JPH06326426A - Flexible wiring board - Google Patents
Flexible wiring boardInfo
- Publication number
- JPH06326426A JPH06326426A JP5111698A JP11169893A JPH06326426A JP H06326426 A JPH06326426 A JP H06326426A JP 5111698 A JP5111698 A JP 5111698A JP 11169893 A JP11169893 A JP 11169893A JP H06326426 A JPH06326426 A JP H06326426A
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- wiring board
- flexible wiring
- dummy
- flexible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、例えばＩＣやＬＳＩ或
いはコンデンサ等の電子部品を実装し、または電気機器
や電子機器等に内蔵される端子と端子を接続するのに用
いられる可撓性を有したフレキシブル配線基板に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention provides a flexible structure for mounting electronic parts such as ICs, LSIs, capacitors, etc., or connecting terminals incorporated in electric equipment or electronic equipment. A flexible wiring board having the same.
【０００２】[0002]
【従来の技術】例えば、フレキシブル配線基板は、図４
に示すように、可撓性を有する肉薄のポリイミドフィル
ム１０１上に形成される銅箔を所定のパターンにエッチ
ングすることにより形成される導体パターン１０２を有
してなる。2. Description of the Related Art For example, a flexible wiring board is shown in FIG.
As shown in FIG. 3, a conductor pattern 102 is formed by etching a copper foil formed on a thin polyimide film 101 having flexibility into a predetermined pattern.
【０００３】ここでの導体パターン１０２は、長尺状を
なすポリイミドフィルム１０１上に、そのフィルム１０
１の長手方向に沿って所定間隔でストライプ状に形成さ
れている。The conductor pattern 102 here is formed by forming a film 10 on a long polyimide film 101.
1 are formed in stripes at predetermined intervals along the longitudinal direction.
【０００４】ところで、上記フレキシブル配線基板は、
ポリイミドフィルム１０１の持つその柔軟性から、各種
電気機器や電子機器に内蔵される硬質基板の接続等に多
用されている。By the way, the flexible wiring board is
Due to the flexibility of the polyimide film 101, the polyimide film 101 is often used for connecting a hard substrate incorporated in various electric and electronic devices.
【０００５】しかしながら、例えば機器本体に対して開
閉可能となされた蓋体との間にこのフレキシブル配線基
板が配設されるような場合には、蓋体の開閉動作の繰り
返しにより、フレキシブル配線基板の折り曲げ部（図中
Ａ−Ａで示す位置）の端縁部から折り曲げ方向（図中矢
印Ｘで示す方向）と直交する方向に亀裂１０３が入る可
能性がある。However, for example, when the flexible wiring board is arranged between the lid body which can be opened and closed with respect to the main body of the device, the flexible wiring board is repeatedly opened and closed by repeating the opening and closing operation of the lid body. There is a possibility that cracks 103 may enter from the edge of the bent portion (the position indicated by AA in the drawing) in the direction orthogonal to the bending direction (the direction indicated by the arrow X in the drawing).
【０００６】また、生じた亀裂１０３は、折り曲げ部に
沿って進行するため、特に酷いときには導体パターン１
０２にまで達することもある。導体パターン１０２にま
で亀裂１０３が達すると、フレキシブル配線基板として
の機能が損なわれ、信頼性が大幅に低下する。Further, since the cracks 103 that have formed progress along the bent portions, the conductor pattern 1 is particularly severe.
It may reach up to 02. When the crack 103 reaches the conductor pattern 102, the function as a flexible wiring board is impaired, and the reliability is significantly reduced.
【０００７】[0007]
【発明が解決しようとする課題】そこで本発明は、上述
の従来の有する課題を解決するべく提案されたものであ
って、折り曲げ時に生じ得る端縁からの亀裂の進行を防
止し、繰り返し疲労による寿命を大幅に延ばすことがで
きる信頼性の高いフレキシブル配線基板を提供しようと
するものである。SUMMARY OF THE INVENTION Therefore, the present invention has been proposed to solve the above-mentioned problems of the prior art, and prevents the progress of cracks from the edges that may occur during bending and prevents repeated fatigue. An object of the present invention is to provide a flexible wiring board with high reliability that can significantly extend the life.
