CN209592081U - A kind of ultra high density COB light source - Google Patents
A kind of ultra high density COB light source Download PDFInfo
- Publication number
- CN209592081U CN209592081U CN201920319228.5U CN201920319228U CN209592081U CN 209592081 U CN209592081 U CN 209592081U CN 201920319228 U CN201920319228 U CN 201920319228U CN 209592081 U CN209592081 U CN 209592081U
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- Prior art keywords
- light source
- high density
- ultra high
- ceramic substrate
- cob light
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Abstract
The utility model discloses a kind of ultra high density COB light sources, including including aluminum nitride ceramic substrate, the top of the aluminum nitride ceramic substrate, which is provided with, encloses glue, described enclose is provided with isolation adhesive tape on the inside of glue, the region that the isolation adhesive tape is separated out is welding region, flip LED chips are welded with by scolding tin at the welding region on the top of the aluminum nitride ceramic substrate, the flip LED chips are provided with several, the positive and negative anodes line direction of adjacent flip LED chips is not located at same straight line in the welding region, the surface of the aluminum nitride ceramic substrate is coated with high reflecting coating, the positive and negative anodes line direction that the utility model is provided with flip LED chips adjacent in welding region is not located at same straight line, when solving using ultra high density COB light source, since ultra high density COB light source is difficult to avoid that upside-down mounting The problem of identical excess calories on substrate in the heating region position of LED chip are accumulated, influence the using effect using ultra high density COB light source.
Description
Technical field
The utility model belongs to COB light source technical field, and in particular to a kind of ultra high density COB light source.
Background technique
COB light source is that the high photosynthetic efficiency being placed directly against LED chip on the mirror metal substrate of high reflecting rate integrates area source
Technology, this technology eliminate bracket concept, electroless plating, without Reflow Soldering, without patch process, therefore process reduces nearly one third,
Cost also saves one third.COB light source can simply be interpreted as high power and integrate area source, can be according to product shape knot
The lighting area and outer dimension of structure design light source.Products characteristics: it is cheap, facilitate electrical stabilization, circuit design, optical design,
Heat dissipation design is scientific and reasonable to use heat sink technology, guarantees that LED has leading hot lumen depreciation (95%).It is convenient for
The secondary optics of product are mating, improve lighting quality.Height colour developing shines uniformly, without hot spot, health environment-friendly.Installation is simple, uses
It is convenient, Design of Luminaires difficulty is reduced, lamps and lanterns processing and follow-up maintenance cost are saved.
But currently on the market still have certain defect during use using ultra high density COB light source,
For example, when using ultra high density COB light source, since ultra high density COB light source is difficult to avoid that the heating region position of flip LED chips
The excess calories accumulation on identical and substrate is set, the using effect using ultra high density COB light source is influenced, meanwhile, use superelevation
When density COB light source, since ultra high density COB light source is difficult to splice, multiple light sources also need to add fixed device when combining, and influence
The convenience used using ultra high density COB light source.
Utility model content
The purpose of this utility model is to provide a kind of ultra high density COB light sources, to solve to propose in above-mentioned background technique
Use ultra high density COB light source when, since ultra high density COB light source is difficult to avoid that the heating region position of flip LED chips
Excess calories accumulation and ultra high density COB light source on identical and substrate are difficult to splice, and multiple light sources also need to add when combining
The problem of fixed device.
To achieve the above object, the utility model provides the following technical solutions: a kind of ultra high density COB light source, including includes
Aluminum nitride ceramic substrate, it is characterised in that: the top of the aluminum nitride ceramic substrate, which is provided with, encloses glue, described to enclose setting on the inside of glue
There is isolation adhesive tape, the region that the isolation adhesive tape is separated out is welding region, the welding on the top of the aluminum nitride ceramic substrate
Flip LED chips are welded with by scolding tin at region, the flip LED chips are provided with several, phase in the welding region
The positive and negative anodes line direction of adjacent flip LED chips is not located at same straight line, and the surface of the aluminum nitride ceramic substrate is coated with
High reflecting coating, the bottom end of the aluminum nitride ceramic substrate are fixedly connected with connecting bottom board, and the top of the connecting bottom board is fixed
Be connected with prominent fixture block, the bottom end of the aluminum nitride ceramic substrate is provided with card slot seat, be provided on the inside of the card slot seat with
Protrude the corresponding card slot of fixture block.
