CN209606770U - Direct-write photoetching exposure sources position motion platform orthogonality debugging apparatus - Google Patents

Direct-write photoetching exposure sources position motion platform orthogonality debugging apparatus Download PDF

Info

Publication number
CN209606770U
CN209606770U CN201920382891.XU CN201920382891U CN209606770U CN 209606770 U CN209606770 U CN 209606770U CN 201920382891 U CN201920382891 U CN 201920382891U CN 209606770 U CN209606770 U CN 209606770U
Authority
CN
China
Prior art keywords
axis
debugging
motion platform
direct
orthogonality
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201920382891.XU
Other languages
Chinese (zh)
Inventor
李辉
项宗齐
卫攻文
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hefei Xinqi microelectronics equipment Co., Ltd
Original Assignee
Hefei Xinqi Microelectronic Equipment Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hefei Xinqi Microelectronic Equipment Co Ltd filed Critical Hefei Xinqi Microelectronic Equipment Co Ltd
Priority to CN201920382891.XU priority Critical patent/CN209606770U/en
Application granted granted Critical
Publication of CN209606770U publication Critical patent/CN209606770U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

The utility model relates to direct-write photoetching exposure sources to position motion platform orthogonality debugging apparatus, belong to direct-write photoetching exposure technique field.The debugging apparatus includes support base, precision positioning motion platform, debugging mechanism, support frame and ccd image acquisition system.Precision positioning motion platform includes Y-axis, X-axis and Z axis;Vacuum chuck is installed at the top of Z axis;Absorption has the high-precision calibrating plate of Mark point above vacuum chuck.Debugging mechanism includes being mounted on liftable Mobile Slide in support base, debugging connecting bottom board, shifting sledge and the shifting sledge shifting sledge kinematic nest being slidably matched and the amesdial being fixed in shifting sledge kinematic nest.The utility model first uses ccd image acquisition system to measure the orthogonality of X-axis and Y-axis, then using the orthogonality of debugging mechanism debugging X-axis and Y-axis.The utility model can be improved the efficiency and accuracy of direct-write photoetching exposure sources precision positioning motion platform orthogonality debugging, reduce debugging cost.