【０００８】[0008]
【課題を解決するための手段】本発明は、上記の目的を
達成するために提案されたものであって、絶縁フレキシ
ブル基材の少なくとも一方の面に導体パターンが形成さ
れてなるフレキシブル配線基板において、上記絶縁フレ
キシブル基材の端縁に沿って、フレキシブル配線基板の
機械的強度を高めるダミーパターンが複数形成されてい
ることを特徴とする。DISCLOSURE OF THE INVENTION The present invention has been proposed in order to achieve the above-mentioned object, and is a flexible wiring board in which a conductor pattern is formed on at least one surface of an insulating flexible base material. A plurality of dummy patterns for enhancing the mechanical strength of the flexible wiring board are formed along the edge of the insulating flexible base material.
【０００９】そして、そのダミーパターンが千鳥状であ
ることを特徴とする。The dummy pattern is staggered.
【００１０】また、ダミーパターンは、フレキシブル配
線基板の折り曲げ方向と略平行な第１のパターン部と、
これを連結する第２のパターン部とからなり、且つ各ダ
ミーパターンの第１のパターン部同士が折り曲げ方向と
垂直方向で重なるように設けられていることを特徴とす
る。The dummy pattern has a first pattern portion substantially parallel to the bending direction of the flexible wiring board,
It is characterized in that it is formed of a second pattern portion that connects these, and that the first pattern portions of each dummy pattern are provided so as to overlap each other in the direction perpendicular to the bending direction.
【００１１】[0011]
【作用】本発明に係るフレキシブル配線基板において
は、絶縁フレキシブル基材の端縁に沿って、フレキシブ
ル配線基板の機械的強度を高めるダミーパターンが複数
形成されているので、導体パターンとダミーパターンの
剛の部分とフレキシブルな基材のみの部分が分散するこ
とになり、折り曲げ時の応力が折り曲げ部分にのみ集中
せず分散せしめられる。したがって、フレキシブル配線
基板を繰り返し折り曲げた場合でも、折り曲げ部から亀
裂が入るのが抑制される。In the flexible wiring board according to the present invention, since a plurality of dummy patterns for enhancing the mechanical strength of the flexible wiring board are formed along the edge of the insulating flexible base material, the conductor pattern and the dummy pattern are rigid. Thus, the portion of and the portion of only the flexible base material are dispersed, and the stress at the time of bending is dispersed without being concentrated only in the bent portion. Therefore, even when the flexible wiring board is repeatedly bent, it is possible to prevent cracks from entering from the bent portion.
【００１２】ダミーパターンが千鳥状である場合には、
仮にダミーパターンの一部に亀裂が入ったとしても、そ
の周囲の剛柔交互の構造により、導体パターン部分への
亀裂の進行が防止される。If the dummy pattern is staggered,
Even if a crack is formed in a part of the dummy pattern, the structure of rigid and flexible structure around the dummy pattern prevents the crack from progressing to the conductor pattern part.
【００１３】また、ダミーパターンは、フレキシブル配
線基板の折り曲げ方向と略平行な第１のパターン部と、
これを連結する第２のパターン部とからなり、且つ各ダ
ミーパターンの第１のパターン部同士が折り曲げ方向と
垂直方向に重なるように設けられているので、折り曲げ
部の端縁から亀裂が入ったとしても、各ダミーパターン
の第１のパターン同士の重なりにより、導体パターン部
分への亀裂の進行は防止される。Further, the dummy pattern has a first pattern portion substantially parallel to the bending direction of the flexible wiring board,
Since the first pattern parts of the dummy patterns are provided so as to overlap each other in the direction perpendicular to the bending direction, a crack is formed from the edge of the bending part. In this case, the overlapping of the first patterns of the dummy patterns prevents the progress of cracks in the conductor pattern portion.
【００１４】[0014]
【実施例】以下、本発明を適用した具体的な実施例につ
いて図面を参照しながら詳細に説明する。本実施例のフ
レキシブル配線基板においては、図１に示すように、肉
薄のポリイミドフィルムよりなる絶縁フレキシブル基材
１の少なくとも一方の面に形成された銅箔をエッチング
等することにより所定のパターンに形成してなる導体パ
ターン２を有してなっている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Specific embodiments to which the present invention is applied will be described in detail below with reference to the drawings. In the flexible wiring board of the present embodiment, as shown in FIG. 1, a copper foil formed on at least one surface of an insulating flexible base material 1 made of a thin polyimide film is formed into a predetermined pattern by etching or the like. The conductor pattern 2 is formed.
