens positioning column
(12), lens positioning column (12) also is located in the space being surrounded by by waterproof edge (8), and corresponding lens positioning column (12) are on lens
Second location hole is set.
6. encapsulating LED module according to claim 1, it is characterised in that: the back side of cover board (1) is by viscose glue (18) and dissipates
The waterproof edge (8) of hot device (9) is filled in the sealant (16) of waterproof edge (8) in the space and is bonded as one, and realizes solid
It is fixed.
7. any encapsulating LED module in -2 or 4-6 according to claim 1, it is characterised in that: radiator (9) is just
Face is equipped with waterproof connector (11), and corresponding waterproof connector (11) are equipped with through-hole (13) on radiator (9), on waterproof connector (11)
Positive and negative anodes wiring pass through radiator (9) through-hole (13) afterwards, be respectively welded on the positive and negative anodes of substrate (6).
8. any encapsulating LED module in -2 or 4-6 according to claim 1, it is characterised in that: substrate (6) uses aluminium
Substrate.
9. any encapsulating LED module in -2 or 4-6 according to claim 1, it is characterised in that: radiator (9) uses
Die casting aluminium radiator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920805692.5U CN209672280U (en) | 2019-05-30 | 2019-05-30 | Encapsulating LED module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920805692.5U CN209672280U (en) | 2019-05-30 | 2019-05-30 | Encapsulating LED module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209672280U true CN209672280U (en) | 2019-11-22 |
Family
ID=68575667
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920805692.5U Expired - Fee Related CN209672280U (en) | 2019-05-30 | 2019-05-30 | Encapsulating LED module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209672280U (en) |
-
2019
- 2019-05-30 CN CN201920805692.5U patent/CN209672280U/en not_active Expired - Fee Related
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|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191122 |