Description

Direct-write photoetching exposure sources position motion platform orthogonality debugging apparatus
Technical field
The utility model relates to direct-write photoetching exposure technique fields, and in particular to a kind of direct-write photoetching exposure sources positioning fortune Moving platform orthogonality debugging apparatus.
Background technique
Direct-write photoetching technology is to print the figure with feature on the surface of a substrate using laser.Such substrate is applied to The fields such as PCB circuit board, semiconductor devices, flat-panel monitor, biochip, encapsulation, microelectronic chip.Direct write light on substrate Carving lithography process is: substrate being placed on the vacuum chuck of precision positioning motion platform, using vacuum suction, is set by photoetching Exposure device in standby, projects substrate surface for the pattern image of design, in order to guarantee to expose figure on substrate and reason It is consistent by figure, it is necessary to keep precision positioning motion platform motion profile accurate, it is desirable that there is preferable orthogonality, can just make Theoretical exposure position is consistent with the position of actual exposure.
The orthogonality of precision positioning motion platform is an important indicator of measurement precision positioning motion platform identity, and Influence an important indicator of direct-write photoetching exposure sources exposure performance.It depends primarily on following factor: positioning movement What the resolution ratio of grating scale and thermal expansion coefficient, multiaxis assembling generated in the accurate grade of platform rail, feedback system comprehensive misses Difference etc..The superiority and inferiority of precision positioning motion platform orthogonality will affect splicing in exposure process, the deformation of exposure figure, further shadow Ring the alignment of exposure figure outer layer and internal layer alignment precision.
Traditional direct-write photoetching exposure sources precision positioning motion platform orthogonality adjustment method is mainly dry using laser The squareness measurement module of interferometer measures the quadrature value of XY axis integrated platform plane different location along the direction that axis is run, Then need length that can cover the reflecting mirror of XY axis stroke, cost further increases, and the method is expensive, tests environmental requirement pole Height, and assembly and adjustment process is complicated.In view of the disadvantages mentioned above of the prior art, the technical issues of the utility model is solved, is: mentioning The debugging side of simple, efficient and lower-cost direct-write photoetching exposure sources precision positioning motion platform orthogonality for a kind of adjustment Method, can effectively improve the verticality of precision positioning motion platform XY axis, to increase substantially direct-write photoetching exposure sources Exposure figure correctness.
Utility model content
The purpose of this utility model is to provide a kind of direct-write photoetching exposure sources positioning motion platform orthogonality debugging dresses It sets, which can effectively calibrate the orthogonality of direct-write photoetching exposure sources precision positioning motion platform, expose direct-write photoetching Equipment reduces the generation of splicing dislocation, outer layer alignment and the excessive phenomenon of internal layer alignment error in exposure process.
To achieve the above object, the utility model uses following technical scheme:
Direct-write photoetching exposure sources position motion platform orthogonality debugging apparatus, including support base, be mounted on support bottom Precision positioning motion platform on seat, the debugging mechanism being mounted in support base, the support frame being mounted in support base and The ccd image acquisition system of installation on the support frame.
The precision positioning motion platform includes the Y-axis, X-axis and Z axis set gradually from bottom to top;The top of the Z axis Vacuum chuck is installed, the high-precision calibrating plate of Mark point is had on vacuum chuck, the high-precision calibrating plate is high-accuracy exposure Prepared by ray machine, the Mark point on high-precision calibrating plate is regularly arranged arrangement.
The debugging mechanism includes the liftable Mobile Slide being mounted in support base, is mounted at the top of Mobile Slide Debugging connecting bottom board, the shifting sledge being mounted on debugging connecting bottom board, the shifting sledge that is slidably matched with shifting sledge transport Dynamic seat and the amesdial being fixed in shifting sledge kinematic nest.
Further, the support base and support frame are all made of granite and marble material.
Further, the ccd image acquisition system includes the CCD1 image capturing system being sequentially arranged on support frame With CCD2 image capturing system;The CCD1 image capturing system is what direct-write photoetching exposure sources carried.
Further, the Mark point on the high-precision calibrating plate is several evenly arranged filled circles Mark points;It is adjacent The spacing of filled circles Mark point in the X-axis direction is set as a, and spacing in the Y-axis direction is set as b.
Further, the CCD2 image capturing system is mounted on CCD2 bracket, and the CCD2 bracket passes through fixed branch Frame is installed on the support frame;The waist-shaped hole for adjusting CCD2 image capturing system Y-axis position is offered on the fixed bracket.
Further, the X-axis is connected in Y-axis by several screws.
From the above technical scheme, the utility model first uses ccd image acquisition system to the orthogonality of X-axis and Y-axis It measures, then using the orthogonality of debugging mechanism debugging X-axis and Y-axis, until the orthogonality of the two meets the requirements.This is practical new Type can effectively calibrate the orthogonality of direct-write photoetching exposure sources precision positioning motion platform, expose direct-write photoetching exposure sources The generation that splicing dislocation, outer layer alignment and the excessive phenomenon of internal layer alignment error are reduced in photoreduction process, is direct-write photoetching exposure sources An indispensable step in debugging process.The utility model can be improved direct-write photoetching exposure sources precision positioning motion platform just The efficiency and accuracy of the property handed over debugging, reduce debugging cost.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of debugging apparatus in the utility model;