【００１５】ここでの絶縁フレキシブル基材１として
は、可撓性を有することから例えばその厚みが２０μｍ
〜６０μｍ程度とされた長尺状をなすフィルムとして形
成されている。Since the insulating flexible base material 1 has flexibility, its thickness is, for example, 20 μm.
It is formed as a long film having a thickness of about 60 μm.
【００１６】一方、導体パターン２は、例えばその厚み
が１８μｍ〜３５μｍ程度とされ、ストライプ状のパタ
ーンに形成されている。On the other hand, the conductor pattern 2 has a thickness of, for example, about 18 μm to 35 μm and is formed in a stripe pattern.
【００１７】そして特に本実施例では、絶縁フレキシブ
ル基材１の長手方向における両端縁部１ａ，１ｂの近傍
に、フレキシブル配線基板の剛性を高めるためのダミー
パターン３，４が千鳥状として形成されている。In particular, in this embodiment, dummy patterns 3 and 4 for increasing the rigidity of the flexible wiring board are formed in a zigzag shape in the vicinity of both end edges 1a and 1b in the longitudinal direction of the insulating flexible base material 1. There is.
【００１８】すなわち、上記ダミーパターン３，４は、
先の導体パターン２をエッチングによって形成する際に
同時に平面略長方形状をなす小さなパターンとして形成
され、上記絶縁フレキシブル基材１の両端縁部１ａ，１
ｂに沿って２列に互い違いとして所定ピッチを持って形
成されている。さらに詳述すると、絶縁フレキシブル基
材１の端縁部１ａ，１ｂに近接する第１列目の各ダミー
パターン３の間に、第２列目のダミーパターン４が設け
られるようになっている。That is, the dummy patterns 3 and 4 are
Simultaneously when the conductor pattern 2 is formed by etching, it is formed as a small pattern having a substantially rectangular shape in a plane, and both end edges 1a, 1 of the insulating flexible base material 1 are formed.
They are formed in two rows along b and have a predetermined pitch as a stagger. More specifically, the dummy patterns 4 of the second row are provided between the dummy patterns 3 of the first row which are close to the edge portions 1a and 1b of the insulating flexible base material 1.
【００１９】このように絶縁フレキシブル基材１の両端
縁部１ａ，１ｂにダミーパターン３，４を千鳥状に設け
ることにより、導体パターン２とダミーパターン３，４
の剛の部分とフレキシブルな基材のみの部分が分散する
ため、フレキシブル配線基板の折り曲げ時における応力
が当該折り曲げ部に集中せずに分散される。したがっ
て、フレキシブル配線基板を同図中矢印Ｘで示す方向に
同図Ａ−Ａで示す位置で繰り返して折り曲げた場合で
も、上記絶縁フレキシブル基材１の端縁部１ａ，１ｂよ
り亀裂が入ることが抑制される。As described above, the conductor patterns 2 and the dummy patterns 3 and 4 are formed by providing the dummy patterns 3 and 4 in a zigzag pattern on the both ends 1a and 1b of the insulating flexible substrate 1.
Since the rigid portion and the portion of only the flexible base material are dispersed, the stress when the flexible wiring board is bent is dispersed without being concentrated in the bent portion. Therefore, even when the flexible wiring board is repeatedly bent in the direction indicated by arrow X in the figure at the position indicated by AA in the figure, cracks may form from the edge portions 1a and 1b of the insulating flexible base material 1. Suppressed.
【００２０】仮に、絶縁フレキシブル基材１の端縁部１
ａ，１ｂより亀裂５，６が入った場合でも、千鳥状とさ
れたダミーパターン３，４の第２列目のダミーパターン
４によってそれ以上の進行が防止される。またさらに、
ダミーパターン３，４の一部に亀裂を生じたとしても、
周囲の構造が剛柔交互になっているため、亀裂が進行し
難い。Assuming that the edge 1 of the insulating flexible substrate 1 is
Even if cracks 5 and 6 are formed from a and 1b, the dummy patterns 4 in the second row of the zigzag dummy patterns 3 and 4 prevent further progress. Furthermore,
Even if some cracks are generated in the dummy patterns 3 and 4,
Cracks are hard to progress because the surrounding structure is rigid and flexible.
