CN209643079U

CN209643079U - Circuit substrate and proximity sensor comprising the circuit substrate

Info

Publication number: CN209643079U
Application number: CN201920053504.8U
Authority: CN
Inventors: 吴燕平; 周静怡; 张慧
Original assignee: Europa Corp
Current assignee: Europa Corp; Omron Corp
Priority date: 2019-01-11
Filing date: 2019-01-11
Publication date: 2019-11-15
Anticipated expiration: 2029-01-11
Also published as: WO2020145349A1

Abstract

The utility model embodiment provides a kind of circuit substrate and the proximity sensor comprising the circuit substrate.The circuit substrate includes: substrate and bracing means, the bracing means is disposed on the substrate, the bracing means includes 2 or more pads, the pad is at least arranged in 2 rows and forms the first row pad and the second row pad, the first row pad intersects with the second row pad, alternatively, the first row pad is intertwined with the second row pad.The utility model can enhance the intensity of substrate, the bending deformation of correction substrate, and bracing means can be easily formed on substrate by the way that above-mentioned bracing means is arranged.

Description

Circuit substrate and proximity sensor comprising the circuit substrate

Technical field

The utility model relates to matrix technique field more particularly to a kind of circuit substrate and connecing comprising the circuit substrate Nearly sensor.

Background technique

In recent years, along with the high performance of industrial equipment, the precision for the component carried on substrate and substrate is increasingly It is high.

It should be noted that the above description of the technical background is intended merely to conveniently carry out clearly the technical solution of the utility model Chu, complete explanation, and facilitate the understanding of those skilled in the art and illustrate.It cannot be merely because these schemes be practical at this Novel background technology part is expounded and thinks that above-mentioned technical proposal is known to those skilled in the art.

Utility model content

In general, substrate can have 1% to 2% bending deformation after processing is made, stood carrying out subsequent group to substrate During, substrate will receive the contrary stress of the bending deformation with substrate of extraneous application.Due to the electronics on substrate Element is to deposit to be installed on substrate in the case of bending deformation in substrate, therefore, when substrate is by extraneous above-mentioned stress When, it is easy to cause the electronic component on substrate impaired, to cause economic loss.

To solve the above-mentioned problems, the utility model embodiment provides a kind of circuit substrate and comprising the circuit substrate Proximity sensor, can by bracing means enhance substrate intensity and correction substrate bending deformation, further, it is possible in base The bracing means is readily formed on plate.

According to the utility model embodiment in a first aspect, providing a kind of circuit substrate, the circuit substrate includes: base Plate；And bracing means, on the substrate, the bracing means includes 2 or more pads, and the pad is at least for setting It is arranged in 2 rows formation the first row pad and the second row pad, the first row pad intersects with the second row pad, or Person, the first row pad are intertwined with the second row pad.

According to the second aspect of the utility model embodiment, a kind of circuit substrate as described in relation to the first aspect is provided, in institute State the first row pad and in the case that the second row pad is intertwined, the first row pad and second row weldering Disk respectively includes 2 or more pads, and the first gap, the second row pad are formed between the pad in the first row pad In pad between form the second gap, first gap is mutually staggered with second gap.

According to the third aspect of the utility model embodiment, a kind of circuit substrate as described in relation to the first aspect is provided, it is described The geometric shape of pad is identical and in the same size.

According to the fourth aspect of the utility model embodiment, a kind of circuit substrate as described in relation to the first aspect is provided, it is described The geometric shape of pad is the combination of round, polygon or both.

According to the 5th of the utility model embodiment the aspect, a kind of circuit substrate as described in relation to the first aspect is provided, in institute It states the first row pad and the second row pad is intertwined and the case where the geometric shape of the pad is quadrangle Under, the angle between the long side of the pad of the quadrangle and the long side of the substrate is less than 45 degree.

According to the 6th of the utility model embodiment aspect, a kind of circuit substrate as described in terms of the 5th is provided, it is described The long side of the pad of quadrangle is parallel with the long side of the substrate.

According to the 7th of the utility model embodiment the aspect, a kind of circuit substrate as described in relation to the first aspect is provided, in institute It states the first row pad and the second row pad intersects and in the case that the geometric shape of the pad is quadrangle, institute The angle between the long side of the pad of quadrangle and the long side of the substrate is stated less than 45 degree.

