CN102566311A - Dynamic stability measuring method for plate making photoetching device - Google Patents
Dynamic stability measuring method for plate making photoetching device Download PDFInfo
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- CN102566311A CN102566311A CN2012100092381A CN201210009238A CN102566311A CN 102566311 A CN102566311 A CN 102566311A CN 2012100092381 A CN2012100092381 A CN 2012100092381A CN 201210009238 A CN201210009238 A CN 201210009238A CN 102566311 A CN102566311 A CN 102566311A
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Abstract
The invention belongs to the technical field of plate making photoetching and particularly relates to a dynamic stability measuring method for a plate making photoetching device. The dynamic stability measuring method includes fixing a mask plate onto a platform, and making a plurality of positioning marks on the mask plate; sequentially recording the platform coordinate when the center of each positioning mark and the center of charge coupled device (CCD) camera viewing field are coincident; sequentially setting each coordinate as the center, enabling the platform to shift out and return, and working out a center offset between the positioning mark center and the center of the CCD camera viewing field when the loading platform returns; repeating above steps, obtaining a plurality of center offsets, using arithmetic to work out the repeated positioning accuracy value corresponding to the positioning mark center on the basis of the plurality of center offsets; obtaining the repeated positioning accuracy values respectively corresponding to a plurality of positioning mark centers; and working out the dynamic repeated positioning accuracy value of the system on the basis of a plurality of the repeat positioning accuracy values. According to the dynamic stability measuring method, the measurement accuracy is high, the installation and adjustment are easy, and the measurement cost is low.
Description
Technical field
The invention belongs to the plate-making technical field of lithography, be specifically related to a kind of dynamic stability measuring method of the lithographic equipment that is used to make a plate.
Background technology
Photoetching technique is used on substrate surface the composition that printing has characteristic, said substrate comprise be used for producing the semiconductor devices, the substrate of multiple integrated circuit, flat-panel screens (for example LCD), circuit board, biochip, micromechanics electronic chip, photoelectron circuit chip etc.The substrate that often uses is semiconductor crystal wafer or mask plate.
In photoetching plate-making process, with mask plate be placed on can the accurate article carrying platform that moves on, through the exposure device in the lithographic equipment, feature pattern is projected the assigned address on mask plate surface.For guaranteeing that feature pattern can accurately project assigned address, need satisfy following two conditions: at first the article carrying platform at needs mask plate place satisfies certain bearing accuracy; Moreover need the overall optical etching system reliable and stable.
Weigh the stability of etching system, be divided into usually dynamically and static two aspects.Dynamic stability is to weigh in normal operation; Needs according to photoetching process; The moving components such as article carrying platform at mask plate place will move, and this moment, system received the influence of dynamic factors such as external force, moving component inertial force, positioning system repeatability and the offset that produces.Static stability is to weigh under certain environmental conditions, and when movement-less part inertial force and external force influenced, system received the influence of factors such as environment temperature, humidity, vibration and system self rigidity and the position excursion that causes.
In order to guarantee the stability of overall optical etching system in the exposure process, need the static state and the dynamic offset of accurate measuring light etching system, thereby realize the demarcation or the compensation of exposed feature figure launching position.Said etching system also is the summation of whole plate-making lithographic equipment.The stability measurement of traditional etching system is to adopt high-accuracy laser interferometer; But this metering system not only cost is high; And the installation of measurement mechanism and the adjustment difficulty big; Measuring accuracy is affected by environment big, simultaneously because laser interferometer self also is a heater element, therefore when laser interferometer is measured, can produce extra influence to the stability of etching system.
Summary of the invention
The purpose of this invention is to provide a kind of plate-making lithographic equipment dynamic stability measuring method, this method makes full use of the CCD camera in the plate-making lithographic equipment, can realize the accurate measurement of etching system dynamic stability, and measuring accuracy height and measuring process are easy.