【００２１】なお、上述の実施例では、ダミーパターン
３，４を千鳥状としたが、例えば以下に示すようなパタ
ーンとしても同様の作用効果がある。その一つとして、
例えば図２に示すように、同図中Ｂ−Ｂで示す位置での
フレキシブル配線基板の折り曲げ方向（同図中Ｘで示す
方向）と略平行な３つのパターンからなる第１のパター
ン部７，８と、これを連結する第２のパターン部９，１
０とによって平面矩形波状をなすダミーパターンを形成
する。そして、その各ダミーパターンの向きを交互に逆
向きに配列すると共に、各ダミーパターンの第１のパタ
ーン部７，８同士が折り曲げ方向と垂直方向（導体パタ
ーン２の形成方向と略直交する方向）で重なり合うよう
にして設ける。Although the dummy patterns 3 and 4 are staggered in the above-mentioned embodiment, similar effects can be obtained even if the following patterns are used. As one of them,
For example, as shown in FIG. 2, a first pattern portion 7 consisting of three patterns substantially parallel to the bending direction (direction indicated by X in the figure) of the flexible wiring board at the position indicated by BB in the figure, 8 and the second pattern portions 9 and 1 for connecting them
A dummy pattern having a plane rectangular wave shape is formed by 0 and 0. Then, the directions of the dummy patterns are alternately arranged in opposite directions, and the first pattern portions 7 and 8 of the dummy patterns are perpendicular to the bending direction (direction substantially orthogonal to the forming direction of the conductor pattern 2). So that they overlap each other.
【００２２】このような形状をなすダミーパターンで
は、先の千鳥状としたダミーパターン３，４と同様に、
フレキシブル配線基板を繰り返し折り曲げた場合でも疲
労による亀裂が入り難く、仮に亀裂が入ったとしても周
囲の構造が剛柔交互であることから、それ以上の亀裂の
進行を防止することができる。また、各ダミーパターン
の第１のパターン部７，８同士が折り曲げ方向と垂直方
向で重なり合うようにして設けられているので、その重
なり合ったパターン部で亀裂がストップする。In the dummy pattern having such a shape, like the above-mentioned zigzag dummy patterns 3 and 4,
Even if the flexible wiring board is repeatedly bent, cracks due to fatigue are unlikely to occur, and even if cracks occur, the surrounding structure is rigid and flexible, so that further progress of cracks can be prevented. Further, since the first pattern portions 7 and 8 of each dummy pattern are provided so as to overlap each other in the direction perpendicular to the bending direction, the crack stops at the overlapping pattern portions.
【００２３】この他、図３に示すように、同図中Ｃ−Ｃ
で示す位置でのフレキシブル配線基板の折り曲げ方向
（同図中Ｘで示す方向）と略平行な一対のパターンから
なる第１のパターン部１１，１２と、これを連結する第
２のパターン部１３，１４とによって平面略クランク形
状をなすダミーパターンを形成する。そして、その各ダ
ミーパターンの第１のパターン部１１，１２同士が折り
曲げ方向と垂直方向（導体パターン２の形成方向と略直
交する方向）で重なり合うようにして設ける。In addition, as shown in FIG. 3, CC in FIG.
First pattern portions 11 and 12 formed of a pair of patterns substantially parallel to the bending direction of the flexible wiring board (direction indicated by X in the figure) at the position indicated by, and second pattern portions 13 connecting the first pattern portions 11 and 12, A dummy pattern having a substantially crank shape in plan view is formed by 14 and. Then, the first pattern portions 11 and 12 of each dummy pattern are provided so as to overlap each other in the direction perpendicular to the bending direction (direction substantially orthogonal to the forming direction of the conductor pattern 2).
【００２４】上記形状のダミーパターンでは、やはり先
の千鳥状としたダミーパターン３，４と同様に、フレキ
シブル配線基板を繰り返し折り曲げた場合でも疲労によ
る亀裂が入り難く、仮に亀裂が入ったとしても周囲の構
造が剛柔交互であることから、それ以上の亀裂の進行を
防止することができる。また、各ダミーパターンの第１
のパターン部１１，１２同士が折り曲げ方向と垂直方向
で重なり合うようにして設けられているので、その重な
り合ったパターン部で亀裂がストップする。In the dummy pattern having the above-mentioned shape, similarly to the zigzag dummy patterns 3 and 4 described above, cracks due to fatigue do not easily occur even when the flexible wiring board is repeatedly bent. Since the structure of (2) is rigid and flexible, it is possible to prevent the crack from further progressing. In addition, the first of each dummy pattern
Since the pattern parts 11 and 12 are provided so as to overlap each other in the direction perpendicular to the bending direction, the cracks stop at the overlapping pattern parts.