According to the eighth aspect of the utility model embodiment, a kind of circuit substrate as described in relation to the first aspect is provided, it is described Any one or both sides of the substrate are arranged in bracing means.

According to the 9th of the utility model embodiment the aspect, a kind of circuit substrate as described in eighth aspect is provided, in institute In the case where stating the two sides that the substrate is arranged in bracing means, the bracing means in the one side of the substrate is set The pattern of pattern and the bracing means on the another side that the substrate is arranged in is symmetrical relative to the substrate.

According to the tenth of the utility model embodiment the aspect, a kind of circuit substrate as described in relation to the first aspect is provided, in institute State the first row pad and in the case that the second row pad intersects, the first row pad and the second row pad shape At X-shaped or V-arrangement.

On the one hand according to the tenth of the utility model embodiment the, a kind of proximity sensor, the proximity sensor packet are provided The circuit substrate as described in any one in terms of including such as first aspect to the tenth.

The beneficial effect of the utility model embodiment is: by being arranged bracing means on substrate, the of bracing means A line pad intersects or is staggered with the second row pad, and thereby, it is possible to enhance the intensity of substrate and correction substrate Bending deformation, so that the electronic component that can be avoided on substrate during subsequent group vertical is impaired；Also, it is formed on substrate The reinforcing mode of one piece of continuous pad is compared, can by the way that the bracing means of the pad comprising 2 or more is arranged on substrate Substrate is reinforced using multiple areas lesser pad, therefore, when forming pad, can effectively be kept needed for welding The heat wanted, so as to easily form pad on substrate.

Referring to following description and accompanying drawings, the particular implementation of the utility model is disclosed in detail, specifies practical Novel principle can be in a manner of adopted.It should be understood that the embodiments of the present invention in range not therefore and by To limitation.In the range of the spirit and terms of appended claims, the embodiments of the present invention includes many changes, repairs Change and is equal.

The feature for describing and/or showing for a kind of embodiment can be in a manner of same or similar one or more It uses in a other embodiment, is combined with the feature in other embodiment, or the feature in substitution other embodiment.

It should be emphasized that term "comprises/comprising" refers to the presence of feature, one integral piece, step or component when using herein, but simultaneously It is not excluded for the presence or additional of one or more other features, one integral piece, step or component.

Detailed description of the invention

Included attached drawing is used to provide to be further understood from the utility model embodiment, and which constitute specifications A part for illustrating the embodiments of the present invention, and comes together to illustrate the principles of the present invention with verbal description.It is aobvious And easy insight, the drawings in the following description are merely some embodiments of the present invention, for those of ordinary skill in the art For, without creative efforts, it can also be obtained according to these attached drawings other attached drawings.In the accompanying drawings:

Fig. 1 is a schematic diagram of the structure of the circuit substrate of the utility model embodiment 1；

Fig. 2A is another schematic diagram of the structure of the circuit substrate of the utility model embodiment 1；

Fig. 2 B is another schematic diagram of the structure of the circuit substrate of the utility model embodiment 1；

Fig. 2 C is another schematic diagram of the structure of the circuit substrate of the utility model embodiment 1；

Fig. 3 is another schematic diagram of the structure of the circuit substrate of the utility model embodiment 1；

Fig. 4 is another schematic diagram of the structure of the circuit substrate of the utility model embodiment 1；

Fig. 5 is another schematic diagram of the structure of the circuit substrate of the utility model embodiment 1；

Fig. 6 is a schematic diagram of the structure of the proximity sensor of the utility model embodiment 2；

Fig. 7 is a decomposition diagram of the structure of the proximity sensor of the utility model embodiment 2.

Specific embodiment

Referring to attached drawing, by following specification, the aforementioned and other feature of the utility model be will be apparent.It is saying In bright book and attached drawing, the particular implementation of the utility model is specifically disclosed, which show wherein can be practical new using this The some embodiments of the principle of type, it will thus be appreciated that the utility model is not limited to described embodiment, on the contrary, this reality With novel whole modifications, modification and equivalent including falling within the scope of the appended claims.