Fig. 2 is the structural schematic diagram of high-precision calibrating plate in the utility model;
Fig. 3 is CCD2 image capturing system and CCD2 bracket, support bracket fastened structural schematic diagram in the utility model;
Fig. 4 is the main view of debugging mechanism in the utility model;
Fig. 5 is the top view of debugging mechanism in the utility model;
Fig. 6 is the structural relation schematic diagram of X-axis, Y-axis and screw in the utility model operating process;
Fig. 7 is the schematic diagram for the triangle cosine function that formula (1) indicates;
Fig. 8 is the schematic diagram for the triangle tangent function that formula (3) indicate.
Wherein:
1, support base, 2, support frame, 3, Y-axis, 4, X-axis, 5, Z axis, 6, vacuum chuck, 7, high-precision calibrating plate, 8, shifting Dynamic slide unit, 9, fixed bracket, 10, CCD1 image capturing system, 11, amesdial, 12, shifting sledge, 13, shifting sledge movement Seat, 14, CCD2 bracket, 15, CCD2 image capturing system, 16, filled circles Mark point, 17, handwheel, 18, screw, 19, debugging company Connect bottom plate.
Specific embodiment
The utility model is described further with reference to the accompanying drawing:
Direct-write photoetching exposure sources positioning motion platform orthogonality debugging apparatus as shown in Figure 1, including support base 1, The precision positioning motion platform that is mounted in support base 1, the debugging mechanism being mounted in support base 1 are mounted on support bottom Support frame 2 on seat 1 and the ccd image acquisition system that is mounted on support frame 2.
The precision positioning motion platform includes the Y-axis 3, X-axis 4 and Z axis 5 set gradually from bottom to top.Precision positioning fortune The structure construction of moving platform is identical with the structure of precision positioning motion platform that direct-write photoetching exposure sources in the prior art use. The top of the Z axis 5, which is set, is equipped with vacuum chuck 6;High-precision calibrating plate 7 is placed with above the vacuum chuck 6.Vacuum chuck It is that direct-write photoetching exposure sources are included.The high-precision calibrating plate 7 is that high-accuracy exposure mechanism is standby, on high-precision calibrating plate 7 Mark point be regularly arranged arrangement;Mark point on the high-precision calibrating plate 7 is several evenly arranged filled circles Mark Point 16, the spacing of neighboring solid circle Mark point 16 in the X-axis direction are set as a, and spacing in the Y-axis direction is set as b.This is practical new The point of Mark described in type indicates label.
As shown in Figure 4 and Figure 5, the debugging mechanism includes being mounted on liftable Mobile Slide 8 in support base, installation The top of Mobile Slide 8 debugging connecting bottom board, be mounted on debugging connecting bottom board shifting sledge 12, with the cunning of shifting sledge 12 The shifting sledge kinematic nest 13 of dynamic cooperation and the amesdial 11 being fixed in shifting sledge kinematic nest 13.Pacify on Mobile Slide 8 Equipped with handwheel 17, handwheel 17 is used to adjust the height of Mobile Slide.The realization of Mobile Slide lifting uses liter in the prior art Structure drops.The adjustment of length in z-direction may be implemented by liftable Mobile Slide 8 in the debugging mechanism;Pass through The shifting sledge 12 and shifting sledge kinematic nest 13 being slidably matched, may be implemented the tune of position of the amesdial 11 on 4 direction of X-axis It is whole.The adjustable precision positioning motion platform different length of the debugging mechanism, different types precision positioning motion platform X-axis and The quadrature value of Y-axis.The debugging mechanism is located at the periphery of precision positioning motion platform, passes through the lateral and vertical shifting of debugging mechanism It is dynamic, can debug different range, different types precision positioning motion platform orthogonality.In debugging precision positioning motion platform Orthogonality when, Y direction is calculated according to triangle cosine function and triangle tangent function and needs the numerical value that deviates, is used Amesdial debugs the installation site of precision positioning motion platform X-axis, and adjustment method is simple and efficient.
Further, the support base 1 and support frame 2 are all made of granite and marble material, it is preferred that using High-precision marble granite material.Marble stability is preferable, is influenced by temperature change small.
Further, the ccd image acquisition system includes the CCD1 image capturing system being sequentially arranged on support frame With CCD2 image capturing system;The CCD1 image capturing system is what direct-write photoetching exposure sources carried.Described image acquisition System is to be automatically moved to the Mark point in CCD visual field using images match method in the prior art and image processing algorithm The center of CCD visual field, measurement accuracy is high, and trueness error is less than 0.5 μm.The utility model does not use only direct-write photoetching exposure The included CCD1 image capturing system of light device, is also additionally provided with a CCD2 image capturing system, can increase tune in this way Range is tried, Image Acquisition blind area is avoided.Since high-accuracy calibration board size is limited and vacuum chuck size is limited, an image is adopted Collecting system is difficult to measure the quadrature value of Y direction different location.Two ccd images are arranged in the Y-axis direction and adopt for the utility model Collecting system can measure the quadrature value of Y-axis total travel and X-axis.The size that X-direction requires in this example, an Image Acquisition System can cover, and from existing in X-direction, there are two image capturing systems side by side in direct-write photoetching equipment.
Further, as shown in Fig. 2, the high-precision calibrating plate 7 is equipped with several evenly arranged filled circles Mark points 16;The spacing of neighboring solid circle in the X-axis direction is set as a, and spacing in the Y-axis direction is set as b.High-precision calibrating plate is quartz Substrate or silicon base, filled circles Mark point thereon are the figures after being exposed as high-precision exposure machine obtained by etching, after etching Deformation and the equal very little of scaling, the trueness error of filled circles Mark point any distance is less than 0.1 μm.It is regular on high-accuracy scaling board The filled circles Mark point of arrangement is the image for the identification of ccd image acquisition system, due to being that in high precision, can be used as measurement base It is quasi-.