For realizing above-mentioned purpose, the present invention has adopted following technical scheme: a kind of plate-making lithographic equipment dynamic stability measuring method is characterized in that comprising following steps:
1), mask plate is fixed on the article carrying platform, and (P＞1) the individual telltale mark of on mask plate, making P;
2), a said P telltale mark is imaged in the CCD viewing field of camera in the plate-making lithographic equipment successively; And telltale mark is handled and calculated through image processing techniques; To draw the side-play amount at each specifically labelled center and CCD viewing field of camera center; Move article carrying platform then; Each specifically labelled center is all moved to CCD viewing field of camera center coincide, and the record and the space physics coordinate of the corresponding article carrying platform when this telltale mark center overlaps with CCD viewing field of camera center in each telltale mark center successively;
3), one by one; Each space physics coordinate with article carrying platform is the center; Making article carrying platform in the visual field of CCD camera, repeat to do shifts out and returning movement; Also promptly make article carrying platform outwards move a segment distance from its space physics coordinate place earlier, treat that article carrying platform comes to a complete stop after, make article carrying platform move to its space physics coordinate place again again; Shift out each time with returning movement and finish; And after article carrying platform moves to its space physics coordinate place again; Gather specifically labelled image through the CCD camera; And calculate the center offset between the space physics coordinate corresponding telltale mark center and CCD viewing field of camera center therewith, then each equal correspondence in telltale mark center is obtained a plurality of center offsets;
4), the pairing a plurality of center offsets in each telltale mark center are calculated and the corresponding repetitive positioning accuracy value in this telltale mark center through the mathematical statistics algorithm, obtain and P the repetitive positioning accuracy value that specifically labelled center is corresponding respectively;
5), at last P repetitive positioning accuracy value calculated the dynamic repetitive positioning accuracy value of this etching system through the mathematical statistics algorithm.
This plate-making lithographic equipment dynamic stability measuring method can also be able to further realization in the following manner:
Repeat 3), 4) step m time, finally each telltale mark is all obtained m repetitive positioning accuracy value, at last P * m repetitive positioning accuracy value calculated the dynamic stability value of this etching system through the mathematical statistics algorithm.
Preferably, said telltale mark is evenly distributed on the mask plate, then can measure and the distribution situation of the corresponding repetitive positioning accuracy of each telltale mark in whole working face.
Concrete; With the working face of mask plate also is directions X and Y direction n five equilibrium along two-dimensional directional respectively, obtains n * n little square region, processes telltale mark at the drift angle place of each little square region; Obtain finally that equally distributed n+1 is capable, n+1 row telltale mark, and P=(n+1) * (n+1).
Further, said telltale mark is crosswise, and this structure not only makes telltale mark comparatively simple, easy to implement, and is convenient to accurately calculate specifically labelled geometric center position.
Said plate-making lithographic equipment comprises exposure light source, optical light-collecting system, projection optical system, camera lens throw-over gear, optical alignment detection system and focusing system; The light that focusing light source in the said focusing system is sent is successively through being radiated on the mask plate behind the optical device in optical alignment detection system and the projection optical system, light through the mask plate reflection after more successively through the optical device of the optical device in the projection optical system, optical alignment detection system in the CCD viewing field of camera in outgoing to the optical alignment detection system; In step 2) in; Move article carrying platform and the telltale mark of choosing is got in the CCD viewing field of camera, utilize the focusing technology again, calculate the focal plane position of CCD camera; And drive article carrying platform and realize specifically labelled focusing, realize promptly that also said telltale mark images in the CCD viewing field of camera.
Further, said optical light-collecting system comprises optical light-collecting device and pattern generator, and said exposure light source is corresponding with the optical light-collecting device; Said projection optical system comprises first lens or lens combination, first Amici prism, second Amici prism and at least two projection lens; Said first lens or lens combination and first Amici prism are successively set on the downside of pattern generator from top to bottom; Second Amici prism is arranged on the side of first Amici prism; Said projection lens is arranged on the downside of second Amici prism, and said projection lens is arranged in the camera lens throw-over gear of wheel plate-like; Said optical alignment detection system comprises CCD camera, second lens or lens combination and the 3rd Amici prism that is provided with from top to bottom, and second lens or lens combination are corresponding with said projection lens through the 3rd Amici prism and second Amici prism successively from top to bottom; Said focusing system is arranged on the side of projection optical system.
Preferably, in step 3), article carrying platform is the center of circle at the space physics coordinate with article carrying platform, with a be to do in the spacing circle of radius to shift out and returning movement, and a is less than or equal to the visual field radius of CCD camera.