In the utility model embodiment, singular " one ", "the" etc. include plural form, be should be broadly interpreted as "an" or " one kind " and the meaning for not being defined as "one"；Furthermore term " described " is interpreted as both including singular It also include plural form, unless the context clearly indicates otherwise.Furthermore term " according to " is interpreted as " at least partly root According to ... ", term "based" is interpreted as " being at least partially based on ... ", unless the context clearly indicates otherwise.

Embodiment 1

The utility model embodiment 1 provides a kind of circuit substrate, and Fig. 1 is the circuit substrate 1 of the utility model embodiment 1 Structure a schematic diagram, Fig. 2A to Fig. 2 C be the structure of the circuit substrate 1 of the utility model embodiment 1 another signal Figure.

In the present embodiment, as shown in Fig. 1 and Fig. 2A to Fig. 2 C, circuit substrate 1 includes:

Substrate 101；And

Bracing means 102 (as shown in the dotted line frame in Fig. 1 and Fig. 2A to Fig. 2 C), setting is on the substrate 101.Reinforce dress The pad 103 that 102 include 2 or more is set, pad 103 is at least arranged in 2 rows and forms the first row pad 104 and the second row pad 105.As shown in Fig. 2A to Fig. 2 C, the first row pad 104 can intersect with the second row pad 105, alternatively, as shown in Figure 1, The first row pad 104 can be intertwined with the second row pad 105.

In addition, being provided with electronic component 106, the present embodiment pair in aforesaid substrate 101 as shown in Fig. 1 and Fig. 2A to Fig. 2 C The setting form and type of the electronic component 106 are with no restrictions.

By the way that bracing means 102, the first row pad 104 of bracing means 102 and the second row pad are arranged on the substrate 101 105 intersect or are staggered, and can enhance the intensity of substrate 101, the bending deformation of correction substrate 101, thus rear The electronic component 106 that can be avoided on substrate 101 during continuous group is vertical is impaired；Also, it is continuous with forming one piece on substrate The reinforcing mode of pad is compared, and by the way that the bracing means of the pad comprising 2 or more is arranged on substrate, can utilize multiple faces The lesser pad of product reinforces substrate, therefore, when forming pad, can effectively keep welding required heat, So as to easily form pad on substrate.

In the present embodiment, circuit substrate 1 can be any type of circuit substrate, be applied to connect for example, it can be Circuit substrate in nearly sensor, or it is also possible to the circuit substrate being applied in other electronic products, the utility model pair This is not specifically limited.

In the present embodiment, pad 103 can be formed by the method for reflux solder or flow solders on the substrate 101. But the application is without being limited thereto, can also form pad 103 on the substrate 101 by other means.

In the present embodiment, the quantity for the row pad that the arrangement of pad 103 is formed can be 2 rows, as shown in Fig. 2A to Fig. 2 C 2 rows, or be also possible to the quantity greater than 2,4 rows as shown in Figure 1.

In the present embodiment, the number of pads for including in a line pad can be 1, and as shown in Fig. 2A to Fig. 2 C 1 Pad, or it is also possible to the quantity greater than 1, as shown in Figure 17 or 8.

In the present embodiment, as shown in Figure 1, the first row pad 104 is intertwined with the second row pad 105, wherein The first row pad 104 and the second row pad 105 respectively include 2 or more pads 103, the pad 103 in the first row pad 104 Between be formed with the first gap 107, the second gap 108, the first gap 107 are formed between the pad 103 in the second row pad 105 It is mutually staggered with the second gap 108.Compared to the set-up mode for being aligned the first gap 107 with the second gap 108, by making One gap 107 and the second gap 108 mutually stagger, and can significantly improve the intensity of substrate 101.

In the present embodiment, as shown in Figure 1, pad 103 is arranged in 4 rows, wherein two row pads 103 of arbitrary neighborhood can Using as the first row pad 104 and the second row pad 105.For example, being welded with the 3rd row and the 4th behavior example to the first row in Fig. 1 The set-up mode of disk 104 and the second row pad 105 is illustrated.It is understood that the row of the pad 103 in the present embodiment Number is not limited to 4 row shown in FIG. 1, as long as the pad 103 of bracing means 102 is arranged in 2 rows or more.