Further, as shown in figure 3, the CCD2 image capturing system 15 is mounted on CCD2 bracket 14, the CCD2 Bracket 14 passes through fixed bracket 9 and is mounted on support frame 2;It offers on the fixed bracket 9 for adjusting CCD2 Image Acquisition The waist-shaped hole of system Y-axis position.
Further, as shown in fig. 6, the X-axis 4 is connected in Y-axis 3 by several screws 18.
The debugging process of direct-write photoetching exposure sources positioning motion platform orthogonality debugging apparatus described in the utility model Are as follows:
(1) mobile high-precision calibrating plate, make the orientation of filled circles Mark point thereon and precision positioning motion platform X and The moving direction of Y-axis is consistent.
(2) Z axis of mobile precision positioning motion platform, and ccd image acquisition system is debugged, find high-precision calibrating plate Accurate focal plane.
(3) by the X-axis of precision positioning motion platform and Y-axis return-to-zero, with the quadrature value of surveyed X-axis and Y-axis dead-center position As debugging benchmark.
(4) X-axis and Y-axis of mobile precision positioning motion platform, chooses one filled circles Mark point of high-precision calibrating plate, if For Mark1 point, Mark1 point is moved to ccd image acquisition system field of view center, records the coordinate of precision movement platform at this time Point (x1, y1)。
(5) mobile precision positioning motion platform Y-axis, moving distance are the integral multiple of b or b, are chosen on high-precision calibrating plate One filled circles Mark point, is set as Mark2 point, and Mark2 point is moved to ccd image acquisition system field of view center, is recorded at this time Coordinate points (the x of precision movement platform2, y2)。
(6) precisely locating platform coordinate points (x is returned to1, y1), mobile precision positioning motion platform X-axis, moving distance be a or The integral multiple of a, and ccd image acquisition system is used, a filled circles Mark point on high-precision calibrating plate is chosen, Mark3 is set as Mark3 point is moved to ccd image acquisition system field of view center, records the coordinate points (x of precision movement platform at this time by point3, y3)。
(7) coordinate points (x obtained according to measurement1, y1)、(x2, y2)、(x3, y3), using formula (1) and formula (2), calculate The quadrature value α of precision positioning motion platform X-axis and Y-axis;
(8) spacing of the screw of connection precision positioning motion platform X-axis and Y-axis is set as L, and acquiring using formula (3) need to be orthogonal It is worth the deviation m of debugging:
M=Ltan α (3)
(9) the deviation m acquired according to step (8), using debugging mechanism, first liftable shifting in adjusting support base Dynamic slide unit 8, is moved to required position, then moves the amesdial 11 being fixed in shifting sledge kinematic nest 13, by thousand points Along one end that the spacing that shifting sledge 12 is moved to screw is L, amesdial 11 refers in precisely locating platform X-axis 4 table 11, unclamps Precision positioning motion platform X and several fastening screws of Y-axis, finally by the m distance that formula (3) calculate, debugging precision positioning fortune Moving platform X axis Y direction deviates m distance, after process to be debugged is completed, then will connection precision positioning motion platform X-axis and Y The screw of axis is locked.
(10) step (3) to step (7) are repeated, calculates the quadrature value α of precision positioning motion platform X-axis and Y-axis again; If the quadrature value α of precision positioning motion platform X-axis measured by step (10) and Y-axis not within the scope of the orthogonality threshold of setting, Step (8)-(9) are then repeated, until orthogonal threshold of the quadrature value α of measured precision positioning motion platform X-axis and Y-axis in setting It is worth in range.
The working principle of the utility model are as follows:
Vacuum chuck is installed on surveyed direct-write photoetching exposure sources precision positioning motion platform, is adsorbed on vacuum chuck High-precision calibrating plate with regularly arranged filled circles Mark point is schemed by the CCD1 of direct-write photoetching exposure sources itself institute band As acquisition system and additionally mounted CCD2 image capturing system, the coordinate of precision positioning motion platform X-axis and Y-axis is measured Point calculates the angle of precision positioning motion platform X-axis and Y-axis, then by debugging mechanism, can be transferred to direct-write photoetching exposure sources The high-precision quadrature value of precision positioning motion platform.The utility model can be surveyed by ccd image acquisition system and debugging mechanism The quadrature value of precision positioning motion platform total travel is measured, is compensated into direct-write photoetching exposure sources measuring system, is reduced accurate Influence of the motion platform orthogonality to direct-write photoetching exposure sources exposure performance is positioned, exposure accuracy is improved.It is generated after measurement File has fixed format, can be read by direct-write photoetching exposure sources exposure system, carries out interpolation algorithm benefit by exposure system It repays, for improving the orthogonality of precision positioning motion platform X-axis and Y-axis different location.The utility model is suitable for direct-write photoetching Technology or the other technologies field for using precisely locating platform, it is more at low cost and easy than traditional laser interferometer debugging orthogonality Operation, high-precision calibrating plate described in the utility model and ccd image acquisition system, measurement accuracy is high, and error is less than 0.5um, Direct-write photoetching exposure sources precision positioning motion platform orthogonality can effectively be assessed.The utility model can measure direct-write photoetching The platform of exposure sources X&Y axial cross crossover-platform, X&Y&Z three-axis platform or gantry structure, with X&Y&Z tri- in the present embodiment For shaft platform.
Embodiment described above is only that preferred embodiments of the present invention are described, not practical new to this The range of type is defined, and under the premise of not departing from the spirit of the design of the utility model, those of ordinary skill in the art are to this reality The various changes and improvements made with novel technical solution should all fall into the protection model that the utility model claims book determines In enclosing.