Preferably, the top of the flip LED chips is provided with chip substrate.
Preferably, the bottom end of the flip LED chips is provided with the pole LED chip N and gallium nitride PN junction.
Preferably, the pole the LED chip N is located at the side of gallium nitride PN junction.
Preferably, the bottom end of the gallium nitride PN junction is provided with the pole LED chip P.
Preferably, the top cover of the aluminum nitride ceramic substrate is equipped with phosphor laminate.
Compared with prior art, the utility model has the beneficial effects that
(1) the positive and negative anodes line direction that the utility model is provided with flip LED chips adjacent in welding region is not located at
Same straight line, the positive and negative anodes line direction of adjacent flip LED chips is not located at same straight line, adjacent upside-down mounting in welding region
LED chip can be mutually perpendicular to place, and avoid flip LED chips welding excessively intensive, the flip LED chips of equivalent amount are according to same
To arrangement, light emitting region is smaller, meanwhile, avoid flip LED chips according to being collectively aligned, the heating region phase of flip LED chips
Together, so that accumulation of heat on aluminum nitride ceramic substrate, damages aluminum nitride ceramic substrate, solve using ultra high density COB light
When source, since ultra high density COB light source is difficult to avoid that the identical heat mistake on substrate in heating region position of flip LED chips
The problem of degree is accumulated, and the using effect using ultra high density COB light source is influenced.
(2) the utility model needs use bigger provided with aluminum nitride ceramic substrate, prominent fixture block and card slot seat, user
When the COB light source of block, muti-piece aluminum nitride ceramic substrate can be spliced and be used, the protrusion fixture block of one piece of aluminum nitride ceramic substrate is inserted
Enter the card slot to the card slot seat bottom end of adjacent aluminum nitride ceramic substrate bottom end, convenient for the splicing of muti-piece aluminum nitride ceramic substrate,
When solving using ultra high density COB light source, since ultra high density COB light source is difficult to splice, multiple light sources also need to add when combining
The problem of being fixed device, influencing the convenience used using ultra high density COB light source.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model；
Fig. 2 is the flip LED chips structural schematic diagram of the utility model；
Fig. 3 is the aluminum nitride ceramic substrate top view of the utility model.
In figure: 1- high reflecting coating, 2- scolding tin, the pole 3-LED chip P, 4- flip LED chips, the pole 5-LED chip N, 6- nitrogen
Change gallium PN junction, 7- card slot seat, 8- phosphor laminate, 9- and encloses glue, 10- aluminum nitride ceramic substrate, 11- prominent fixture block, 12- connection bottom
Adhesive tape is isolated in plate, 13- welding region, 14-.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
It please refers to shown in Fig. 1-3, the utility model provides a kind of technical solution: a kind of ultra high density COB light source, including nitrogen
Change aluminium ceramic substrate 10, it is characterised in that: the top of aluminum nitride ceramic substrate 10, which is provided with, encloses glue 9, enclose be provided on the inside of glue 9 every
From adhesive tape 14, it is welding region 13, the welding region on the top of aluminum nitride ceramic substrate 10 that the region that adhesive tape 14 is separated out, which is isolated,
Flip LED chips 4 are welded with by scolding tin 2 at 13, flip LED chips 4 are provided with several, adjacent in welding region 13 to fall
The positive and negative anodes line direction of dress LED chip 4 is not located at same straight line, and the surface of aluminum nitride ceramic substrate 10 is coated with high reflective painting
Layer 1, the bottom end of aluminum nitride ceramic substrate 10 is fixedly connected with connecting bottom board 12, and the top of connecting bottom board 12 is fixedly connected with protrusion
Fixture block 11, the bottom end of aluminum nitride ceramic substrate 10 are provided with card slot seat 7, and the inside of card slot seat 7 is provided with and prominent 11 phase of fixture block
Corresponding card slot.
The top of flip LED chips 4 is provided with chip substrate.
The bottom end of flip LED chips 4 is provided with the pole LED chip N 5 and gallium nitride PN junction 6.
The pole LED chip N 5 is located at the side of gallium nitride PN junction 6.
The bottom end of gallium nitride PN junction 6 is provided with the pole LED chip P 3.