In the present embodiment, as shown in Fig. 2A to Fig. 2 C, bracing means 102 includes 2 pads 103,2 pads 103 It can mutually be handed over respectively as the first row pad 104 and the second row pad 105, the first row pad 104 and the second row pad 105 Fork, for example, the first row pad 104 and the second row pad 105 can form X-shaped as shown in Figure 2 A, alternatively, can also be such as Fig. 2 B V-arrangement is formed with shown in Fig. 2 C.It is understood that the number of the cross one another pad 103 in the present embodiment is not limited to Fig. 2A To 2 shown in fig. 2 C, it can also be intersected by the pad 103 greater than 2 and form bracing means 102.

In the present embodiment, the geometric shape of pad 103 can be identical, and in the same size.Thereby, it is possible to uniform And the symmetrically bending deformation of correction substrate.As shown in Fig. 2A to Fig. 2 C, two pads 103 in bracing means 102 are big Small identical quadrangle.Fig. 3 is another schematic diagram of the structure of the circuit substrate 1 of the utility model embodiment 1.Such as Fig. 3 institute Show, multiple pads 103 in bracing means 102 are the identical rectangle of size.Fig. 4 is the circuit base of the utility model embodiment 1 Another schematic diagram of the structure of plate 1.As shown in figure 4, multiple pads 103 in bracing means 102 are the identical rectangle of size. But the application is without being limited thereto, the geometric shape of pad 103 or the size of pad are also possible to different.

In the present embodiment, the geometric shape of pad 103 can be the combination of round, polygon or both.Extremely such as Fig. 1 Shown in Fig. 4, the geometric shape of pad 103 is quadrangle.However, the application is without being limited thereto, the geometric shape of pad 103 can also be with It is that the geometric shape of the polygons such as triangle, pentagon, hexagon or pad 103 is also possible to circle, alternatively, a part of The geometric shape of pad 103 is polygon, and the geometric shape of another part pad 103 is round.Thereby, it is possible to more flexiblely Shape and the position of pad 103 are set.

In the present embodiment, as shown in figure 3, be intertwined in the first row pad 104 and the second row pad 105 and In the case that the geometric shape of pad 103 is quadrangle, between the long side of the pad 103 of quadrangle and the long side of substrate 101 Angle α is less than 45 degree.Since the longer bending deformation of substrate 101 is bigger, the bending deformation of the longitudinal direction of substrate 101 is big In the bending deformation of short side direction.By making the angle α between the long side of pad 103 and the long side of substrate 101 less than 45 degree, weld Projection of the long side of disk 103 in the long side of substrate 101 is greater than its projection on the short side of substrate 101, and thereby, it is possible to improve The intensity of substrate 101 in the long side direction.But the application is without being limited thereto, the long side and substrate 101 of the pad 103 of quadrangle Long side between angle α can also be greater than or equal to 45 degree.

In the present embodiment, as shown in Figure 1 and Figure 4, the long side of the pad 103 of quadrangle is parallel with the long side of substrate 101. Thereby, it is possible to further increasing the intensity of substrate 101 in the long side direction, further correction substrate 101 is in the long side direction Bending deformation.

In the present embodiment, as shown in Fig. 2A to Fig. 2 C, it intersects in the first row pad 104 and the second row pad 105 And in the case that the geometric shape of pad 103 is quadrangle, the long side of the long side of the pad 103 of quadrangle and substrate 101 it Between angle theta less than 45 degree.Since the long side of pad 103 projects the short side being greater than in substrate 101 in the long side of substrate 101 On projection therefore can be improved the intensity of substrate 101 in the long side direction.But the application is without being limited thereto, quadrangle Angle theta between the long side of pad 103 and the long side of substrate 101 can also be greater than or equal to 45 degree.

In the present embodiment, any one or both sides in substrate 101 can be set in bracing means 102.Such as Fig. 1, Fig. 4 institute Show, the one side in substrate 101 can be set in bracing means 102；As shown in Fig. 2A to Fig. 2 C and Fig. 3, bracing means 102 can also be with The another side of substrate 101 is set；Alternatively, the two sides of substrate 101 can also be arranged in bracing means 102 simultaneously, thereby, it is possible to Further increase the intensity of substrate 101.

In the present embodiment, pad 103, which can be set, is not generating appointing for interference to the electronic component 106 on substrate 101 At the position of meaning.For example, bracing means 102 can be with concentrated setting in the middle position of substrate 101, as a result, shown in Fig. 1 to Fig. 4 It can prevent substrate 101 from occuring bending and deformation from centre.