【００２５】[0025]
【発明の効果】以上の説明からも明らかなように、本発
明のフレキシブル配線基板においては、絶縁フレキシブ
ル基材の端縁に沿って、フレキシブル配線基板の機械的
強度を高めるダミーパターンを複数形成しているので、
導体パターンとダミーパターンの剛の部分とフレキシブ
ルな基材のみの部分の分散により、折り曲げ時の応力を
分散させることができ、繰り返し行われる折り曲げ動作
による折り曲げ部から入る亀裂を抑制することができ
る。仮に、ダミーパターンの一部に亀裂が入ったとして
も、その周囲の構造が剛柔交互になっているため、導体
パターン部分への亀裂の進行を防止することができる。As is apparent from the above description, in the flexible wiring board of the present invention, a plurality of dummy patterns for enhancing the mechanical strength of the flexible wiring board are formed along the edge of the insulating flexible base material. Because
By dispersing the rigid portion of the conductor pattern and the dummy pattern and the portion of the flexible base material only, the stress at the time of bending can be dispersed, and cracks entering from the bent portion due to repeated bending operations can be suppressed. Even if a crack is formed in a part of the dummy pattern, the structure around the dummy pattern is alternately rigid and flexible, so that the progress of the crack to the conductor pattern portion can be prevented.
【００２６】したがって、フレキシブル配線基板を繰り
返し折り曲げしても、折り曲げ時に生じ得る端縁部から
の亀裂の進行を防止することができ、その結果、疲労に
よる寿命を大幅に延ばすことができ、高信頼性を得るこ
とができる。Therefore, even if the flexible wiring board is repeatedly bent, it is possible to prevent cracks from progressing from the edge portions that may occur during bending, and as a result, it is possible to significantly extend the life due to fatigue and to achieve high reliability. You can get sex.
【００２７】また、本発明のフレキシブル配線基板にお
いては、フレキシブル配線基板の折り曲げ方向と略平行
な第１のパターン部と、これを連結する第２のパターン
部とで構成したダミーパターンを、その各ダミーパター
ンの第１のパターン部同士を折り曲げ方向と垂直方向に
重なるように設けているので、折り曲げ部の端縁から亀
裂が入ったとしても、各ダミーパターンの第１のパター
ン同士の重なりにより、導体パターン部分への亀裂の進
行を確実に防止することができる。Further, in the flexible wiring board of the present invention, a dummy pattern composed of a first pattern portion which is substantially parallel to the bending direction of the flexible wiring board and a second pattern portion which connects the dummy pattern is formed in each of the dummy patterns. Since the first pattern portions of the dummy patterns are provided so as to overlap with each other in the direction perpendicular to the bending direction, even if a crack is formed from the edge of the bending portion, due to the overlapping of the first patterns of the dummy patterns, It is possible to reliably prevent the progress of cracks in the conductor pattern portion.
【図１】本発明を適用したフレキシブル配線基板の要部
拡大平面図である。FIG. 1 is an enlarged plan view of an essential part of a flexible wiring board to which the present invention is applied.
【図２】本発明を適用したフレキシブル配線基板の他の
例を示す要部拡大平面図である。FIG. 2 is an enlarged plan view of an essential part showing another example of a flexible wiring board to which the present invention is applied.
【図３】本発明を適用したフレキシブル配線基板のさら
に他の例を示す要部拡大平面図である。FIG. 3 is an enlarged plan view of an essential part showing still another example of a flexible wiring board to which the present invention is applied.
【図４】従来のフレキシブル配線基板を示す要部拡大平
面図である。FIG. 4 is an enlarged plan view of an essential part showing a conventional flexible wiring board.
１・・・絶縁フレキシブル基材 ２・・・導体パターン ３，４・・・ダミーパターン ５，６・・・亀裂 ７，８，１１，１２・・・第１のパターン部 ９，１０，１３，１４・・・第２のパターン部 1 ... Insulating flexible base material 2 ... Conductor pattern 3, 4 ... Dummy pattern 5, 6 ... Crack 7, 8, 11, 12 ... 1st pattern part 9, 10, 13, 14 ... Second pattern portion
Claims (3)
の面に導体パターンが形成されてなるフレキシブル配線
基板において、 上記絶縁フレキシブル基材の端縁に沿って、フレキシブ
ル配線基板の機械的強度を高めるダミーパターンが複数
形成されていることを特徴とするフレキシブル配線基
板。1. A flexible wiring board in which a conductor pattern is formed on at least one surface of an insulating flexible base material, and a dummy pattern for increasing the mechanical strength of the flexible wiring board along the edge of the insulating flexible base material. A flexible wiring board having a plurality of formed.