Claims (6)

1. direct-write photoetching exposure sources position motion platform orthogonality debugging apparatus, it is characterised in that: including support base, installation Precision positioning motion platform in support base, is mounted in support base the debugging mechanism being mounted in support base The ccd image acquisition system of support frame and installation on the support frame;
The precision positioning motion platform includes the Y-axis, X-axis and Z axis set gradually from bottom to top;It installs at the top of the Z axis There is vacuum chuck, absorption has the high-precision calibrating plate of Mark point on vacuum chuck;
The debugging mechanism includes being mounted on liftable Mobile Slide in support base, the debugging being mounted at the top of Mobile Slide Connecting bottom board, the shifting sledge being mounted on debugging connecting bottom board, the shifting sledge kinematic nest being slidably matched with shifting sledge with And it is fixed on the amesdial in shifting sledge kinematic nest.
2. direct-write photoetching exposure sources according to claim 1 position motion platform orthogonality debugging apparatus, feature exists In: the support base and support frame are all made of granite and marble material.
3. direct-write photoetching exposure sources according to claim 1 position motion platform orthogonality debugging apparatus, feature exists In: the ccd image acquisition system includes the CCD1 image capturing system being sequentially arranged on support frame and CCD2 Image Acquisition System;The CCD1 image capturing system is what direct-write photoetching exposure sources carried.
4. direct-write photoetching exposure sources according to claim 1 position motion platform orthogonality debugging apparatus, feature exists In: the high-precision calibrating plate is that high-accuracy exposure mechanism is standby, and the Mark point on high-precision calibrating plate is regularly arranged arrangement;Institute Stating the Mark point on high-precision calibrating plate is several evenly arranged filled circles Mark points, and neighboring solid circle Mark point is in X-axis side Upward spacing is set as a, and spacing in the Y-axis direction is set as b.
5. direct-write photoetching exposure sources according to claim 3 position motion platform orthogonality debugging apparatus, feature exists In: the CCD2 image capturing system is mounted on CCD2 bracket, and the CCD2 bracket is mounted on support frame by fixed bracket On;The waist-shaped hole for adjusting CCD2 image capturing system Y-axis position is offered on the fixed bracket.
6. direct-write photoetching exposure sources according to claim 1 position motion platform orthogonality debugging apparatus, feature exists In: the X-axis is connected in Y-axis by several screws.
CN201920382891.XU 2019-03-25 2019-03-25 Direct-write photoetching exposure sources position motion platform orthogonality debugging apparatus Active CN209606770U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920382891.XU CN209606770U (en) 2019-03-25 2019-03-25 Direct-write photoetching exposure sources position motion platform orthogonality debugging apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920382891.XU CN209606770U (en) 2019-03-25 2019-03-25 Direct-write photoetching exposure sources position motion platform orthogonality debugging apparatus