In the present embodiment, pad 103 can not be connect with the wiring (not shown) on substrate 101, and thereby, it is possible to reduce The manufacturing cost of bracing means 102.But the application is without being limited thereto, pad 103 can also be connect with the wiring on substrate 101.

In the present embodiment, in the case where the two sides of substrate 101 is arranged in bracing means 102, substrate 101 is set The pattern of the pattern of bracing means 102 on one side and the bracing means 102 on the another side that substrate 101 is arranged in can be opposite It is symmetrical in substrate 101.Thereby, it is possible to the uniform and symmetrically bending deformations of correction substrate 101.

Wherein, the pattern of bracing means 102 refer to the quantity of the pad 103 in bracing means 102, geometry, size, Arrangement mode and setting position etc..Fig. 5 is another schematic diagram of the structure of the circuit substrate 1 of the utility model embodiment 1. In Fig. 1, bracing means 102 is arranged in the one side of substrate 101, and in Fig. 5, the another of substrate 101 is arranged in bracing means 102 On on one side, bracing means 102 is in the pattern (as shown in Figure 1) in the one side of substrate 101 and the figure on the another side of substrate 101 Case (as shown in Figure 5) is symmetrical relative to substrate 101.But the application is without being limited thereto, one side of the bracing means 102 in substrate 101 On pattern can also be symmetrical not relative to substrate 101 with the pattern on the another side of substrate 101.

Circuit substrate through this embodiment, is arranged bracing means on substrate, make the first row pad of bracing means with Second row pad intersects or is staggered, and can enhance the intensity of substrate, the bending deformation of correction substrate, thus rear The electronic component that can be avoided on substrate during continuous group is vertical is impaired；Also, with one piece of continuous pad of formation on substrate Reinforcing mode is compared, can be smaller using multiple areas by the way that the bracing means of the pad comprising 2 or more is arranged on substrate Pad substrate is reinforced, therefore, when forming pad, can effectively keep welding required heat, so as to It is enough that pad is easily formed on substrate.

Embodiment 2

The utility model embodiment 2 provides a kind of proximity sensor, which includes as the utility model is real Apply circuit substrate described in example 1.By the way that the circuit substrate 1 as described in the utility model embodiment 1 is arranged in proximity sensor, Since bracing means is arranged on the substrate of circuit substrate 1, hand over the first row pad of bracing means mutually with the second row pad It pitches or is staggered, the intensity of substrate, the bending deformation of correction substrate, thus can during subsequent group vertical can be enhanced It avoids the electronic component on substrate impaired, can be improved the reliability of proximity sensor；Also, with one piece of company of formation on substrate The reinforcing mode of continuous pad is compared, and by the way that the bracing means of the pad comprising 2 or more is arranged on substrate, can be utilized more A lesser pad of area reinforces substrate, therefore, when forming pad, can effectively keep welding required heat Amount, so as to easily form pad on substrate, reduces the manufacturing cost of proximity sensor.

In the present embodiment, proximity sensor 2 can detecte the mobile message of object and/or there are information, and will test To information be converted to electric signal and exported, can be capacitive proximity sensor, inductive proximity sensor or Any one in photo-electric proximity sensor etc..

Fig. 6 is a schematic diagram of the structure of the proximity sensor 2 of the utility model embodiment 2, and Fig. 7 is shown in fig. 6 The decomposition diagram of proximity sensor 2.As shown in Figure 6 and Figure 7, proximity sensor 2 may include test section 201, control unit 202, display unit 203, protection portion 204, output section 205 and fixed part 206.But the application is without being limited thereto, close to sensing Device 2 also may include divided by the other component except upper-part, alternatively, proximity sensor 2 can also only include in upper-part Section components.

Wherein, test section 201 can be the magnetism type test section being made of solenoid housing etc., be examined using electromagnetic induction technology It surveys the mobile message of object and/or there are information.But the application is without being limited thereto, test section 201 is also possible to other types Test section.

It is can be set in control unit 202 just like circuit substrate 1 described in the utility model embodiment 1.Control unit 202 and inspection Survey portion 201 and output section 205 are electrically connected, and control the movement of test section 201 and output section 205.The circuit substrate 1 of control unit 202 On light emitting diode 207 (LED) also can be set, whether can have electricity by displays such as color, the flashing modes of LED 207 The information such as gas signal output.