Further, said article carrying platform shifts out apart from a along eight directions respectively in spacing circle, and the angle angle between the adjacent both direction is 45 °.
The present invention has following beneficial effect:
What 1), the present invention had directly utilized various optical components and mask plate place in the plate-making lithographic equipment can the accurate article carrying platform that moves; Not only realized the measurement of etching system dynamic stability; And measuring accuracy high, be easy to debug, also reduced the measurement cost simultaneously widely.
2), the present invention not only can measure the dynamic stability of etching system in real time; Can also measure the distribution situation of the repetitive positioning accuracy in the whole working face of article carrying platform, test effectively and the checking means thereby can provide a kind of for structural design, systematic analysis and the demarcation of plate-making lithographic equipment.
Description of drawings
Fig. 1 is the structural representation of plate-making lithographic equipment.
Fig. 2 is the distribution synoptic diagram of telltale mark on the mask plate working face.
Fig. 3 is the structural representation of spacing circle.
The implication of mark is following among the figure:
1-exposure light source 2-optical light-collecting device 3-pattern generator
4-first lens or the lens combination 5-first Amici prism 6-second Amici prism
7-projection lens 8-CCD camera 9-second lens or lens combination
10-the 3rd Amici prism 11-camera lens throw-over gear 12-mask plate
13-article carrying platform 14-focusing catoptron 15-is to focus lens or lens combination
The spacing circle of 16-focusing light source 17-telltale mark 18-
Embodiment
As shown in Figure 1, said plate-making lithographic equipment comprises exposure light source 1, optical light-collecting system, projection optical system, camera lens throw-over gear, optical alignment detection system and focusing system.
Said optical light-collecting system comprises optical light-collecting device 2 and pattern generator 3, and said exposure light source 1 is corresponding with optical light-collecting device 2; Said projection optical system comprises first lens or lens combination 4, first Amici prism 5, second Amici prism 6 and at least two projection lens 7; Said first lens or lens combination 4 and first Amici prism 5 are successively set on the downside of pattern generator 3 from top to bottom; Second Amici prism 6 is arranged on the side of first Amici prism 5; Said projection lens 7 is arranged on the downside of second Amici prism 6, and said projection lens 7 is arranged in the camera lens throw-over gear 11 of wheel plate-like; Said optical alignment detection system comprises that from top to bottom the CCD camera 8, second lens or the lens combination 9 that are provided with and the 3rd Amici prism 10, the second lens or lens combination 9 are corresponding with said projection lens 7 through the 3rd Amici prism 10, second Amici prism 6 successively through from top to bottom; Said focusing system is arranged on the side of projection optical system.
Focusing system comprises from top to bottom the focusing light source 16 that is provided with, to focus lens or lens combination 15 and focusing catoptron 14.
Light path in light path in the focusing system and the optical alignment detection system is parallel.
The light that focusing light source 16 in the said focusing system is sent is successively through to the 3rd Amici prism 10 places in focus lens or lens combination 15, focusing catoptron 14 back outgoing to the optical alignment detection systems, passed through second Amici prism 6 and projection lens 7 outgoing in the projection optical system again after 10 reflections of the 3rd Amici prism successively to mask plate 12 places; Light through mask plate 12 reflection after, more successively through the projection lens 7 in the projection optical system and the 3rd Amici prism 10 in second Amici prism 6 and the optical alignment detection system and second lens or lens combination 9 outgoing to the visual field of CCD camera 8.
Further specify below in conjunction with 1～3 pair of course of work of the present invention of accompanying drawing.