Publications (1)

Publication Number Publication Date
CN209606770U true CN209606770U (en) 2019-11-08

Family

ID=68406829

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201920382891.XU Active CN209606770U (en) 2019-03-25 2019-03-25 Direct-write photoetching exposure sources position motion platform orthogonality debugging apparatus

Country Status (1)

Country Link
CN (1) CN209606770U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109856926A (en) * 2019-03-25 2019-06-07 合肥芯碁微电子装备有限公司 Direct-write photoetching exposure sources position motion platform orthogonality debugging apparatus and method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109856926A (en) * 2019-03-25 2019-06-07 合肥芯碁微电子装备有限公司 Direct-write photoetching exposure sources position motion platform orthogonality debugging apparatus and method
CN109856926B (en) * 2019-03-25 2024-04-09 合肥芯碁微电子装备股份有限公司 Orthogonalization debugging device and method for positioning motion platform of direct-writing lithography exposure equipment

Similar Documents

Publication Publication Date Title
CN109856926A (en) Direct-write photoetching exposure sources position motion platform orthogonality debugging apparatus and method
CN109916342A (en) A kind of locating platform straight line degree measurement system and method
CN100587603C (en) Mask alignment marker and aligning method used for photo etching device
CN104199257B (en) The measurement of a kind of precisely locating platform absolute fix precision and compensation method
TW528881B (en) Position measuring apparatus
US10907952B2 (en) Optical measurement device and method with improved measurement precision
CN105241399B (en) A kind of measuring method of precisely locating platform dynamic flatness
CN103972135B (en) Silicon wafer accurate positioning and conveying device and positioning method
CN107367911B (en) Alignment methods and to Barebone
CN104820344A (en) Precision positioning platform Yaw value measurement method
CN104251695B (en) System and centering measurement method thereof are measured in a kind of laser alignment
CN209606770U (en) Direct-write photoetching exposure sources position motion platform orthogonality debugging apparatus
CN109813214B (en) Method and device for rapidly measuring two-dimensional positioning error of cross-shaped motion platform
WO2018059359A1 (en) Optical measurement device and method
CN111895947A (en) Temperature compensation system and temperature compensation method based on three-coordinate measuring machine
CN206113868U (en) Nanometer displacement table 6 -degree of freedom calibrating device
CN207610690U (en) A kind of reversal process linearity measurer based on 6 DOF adjustment
CN102289153A (en) Method for measuring steady state stability of plate-making etching equipment
CN115128914A (en) Leveling and aligning method applied to full-field exposure machine
CN109084739B (en) Total station laser pointer precision detection device and detection method based on image system
CN106997146A (en) A kind of preparation method of mask plate, manufacturing system and mask plate
CN102566311A (en) Dynamic stability measuring method for plate making photoetching device
CN111912316B (en) System and method for measuring Roll value of precision positioning platform
CN100587604C (en) Subsection interleaving aligning mark combined and aligning method thereof
CN101140423A (en) Transmission aligning mark combination used for mask alignment and mask alignment method thereof

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
CP01 Change in the name or title of a patent holder
CP01 Change in the name or title of a patent holder

Address after: 230088 the 11 level of F3 two, two innovation industrial park, No. 2800, innovation Avenue, Hi-tech Zone, Hefei, Anhui.

Patentee after: Hefei Xinqi microelectronics equipment Co., Ltd

Address before: 230088 the 11 level of F3 two, two innovation industrial park, No. 2800, innovation Avenue, Hi-tech Zone, Hefei, Anhui.

Patentee before: HEFEI XINQI MICROELECTRONIC EQUIPMENT CO., LTD.