Display unit 203 can be arranged opposite with the LED 207 on the circuit substrate 1 of control unit 202, the luminous energy of LED 207 Enough captured through display unit 203 by the external world.Display unit 203 for example can be the form of lightening hole.But the application is not limited to This, display unit 203 is also possible to other kinds of display unit.

Protection portion 204 can be cylindrical shape, cover control unit 202, wherein test section 201 is from protection portion 204 one end is exposed, and display unit 203 exposes from the other end in protection portion 204.But the application is without being limited thereto, appearance is protected Shield portion 204 is also possible to the component of other shapes.

Output section 205 can be electrically connected with control unit 202, be used to export electric signal outward.

Fixed part 206, which is used to proximity sensor being fixed to client, uses end, may be mounted at protection portion 204 Peripheral part.

In the present embodiment, by the way that the circuit substrate as described in the utility model embodiment 1 is arranged in proximity sensor, Since bracing means being arranged on the substrate of circuit substrate, the first row pad of bracing means is made to intersect with the second row pad Or be staggered, the intensity of substrate, the bending deformation of correction substrate can be enhanced, to can keep away during subsequent group is vertical The electronic component exempted from substrate is impaired, can be improved the reliability of proximity sensor；Also, it is continuous with forming one piece on substrate The reinforcing mode of pad compare, by the way that the bracing means of the pad comprising 2 or more is arranged on substrate, can utilize multiple The lesser pad of area reinforces substrate, therefore, when forming pad, can effectively keep welding required heat Amount, so as to easily form pad on substrate, reduces the manufacturing cost of proximity sensor.

Combine specific embodiment that the utility model is described above, but those skilled in the art should be clear Chu, these descriptions are all exemplary, and are not the limitation to scope of protection of the utility model.Those skilled in the art can root Various variants and modifications are made to the utility model according to the spirit and principle of the utility model, these variants and modifications are also in this reality With in novel range.

Claims

1. a kind of circuit substrate, which is characterized in that the circuit substrate includes:

Substrate；And

Bracing means, on the substrate, the bracing means includes 2 or more pads, and the pad is at least arranged for setting It arranges into 2 rows formation the first row pad and the second row pad, the first row pad intersects with the second row pad, or Person, the first row pad are intertwined with the second row pad.

2. circuit substrate according to claim 1, which is characterized in that in the first row pad and the second row pad In the case where being intertwined, the first row pad and the second row pad respectively include 2 or more pads, described The first gap is formed between pad in the first row pad, and the second gap, institute are formed between the pad in the second row pad The first gap is stated to mutually stagger with second gap.

3. circuit substrate according to claim 1, which is characterized in that the geometric shape of the pad is identical and size one It causes.

4. circuit substrate according to claim 1, which is characterized in that the geometric shape of the pad is round, polygon Or both combination.

5. circuit substrate according to claim 1, which is characterized in that in the first row pad and the second row pad Be intertwined and the geometric shape of the pad be quadrangle in the case where, the long side of the pad of the quadrangle and institute The angle between the long side of substrate is stated less than 45 degree.

6. circuit substrate according to claim 5, which is characterized in that the long side of the pad of the quadrangle and the substrate Long side it is parallel.

7. circuit substrate according to claim 1, which is characterized in that in the first row pad and the second row pad It intersects and in the case that the geometric shape of the pad is quadrangle, the long side of the pad of the quadrangle and the base Angle between the long side of plate is less than 45 degree.

8. circuit substrate according to claim 1, which is characterized in that any of the substrate is arranged in the bracing means One or both sides.

9. circuit substrate according to claim 8, which is characterized in that be arranged in the two of the substrate in the bracing means In the case where face, the pattern for the bracing means being arranged in the one side of the substrate and the another side that the substrate is set On the bracing means pattern it is symmetrical relative to the substrate.

10. circuit substrate according to claim 1, which is characterized in that welded in the first row pad and second row In the case that disk intersects, the first row pad and the second row pad form X-shaped or V-arrangement.

11. a kind of proximity sensor, which is characterized in that the proximity sensor includes such as any one in claim 1-10 The circuit substrate.