1), through the vacuum suction technology with mask plate 12 be fixed on can the accurate article carrying platform 13 that moves on; And with the working face of mask plate 12 respectively along X, Y direction n five equilibrium; Obtain n * n little square region; Four drift angle places in each little square region process specific telltale mark, obtain (n+1) row, (n+1) row telltale mark, like Fig. 1, shown in 2; Wherein said specific telltale mark is crosswise;
2), through moving horizontally article carrying platform 13, the telltale mark of the 1st row the 1st row is moved in the CCD viewing field of camera;
3), utilize the focusing technology, calculate the focal plane position of CCD camera, and through the oscilaltion article carrying platform to realize the specifically labelled focusing of the 1st row the 1st row;
4), utilize image processing techniques; Calculate the center offset between the 1st row the 1st row telltale mark center and the CCD viewing field of camera center; And through moving horizontally article carrying platform; The center that the specifically labelled center of the 1st row the 1st row is moved to the CCD viewing field of camera coincides, simultaneously the space physics coordinate (X of record article carrying platform this moment
11, Y
11);
5), according to the method for step 4); Line by line each telltale mark is moved in the CCD viewing field of camera; And calculate and each corresponding center offset in telltale mark center through image processing techniques; And each telltale mark center is moved to CCD viewing field of camera center coincide, and write down each telltale mark center and the CCD viewing field of camera center article carrying platform space physics coordinate (X when coinciding through moving horizontally article carrying platform
12, Y
12) ..., (X
Nn, Y
Nn), (X
(n+1) (n+1), Y
(n+1) (n+1)); So far, accomplished demarcation with each corresponding article carrying platform physical coordinates in telltale mark center;
6), since the 1st row the 1st row telltale mark, line by line article carrying platform 13 correspondences are moved to space physics coordinate (X
12, Y
12) ..., (X
Nn, Y
Nn), (X
(n+1) (n+1), Y
(n+1) (n+1)) locate; Whenever to a space physics coordinate (X
Ij, Y
Ij) when (i is the row number at the corresponding telltale mark of space of points physical coordinates place therewith, and j be the row that belong to of the corresponding telltale mark of space of points physical coordinates number therewith), with this space physics coordinate (X
Ij, Y
Ij) locate to be the center of circle; In spacing circle 18, move horizontally article carrying platform; And article carrying platform is shifted out apart from a respectively along 0 °, 45 °, 90 °, 135 °, 180 °, 225 °, 270 °, 315 ° eight directions; As shown in Figure 3, saidly be the radius of spacing circle 18, and a is less than or equal to the visual field radius of CCD camera apart from a;
Shift out at every turn treat that article carrying platform 13 comes to a complete stop after, move article carrying platform 13 again and make it be repositioned to space physics coordinate (X
Ij, Y
Ij) locate, behind article carrying platform 13 returns, gather space physics coordinate (X therewith through the CCD camera again
Ij, Y
Ij) corresponding specifically labelled image, and calculate the center offset between this telltale mark center and the CCD viewing field of camera center, obtain the center offset E of eight measurements altogether
Ij1, E
Ij2..., E
Ij8, cooperate the mathematical statistics algorithm, calculate the corresponding repetitive positioning accuracy value in telltale mark center E therewith
Ij
Accumulative total can record (n+1) * (n+1) individual repetitive positioning accuracy value corresponding respectively with (n+1) row, (n+1) row telltale mark center;
7), utilize the repetitive positioning accuracy value of (n+1) * (n+1) individual point that step 6) gathers, cooperate the mathematical statistics algorithm, can count the dynamic repetitive positioning accuracy value of this etching system, thereby realize accurate measurement power system dynamic stability property.
Further, can also do more accurately the dynamic stability of etching system and measure, also promptly can also carry out following two steps operation:
8), repeating step 6) m time, obtain m group (n+1) * (n+1) individual repetitive positioning accuracy value;
9), utilize the repetitive positioning accuracy value of m group (n+1) * (n+1) individual point that step 8) gathers, cooperate the mathematical statistics algorithm, can count the dynamic stability value of this etching system.
The present invention makes full use of the aligning imaging system of plate-making lithographic equipment self, adopts image processing techniques, the dynamic stability of accurate measuring light etching system, and method is unique novel, and simple and feasible.Pass through this method; Not only can measure the dynamic deviation amount of lithographic objective and mask plate in the plate-making lithographic equipment quickly and easily; To measure the dynamic stability of etching system in real time; Can also measure the distribution of repetitive positioning accuracy in whole working face of article carrying platform, thus for plate-making lithographic equipment structural design, systematic analysis and demarcation a kind of effective test and checking means are provided.