徴とする請求項１記載のフレキシブル配線基板。2. The flexible wiring board according to claim 1, wherein the dummy patterns are staggered.
板の折り曲げ方向と略平行な第１のパターン部と、これ
を連結する第２のパターン部とからなり、且つ各ダミー
パターンの第１のパターン部同士が折り曲げ方向と垂直
方向で重なるように設けられていることを特徴とする請
求項１記載のフレキシブル配線基板。3. The dummy pattern comprises a first pattern portion that is substantially parallel to the bending direction of the flexible wiring board and a second pattern portion that connects the first pattern portion and the first pattern portions of each dummy pattern. The flexible wiring board according to claim 1, wherein is provided so as to overlap in a direction perpendicular to the bending direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5111698A JPH06326426A (en) | 1993-05-13 | 1993-05-13 | Flexible wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5111698A JPH06326426A (en) | 1993-05-13 | 1993-05-13 | Flexible wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06326426A true JPH06326426A (en) | 1994-11-25 |
Family
ID=14567895
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5111698A Withdrawn JPH06326426A (en) | 1993-05-13 | 1993-05-13 | Flexible wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06326426A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09283889A (en) * | 1996-04-09 | 1997-10-31 | Rohm Co Ltd | Reinforcing method of flexible substrate and flexible substrate |
| KR100752660B1 (en) * | 2006-03-31 | 2007-08-29 | 삼성전자주식회사 | Flexible printed circuit and hard disk drive with the same |
| JP2010043930A (en) * | 2008-08-12 | 2010-02-25 | Tateyama Kagaku Kogyo Kk | Noncontact temperature sensor |
| JP2012101425A (en) * | 2010-11-09 | 2012-05-31 | Canon Inc | Liquid discharge head and flexible wiring substrate used for the same |
| US9560748B2 (en) | 2013-01-04 | 2017-01-31 | Bose Corporation | Flexible printed circuit |
| JP2017050361A (en) * | 2015-08-31 | 2017-03-09 | 富士ゼロックス株式会社 | Conductor connection structure and mounting substrate |
| WO2020145349A1 (en) * | 2019-01-11 | 2020-07-16 | オムロン株式会社 | Circuit board and proximity sensor including circuit board |
-
1993
- 1993-05-13 JP JP5111698A patent/JPH06326426A/en not_active Withdrawn
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09283889A (en) * | 1996-04-09 | 1997-10-31 | Rohm Co Ltd | Reinforcing method of flexible substrate and flexible substrate |
| KR100752660B1 (en) * | 2006-03-31 | 2007-08-29 | 삼성전자주식회사 | Flexible printed circuit and hard disk drive with the same |
| JP2007273981A (en) * | 2006-03-31 | 2007-10-18 | Samsung Electronics Co Ltd | Flexible printed circuit and hard disc drive |
| US7869164B2 (en) | 2006-03-31 | 2011-01-11 | Samsung Electronics Co., Ltd. | Flexible printed circuit board having crack-preventing features between static and dynamic regions, and hard disk drive employing the same |
| JP2010043930A (en) * | 2008-08-12 | 2010-02-25 | Tateyama Kagaku Kogyo Kk | Noncontact temperature sensor |
| JP2012101425A (en) * | 2010-11-09 | 2012-05-31 | Canon Inc | Liquid discharge head and flexible wiring substrate used for the same |
| US8740353B2 (en) | 2010-11-09 | 2014-06-03 | Canon Kabushiki Kaisha | Liquid ejection head and flexible wiring substrate used in liquid ejection head |
| US9560748B2 (en) | 2013-01-04 | 2017-01-31 | Bose Corporation | Flexible printed circuit |
| JP2017050361A (en) * | 2015-08-31 | 2017-03-09 | 富士ゼロックス株式会社 | Conductor connection structure and mounting substrate |
| WO2020145349A1 (en) * | 2019-01-11 | 2020-07-16 | オムロン株式会社 | Circuit board and proximity sensor including circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20000801 |