The top cover of aluminum nitride ceramic substrate 10 is equipped with phosphor laminate 8.
The working principle and process for using of the utility model: when the utility model is used, adjacent in welding region 13
The positive and negative anodes line direction of flip LED chips 4 is not located at same straight line, and adjacent flip LED chips 4 can be mutually perpendicular to place,
Avoid the welding of flip LED chips 4 excessively intensive, for the flip LED chips 4 of equivalent amount according to being collectively aligned, light emitting region is smaller,
Meanwhile avoiding flip LED chips 4 according to being collectively aligned, the heating region of flip LED chips 4 is identical, so that aluminium nitride ceramics base
Accumulation of heat on plate 10, damaging aluminum nitride ceramic substrate 10 can will be more when user needs the COB light source using more bulk
The splicing of block aluminum nitride ceramic substrate 10 uses, and the protrusion fixture block 11 of one piece of aluminum nitride ceramic substrate 10 is inserted into adjacent nitridation
The card slot of 7 bottom end of card slot seat of 10 bottom end of aluminium ceramic substrate, convenient for the splicing of muti-piece aluminum nitride ceramic substrate 10.
It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment
Intrinsic element.In the absence of more restrictions.By sentence " element limited including one ..., it is not excluded that
There is also other identical elements in the process, method, article or apparatus that includes the element ".
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (6)
1. a kind of ultra high density COB light source, including aluminum nitride ceramic substrate (10), it is characterised in that: the aluminium nitride ceramics base
The top of plate (10), which is provided with, encloses glue (9), and described enclose is provided with isolation adhesive tape (14), the isolation adhesive tape (14) on the inside of glue (9)
The region being separated out is welding region (13), passes through weldering at the welding region (13) on the top of the aluminum nitride ceramic substrate (10)
Tin (2) is welded with flip LED chips (4), and the flip LED chips (4) are provided with several, the interior phase of the welding region (13)
The positive and negative anodes line direction of adjacent flip LED chips (4) is not located at same straight line, the surface of the aluminum nitride ceramic substrate (10)
It is coated with high reflecting coating (1), the bottom end of the aluminum nitride ceramic substrate (10) is fixedly connected with connecting bottom board (12), the company
The top for connecing bottom plate (12) is fixedly connected with prominent fixture block (11), and the bottom end of the aluminum nitride ceramic substrate (10) is provided with card slot
Seat (7) is provided with card slot corresponding with protrusion fixture block (11) on the inside of the card slot seat (7).
2. a kind of ultra high density COB light source according to claim 1, it is characterised in that: the flip LED chips (4)
Top is provided with chip substrate.
3. a kind of ultra high density COB light source according to claim 2, it is characterised in that: the flip LED chips (4)
Bottom end is provided with the pole LED chip N (5) and gallium nitride PN junction (6).
4. a kind of ultra high density COB light source according to claim 3, it is characterised in that: the pole the LED chip N (5) is located at
The side of gallium nitride PN junction (6).
5. a kind of ultra high density COB light source according to claim 4, it is characterised in that: the bottom of the gallium nitride PN junction (6)
End is provided with the pole LED chip P (3).
6. a kind of ultra high density COB light source according to claim 1, it is characterised in that: the aluminum nitride ceramic substrate
(10) top cover is equipped with phosphor laminate (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920319228.5U CN209592081U (en) | 2019-03-13 | 2019-03-13 | A kind of ultra high density COB light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920319228.5U CN209592081U (en) | 2019-03-13 | 2019-03-13 | A kind of ultra high density COB light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209592081U true CN209592081U (en) | 2019-11-05 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920319228.5U Expired - Fee Related CN209592081U (en) | 2019-03-13 | 2019-03-13 | A kind of ultra high density COB light source |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209592081U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113224219A (en) * | 2021-05-10 | 2021-08-06 | 珠海市宏科光电子有限公司 | Manufacturing method of intelligent full-color-mixing COB light source |
-
2019
- 2019-03-13 CN CN201920319228.5U patent/CN209592081U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113224219A (en) * | 2021-05-10 | 2021-08-06 | 珠海市宏科光电子有限公司 | Manufacturing method of intelligent full-color-mixing COB light source |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191105 Termination date: 20210313 |