Claims (9)
1. plate-making lithographic equipment dynamic stability measuring method is characterized in that comprising following steps:
1), mask plate is fixed on the article carrying platform, and (P＞1) the individual telltale mark of on mask plate, making P;
2), a said P telltale mark is imaged in the CCD viewing field of camera in the plate-making lithographic equipment successively; And telltale mark is handled and calculated through image processing techniques; To draw the side-play amount at each specifically labelled center and CCD viewing field of camera center; Move article carrying platform then; Each specifically labelled center is all moved to CCD viewing field of camera center coincide, and the record and the space physics coordinate of the corresponding article carrying platform when this telltale mark center overlaps with CCD viewing field of camera center in each telltale mark center successively;
3), one by one; Each space physics coordinate with article carrying platform is the center; Making article carrying platform in the visual field of CCD camera, repeat to do shifts out and returning movement; Also promptly make article carrying platform outwards move a segment distance from its space physics coordinate place earlier, treat that article carrying platform comes to a complete stop after, make article carrying platform move to its space physics coordinate place again again; Shift out each time with returning movement and finish; And after article carrying platform moves to its space physics coordinate place again; Gather specifically labelled image through the CCD camera; And calculate the center offset between the space physics coordinate corresponding telltale mark center and CCD viewing field of camera center therewith, then each equal correspondence in telltale mark center is obtained a plurality of center offsets;
4), the pairing a plurality of center offsets in each telltale mark center are calculated and the corresponding repetitive positioning accuracy value in this telltale mark center through the mathematical statistics algorithm, obtain and P the repetitive positioning accuracy value that specifically labelled center is corresponding respectively;
5), at last P repetitive positioning accuracy value calculated the dynamic repetitive positioning accuracy value of this etching system through the mathematical statistics algorithm.
2. plate-making lithographic equipment dynamic stability measuring method according to claim 1; It is characterized in that: repeat 3), 4) step m time; Finally each telltale mark is all obtained m repetitive positioning accuracy value, at last P * m repetitive positioning accuracy value calculated the dynamic stability value of this etching system through the mathematical statistics algorithm.
3. plate-making lithographic equipment dynamic stability measuring method according to claim 1 and 2, it is characterized in that: said telltale mark is evenly distributed on the mask plate.
4. plate-making lithographic equipment dynamic stability measuring method according to claim 1 and 2, it is characterized in that: said plate-making lithographic equipment comprises exposure light source, optical light-collecting system, projection optical system, camera lens throw-over gear, optical alignment detection system and focusing system; The light that focusing light source in the said focusing system is sent is successively through being radiated on the mask plate behind the optical device in optical alignment detection system and the projection optical system, light through the mask plate reflection after more successively through the optical device of the optical device in the projection optical system, optical alignment detection system in the CCD viewing field of camera in outgoing to the optical alignment detection system;
In step 2) in; Move article carrying platform and the telltale mark of choosing is got in the CCD viewing field of camera, utilize the focusing technology again, calculate the focal plane position of CCD camera; And drive article carrying platform and realize specifically labelled focusing, realize promptly that also said telltale mark images in the CCD viewing field of camera.
5. plate-making lithographic equipment dynamic stability measuring method according to claim 3; It is characterized in that: with the working face of mask plate also is directions X and Y direction n five equilibrium along two-dimensional directional respectively; Obtain n * n little square region; Drift angle place in each little square region processes telltale mark, obtains finally that equally distributed n+1 is capable, n+1 row telltale mark, and P=(n+1) * (n+1).
6. plate-making lithographic equipment dynamic stability measuring method according to claim 4 is characterized in that: said optical light-collecting system comprises optical light-collecting device and pattern generator, and said exposure light source is corresponding with the optical light-collecting device; Said projection optical system comprises first lens or lens combination, first Amici prism, second Amici prism and at least two projection lens; Said first lens or lens combination and first Amici prism are successively set on the downside of pattern generator from top to bottom; Second Amici prism is arranged on the side of first Amici prism; Said projection lens is arranged on the downside of second Amici prism, and said projection lens is arranged in the camera lens throw-over gear of wheel plate-like; Said optical alignment detection system comprises CCD camera, second lens or lens combination and the 3rd Amici prism that is provided with from top to bottom, and second lens or lens combination are corresponding with said projection lens through the 3rd Amici prism and second Amici prism successively from top to bottom; Said focusing system is arranged on the side of projection optical system.
7. according to claim 1 or 2 or 3 or 5 described plate-making lithographic equipment dynamic stability measuring methods, it is characterized in that: said telltale mark is crosswise.
8. according to claim 1 or 2 or 3 or 5 described plate-making lithographic equipment dynamic stability measuring methods; It is characterized in that: in step 3); Article carrying platform is the center of circle at the space physics coordinate with article carrying platform; Be to do in the spacing circle of radius to shift out and returning movement with a, and a is less than or equal to the visual field radius of CCD camera.
9. plate-making lithographic equipment dynamic stability measuring method according to claim 8 is characterized in that: said article carrying platform shifts out apart from a along eight directions respectively in spacing circle, and the angle angle between the adjacent both direction is 45 °.
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| CN2012100092381A CN102566311A (en) | 2012-01-12 | 2012-01-12 | Dynamic stability measuring method for plate making photoetching device |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112648920A (en) * | 2019-10-12 | 2021-04-13 | 上海微电子装备（集团）股份有限公司 | Mask opening size measuring method, mask plate stretching device and screen expanding machine |
| CN112945102A (en) * | 2021-03-09 | 2021-06-11 | 武汉先河激光技术有限公司 | Precision platform precision metering and compensating method based on glass cutting technology |
| CN113168087A (en) * | 2018-11-15 | 2021-07-23 | 应用材料公司 | Self-alignment system and method for photoetching system |
| WO2022042034A1 (en) * | 2020-08-26 | 2022-03-03 | 长鑫存储技术有限公司 | Marker coordinates determination method and apparatus, computer readable medium, and electronic device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003197502A (en) * | 2001-12-26 | 2003-07-11 | Nikon Corp | Measuring method and exposing method, aligner, and method for manufacturing device |
| CN101169595A (en) * | 2007-11-28 | 2008-04-30 | 上海微电子装备有限公司 | Calibration device for aligning system of stepper and its calibration method |
| US20110153265A1 (en) * | 2009-12-18 | 2011-06-23 | Asml Netherlands B.V. | Method of measuring properties of dynamic positioning errors in a lithographic apparatus, data processing apparatus, and computer program product |
| CN102207689A (en) * | 2011-05-20 | 2011-10-05 | 合肥芯硕半导体有限公司 | Alignment system and align mark precision extraction method of write-through lithography machine |
| CN102289153A (en) * | 2011-05-31 | 2011-12-21 | 合肥芯硕半导体有限公司 | Method for measuring steady state stability of plate-making etching equipment |
-
2012
- 2012-01-12 CN CN2012100092381A patent/CN102566311A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003197502A (en) * | 2001-12-26 | 2003-07-11 | Nikon Corp | Measuring method and exposing method, aligner, and method for manufacturing device |
| CN101169595A (en) * | 2007-11-28 | 2008-04-30 | 上海微电子装备有限公司 | Calibration device for aligning system of stepper and its calibration method |
| US20110153265A1 (en) * | 2009-12-18 | 2011-06-23 | Asml Netherlands B.V. | Method of measuring properties of dynamic positioning errors in a lithographic apparatus, data processing apparatus, and computer program product |
| CN102207689A (en) * | 2011-05-20 | 2011-10-05 | 合肥芯硕半导体有限公司 | Alignment system and align mark precision extraction method of write-through lithography machine |
| CN102289153A (en) * | 2011-05-31 | 2011-12-21 | 合肥芯硕半导体有限公司 | Method for measuring steady state stability of plate-making etching equipment |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113168087A (en) * | 2018-11-15 | 2021-07-23 | 应用材料公司 | Self-alignment system and method for photoetching system |
| CN112648920A (en) * | 2019-10-12 | 2021-04-13 | 上海微电子装备（集团）股份有限公司 | Mask opening size measuring method, mask plate stretching device and screen expanding machine |
| WO2022042034A1 (en) * | 2020-08-26 | 2022-03-03 | 长鑫存储技术有限公司 | Marker coordinates determination method and apparatus, computer readable medium, and electronic device |
| CN112945102A (en) * | 2021-03-09 | 2021-06-11 | 武汉先河激光技术有限公司 | Precision platform precision metering and compensating method based on glass cutting technology |
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Application publication date: 20120711 |